JPH05278135A - Production of laminated sheet - Google Patents

Production of laminated sheet

Info

Publication number
JPH05278135A
JPH05278135A JP4081060A JP8106092A JPH05278135A JP H05278135 A JPH05278135 A JP H05278135A JP 4081060 A JP4081060 A JP 4081060A JP 8106092 A JP8106092 A JP 8106092A JP H05278135 A JPH05278135 A JP H05278135A
Authority
JP
Japan
Prior art keywords
resin
metal
metal plate
cushion material
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4081060A
Other languages
Japanese (ja)
Inventor
Itsuo Tomita
逸男 富田
Takaya Nibu
貴也 丹生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4081060A priority Critical patent/JPH05278135A/en
Publication of JPH05278135A publication Critical patent/JPH05278135A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To obtain a laminated sheet free from scratch and void inferiority and reduced in its thickness common difference and dimensional change rate. CONSTITUTION:When a laminate consisting of a resin impregnated base material, a metal foil and, if necessary, an inner layer material is subjected to laminate molding using a metal plate and a cushion material, a cushion material wherein a metal plate is arranged to the arbitrary layer of a non-metal cushion material is used.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器、電気機器、
コンビュ−タ−、通信機器等に用いられる積層板、プリ
ント配線板の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a method for manufacturing a laminated board and a printed wiring board used for a computer, a communication device and the like.

【0002】[0002]

【従来の技術】従来、積層板、プリント配線板等は、樹
脂含浸基材、金属箔及び必要に応じて内層材からなる積
層体を金属プレートに挟んだものを1〜15組重ねた外
側にクッションを介し、必要に応じてキャリア板を配し
熱盤間に鋏み加熱加圧成形して得られるものであるが、
クッション材としては紙、不織布、織物等が用いられて
いた。
2. Description of the Related Art Conventionally, a laminated board, a printed wiring board, etc., has a laminated body composed of a resin-impregnated base material, a metal foil and, if necessary, an inner layer material sandwiched between metal plates, and is laminated on an outer side of 1 to 15 sets. It is obtained by arranging a carrier plate as needed through a cushion, scissors between heating plates, and heating and pressure molding.
Paper, non-woven fabric, woven fabric and the like have been used as the cushion material.

【0003】[0003]

【発明が解決しようとする課題】従来の技術で述べたよ
うに、クッション材として紙、不織布、織物を単独で用
いるとクッション性が均一でなく、熱伝導性にもバラツ
キが発生するため、成形時にカスレ、ボイドといった外
観不良が発生すると共に板厚偏差、寸法変化も大きくな
っていた。本発明は従来の技術における上述の問題点に
鑑みてなされたもので、その目的とするところはカス
レ、ボイドがなく、板厚偏差、寸法変化率の小さい積層
板の得られる製造方法を提供することにある。
As described in the prior art, when paper, non-woven fabric or woven fabric is used alone as the cushioning material, the cushioning property is not uniform and the thermal conductivity also varies. Occasionally, appearance defects such as scratches and voids occurred, and plate thickness deviation and dimensional change were large. The present invention has been made in view of the above-mentioned problems in the prior art, and an object thereof is to provide a manufacturing method capable of obtaining a laminated plate having no scratches and voids, a plate thickness deviation, and a small dimensional change rate. Especially.

【0004】[0004]

【課題を解決するための手段】本発明は、樹脂含浸基
材、金属箔及び必要に応じて内層材からなる積層体を金
属プレート、クッション材を用いて積層成形するに際
し、非金属製クッション材の任意層に金属板を配設した
クッション材を用いることを特徴とする積層板の製造方
法のため、上記目的を達成することができたもので、以
下本発明を詳細に説明する。
DISCLOSURE OF THE INVENTION The present invention is a non-metallic cushioning material for laminating a laminate comprising a resin-impregnated base material, a metal foil and, if necessary, an inner layer material using a metal plate and a cushioning material. The above object can be achieved because of the method for manufacturing a laminated plate, which is characterized by using a cushioning material in which a metal plate is arranged in any of the layers, and the present invention will be described in detail below.

