JPH0220327A - Production of laminate - Google Patents

Production of laminate

Info

Publication number
JPH0220327A
JPH0220327A JP63171605A JP17160588A JPH0220327A JP H0220327 A JPH0220327 A JP H0220327A JP 63171605 A JP63171605 A JP 63171605A JP 17160588 A JP17160588 A JP 17160588A JP H0220327 A JPH0220327 A JP H0220327A
Authority
JP
Japan
Prior art keywords
resin
laminate
cushioning member
hermetically sealed
sealed bag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63171605A
Other languages
Japanese (ja)
Inventor
Yasuo Azumabayashi
泰郎 東林
Hiroshi Takeda
浩志 武田
Yasuhiro Oki
沖 泰宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63171605A priority Critical patent/JPH0220327A/en
Publication of JPH0220327A publication Critical patent/JPH0220327A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

PURPOSE:To markedly lower the rate of generation of wrinkles on the surface of a laminate and enhance the number of times that a cushioning member can be used in the meantime by using as the cushioning member a hermetically sealed bag containing a material which is solid at normal temperature, is softened at 60-100 deg.C and shows fluidity at or above 140 deg.C. CONSTITUTION:A laminate comprising a resin-impregnated material, a metallic foil and, optionally, an inner layer material is produced by laminate molding by use of a metallic plate and a cushioning member. A resin for use in the resin-impregnated material may be a phenolic resin, a cresol resin, an epoxy resin, an unsaturated polyester resin, a melamine resin, a polyimide, polybutadiene, a fluororesin or the like, at least one of which may be used either singly, or in a modified state or in combination. The metallic foil and the plate may be formed of a single metal such as copper, aluminum, iron, nickel and zinc, an alloy thereof or the like. A hermetically sealed bag containing a material which is solid at normal temperature, is softened at 60-100 deg.C and has a viscosity of preferably 1-2,000cP at a temperature of 140 deg.C or above is used as the cushioning member. The hermetically sealed bag may be a heat-resistant bag of a polyimide, a silicone polymer, a fluororesin or the like.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電気41II器、計算機ベル、通信機器等に用
いられる電気用積層板の製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing electrical laminates used in electrical 41II appliances, computer bells, communication equipment, and the like.

〔従来の技術〕[Conventional technology]

従来、電気用積層板は樹脂含浸基材、金属箔からなる積
層体を金属プレートに挾んだものを1〜正組重ねた外側
にクッション材を介し、必要に応じてキャリア板を配し
熱盤間に挾み加熱加圧積層成形して得られるものである
が、クッション材としては樹脂板、紙、樹脂含浸紙布等
を用いていた。
Conventionally, electrical laminates consist of a laminate consisting of a resin-impregnated base material and metal foil sandwiched between metal plates, which are stacked one on top of the other, with a cushioning material interposed on the outside, and a carrier plate as required, and heated. It is obtained by sandwiching between discs and laminating under heat and pressure, and the cushioning material used is resin board, paper, resin-impregnated paper cloth, etc.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の技術で述べたようにクッション材として樹脂板、
樹脂含浸紙布等を用いるとクッション性不足に起因する
積層板表面のシワを発生する。紙を用いるとクツシーン
性はよいが数回でクッション性が失われ耐久性がない。
As mentioned in the conventional technology, resin plates are used as cushioning materials.
If resin-impregnated paper cloth or the like is used, wrinkles will occur on the surface of the laminate due to insufficient cushioning properties. When paper is used, the shoes have good sheen properties, but the cushioning properties are lost after a few times and the shoes are not durable.

