JPH0220327A - Production of laminate - Google Patents
Production of laminateInfo
- Publication number
- JPH0220327A JPH0220327A JP63171605A JP17160588A JPH0220327A JP H0220327 A JPH0220327 A JP H0220327A JP 63171605 A JP63171605 A JP 63171605A JP 17160588 A JP17160588 A JP 17160588A JP H0220327 A JPH0220327 A JP H0220327A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- cushioning member
- hermetically sealed
- sealed bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000011888 foil Substances 0.000 claims abstract description 5
- 239000007787 solid Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 230000037303 wrinkles Effects 0.000 abstract description 6
- 239000004642 Polyimide Substances 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 4
- 239000005011 phenolic resin Substances 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005062 Polybutadiene Substances 0.000 abstract description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 229920002857 polybutadiene Polymers 0.000 abstract description 2
- 229920005573 silicon-containing polymer Polymers 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 239000004640 Melamine resin Substances 0.000 abstract 1
- 229920000877 Melamine resin Polymers 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気41II器、計算機ベル、通信機器等に用
いられる電気用積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing electrical laminates used in electrical 41II appliances, computer bells, communication equipment, and the like.
従来、電気用積層板は樹脂含浸基材、金属箔からなる積
層体を金属プレートに挾んだものを1〜正組重ねた外側
にクッション材を介し、必要に応じてキャリア板を配し
熱盤間に挾み加熱加圧積層成形して得られるものである
が、クッション材としては樹脂板、紙、樹脂含浸紙布等
を用いていた。Conventionally, electrical laminates consist of a laminate consisting of a resin-impregnated base material and metal foil sandwiched between metal plates, which are stacked one on top of the other, with a cushioning material interposed on the outside, and a carrier plate as required, and heated. It is obtained by sandwiching between discs and laminating under heat and pressure, and the cushioning material used is resin board, paper, resin-impregnated paper cloth, etc.
従来の技術で述べたようにクッション材として樹脂板、
樹脂含浸紙布等を用いるとクッション性不足に起因する
積層板表面のシワを発生する。紙を用いるとクツシーン
性はよいが数回でクッション性が失われ耐久性がない。As mentioned in the conventional technology, resin plates are used as cushioning materials.
If resin-impregnated paper cloth or the like is used, wrinkles will occur on the surface of the laminate due to insufficient cushioning properties. When paper is used, the shoes have good sheen properties, but the cushioning properties are lost after a few times and the shoes are not durable.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは、クッション性が
よく、且つ耐久性のあるクッション材を用いることによ
シ表面にシワのない積層板が得られる製造方法を提供す
ることにある。The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to create a laminated layer with no wrinkles on the surface by using a cushioning material that has good cushioning properties and is durable. The object of the present invention is to provide a manufacturing method by which a plate can be obtained.
本発明は樹脂含浸基材、金属箔及び必要に応じて内層材
からな右積層体を金属プレート、クッション材を用いて
積層成形するに際し、常温固形でω〜ioo℃で軟化し
、140“C以上で流動性を示す材料を収納する密閉袋
をクツシラン材として用いることを特徴とする積層板の
製造方法のため、りッシーン材のクッション材がよく、
且つ耐久性があシ積層板の表面シワをなくすることがで
きたもので、以下本発明の詳細な説明する。In the present invention, when forming a right laminate consisting of a resin-impregnated base material, metal foil, and optionally an inner layer material using a metal plate and a cushioning material, it is solid at room temperature and softens at ω~ioo°C, and is 140"C Since the method for manufacturing a laminate is characterized by using a sealed bag containing a material exhibiting fluidity as a cushioning material, a cushioning material made of a cushioning material is preferably used.
In addition, the present invention is durable and can eliminate wrinkles on the surface of the laminate.The present invention will be described in detail below.
本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メフミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ポリスルフォン、
ポリフェニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
七トン、シクロヘキサノン、スチレン等の溶媒全添加し
たもので、基材としては、ガラス、アスベスト等の無機
繊維やポリエステル、ポリアミ民ポリビニルアルコール
、アクリル等の有機合成繊維や木綿等の天然Raからな
る織布、不織布、マット或は紙又はこれらの組合せ基材
等である。金11ffi、!:しては鋼、アルミニウム
、鉄、ニッケル、亜鉛等の単独、合金、複合量で8シ、
必要に応じて接着面を化学処理及び又は物理処理し更に
必要に応じて接着剤層を設けたものである。金属プレー
トとしては厚さ1〜5Hの鉄、アルミニウム、銅、ニッ
ケル等の単独、合金、複合量であシ、必要に応じて表面
に離型層を設けることができる。Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, mehumine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol, aptane, cyclohexanone, styrene, etc. are used to adjust the viscosity. The base materials include woven fabrics, non-woven fabrics, mats, etc. made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural Ra such as cotton. Paper or a combination of these materials, etc. Gold 11ffi! : Steel, aluminum, iron, nickel, zinc, etc. alone, alloy, composite amount: 8 pieces,
The adhesive surface is chemically and/or physically treated as necessary, and an adhesive layer is further provided as necessary. The metal plate may be made of iron, aluminum, copper, nickel, or the like with a thickness of 1 to 5H, either alone, in an alloy, or in combination, and a release layer may be provided on the surface if necessary.
