JPS61261044A - Manufacture of metallic foil lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Technical Field 1] The present invention relates to a method for manufacturing a metal foil-clad laminate that suppresses dimensional changes and deterioration of electrical properties. Paper phenol laminates, paper epoxy laminates, etc. are available, and these laminates are manufactured by stacking the required number of prepregs, placing metal foil on one side, and laminating. In the laminates manufactured by the resin in the prepreg flowing out during the process, the paper base material, which is a hydrophilic base material, is exposed on the surface of the substrate or is present near the surface.
Therefore, moisture is absorbed from the cellulose fibers of this paper base material, resulting in large dimensional changes during the printed wiring board processing process and the deterioration of electrical properties. .

[Objective of the Invention 1 The present invention has been made in view of the above circumstances, and its object is to provide a method for manufacturing a laminate from a prepreg using a hydrophilic base material, which reduces the strength of the base material. The object of the present invention is to produce a metal foil-clad laminate that can prevent moisture absorption from the elements, has excellent moisture resistance, can suppress dimensional changes and warping, and can prevent deterioration of electrical properties.

[Disclosure 1 of the Invention] The method for manufacturing a metal foil-clad laminate of the present invention involves forming a prepreg 1 by impregnating a hydrophilic base material with a resin varnish and drying it. The special feature is that a metal foil 3 is arranged on one side of the object and laminated and formed, and then a resin layer 4 is formed on the other side of the substrate 2 of the obtained laminate 7. With this structure, the above purpose can be achieved. was achieved. That is, even if the base material is exposed on the surface of the substrate 1 due to lamination molding or is present near the surface, the resin set 4 is formed, so this resin layer 4 can prevent the base material from absorbing moisture. It is.

Examples of the hydrophilic base material in the present invention include paper base materials, cloth made from hydrophilic fibers such as cotton, and nonwoven fabrics. First, this base material is impregnated with resin varnish.

As the resin for the resin varnish, thermosetting resins such as phenol resins, epoxy resins, and unsaturated polyester resins, and thermoplastic 01 resins such as polyimide resins, polyphenylene polysulfide resins, and polyamide resins can be used. Prepreg 1 is obtained by impregnating with resin varnish and drying.

Next, the required number of prepregs are stacked between the metal plates 6, and the metal foil 3 whose back side is coated with adhesive to form an adhesive layer 5 is placed on one side of the prepreg, and this is assembled into a set. Sandwiched between multiple sets of heating plates, e.g. 30-150kHz
/cm2.40-40-9O, heated and pressed at 150-170°C to form a laminate to obtain a laminate 7. In this case, gold 1
4 As foil 3, copper foil, aluminum foil, brass foil,
Nickel foil, stainless steel foil, iron foil, etc. can be used. The adhesive layer 5 is a mixture of a thermosetting resin such as an epoxy resin or a phenol resin and a thermoplastic resin such as a rubber-based resin, or a thermosetting resin modified with a rubber-based resin, or a thermoplastic resin modified by graft polymerization to become thermoplastic. Modified products from 10 to
It is formed by coating in a range of 50 g/m2 to improve the adhesion between the prepreg 1 having a rough surface and the metal M3. Thereafter, a resin N4 is applied to the other surface of the substrate 2 of the obtained laminate 7 using a roll coater and cured by heating or ultraviolet rays to a thickness of 1 to 100 μm, preferably 5 to 50 μm.
A metal foil-clad laminate A is obtained by forming. The resin layer 4 is mainly composed of a thermosetting resin or a photocurable resin such as a phenolic resin, an epoxy resin, a polyester resin, etc. alone or a mixture thereof, and a thermosetting resin such as hexamethylenetetramine, organic acid anhydride, etc. A thermosetting resin composition or a photocurable resin composition containing a polymerization initiator or a photopolymerization initiator such as a benzoin compound or a benzophenone compound can be used.

Next, the present invention will be explained in detail, but the present invention is not limited to the following examples.

(Example 1) A paper base material of 75 g/m2 was impregnated with an epoxy resin varnish containing a curing agent and dried to obtain a prepreg of 700 g/m2.Next, three sheets of this prepreg were stacked and one side of the prepreg was On the side, a sheet of copper foil with a thickness of 0.070 mm, on which an adhesive layer was formed by applying 25 g/so2 of solid content of phenolic resin modified with butyl rubber, was stacked on the back side and sandwiched between metal plates, and the pressure was applied. 40 kg/am" and a temperature of 1°C to obtain a laminate. After this, a mixture of 7 enol resin and butyl 2 resin was applied to the other side of the substrate of the laminate and cured by heating. The thickness of the resin layer is 3μ, and the total thickness is 1.
A single-sided copper foil-clad laminate of 0.0 mm was obtained.

