JPS61118246A - Metal lined laminated board - Google Patents

Metal lined laminated board

Info

Publication number
JPS61118246A
JPS61118246A JP23992484A JP23992484A JPS61118246A JP S61118246 A JPS61118246 A JP S61118246A JP 23992484 A JP23992484 A JP 23992484A JP 23992484 A JP23992484 A JP 23992484A JP S61118246 A JPS61118246 A JP S61118246A
Authority
JP
Japan
Prior art keywords
metal
resin
prepreg
foil
prepregs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23992484A
Other languages
Japanese (ja)
Inventor
中井 道雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23992484A priority Critical patent/JPS61118246A/en
Publication of JPS61118246A publication Critical patent/JPS61118246A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 [技術分野1 本発明はパンチング加工性を向上させたいわゆるコンポ
シフト積層板である金属張積層板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a metal-clad laminate, which is a so-called composite shift laminate, which has improved punching processability.

[背景技術l it属張槙層板をプリント配線板などに使用する際には
、いわゆるパンチング性が問題にされる場合が多い、こ
のため金属張積層板の中間層を無機不織布にて形成して
密度を下げた、いわゆるコンポシフト積層板が採用され
ている。従来のコンポノット積層板は、確かにパンチン
グ性に優れ、しかも寸法安定性及び耐熱性に優れている
ものの、無機不織布に樹脂を含浸させて形成したプリプ
レグは表面が荒く、その為金属箔との接着性が低く、待
にパンチング後に金属箔が剥がれたりして接着性に問題
があり、信頼性の低いものであった。
[Background technology] When metal-clad laminates are used for printed wiring boards, so-called punching properties are often a problem. For this reason, the intermediate layer of metal-clad laminates is formed of an inorganic nonwoven fabric. A so-called compo-shift laminate, which has a lower density, is used. Although conventional component knot laminates have excellent punchability, dimensional stability, and heat resistance, prepregs made by impregnating inorganic nonwoven fabric with resin have a rough surface and are difficult to bond with metal foils. Adhesion was low, and the metal foil peeled off after punching, resulting in problems with adhesion and low reliability.

[発明の目的1 本発明はこのような点に鑑みてなされたものであり、そ
の目的とするところはパンチング性が良好で、寸法安定
性および耐熱性に優れ、しかもパンチング後のプリプレ
グと金属箔との接着性が高く信頼性の高い金属張積層板
を提供することにある。
[Objective of the Invention 1 The present invention has been made in view of the above points, and its object is to have good punching properties, excellent dimensional stability and heat resistance, and to provide a prepreg and metal foil after punching. The object of the present invention is to provide a metal-clad laminate that has high adhesiveness and reliability.

【発明の開示] 本発明の金属箔張Ht層板は、無機不織布に樹脂ワニス
を含浸させ乾燥させて形成した所要枚数のプリプレグ1
を重ね合わせてその少なくとも片面に樹脂N32を介し
て金属M3を張着させて成ることを特徴とし、この構成
により上記目的を達成できたものであろ、即ちプリプレ
グ1に樹脂N2を介して金属r63を張着しているので
、樹脂層2が接着剤として機能し、パンチング後にも金
属M3がプリプレグ1から剥がれることもなくパンチン
グ加工性が良好となったものである。
DISCLOSURE OF THE INVENTION The metal foil-clad Ht laminate of the present invention consists of a required number of prepregs formed by impregnating an inorganic nonwoven fabric with a resin varnish and drying it.
It is characterized by overlapping the prepregs 1 and pasting the metal M3 on at least one side of the prepreg 1 through the resin N32.With this configuration, the above object can be achieved. Since the resin layer 2 functions as an adhesive, the metal M3 does not peel off from the prepreg 1 even after punching, resulting in good punching processability.

