JPS61261042A - Metallic foil lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a metal foil-clad laminate that suppresses dimensional changes and deterioration of electrical properties.

[Background technology] Paper phenol laminates and paper epoxy laminates with metal foil pasted on one side have conventionally been provided, but these laminates have a hydrophilic paper base material on the surface of the substrate. The cellulose fibers of this paper base material absorb moisture, which increases dimensional changes and warpage during the printed circuit board processing process, as well as changes in electrical properties. The deterioration was also getting worse and worse.

[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to prevent moisture absorption from the base material even in a laminate made of prepreg using a hydrophilic base material. It is an object of the present invention to provide a metal foil-clad laminate that can prevent this, has excellent moisture resistance, can suppress dimensional changes and warping, and can also prevent deterioration of electrical characteristics.

[Disclosure 1 of the Invention The metal foil-clad laminate of the present invention is a substrate 2 formed by stacking a required number of prepregs 1 formed by impregnating a hydrophilic base material with a resin varnish and drying the same, and cladding a metal W3 on one side. and a resin layer 4 is formed on the other surface of the substrate 2,
With this configuration, the above object was achieved. That is, even if the resin layer 4 exposes the base material to the surface of the substrate 1 or exists near the surface, moisture absorption from the base material can be prevented.

Examples of the hydrophilic base material in the present invention include paper base materials, cloth made from hydrophilic fibers such as cotton, and nonwoven fabrics. This base material is impregnated with resin varnish. The resins for resin varnish include phenolic resin, epoxy resin,
Thermosetting resins such as unsaturated polyester resins, thermoplastic resins such as polyimide resins, polyphenylene polysulfide resins, and polyamide resins can be used. Prepreg 1 is obtained by impregnating with resin varnish and drying it. A required number of prepregs 1 are stacked to form a substrate 2, a metal foil 3 is pasted on one side of the prepreg 1 through a P1 adhesive layer 5, and a resin with a thickness of 1 to 100 μm, preferably 5 to 50 μm is applied to the other surface. Layer 4 is formed to obtain metal foil-clad laminate A. Metal foil 3 includes copper foil, aluminum foil, brass foil, nickel foil,
Stainless steel foil, iron foil, etc. can be used. The adhesive layer 5 is made of a mixture of a thermosetting resin such as an epoxy resin or a phenolic resin and a thermoplastic resin such as a rubber-based resin, or a modified product of a thermosetting resin such as a rubber-based resin, or a thermoplastic resin modified by polymerization. 10 to 50 g/Ia of the modified product
2, which improves the adhesion between the prepreg 1 having a rough surface and the metal M3. The resin layer 4 can be formed from a single substance or a mixture of resins such as 7㎱/l resin, epoxy resin, and polyester resin.

This metal foil clad laminate A is, for example, as shown in FIG.
A required number of prepregs 1 are stacked between the metal plates 6, and on one side of the prepreg 1, a metal foil 3 whose back side is coated with adhesive to form an adhesive layer 5 is placed, and on the other side, a roll is placed on the back side. A heat-resistant film 7 made of triacetate, polypropylene, polyester, nylon, etc., which has been coated with resin using a coater or the like to form a resin layer 4, is arranged, and a plurality of sets of this film are sandwiched between heating plates. -150k
g/cm2.4O-90IIlin, 150~1FO
It can be manufactured by heating and pressurizing at a temperature of 0.degree. C. to perform lamination molding, and then peeling off the heat-resistant film 7.

In addition, the required number of prepregs 1 are stacked between the metal plates 6, and the metal M3 on which an adhesive layer 5 is formed by applying adhesive to one side and the back side of the prepreg 1 is layered again and laminated molding is performed in the same manner as above. After that, a resin is applied to the other surface of the substrate 2 using a roll coater and cured by heating or ultraviolet rays to form a resin layer 4, thereby manufacturing the metal foil clad laminate A.

Next, the present invention will be described in detail, but the present invention is not limited to the following examples.

