JPH0732545A - Coppered laminate - Google Patents

Abstract

PURPOSE:To provide a print patchboard which can prevent bridges between circuits from taking place by inhibiting a flux or solder which enters from a through hole at the time of component mounting in the manufacturing processes of the print patchboard. CONSTITUTION:For a coppered laminate of a print patchbaord, which is constituted by laminating a copper foil 2 on one surface or both surfaces of an insulating layer 1 being formed by laminating a plurality of insulating sheets, an intermediate layer consisting of a bridge-preventing layer 3 which is impregnated with silicon or fluorocarbon resin is provided in the insulating layer 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper clad laminate used for forming a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a printed wiring board used for manufacturing a printed wiring board usually has a plurality of paper phenolic resin sheets which are heated and pressed to form an insulating substrate, and a copper foil is formed on one or both sides of the insulating substrate. So-called copper clad laminates that are laminated are used.

[0003]

However, in the case of manufacturing a printed wiring board using the copper clad laminate, after the required circuit pattern is formed by etching the copper foil,
When mounting the required electrical parts in the circuit pattern,
The solder resist film is coated on the circuit pattern, leaving lands for connecting electrical parts.However, as the circuit pattern becomes denser, bridging between adjacent circuits occurs. An invention has been developed in which a high density portion in a pattern is coated with the solder resist film again (Japanese Patent Publication No. 54-411).
62).

In addition, from the through holes for connecting the components, which are opened in the connection lands for mounting the electrical parts,
Since flux or solder enters and unnecessary bridges are generated in the circuit pattern, in order to prevent this, the adhesion of flux or solder is prevented with the purpose of preventing adhesion of flux or solder to the peripheral edge of the through hole. The applicant has already proposed an invention for providing a coating.

Therefore, according to the present invention, an electric component can be formed without forming a double solder resist coating required for mounting the electric component or forming a bridge prevention coating on the periphery of the component insertion hole. It is an object of the present invention to provide a copper-clad laminate capable of carrying out the mounting work of.

[0006]

The copper clad laminate of the present invention comprises:
A copper clad laminate obtained by laminating a copper foil on one side or both sides of an insulating layer formed by laminating a plurality of insulating sheets, comprising a bridge prevention layer in which the insulating layer is impregnated with silicon and / or a fluorine resin. It is configured by providing an intermediate layer.

[0007]

The copper-clad laminate of the present invention has the function of preventing the wetting of flux or solder by the bridge prevention layer impregnated with silicon and fluorine resin provided in the intermediate layer of the insulating layer.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the copper clad laminate of the present invention will be described below with reference to the drawings. The drawing is a partially enlarged sectional view showing an embodiment of the copper clad laminate of the present invention, in which 1 is an insulating layer formed by laminating a plurality of insulating sheets, and 2 is a copper provided on one surface of the insulating layer 1. It is a foil.

The intermediate sheet in the insulating sheet forming the insulating layer 1 is impregnated with silicon and a fluorine-based resin to form the bridge preventing layers 3 and 4.
In forming the impregnated layers of the bridge preventing layers 3 and 4 of silicon and a fluorine-based resin, the paper-based phenolic sheet used in the conventional formation of the insulating layer 1 is formed in advance with the silicon-based and fluorine-based resin. The insulating layer 1 is formed by impregnating the same with an intermediate layer forming portion of another plurality of paper phenolic sheets forming the insulating layer 1 and then laminated with heat and pressure by another plurality of paper phenolic sheets. At the same time as the formation of the
Can be formed as an intermediate layer.

Further, it is necessary to form an impregnated layer of a silicon-based resin and a fluorine-based resin formed separately from the above-mentioned paper phenolic sheet by replacing the intermediate layer of the sheet impregnated with a silicon-based resin and a fluorine-based resin. It is also possible to form a sheet for intermediate layer and form the sheet by interposing the sheet at a required position between the sheets for forming the insulating layer 1.

In addition, the impregnating layer can also be implemented by a sheet of silicon and a fluorine-based resin itself. In this case, the silicon-based and fluorine-based resin sheet is used as an intermediate layer between the insulating layer 1 and another insulating sheet. It is possible to form a copper clad laminate including the insulating layer 1 interposed therebetween.

Specific examples of the above-mentioned silicon-based and fluorine-based resins are shown below. (Silicon type) Polon L, Polon T, KF
96, KS-700, KS-701, KS-707, K
S-705F, KS-706, KS-709, KS-7
09S, KS-711, KSX-712, KS-62
F, KS-62M, KS-64, Silicolube
G-430, Silicone G-540, S
ilicolube G-541 or above SH-200, SH-210, SH-1109, SH- manufactured by Shin-Etsu Chemical Co., Ltd.
3109, SH-3107, SH-8011, FS-1
265, Syli-off23, DC panGlaz
e620 or above Die-free MS-443, MS-54 manufactured by Toray Silicon Co., Ltd.
3, MS-743, MS-043, ME-413, ME
-810 or more Fluorine FC-93, FC-95, FC-98, F manufactured by Daikin Industries, Ltd.
C-129, FC-134, FC-430, FC-43
1, FC-721 or more Sumitomo 3M Co., Ltd. Sumiflunon FP-81, FP-81R, FP-8
2, FP-84C, FP-84R, FP-86 and above Sumitomo Chemical Co., Ltd. Surflon SR-100, SR-100X and above Kiyomi Chemical Co., Ltd.

[0013]

According to the copper clad laminate of the present invention, since the bridge prevention layer impregnated with silicon and fluorine resin is provided in the intermediate layer of the insulating layer, the bridge prevention layer can be used for manufacturing a printed wiring board. It is possible to properly prevent the adhesion of flux or solder during the soldering process when mounting the electric component.

[Brief description of drawings]

FIG. 1 is a partially enlarged sectional view showing an embodiment of a copper clad laminate of the present invention.

[Explanation of symbols]

 1 Insulation layer 2 Copper foil 3 Intermediate layer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H05K 1/03 J 7011-4E (72) Inventor Hirotaka Kokonoki 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan Within CMK Co., Ltd. (72) Inventor Katsutomo Nikaido 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan Inside CMK Co., Ltd. (72) Norihito Mukai 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan

Claims (1)

[Claims] 1. A copper clad laminate obtained by laminating a copper foil on one side or both sides of an insulating layer formed by laminating a plurality of insulating sheets, wherein the insulating layer is impregnated with silicon and / or a fluorine-based resin. A copper clad laminate characterized by being constituted by providing an intermediate layer comprising a bridge prevention layer.