本発明における無機不織布としてはガラス、アスベスト
等の無機繊維の単独もしくは混紡による不織布を使用で
きる。この黒磯不織布を樹脂ワニスに含浸させる。樹脂
ワニスの樹脂としてはフェノール樹脂、エポキシ樹脂、
不飽和ポリエステル1f脂等の熱硬化性樹脂とかポリイ
ミド樹脂、ポリフェニレンポリサルファイド樹脂、ポリ
アミド樹脂等の熱可塑性樹脂を採用t′きる。この樹脂
ワニスには樹脂固形分100重量部に対して炭酸カルシ
ウム、シリカ、アルミナ、水酸化アルミニウム、fi化
チタン、jフ入粉、炭酸マグネシウム、クレー等の無機
粒子充填剤をパンチング性を損なわない程度である80
〜120重量部含有させて吸湿時の絶縁抵抗性、寸法安
定性及び耐熱性をより向上させるようにしてもよい。又
、黒磯不織布を!!脂7ニスに含浸させる前に予めカッ
プリング剤にて処理し、カップリング剤を0.1〜2.
0!I!m%含有させて、黒磯不織布の511性を向上
させておき、樹脂ワニスに含浸させてa2.燥させた際
に燕磯不織布と樹脂との接着性を高めることができ、@
湿時の絶縁抵抗をより向上させた積層板を得るようにし
てもよい。このカップリング剤としては一般に使用され
ているものを採用でき、具体的にはメタクリレートクロ
ミッククロライド、ビニルトリクロロシラン、ビニルト
リスベータメトキシンラン、がンマ7ミノプロビルトリ
エトキシシランなどを挙げることができる。無へ不織布
にυ(脂ワニスを含浸させた後乾燥させてプリプレグ1
を得る。このプリプレグ1を所要枚数重ね合わせその少
なくとも片面に金属M3を樹脂/[2を介して張Hさせ
て金属張積層板Aを得る。この場合、例えば金属プレー
ト間に所要枚数のプリプレグ1を重ね合わせ、その両面
又は片面に金属箔3を配置し、このものを−組みとして
複数組み熱盤間に挟み、例えば30−150kg/cm
’、4O−90s+in、 150−170℃で加熱加
圧して積層成形し、金属張積層板へを製造することがで
さる。金属箔3としては銅箔、アルミニウム箔、しんち
ゅう箔、ニッケル箔、ステンレスw4箔、鉄76などを
用いることができる。この金属箔3の裏面にはエポキシ
樹脂、7ヱ7−ルflf脂等の熱硬化性樹脂とゴム系等
の熱可塑性樹脂との混合物又は熱硬化性樹脂の例えば、
ゴム糸による変性物あるいはグラフト重合により熱可塑
性樹脂性した変性物を10〜50g/鴎2の範囲で塗布
して樹脂層2を形成しておき、表面の荒いプリプレグ1
と金属箔3との接着性を向上させている。
As the inorganic nonwoven fabric in the present invention, a nonwoven fabric made of inorganic fibers such as glass and asbestos alone or in combination can be used. This black iso nonwoven fabric is impregnated with resin varnish. The resins for resin varnish include phenolic resin, epoxy resin,
Thermosetting resins such as unsaturated polyester resins, thermoplastic resins such as polyimide resins, polyphenylene polysulfide resins, and polyamide resins can be used. This resin varnish contains inorganic particle fillers such as calcium carbonate, silica, alumina, aluminum hydroxide, titanium oxide, J-F powder, magnesium carbonate, and clay, based on 100 parts by weight of resin solid content, without impairing punching properties. about 80
It may be contained in an amount of up to 120 parts by weight to further improve insulation resistance, dimensional stability, and heat resistance during moisture absorption. Also, Kuroiso nonwoven fabric! ! Before impregnating the oil 7 varnish, it is treated with a coupling agent in advance, and the coupling agent is applied in an amount of 0.1 to 2.
0! I! m% to improve the 511 properties of the Kuroiso nonwoven fabric, and impregnated with resin varnish to obtain a2. When dried, it can improve the adhesion between Tsubameiso nonwoven fabric and resin.
It is also possible to obtain a laminate with improved insulation resistance when wet. As this coupling agent, commonly used ones can be used, and specific examples include methacrylate chromic chloride, vinyltrichlorosilane, vinyltrisbetamethoxysilane, and ganma-7minoprobyltriethoxysilane. Non-woven fabric is impregnated with υ (greasy varnish and then dried to prepare prepreg 1)
get. A required number of prepregs 1 are stacked and a metal M3 is stretched on at least one side of the prepregs 1 via a resin/[2] to obtain a metal-clad laminate A. In this case, for example, a required number of prepregs 1 are stacked between metal plates, metal foils 3 are placed on both or one side of the prepregs, and a plurality of prepregs 1 are sandwiched between hot platens as a set.
', 4O-90s+in, heated and pressurized at 150-170°C to form a metal clad laminate. As the metal foil 3, copper foil, aluminum foil, brass foil, nickel foil, stainless steel W4 foil, iron 76, etc. can be used. The back surface of the metal foil 3 is coated with an epoxy resin, a mixture of a thermosetting resin such as 7-7-l-flf resin and a thermoplastic resin such as a rubber-based resin, or a thermosetting resin such as
A resin layer 2 is formed by coating a modified material with rubber thread or a modified material made into a thermoplastic resin by graft polymerization in a range of 10 to 50 g/2, and prepreg 1 with a rough surface is coated.
The adhesion between the metal foil 3 and the metal foil 3 is improved.

次に本発明の詳細な説明するが、本発明は以下の実施例
に限定されるものではない。
Next, the present invention will be described in detail, but the present invention is not limited to the following examples.

(実施例) 75g/m2のプラス不織布をエポキシ樹脂ワニスに含
浸させ、乾燥させて700g/+*’のプリプレグ1a
を得た。
(Example) 75 g/m2 of plus nonwoven fabric is impregnated with epoxy resin varnish and dried to produce prepreg 1a of 700 g/+*'
I got it.

又、200g/+a2のガラス不織布にエボキン相(脂
ワニスを含浸、乾燥して40011/II”のプリプレ
グ1bをイ!トな。
Also, impregnate a 200g/+a2 glass nonwoven fabric with Evokin phase (fatty varnish), dry it, and prepare a 40011/II'' prepreg 1b.

一方、0.070mm厚の電解銅箔3にブチルゴム系t
′変性した7エ/−ル樹脂を固形分で25g/m’塗布
して樹脂層2を形成した。
On the other hand, butyl rubber-based t was applied to the electrolytic copper foil 3 with a thickness of 0.070 mm.
A resin layer 2 was formed by coating a modified 7 el resin at a solid content of 25 g/m'.

次いで、700g/+*2のプリプレグ1aを三枚重ね
、その両側に400g/m2のプリプレグ1bをそれぞ
れ一枚重ね、更にその上に上記電解@M3を一枚重ねて
金属プレート間に挟み、圧力40kg/c+s’、温度
170℃で積層成形し、厚み1.6義−のフンボッ/ト
銅張積層板Aを得た。
Next, three sheets of prepreg 1a of 700 g/+*2 are stacked, one sheet of prepreg 1b of 400 g/m2 is stacked on each side, and one sheet of the above electrolytic@M3 is stacked on top of that, sandwiched between metal plates, and pressure is applied. Lamination molding was carried out at 40 kg/c+s' and a temperature of 170° C. to obtain a 1.6 mm thick copper-clad laminate A.

このフンボノット銅張積層板Aを孔加工してプリント配
線板Bを得た。孔加工は150Lプレスに金型を設置し
パンチングにより行った。tI4箔3とプリプレグ1の
接着性は、パンチング孔4に洋白縁5を挿入し半田6付
けを行ない添付図に示すように矢印の方向に引張りラン
ド7の剥離強度を測定した。結果を第1表に示す。
A printed wiring board B was obtained by drilling holes in this knotted copper-clad laminate A. The holes were formed by punching using a mold installed in a 150L press. The adhesion between the tI4 foil 3 and the prepreg 1 was determined by inserting a nickel silver edge 5 into the punched hole 4, applying solder 6, and measuring the peel strength of the tensile land 7 in the direction of the arrow as shown in the attached figure. The results are shown in Table 1.

(比較例) 電解銅箔に用脂層を形成しなかった以外は実施例と同様
にしてフンボノット積M板を得、同様の孔加工を施して
プリント配M[を得て剥離強度を測定した。結果を第1
表に示す。
(Comparative example) A funbo knot laminated M board was obtained in the same manner as in the example except that no oil layer was formed on the electrolytic copper foil, and a printed M plate was obtained by performing the same hole processing and the peel strength was measured. . Results first
Shown in the table.

第1表 第1表の結果より実施例のものにあっては、パンチング
後の銅箔3の剥離がなく、比較例に対してランド7の剥
離強度が大きいことが判る。これは樹脂層2により#I
i!f 3とプリプレグ1bとの接着強度が大きくなっ
たことによると考えられる。
From the results shown in Table 1, it can be seen that in the example, the copper foil 3 did not peel off after punching, and the peel strength of the land 7 was greater than that of the comparative example. This is #I due to resin layer 2.
i! This is thought to be due to the increased adhesive strength between f3 and prepreg 1b.

[発明の効果1 本発明にあっては、無機不織布に樹脂ワニスを含浸させ
乾燥させて形成した所要枚数のプリプレグを重ね合わせ
てその少なくとも片面に樹脂層を介して金属箔を張着し
ているので、無機不織布によりパンチング性が良好とな
り寸法安定性及び耐熱性に優れ、しかも樹脂層が接着剤
として機能し、表面の荒いプリプレグとi属箔との接着
性を向上させることができ、パンチングによる孔加工を
してプリント配線板を形成した際に、パンチング後に金
属箔がプリプレグから剥がれることもなくパンチング加
工性がより良好となるものである。
[Effect of the invention 1 In the present invention, a required number of prepregs formed by impregnating an inorganic nonwoven fabric with a resin varnish and drying them are superimposed, and a metal foil is attached to at least one side of the prepregs through a resin layer. Therefore, the inorganic nonwoven fabric has good punchability and excellent dimensional stability and heat resistance, and the resin layer functions as an adhesive, improving the adhesion between prepreg with a rough surface and Group I foil. When a printed wiring board is formed by forming holes, the metal foil does not peel off from the prepreg after punching, and the punching processability is improved.

【図面の簡単な説明】[Brief explanation of the drawing]

添付図は本発明の金属張積層板により形成したプリント
配線板のランドの剥離強度を測定する方法を示す断面図
であって、Aは金属張積層板、Bはプリント配線板、1
はプリプレグ、2は樹脂層、3は金属箔、4はパンチン
グ孔、5は半田、6は洋白線、7はランドである。
The attached drawings are cross-sectional views showing a method for measuring the peel strength of the land of a printed wiring board formed using the metal-clad laminate of the present invention, in which A is the metal-clad laminate, B is the printed wiring board, 1
2 is a prepreg, 2 is a resin layer, 3 is a metal foil, 4 is a punched hole, 5 is solder, 6 is a nickel silver wire, and 7 is a land.

Claims (1)

【特許請求の範囲】[Claims] (1)無機不織布に樹脂ワニスを含浸させ乾燥させて形
成した所要枚数のプリプレグを重ね合わせてその少なく
とも片面に樹脂層を介して金属箔を張着して成ることを
特徴とする金属張積層板。
(1) A metal-clad laminate comprising a required number of prepregs formed by impregnating and drying an inorganic non-woven fabric with a resin varnish and pasting a metal foil on at least one side of the prepregs with a resin layer interposed therebetween. .
JP23992484A 1984-11-14 1984-11-14 Metal lined laminated board Pending JPS61118246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23992484A JPS61118246A (en) 1984-11-14 1984-11-14 Metal lined laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23992484A JPS61118246A (en) 1984-11-14 1984-11-14 Metal lined laminated board

Publications (1)

Publication Number Publication Date
JPS61118246A true JPS61118246A (en) 1986-06-05

Family

ID=17051867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23992484A Pending JPS61118246A (en) 1984-11-14 1984-11-14 Metal lined laminated board

Country Status (1)

Country Link
JP (1) JPS61118246A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432541B1 (en) 1998-12-11 2002-08-13 Dow Global Technologies Inc. Resin composition of polyepoxide and polyisocyanate, prepreg, and metallic foil laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432541B1 (en) 1998-12-11 2002-08-13 Dow Global Technologies Inc. Resin composition of polyepoxide and polyisocyanate, prepreg, and metallic foil laminate

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