(Example 1) A paper base material of 75 g/La2 was impregnated with an epoxy resin varnish containing a curing agent and dried to obtain a prepreg of 700 g/a+2. Three sheets of this prepreg were stacked, and on one side, a phenol resin modified with butyl rubber was applied to the back side at a solid content of 25 g/m'' to form an adhesive layer.
, A single sheet of copper foil with a thickness of 0.070 mm was stacked, and on the other side, a polypropylene film with a resin layer formed by coating a mixture of phenol resin and butyral resin was placed on the other side, sandwiched between metal plates, and a pressure of 40 kg/ aI112, laminated molding at a temperature of 170°C, peeling off the polypropylene film, the thickness of the resin layer was 3μ, the overall j\\ was 1. A single-sided copper foil-clad laminate of Ol was obtained.

This single-sided copper foil-clad laminate was subjected to etching, punching, etc. to obtain a printed wiring board. Etching at 120℃, 1
Heated for 5 minutes. The dimensional change rate at this time was measured. Punching was performed after absorbing moisture for 4 days at a humidity of 80% and a temperature of 30℃, and after dehumidifying for 4 days at a humidity of 30% and a temperature of 10℃.
The mold was installed in a 50t press. The warpage during punching was measured.

Further, the surface resistance of the printed wiring board was measured after the printed wiring board was allowed to absorb moisture for 4 days at a humidity of 90% and a temperature of 40°C. tj the result
Shown in Table S1.

(Example 2) A single-sided copper foil-clad laminate was manufactured in the same manner as in Example 1 except that a resin layer having a thickness of 20 μm was formed, and a printed wiring board was obtained from this. Dimensional change rate and warpage similar to Example 1
Surface resistance was measured. The results are shown in table tj&1.

(Example 3) A single-sided copper foil-clad laminate was manufactured in the same manner as in Example 1 except that a resin layer having a thickness of 30 μm was formed, and a printed wiring board was obtained from this. Dimensional change rate and warpage similar to Example 1
Surface resistance was measured. The results are shown in Table 1.

(Example 4) A single-sided copper foil-clad laminate was manufactured in the same manner as in Example 1 except that a resin layer having a thickness of 10 μm was formed using an epoxy resin, and a printed wiring board was obtained from this. The dimensional change rate, warpage, and surface resistance were measured in the same manner as in Example 1. The results are shown in Table 1.

(Comparative Example) A single-sided copper foil-clad laminate was manufactured in the same manner as in Example 1 except that no resin layer was formed. A printed wiring board was obtained from this product. The dimensional change rate, warpage, and surface resistance were measured in the same manner as in Example 1. Table 1 shows the results Surface resistance Dimensional change rate Warpage °,' Example 1 5X10'00.045 +0.5
+1.5 Example 2 1XIO1IO0040±0.5
+1.0 Example 3 5X10 0.030 +0
．． 5 +0.5 From the results in Table 1, it can be seen that the printed wiring boards formed from the examples of the present invention had a higher surface resistance and lower dimensional change rate and dehumidification than those of the comparative examples. It can be seen that the warpage is small. Moreover, this tendency becomes more pronounced as the thickness of the resin layer increases.

[Effect of the invention 1] In the present invention, gold I11.9ri is pasted on one side of the substrate, and a resin layer is formed on the other side of the substrate, so that the hydrophilic base material of the substrate is covered by the resin layer. Even if it is exposed on the surface or exists near the surface, it can prevent moisture absorption from the base material, and it can improve moisture resistance as a laminate. Dimensional changes and warping behavior due to moisture absorption can be suppressed to a minimum, and deterioration of electrical characteristics can be suppressed to obtain a highly reliable printed wiring board.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view showing the same manufacturing method, in which A is a metal foil-clad laminate, 1 is a prepreg, 2 is a substrate, and 3 is a metal Foil, 4 is a resin layer. Agent Patent Attorney Ishi 1) Chief 7 Figure 1 Figure 2

Claims (1)

[Claims] (1) A required number of prepregs formed by impregnating a hydrophilic base material with resin varnish and drying them are stacked together, a metal foil is pasted on one side of the substrate, and a resin layer is formed on the other side of the substrate. A metal foil-clad laminate characterized by: