JPH01225518A - Manufacture of laminate - Google Patents
Manufacture of laminateInfo
- Publication number
- JPH01225518A JPH01225518A JP5183388A JP5183388A JPH01225518A JP H01225518 A JPH01225518 A JP H01225518A JP 5183388 A JP5183388 A JP 5183388A JP 5183388 A JP5183388 A JP 5183388A JP H01225518 A JPH01225518 A JP H01225518A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thickness
- cushioning material
- contact
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 230000008719 thickening Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 8
- 239000004744 fabric Substances 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052742 iron Inorganic materials 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 abstract description 2
- 239000012784 inorganic fiber Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000000123 paper Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 229920003002 synthetic resin Polymers 0.000 abstract description 2
- 239000000057 synthetic resin Substances 0.000 abstract description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 239000013013 elastic material Substances 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000002648 laminated material Substances 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- NSYDOBYFTHLPFM-UHFFFAOYSA-N 2-(2,2-dimethyl-1,3,6,2-dioxazasilocan-6-yl)ethanol Chemical compound C[Si]1(C)OCCN(CCO)CCO1 NSYDOBYFTHLPFM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 101000915175 Nicotiana tabacum 5-epi-aristolochene synthase Proteins 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000013616 tea Nutrition 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、計算機器、通信ツ器等にm−られる
電気用積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing an electrical laminate used in electrical equipment, computing equipment, communication equipment, etc.
従来、電気用積層板は樹脂含浸基材、金@16からなる
積層体を合議プレートに挾んだものを1〜15組重ねた
外側にクッション材を介してキャリア板を配し熱盤間に
挾み加熱面圧積層成形して得られるものであるが、金属
プレートとしては全て同じ厚みのものをm−ていた。Conventionally, electrical laminates have been made by stacking 1 to 15 sets of laminates made of a resin-impregnated base material and gold @ 16 sandwiched between conference plates, with a carrier plate placed on the outside with a cushioning material interposed between the hot plates. It is obtained by sandwich heating and surface pressure lamination molding, and the metal plates are all of the same thickness.
従来の技術で述べたように金属プレートとして全て同じ
厚みのものを用いると、熱盤に鐘近接する電気用積層板
表面にシワが発生する。本発明は従来の技術における上
述の問題点に鑑みてなされたもので、その目的とすると
ころは表面にシワのな一電気用積層板の製造方法を提供
することにある。As described in the prior art section, if all the metal plates are of the same thickness, wrinkles will occur on the surface of the electrical laminate near the heating plate. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for manufacturing an electrical laminate with no wrinkles on the surface.
本発明は樹脂含浸基材、金属箔からなる積層体を金属プ
レート、クッション材、キャリア板をm−て積層成形す
るに際し、り9シーン材に接触する金属プV−)厚を、
非接触金属プレート厚より20〜Boo係厚くすること
を特徴とする積層板の製造方法のため積鳥板狭面のシワ
をなくすることができたもので、以下本発明の詳細な説
明する。In the present invention, when forming a laminate consisting of a resin-impregnated base material and a metal foil with a metal plate, a cushion material, and a carrier plate, the thickness of the metal plate in contact with the sheet material is
This method of manufacturing a laminate is characterized by increasing the thickness of the non-contact metal plate by 20 to Boo, thereby eliminating wrinkles on the narrow side of the laminate.The present invention will be described in detail below.
本発明にm−る樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メラミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミF1ポリスルフォン、
ポリフェニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
セトン、シクロヘキサノン、スチレン等の溶媒を添加し
たもので、基材としては、ガラス、アスベスト等の無機
繊維やポリエステル、ポリアミF1 ポリビニルアルコ
ール、アクリル等の有機合成繊維や木綿等の天然繊維か
らなる織布、不蛾布、マリト或は紙又はこれらの組合せ
基材等である。The resins of the resin-impregnated base material according to the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide F1 polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are used to adjust the viscosity. The base material is woven fabric made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide F1, polyvinyl alcohol, and acrylic, and natural fibers such as cotton, moth-free fabric, marito, etc. Paper or a combination of these materials, etc.
金属箔としては銅、アルミニウム、鉄、ニッケル、亜鉛
等のm狂、合金、複合品であり、必要に応じて接着面を
化学処理及び又は物理処理し更に必要に応じて接着剤層
を設けたものである。金4プレートとしては積層体間に
存在するものとしては厚さ1〜5鰭の鉄、アルミニウム
、銅、二咋ケル等の単独、合金、復合品であり、必要に
応じて表面に1lilt型層を設けることができるが、
り叩シ目ン材に接触する金属プレート厚を、非接触金属
プレート厚より50〜200係厚くすることが必要であ
る。Metal foils are metal foils, alloys, and composites of copper, aluminum, iron, nickel, zinc, etc., and the adhesive surface is chemically and/or physically treated as necessary, and an adhesive layer is provided as necessary. It is something. The gold 4 plate that is present between the laminates is a single, alloy, or composite product of iron, aluminum, copper, two-layered steel, etc., with a thickness of 1 to 5 fins, and a 1 liter type layer on the surface as necessary. can be provided, but
It is necessary to make the thickness of the metal plate in contact with the perforated material 50 to 200 times thicker than the thickness of the non-contact metal plate.