This single-sided copper foil-clad laminate was subjected to etching, punching, etc. to obtain a printed wiring board. Brush 1 when etching
Heated at 20°C for 15 minutes. The dimensional change rate at this time was measured. Punching was performed by installing a mold in a 150-ton press after absorbing moisture for 4 days at a humidity of 80% and a temperature of 30°C, and after dehumidifying for 4 days at a humidity of 30% and a temperature of 10°C. The warpage during punching was measured. Further, the surface resistance of the printed wiring board was measured after the printed wiring board was allowed to absorb moisture for 4 days at a humidity of 90% and a temperature of 40°C. The results are shown in Table 1.

(Example 2) A single-sided copper foil-clad Mt laminate was produced in the same manner as in Example 1, except that a resin layer with a thickness of 20 μm was formed! A printed wiring board was obtained from this product. The dimensional change rate, warpage, and surface resistance were measured in the same manner as in Example 1. The results are shown in Table 1.

(Example 3) A single-sided copper foil temporary laminate was produced in the same manner as in Example 1 except that a resin layer having a thickness of 30 μm was formed, and a printed wiring board was obtained from this. The dimensional change rate, warpage, and surface resistance were measured in the same manner as in Example 1. The results are shown in Table 1.

(Example 4) A single-sided copper foil-clad laminate was manufactured in the same manner as in Example 1 except that a resin layer having a thickness of 10 μm was formed using an epoxy resin, and a printed wiring board was obtained from this. The dimensional change rate, warpage, and surface resistance were measured in the same manner as in Example 1. The results are shown in Table 1.

(Comparative example) One side @? was prepared in the same manner as in Example 1 except that no resin layer was formed. Made of I-strung laminated board. A printed wiring board was obtained from this product. The dimensional change rate, warpage, and surface resistance were measured in the same manner as in Example 1. Table 1 shows the results Surface resistance Dimensional change rate Warpage Ω' ゛Example 1 5X10I00.045 ±0.5
+1.5 Example 2 1X 10” 0.040
±0.5 +1.0 Example 3 5X10 stitches 0.
030 ±0.5 +0.5 From the results in Table 1,
It can be seen that the printed wiring boards formed from the examples of the present invention have higher surface resistance, smaller dimensional change rate, and lower warpage during dehumidification than those of the comparative examples. Moreover, this tendency becomes more pronounced as the thickness of the resin layer increases.

[Effects of the Invention] In the present invention, a required number of prepregs obtained by impregnating a hydrophilic base material with a resin varnish and drying them to form a prepreg are stacked together, a metal foil is placed on one side of the prepregs, and lamination molding is performed. After this, a resin layer is formed on the other side of the substrate of the obtained laminate, so the resin in the prepreg flows during lamination molding and the base material is exposed on the surface of the substrate of the laminate or is present near the surface. However, since a resin layer is formed on the other side of the laminate, this resin layer can prevent moisture absorption from the base material and improve the moisture resistance of the laminate. When forming a printed wiring board using the laminate obtained in this way, it is possible to suppress dimensional changes and warping behavior due to moisture absorption during the processing process, suppress deterioration of electrical characteristics, and produce a highly reliable printed wiring board. Obtainable.

[Brief explanation of the drawing]

Figure 1 is a sectional view showing the process of an embodiment of the present invention, Figure 2 is a sectional view showing a laminate manufactured by the same method, and Figure 3 is a sectional view showing a metal foil-clad laminate manufactured by the same method. , A is a metal foil-clad laminate, 1 is a prepreg, 2 is a substrate, and 3 is a metal foil-clad laminate.
4 is a metal foil, 4 is a resin layer, and 7 is a laminate. 1st meter 112 Figure 3

Claims (1)

[Claims] (1) A hydrophilic base material is impregnated with resin varnish and dried to form a prepreg, then the required number of sheets of this prepreg are stacked, metal foil is placed on one side of this, and laminated molding is performed. A method for manufacturing a metal foil-clad laminate, comprising forming a resin layer on the other side of a substrate of the laminate.