JPS60239228A - Manufacture of laminated plate for electric application - Google Patents

Manufacture of laminated plate for electric application

Info

Publication number
JPS60239228A
JPS60239228A JP59097291A JP9729184A JPS60239228A JP S60239228 A JPS60239228 A JP S60239228A JP 59097291 A JP59097291 A JP 59097291A JP 9729184 A JP9729184 A JP 9729184A JP S60239228 A JPS60239228 A JP S60239228A
Authority
JP
Japan
Prior art keywords
resin
impregnated
base material
tetrafluoroethylene
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59097291A
Other languages
Japanese (ja)
Inventor
Shoji Fujikawa
藤川　彰司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP59097291A priority Critical patent/JPS60239228A/en
Publication of JPS60239228A publication Critical patent/JPS60239228A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B32B2315/085—Glass fiber cloth or fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2317/00—Animal or vegetable based
    • B32B2317/12—Paper, e.g. cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To elevate the high frequency characteristic, moisture resistance, water resistance, drilling property, cutting property and the like by interposing a fluorocarbon resin layer between resin-impregnated substrates obtained by hot melting substrates impregnated with a polytetrafluoroethylene. CONSTITUTION:A substrate is impregnated with a polytetrafluoroethylene by emmersing the substrate into a polytetrafluoroethylene dispersion, coating the substrate with the disversion or others and then, it is heated to melt the polytetrafluoroethylene. Then, a required number of the resin-impregnated substrates thus obtained are piled one on another with a fluorocarbon resin layer interposed therebetween while a metal foil such as copper foil is laminated at least on one side thereof as required and hot molded (monolithically) to obtain a laminated plate for electric application. The substrate herein used can be a cloth such as glass cloth, a unwoven glass cloth, paper or the like.

Description

【発明の詳細な説明】 〔技術分野〕 この発明は、電子機器等に用いられる電気用積層板の製
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing electrical laminates used in electronic devices and the like.

〔背景技術〕[Background technology]

電気用積層板は、一般に、樹脂含浸基材（プリプレグ、
レジンペーパー）所定枚を必要に応じて金属箔とともに
積層成形することによりつくられる。Electrical laminates are generally made of resin-impregnated base materials (prepreg,
(Resin paper) It is made by laminating and molding predetermined sheets together with metal foil as needed.

〔発明の目的〕[Purpose of the invention]

この発明は、高周波特性、耐湿性、耐水性、ドリル加工
性、切削性、打抜加工性および耐熱性等の優れたものを
得ることのできる電気用積層板の製法を提供することを
目的としている。The purpose of this invention is to provide a method for manufacturing an electrical laminate that can obtain excellent high frequency properties, moisture resistance, water resistance, drilling workability, cutting workability, punching workability, heat resistance, etc. There is.

〔発明の開示〕[Disclosure of the invention]

発明者は、従来の製法を改良することにより、前記目的
を達成しようとして研究を重ねた。その結果、樹脂含浸
基材として、四フッ化エチレン樹脂を基材に含浸させた
のち加熱溶融させたものを用い、樹脂含浸基材の間にフ
ッ素樹脂層（フッ化樹脂層）を介在させるようにして積
層形成すればよいということを見い出し、ここにこの発
明を完成した。The inventor conducted repeated research in an attempt to achieve the above object by improving the conventional manufacturing method. As a result, we used a resin-impregnated base material that was impregnated with tetrafluoroethylene resin and then heated and melted it, and a fluororesin layer (fluororesin layer) was interposed between the resin-impregnated base materials. They discovered that it is sufficient to form the layers by laminating them, and have now completed this invention.

したがって、この発明は、樹脂含浸基材を所定枚積層成
形して電気用積層板を得るにあたり、樹脂含浸基材とし
て、四フッ化エチレン樹脂を基材に含浸させたのち加熱
溶融させたものを用いるとともに、樹脂含浸基材の間に
フッ素樹脂層を介在させるようにすることを特徴とする
電気用積層板の製法をその要旨としている。Therefore, in obtaining an electrical laminate by laminating and molding a predetermined number of resin-impregnated base materials, the present invention uses, as the resin-impregnated base material, a base material that is impregnated with tetrafluoroethylene resin and then heated and melted. The gist thereof is a method for manufacturing an electrical laminate, which is characterized in that a fluororesin layer is interposed between resin-impregnated base materials.