本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは、クッション性が
よく、且つ耐久性のあるクッション材を用いることによ
シ表面にシワのない積層板が得られる製造方法を提供す
ることにある。
The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to create a laminated layer with no wrinkles on the surface by using a cushioning material that has good cushioning properties and is durable. The object of the present invention is to provide a manufacturing method by which a plate can be obtained.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は樹脂含浸基材、金属箔及び必要に応じて内層材
からな右積層体を金属プレート、クッション材を用いて
積層成形するに際し、常温固形でω〜ioo℃で軟化し
、140“C以上で流動性を示す材料を収納する密閉袋
をクツシラン材として用いることを特徴とする積層板の
製造方法のため、りッシーン材のクッション材がよく、
且つ耐久性があシ積層板の表面シワをなくすることがで
きたもので、以下本発明の詳細な説明する。
In the present invention, when forming a right laminate consisting of a resin-impregnated base material, metal foil, and optionally an inner layer material using a metal plate and a cushioning material, it is solid at room temperature and softens at ω~ioo°C, and is 140"C Since the method for manufacturing a laminate is characterized by using a sealed bag containing a material exhibiting fluidity as a cushioning material, a cushioning material made of a cushioning material is preferably used.
In addition, the present invention is durable and can eliminate wrinkles on the surface of the laminate.The present invention will be described in detail below.

本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メフミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ポリスルフォン、
ポリフェニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
七トン、シクロヘキサノン、スチレン等の溶媒全添加し
たもので、基材としては、ガラス、アスベスト等の無機
繊維やポリエステル、ポリアミ民ポリビニルアルコール
、アクリル等の有機合成繊維や木綿等の天然Raからな
る織布、不織布、マット或は紙又はこれらの組合せ基材
等である。金11ffi、!:しては鋼、アルミニウム
、鉄、ニッケル、亜鉛等の単独、合金、複合量で8シ、
必要に応じて接着面を化学処理及び又は物理処理し更に
必要に応じて接着剤層を設けたものである。金属プレー
トとしては厚さ1〜5Hの鉄、アルミニウム、銅、ニッ
ケル等の単独、合金、複合量であシ、必要に応じて表面
に離型層を設けることができる。
Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, mehumine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol, aptane, cyclohexanone, styrene, etc. are used to adjust the viscosity. The base materials include woven fabrics, non-woven fabrics, mats, etc. made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural Ra such as cotton. Paper or a combination of these materials, etc. Gold 11ffi! : Steel, aluminum, iron, nickel, zinc, etc. alone, alloy, composite amount: 8 pieces,
The adhesive surface is chemically and/or physically treated as necessary, and an adhesive layer is further provided as necessary. The metal plate may be made of iron, aluminum, copper, nickel, or the like with a thickness of 1 to 5H, either alone, in an alloy, or in combination, and a release layer may be provided on the surface if necessary.

クッション材としては、常温固形でaO〜100”Qで
軟化し、140℃以上で好ましくは1〜2000 Cp
sの粘度を有する材料即ち硬化剤、架橋剤を含まないノ
ボフック型フェノール樹脂、キシレン樹脂、不飽和ポリ
エステル樹脂、エポキシ樹脂等のように上記条件に合致
するものであればよく用いることができる。密閉袋とし
てはポリイミド、ポリフェニレンサルファイド、シリコ
ンポリマー、弗化1ft脂等のような耐熱性を有する袋
であればよく用いることができ、クツシラン材としては
好ましく0.1〜10闘厚で用いることがクッション材
の点でよく望ましいことである。更に必要に応じて全体
をキャリア板に挾み或は載置して積層成形に用いるもの
である。
As a cushioning material, it is solid at room temperature, softens at aO to 100"Q, and preferably 1 to 2000 Cp at 140°C or higher.
Materials having a viscosity of s, ie, Novohook type phenolic resins containing no curing agent or crosslinking agent, xylene resins, unsaturated polyester resins, epoxy resins, etc., which meet the above conditions, can be used. As the airtight bag, any bag having heat resistance such as polyimide, polyphenylene sulfide, silicone polymer, fluoride 1ft fat, etc. can be used, and as the material, it is preferable to use it with a thickness of 0.1 to 10. This is highly desirable for cushioning purposes. Furthermore, if necessary, the whole is sandwiched or placed on carrier plates and used for lamination molding.

以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.