り呼ジョン材としてはゴム、合成樹脂、布、紙、板、合
板等のように弾性を有するものであればよA0キャリア
板としては従来のものをそのまま用−ることができる。Any material having elasticity, such as rubber, synthetic resin, cloth, paper, board, plywood, etc., can be used as the carrier plate, and conventional materials can be used as is for the A0 carrier plate.
以下本発明を実施例にもとづbて説明する。The present invention will be explained below based on examples.
実施例
厚さQ、 2 Fmlのガラス布に、エポキシ樹脂(シ
ェル化学株式会社展、品名エピコート1001) 10
0 重量部(以下単に部と記す)、ジシアンジアミド4
部、ベンジルジメチルアミン0.2部、メチルオキシト
ール100部からなるエボキvim脂ワニスを、乾燥後
樹脂量が50重11以下皐にチと記す)になるように含
浸、乾燥して得た樹脂含浸基材7枚の上下面に厚さu、
o3smの銅箔を夫々配設した遺層体IO組の夫々の間
に厚さ2nのステンレス鋼製金属プレートを挾み、更に
最外側に厚さ4flのステンレス銅製金属プレートを配
し、厚さ3nの布入りゴム板をクリシ四ン材として介し
て厚さ5ffの鉄製!Irヤリア板を夫々配設してから
熱盤間に挾み、成形圧力4aiq/d 、 i ss℃
テas+o l& 1171 加熱加圧成形してLθ枚
の厚さ1.6fiの両面@張り積層板を得た。Example Thickness: Q, 2 Fml glass cloth, epoxy resin (Shell Chemical Co., Ltd. Exhibition, product name: Epicoat 1001) 10
0 parts by weight (hereinafter simply referred to as parts), dicyandiamide 4
A resin obtained by impregnating and drying an ebony vim fat varnish consisting of 2 parts, 0.2 parts of benzyldimethylamine, and 100 parts of methyloxytol so that the amount of resin after drying is 50 parts by weight or less. Thickness u, upper and lower surfaces of 7 impregnated base materials
A stainless steel metal plate with a thickness of 2n is sandwiched between each of the IO sets of laminated bodies each having a copper foil of o3sm, and a stainless steel metal plate with a thickness of 4fl is placed on the outermost side. Made of iron with a thickness of 5ff, using a 3N cloth-filled rubber plate as a crisscross material! After arranging the Ir layer plates, they were sandwiched between hot platens, and the molding pressure was 4 aiq/d, i ss°C.
TEAS+OL&1171 Heat and pressure molding was performed to obtain Lθ sheets of 1.6fi thick double-sided laminate.
比較例
積層体間及び最外側に厚さ2flのステンレス鋼製金属
プレートを用すた以外は実施例と同様に処理して10枚
の厚さ1.6fiの両面鋼張積層板を得た。Comparative Example Ten double-sided steel-clad laminates with a thickness of 1.6 fi were obtained in the same manner as in the example except that stainless steel metal plates with a thickness of 2 fl were used between the laminates and on the outermost side.
実施例及び比較例の積層板表面シワ発生基は、第1表の
ようである。Table 1 shows the wrinkle-generating groups on the surface of the laminates of Examples and Comparative Examples.
本発明は上述した如く構成されて論る。特許請求の範囲
第1項に記載した構成を有する積層板の製造方法におい
ては、積層板異面のシワ発生基が大巾に低下する効果を
有して込る。The present invention is constructed and discussed as described above. The method for manufacturing a laminate having the configuration described in claim 1 has the effect of significantly reducing the wrinkle-generating groups on different surfaces of the laminate.
Claims (1)
ート、クッション材、キャリア板を用いて積層成形する
に際し、クッション材に接触する金属プレート厚を、非
接触金属プレート厚より50〜200%厚くすることを
特徴とする積層板の製造方法。(1) When layer-molding a laminate consisting of a resin-impregnated base material and metal foil using a metal plate, cushioning material, and carrier plate, the thickness of the metal plate in contact with the cushioning material should be 50 to 200 times smaller than the thickness of the non-contact metal plate. % thickening method for producing a laminate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63051833A JPH0661787B2 (en) | 1988-03-04 | 1988-03-04 | Laminated board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63051833A JPH0661787B2 (en) | 1988-03-04 | 1988-03-04 | Laminated board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01225518A true JPH01225518A (en) | 1989-09-08 |
JPH0661787B2 JPH0661787B2 (en) | 1994-08-17 |
Family
ID=12897864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63051833A Expired - Lifetime JPH0661787B2 (en) | 1988-03-04 | 1988-03-04 | Laminated board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0661787B2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5642622A (en) * | 1979-09-14 | 1981-04-20 | Hitachi Chem Co Ltd | Manufacture of lamination sheet |
-
1988
- 1988-03-04 JP JP63051833A patent/JPH0661787B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5642622A (en) * | 1979-09-14 | 1981-04-20 | Hitachi Chem Co Ltd | Manufacture of lamination sheet |
Also Published As
Publication number | Publication date |
---|---|
JPH0661787B2 (en) | 1994-08-17 |
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