以下に、この発明の詳細な説明する。The present invention will be explained in detail below.

前記のように、この発明にかかる電気用積層板は、四フ
ッ化エチレン樹脂を基材に含浸させたのち加熱溶融させ
た樹脂含浸基材を用いる。このような樹脂含浸基材は、
具体的には、たとえば、基材を四フッ化エチレン樹脂デ
ィスパージョンに漬けたり、基材に四フッ化エチレン樹
脂ディスパーンッンを塗布したりして基材に四フッ化エ
チレン樹脂を含浸させたあと、基材を加熱して四フッ化
エチレン樹脂を溶融させることにより得ることができる
。As described above, the electrical laminate according to the present invention uses a resin-impregnated base material obtained by impregnating the base material with tetrafluoroethylene resin and then heating and melting the base material. Such a resin-impregnated base material is
Specifically, for example, after impregnating the base material with tetrafluoroethylene resin by soaking the base material in tetrafluoroethylene resin dispersion or applying tetrafluoroethylene resin dispersion to the base material, , can be obtained by heating the base material and melting the tetrafluoroethylene resin.

基材としては、ガラス布等の布、ガラス不織布等の不織
布１紙、その他電気用積層板の製造用として一般に用い
られているものが用いられる。As the base material, cloth such as glass cloth, nonwoven paper such as glass nonwoven cloth, and other materials commonly used for manufacturing electrical laminates are used.

前記のような樹脂含浸基材所定枚を、樹脂含浸基材間に
フッ素樹脂層を介在させるようにして重ね合わせるとと
もに、必要に応じてその少なくとも片面に銅箔等の金属
箔を重ね合わせ、加熱成形（一体化）して電気用積層板
を得る。A predetermined number of resin-impregnated base materials as described above are stacked with a fluororesin layer interposed between the resin-impregnated base materials, and if necessary, a metal foil such as copper foil is superimposed on at least one side of the resin-impregnated base materials, followed by heating. An electrical laminate is obtained by molding (integration).

フッ素樹脂層となる樹脂としては、四フッ化エチレン樹
脂（ＰＴＦＥ）、四フッ化エチレンー六フッ化プロピレ
ン共重合樹脂（ＦＥＰ）、四フッ化エチレンーパーフル
オロアルキルビニルエーテル共重合樹脂（ＰＦＡ）等が
用いられ、フッ素樹脂層としては、フッ素樹脂フィルム
（フッ素系フィルム）等が用いられるとよい。フィルム
を用いると樹脂層の厚み調節がしやすい。フッ素樹脂層
は、必ずしも全部同じ種類のものにする必要はない。Examples of the resin for the fluororesin layer include tetrafluoroethylene resin (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer resin (FEP), and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin (PFA). As the fluororesin layer, a fluororesin film (fluorine-based film) or the like is preferably used. Using a film makes it easy to adjust the thickness of the resin layer. The fluororesin layers do not necessarily all need to be of the same type.

このようにして得られた電気用積層板は、前記のような
樹脂含浸基材を使用し、樹脂含浸基材の間にフッ素樹脂
層を介在させて成形するようにしているので、層間接着
性が良好になっている。そのうえ、基材に四フッ化エチ
レン樹脂が含まれ、基材間には連続したフッ素樹脂層が
できているため、高周波特性、耐湿性、耐水性、ドリル
加工性、切削性、打抜加工性および耐熱性等が優れたも
のとなっている。The electrical laminate thus obtained uses the resin-impregnated base material as described above and is molded with a fluororesin layer interposed between the resin-impregnated base materials, so it has good interlayer adhesion. is getting better. In addition, the base material contains tetrafluoroethylene resin and there is a continuous fluororesin layer between the base materials, so it has excellent high frequency characteristics, moisture resistance, water resistance, drilling workability, cutting workability, and punching workability. It also has excellent heat resistance.