実施例 厚さ0.2Hのガラス布にエポキシ樹脂(シエ〃化学株
式会社製、品名エビコー) 1001 ) 100  
重量部C以下単に部と記す)、ジシアンジアミド4部、
ベンジルジメチルアミン0.2部、メチルオキシド−/
l/ 100部からなるエポキシ樹脂フェスを、乾燥後
樹脂量が0重量%(以下単に%と記す)I/Cなるよう
に含浸、乾燥して得た樹脂含浸基材7枚の上、下面に厚
さ0.035111の銅箔を夫々配設した積層体を厚み
2mのステンレス鋼製金属プレートに挾んだものを10
組重ねた外側にクッション材として、厚み0.1111
のポリイミドポリマー製密閉袋中忙硬化剤を含まない厚
みinのノボフック型フェノール樹脂(軟化点80’Q
%165℃で粘度1000cps )シートを収納した
ものを上下に夫々用い成形圧力40kg/d、 165
℃で120分間積層成形して10枚の厚み1.6Hの両
面鋼張積層板を得た。
Example: Epoxy resin (manufactured by Cie Kagaku Co., Ltd., product name: Ebiko) 1001) 100 on a glass cloth with a thickness of 0.2H
Part by weight C (hereinafter simply referred to as part), 4 parts of dicyandiamide,
0.2 parts of benzyldimethylamine, methyl oxide/
I/C was impregnated with 100 parts of epoxy resin face so that the resin amount after drying was 0% by weight (hereinafter simply referred to as %) I/C, and then dried on the upper and lower surfaces of 7 resin-impregnated substrates. 10 laminates each having copper foil with a thickness of 0.035111 sandwiched between 2 m thick stainless steel metal plates.
Thickness 0.1111 as cushioning material on the outside of the stack.
A polyimide polymer airtight bag with a thick Novohook type phenolic resin (softening point 80'Q) that does not contain a hardening agent.
(viscosity 1000 cps at 165°C) sheets were housed in the upper and lower molding pressure 40 kg/d, 165
Lamination molding was carried out for 120 minutes at ℃ to obtain 10 double-sided steel clad laminates having a thickness of 1.6H.

比較例 クツシラン材として厚み0.2ffのクラフト紙5枚を
上下に夫々用いた以外は実施例と同様に処理して10枚
の厚み1.6mlの両面鋼張積層板を得た。
Comparative Example Ten sheets of double-sided steel-clad laminates with a thickness of 1.6 ml were obtained in the same manner as in the example except that 5 sheets of kraft paper with a thickness of 0.2 ff were used for the upper and lower sides as the silica material.

実施例及び比較例の積層板の表面シワ発生率及びクツシ
ラン材の耐久性は第1表のようである。
Table 1 shows the surface wrinkle occurrence rate of the laminates of Examples and Comparative Examples and the durability of the Silkshire material.

第1表 〔発明の効果〕 本発明は上述した如く構成されている。特許請求の範囲
第1項に6載した構成を有する積層板の製造方法におい
ては、積層板表面のシワ発生率が大巾に低下し、クッシ
ョン材の耐用回数が大巾に向上する効果を有している。
Table 1 [Effects of the Invention] The present invention is constructed as described above. In the method for manufacturing a laminate having the structure set forth in claim 1, item 6, the wrinkle occurrence rate on the surface of the laminate is greatly reduced, and the number of service life of the cushioning material is greatly increased. are doing.

Claims (1)

【特許請求の範囲】[Claims] (1)樹脂含浸基材、金属箔及び必要に応じて内層材か
らなる積層体を金属プレート、クッション材を用いて積
層成形するに際し、常温固形で60〜100℃で軟化し
、140℃以上で流動性を示す材料を収納する密閉袋を
クッション材として用いることを特徴とする積層板の製
造方法。
(1) When forming a laminate consisting of a resin-impregnated base material, metal foil, and optionally an inner layer material using a metal plate and a cushioning material, it should be solid at room temperature, soften at 60 to 100°C, and soften at 140°C or higher. A method for manufacturing a laminate, characterized in that a sealed bag containing a fluid material is used as a cushioning material.
JP63171605A 1988-07-08 1988-07-08 Production of laminate Pending JPH0220327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63171605A JPH0220327A (en) 1988-07-08 1988-07-08 Production of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63171605A JPH0220327A (en) 1988-07-08 1988-07-08 Production of laminate

Publications (1)

Publication Number Publication Date
JPH0220327A true JPH0220327A (en) 1990-01-23

Family

ID=15926263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63171605A Pending JPH0220327A (en) 1988-07-08 1988-07-08 Production of laminate

Country Status (1)

Country Link
JP (1) JPH0220327A (en)

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