クッション材としては、常温固形でaO〜100”Qで
軟化し、140℃以上で好ましくは1〜2000 Cp
sの粘度を有する材料即ち硬化剤、架橋剤を含まないノ
ボフック型フェノール樹脂、キシレン樹脂、不飽和ポリ
エステル樹脂、エポキシ樹脂等のように上記条件に合致
するものであればよく用いることができる。密閉袋とし
てはポリイミド、ポリフェニレンサルファイド、シリコ
ンポリマー、弗化1ft脂等のような耐熱性を有する袋
であればよく用いることができ、クツシラン材としては
好ましく0.1〜10闘厚で用いることがクッション材
の点でよく望ましいことである。更に必要に応じて全体
をキャリア板に挾み或は載置して積層成形に用いるもの
である。As a cushioning material, it is solid at room temperature, softens at aO to 100"Q, and preferably 1 to 2000 Cp at 140°C or higher.
Materials having a viscosity of s, ie, Novohook type phenolic resins containing no curing agent or crosslinking agent, xylene resins, unsaturated polyester resins, epoxy resins, etc., which meet the above conditions, can be used. As the airtight bag, any bag having heat resistance such as polyimide, polyphenylene sulfide, silicone polymer, fluoride 1ft fat, etc. can be used, and as the material, it is preferable to use it with a thickness of 0.1 to 10. This is highly desirable for cushioning purposes. Furthermore, if necessary, the whole is sandwiched or placed on carrier plates and used for lamination molding.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚さ0.2Hのガラス布にエポキシ樹脂(シエ〃化学株
式会社製、品名エビコー) 1001 ) 100
重量部C以下単に部と記す)、ジシアンジアミド4部、
ベンジルジメチルアミン0.2部、メチルオキシド−/
l/ 100部からなるエポキシ樹脂フェスを、乾燥後
樹脂量が0重量%(以下単に%と記す)I/Cなるよう
に含浸、乾燥して得た樹脂含浸基材7枚の上、下面に厚
さ0.035111の銅箔を夫々配設した積層体を厚み
2mのステンレス鋼製金属プレートに挾んだものを10
組重ねた外側にクッション材として、厚み0.1111
のポリイミドポリマー製密閉袋中忙硬化剤を含まない厚
みinのノボフック型フェノール樹脂(軟化点80’Q
%165℃で粘度1000cps )シートを収納した
ものを上下に夫々用い成形圧力40kg/d、 165
℃で120分間積層成形して10枚の厚み1.6Hの両
面鋼張積層板を得た。Example: Epoxy resin (manufactured by Cie Kagaku Co., Ltd., product name: Ebiko) 1001) 100 on a glass cloth with a thickness of 0.2H
Part by weight C (hereinafter simply referred to as part), 4 parts of dicyandiamide,
0.2 parts of benzyldimethylamine, methyl oxide/
I/C was impregnated with 100 parts of epoxy resin face so that the resin amount after drying was 0% by weight (hereinafter simply referred to as %) I/C, and then dried on the upper and lower surfaces of 7 resin-impregnated substrates. 10 laminates each having copper foil with a thickness of 0.035111 sandwiched between 2 m thick stainless steel metal plates.
Thickness 0.1111 as cushioning material on the outside of the stack.
A polyimide polymer airtight bag with a thick Novohook type phenolic resin (softening point 80'Q) that does not contain a hardening agent.
(viscosity 1000 cps at 165°C) sheets were housed in the upper and lower molding pressure 40 kg/d, 165
Lamination molding was carried out for 120 minutes at ℃ to obtain 10 double-sided steel clad laminates having a thickness of 1.6H.
比較例
クツシラン材として厚み0.2ffのクラフト紙5枚を
上下に夫々用いた以外は実施例と同様に処理して10枚
の厚み1.6mlの両面鋼張積層板を得た。Comparative Example Ten sheets of double-sided steel-clad laminates with a thickness of 1.6 ml were obtained in the same manner as in the example except that 5 sheets of kraft paper with a thickness of 0.2 ff were used for the upper and lower sides as the silica material.
実施例及び比較例の積層板の表面シワ発生率及びクツシ
ラン材の耐久性は第1表のようである。Table 1 shows the surface wrinkle occurrence rate of the laminates of Examples and Comparative Examples and the durability of the Silkshire material.
第1表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
第1項に6載した構成を有する積層板の製造方法におい
ては、積層板表面のシワ発生率が大巾に低下し、クッシ
ョン材の耐用回数が大巾に向上する効果を有している。Table 1 [Effects of the Invention] The present invention is constructed as described above. In the method for manufacturing a laminate having the structure set forth in claim 1, item 6, the wrinkle occurrence rate on the surface of the laminate is greatly reduced, and the number of service life of the cushioning material is greatly increased. are doing.
Claims (1)
らなる積層体を金属プレート、クッション材を用いて積
層成形するに際し、常温固形で60〜100℃で軟化し
、140℃以上で流動性を示す材料を収納する密閉袋を
クッション材として用いることを特徴とする積層板の製
造方法。(1) When forming a laminate consisting of a resin-impregnated base material, metal foil, and optionally an inner layer material using a metal plate and a cushioning material, it should be solid at room temperature, soften at 60 to 100°C, and soften at 140°C or higher. A method for manufacturing a laminate, characterized in that a sealed bag containing a fluid material is used as a cushioning material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63171605A JPH0220327A (en) | 1988-07-08 | 1988-07-08 | Production of laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63171605A JPH0220327A (en) | 1988-07-08 | 1988-07-08 | Production of laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0220327A true JPH0220327A (en) | 1990-01-23 |
Family
ID=15926263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63171605A Pending JPH0220327A (en) | 1988-07-08 | 1988-07-08 | Production of laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0220327A (en) |
-
1988
- 1988-07-08 JP JP63171605A patent/JPH0220327A/en active Pending
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