つぎに、実施例および比較例について説明する（実施例
） 樹脂量が４５％となるよう四フッ化エチレン樹脂ディス
パージョン（ダイキン工業株式会社のポリフロン）を厚
み０．０５鶴のガラス布に含浸させ、つぎに３５０℃で
樹脂を加熱溶融させて樹脂含浸基材をつくった。このよ
うにして得られた樹脂含浸基材９枚を、基材間に厚み０
．０３℃ｍの四フッ化エチレン樹脂フィルム（ダイキン
工業株式会社のポリフロン）を介在させるようにして重
ね合わせ、さらに、その上下面（最外層）に厚み０．０
３５ｍの接着剤付銅箔を重ね合わせて積層体をつくった
。コの積層体を、３０ｋｇ／ａＡ、４００℃、４５分間
の条件で加熱加圧成形して厚み０．８　ｔｍの電気用積
層板を得た。Next, Examples and Comparative Examples will be explained (Example) A glass cloth with a thickness of 0.05 mm was impregnated with tetrafluoroethylene resin dispersion (Polyflon manufactured by Daikin Industries, Ltd.) so that the resin amount was 45%. Next, the resin was heated and melted at 350°C to produce a resin-impregnated base material. The nine resin-impregnated base materials obtained in this way were placed with a thickness of 0 between the base materials.
．． Polytetrafluoroethylene resin films (Polyflon, manufactured by Daikin Industries, Ltd.) at a temperature of 0.3°C are superimposed on each other, and the upper and lower surfaces (outermost layers) are coated with a film with a thickness of 0.0
A laminate was made by overlapping 35 m of adhesive-coated copper foil. This laminate was heat-pressed and molded under conditions of 30 kg/aA, 400° C., and 45 minutes to obtain an electrical laminate having a thickness of 0.8 tm.

（比較例） 実施例で用いたのと同じ樹脂含浸基材を１２枚重ね合わ
せ、さらに、その上下面に厚み０．０３５鶴の接着剤付
銅箔を重ね合わせて積層体をつくった。この積層体を実
施例と同じ条件で加熱加圧成形して厚み０．８ｆｉの電
気用積層板を得た。(Comparative Example) A laminate was made by stacking 12 sheets of the same resin-impregnated base material as used in the example, and then stacking adhesive-coated copper foil with a thickness of 0.035 mm on the top and bottom surfaces. This laminate was molded under heat and pressure under the same conditions as in the example to obtain an electrical laminate having a thickness of 0.8 fi.

実施例および比較例で得られた電気用積層板の打抜加工
性、ドリル加工性、吸水率を調べた。ただし、吸水率は
、２３℃の水中に２４時間浸漬（Ｄ−２４／２３処理）
後のものである。結果を第１表に示す。The punching workability, drilling workability, and water absorption rate of the electrical laminates obtained in Examples and Comparative Examples were investigated. However, the water absorption rate is immersed in water at 23℃ for 24 hours (D-24/23 treatment)
This is the later one. The results are shown in Table 1.

（以　下　余　白） 第１表 第１表より、実施例の電気用積層板は、比較例のものに
比べ、打抜加工性、ドリル加工性が優れ、吸水率も低く
なっていることがわかる。(Margin below) Table 1 From Table 1, it can be seen that the electrical laminates of the examples have superior punching workability and drill workability, and have a lower water absorption rate than those of the comparative examples. Recognize.

〔発明の効果〕〔Effect of the invention〕

この発明にかかる電気用積層板の製法は、樹脂含浸基材
を所定枚積層成形して電気用積層板を得るにあたり、樹
脂含浸基材として、四フッ化エチレン樹脂を基材に含浸
させたのち加熱溶融させたものを用いるとともに、樹脂
含浸基材の間にフッ素樹脂層を介在させるようにするの
で、高周波特性、耐湿性、耐水性、ドリル加工性、切削
性、打抜加工性および耐熱性等の優れたものを得ること
ができる。The method for producing an electrical laminate according to the present invention is to obtain an electrical laminate by laminating and molding a predetermined number of resin-impregnated base materials, after impregnating the base material with tetrafluoroethylene resin as the resin-impregnated base material. In addition to using a heated and melted material, a fluororesin layer is interposed between the resin-impregnated base materials, so it has high frequency characteristics, moisture resistance, water resistance, drilling workability, cutting performance, punching workability, and heat resistance. You can obtain excellent products such as