【0005】本発明に用いる樹脂含浸基材の樹脂として
は、フエノ−ル樹脂、クレゾール樹脂、エポキシ樹脂、
メラミン樹脂、不飽和ポリエステル樹脂、ポリイミド樹
脂、ポリブタジエン樹脂、ポリアミド樹脂、ポリフエニ
レンオキサイド樹脂、ポリフエニレンサルフアイド樹
脂、フッ素樹脂等の単独、変性物、混合物が用いられ、
基材としては、ガラス、アスベスト等の無機質繊維や、
ポリエステル、ポリアミド、ポリアクリル、ポリビニル
アルコ−ル、ポリイミド、ポリフエニレンサルフアイ
ド、ポリフエニレンオキサイド、フッ素樹脂等の有機質
繊維や木綿等の天然繊維からなる織布、不織布、マッ
ト、紙等の基材等である。金属箔としては、銅、アルミ
ニュウム、真鍮、ニッケル、鉄等の単独、合金、複合箔
であり、必要に応じて接着面を活性化又は粗面化処理し
更に必要に応じて接着剤層を設けたものである。金属プ
レートとしては、厚さ1〜5mmの鉄、アルミニゥム、
銅、ニッケル等の単独、合金、複合品であり、必要に応
じて表面に離型層を設けることができる。クッション材
としては、紙、不織布、織物の単独、複合物の層間、片
側、両側等の任意層に銅、アルミニュウム、真鍮、ニッ
ケル、鉄等の単独、合金、複合物からなる金属板を配設
ー体化したクッション材を用いるもので、金属板の厚み
は特に限定しないが0.05〜1mmのものが好まし
い。又表面と層間或いは層間に複数枚というような用い
かたもできる。クッション材としての厚みは好ましくは
0.1〜10mmであることがクッション性の点でよく
望ましいことである。更に必要に応じて全体をキャリア
板に挟み或いは載置して積層成形に用いるものである。
The resin of the resin-impregnated base material used in the present invention includes phenol resin, cresol resin, epoxy resin,
Melamine resin, unsaturated polyester resin, polyimide resin, polybutadiene resin, polyamide resin, polyphenylene oxide resin, polyphenylene sulfide resin, fluorine resin, etc. alone, modified products, mixtures are used,
As the base material, inorganic fibers such as glass and asbestos,
Base materials such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide, polyphenylene sulfide, polyphenylene oxide, organic fibers such as fluororesin and natural fibers such as cotton, non-woven fabrics, mats, papers, etc. Materials, etc. The metal foil is a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron, etc., and if necessary, activates or roughens the adhesive surface and further provides an adhesive layer if necessary. It is a thing. As the metal plate, iron, aluminum with a thickness of 1 to 5 mm,
It is a single product, an alloy, or a composite product of copper, nickel, etc., and a release layer can be provided on the surface if necessary. As the cushioning material, a metal plate made of copper, aluminum, brass, nickel, iron, etc. alone, alloy, or composite is provided on any layer such as paper, non-woven fabric, woven fabric alone, composite layer, one side, both sides, etc. The thickness of the metal plate is not particularly limited, but it is preferably 0.05 to 1 mm. Further, it may be used such that a plurality of sheets are provided between the surface and the interlayer or between the layers. The thickness of the cushioning material is preferably 0.1 to 10 mm, which is desirable in terms of cushioning properties. Further, if necessary, the whole is sandwiched or placed on a carrier plate and used for lamination molding.

【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.

【0007】[0007]

【実施例】厚さ0.18mmのガラス布に樹脂量が45
%になるように硬化剤含有エポキシ樹脂を含浸、乾燥し
て得たプリプレグ7枚の上下面に、厚さ0.035mmの
銅箔を配設した積層体を、厚み2mmのステンレス鋼製
金属プレートに挟んだものを10組重ねた外側に、厚み
0.2mmの綿布8枚の上下面に厚み0.3mmのアル
ミニュウム板を各々配設ー体化したクッション材を各々
用い、成形圧力40Kg/cm2 、165℃で120分
間加熱加圧成形して10枚の厚み1.6mmの積層板を
得た。
EXAMPLE A glass cloth having a thickness of 0.18 mm and a resin amount of 45
% Of the epoxy resin containing a curing agent and dried to obtain a laminated body in which copper foil of 0.035 mm thickness is arranged on the upper and lower surfaces of seven prepregs, and a stainless steel metal plate of 2 mm thickness. Cushion material in which 10 sets of sandwiched in between are placed on the outside, 8 aluminum sheets of 0.2 mm thickness each have an aluminum plate of 0.3 mm thickness on the upper and lower surfaces, respectively, and are made into a body, and a molding pressure of 40 Kg / cm 2 , heat and pressure molding was performed at 165 ° C. for 120 minutes to obtain ten laminated plates having a thickness of 1.6 mm.

【0008】[0008]

【比較例】厚み0.2mmの綿布8枚をクッション材と
して用いた以外は実施例と同様に処理して積層板を得
た。
[Comparative Example] A laminated plate was obtained by the same process as in Example except that eight 0.2 mm-thick cotton cloths were used as the cushioning material.

【0009】実施例及び比較例の積層板の性能は表1の
ようである。
Table 1 shows the performance of the laminates of Examples and Comparative Examples.

【0010】[0010]

【表1】 [Table 1]

【0011】[0011]

【発明の効果】本発明は上述したごとく構成されてい
る。特許請求の範囲に記載した構成を有する積層板の製
造方法においては、カスレ、ポイド不良がなく、厚さ公
差、寸法変化率が小さくなり、本発明の優れていること
を確認した。
The present invention is constructed as described above. In the method for producing a laminated plate having the structure described in the claims, it was confirmed that the present invention is excellent in that there are no scratches and void defects, the thickness tolerance and the dimensional change rate are small.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 B29K 105:06 B29L 9:00 4F 31:34 4F ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display area B29K 105: 06 B29L 9:00 4F 31:34 4F

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 樹脂含浸基材、金属箔及び必要に応じて
内層材からなる積層体を金属プレート、クッション材を
用いて積層成形するに際し、非金属製クッション材の任
意層に金属板を配設したクッション材を用いることを特
徴とする積層板の製造方法。
1. When laminating a laminate comprising a resin-impregnated base material, a metal foil and, if necessary, an inner layer material by using a metal plate and a cushion material, a metal plate is arranged on an arbitrary layer of the non-metal cushion material. A method for manufacturing a laminated board, which comprises using the provided cushioning material.
JP4081060A 1992-04-02 1992-04-02 Production of laminated sheet Pending JPH05278135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4081060A JPH05278135A (en) 1992-04-02 1992-04-02 Production of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4081060A JPH05278135A (en) 1992-04-02 1992-04-02 Production of laminated sheet

Publications (1)

Publication Number Publication Date
JPH05278135A true JPH05278135A (en) 1993-10-26

Family

ID=13735863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4081060A Pending JPH05278135A (en) 1992-04-02 1992-04-02 Production of laminated sheet

Country Status (1)

Country Link
JP (1) JPH05278135A (en)

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