代理人　弁理士　松　本　武　彦Agent: Patent Attorney Takehiko Matsumoto

Claims (4)

【特許請求の範囲】[Claims] （１）　樹脂含浸基材を所定枚積層成形して電気用積層
板を得るにあたり、樹脂含浸基材として、四フッ化エチ
レン樹脂を基材に含浸させたのち加熱溶融させたものを
用いるとともに、樹脂含浸基材の間にフッ素樹脂層を介
在させるようにすることを特徴とする電気用積層板の製
法。(1) When obtaining an electrical laminate by laminating and molding a predetermined number of resin-impregnated base materials, a resin-impregnated base material that is impregnated with tetrafluoroethylene resin and then heated and melted is used. A method for manufacturing an electrical laminate, characterized by interposing a fluororesin layer between resin-impregnated base materials. （２）　フッ素樹脂層が、四フッ化エチレン樹脂。 四フッ化エチレンー六フッ化プロピレン共重合樹脂およ
び四フッ化エチレンーパーフルオロアルキルビニルエー
テル共重合樹脂からなる群の中から選ばれた少なくとも
１種からなるものである特許請求の範囲第１項記載の電
気用積層板の製法。(2) The fluororesin layer is made of tetrafluoroethylene resin. Claim 1, which is made of at least one selected from the group consisting of tetrafluoroethylene-hexafluoropropylene copolymer resin and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin. Manufacturing method for electrical laminates. （３）　フッ素樹脂層が、フッ素樹脂フィルムである特
許請求の範囲第１項または第２項記載の電気用積層板の
製法。(3) The method for producing an electrical laminate according to claim 1 or 2, wherein the fluororesin layer is a fluororesin film. （４）　樹脂含浸基材の基材が、ガラス布、ガラス不織
布および紙からなる群の中から選ばれたものである特許
請求の範囲第１項から第３項までのいずれかに記載の電
気用積層板の製法。(4) The electrical appliance according to any one of claims 1 to 3, wherein the base material of the resin-impregnated base material is selected from the group consisting of glass cloth, glass nonwoven fabric, and paper. Manufacturing method for laminates.
JP59097291A 1984-05-14 1984-05-14 Manufacture of laminated plate for electric application Pending JPS60239228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59097291A JPS60239228A (en) 1984-05-14 1984-05-14 Manufacture of laminated plate for electric application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59097291A JPS60239228A (en) 1984-05-14 1984-05-14 Manufacture of laminated plate for electric application

Publications (1)

Publication Number Publication Date
JPS60239228A true JPS60239228A (en) 1985-11-28

Family

ID=14188395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59097291A Pending JPS60239228A (en) 1984-05-14 1984-05-14 Manufacture of laminated plate for electric application

Country Status (1)

Country Link
JP (1) JPS60239228A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199245A (en) * 1987-02-14 1988-08-17 Matsushita Electric Works Ltd Laminated board
JPH0732545A (en) * 1993-10-12 1995-02-03 Cmk Corp Coppered laminate
JPH0732543A (en) * 1993-10-12 1995-02-03 Cmk Corp Coppered laminate
JPH0747637A (en) * 1993-10-12 1995-02-21 Cmk Corp Copper clad laminated sheet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551551A (en) * 1978-10-06 1980-04-15 Chiyuukou Kasei Kogyo Kk Preparation of copper lined laminated board
JPS60199647A (en) * 1984-03-23 1985-10-09 松下電工株式会社 Laminated board for electricity

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551551A (en) * 1978-10-06 1980-04-15 Chiyuukou Kasei Kogyo Kk Preparation of copper lined laminated board
JPS60199647A (en) * 1984-03-23 1985-10-09 松下電工株式会社 Laminated board for electricity

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199245A (en) * 1987-02-14 1988-08-17 Matsushita Electric Works Ltd Laminated board
JPH0732545A (en) * 1993-10-12 1995-02-03 Cmk Corp Coppered laminate
JPH0732543A (en) * 1993-10-12 1995-02-03 Cmk Corp Coppered laminate
JPH0747637A (en) * 1993-10-12 1995-02-21 Cmk Corp Copper clad laminated sheet

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