JPH0747639A - Copper clad laminated sheet - Google Patents

Abstract

PURPOSE:To provide a printed wiring board capable of preventing the bridge between circuits by obstructing the flux or solder penetrating from a through- hole part at the time of the mounting of parts during a printed wiring board manufacturing process. CONSTITUTION:In a copper clad laminated sheet for a printed wiring board obtained by laminating copper foil 2 to the single surface or both surfaces of an insulating layer 1 formed by laminating a plurality of insulating sheets, an intermediate layer composed of a bridge preventing layer 3 impregnated with a silicon and a fluoroplastic is provided in the insulating layer 1 and a bridge preventing film 4 impregnated with a silicon and a fluoroplastic is provided to the surface of the insulating layer on a part inserting side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper clad laminate used for forming a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a printed wiring board used for manufacturing a printed wiring board usually has a plurality of paper phenolic resin sheets which are heated and pressed to form an insulating substrate, and a copper foil is formed on one or both sides of the insulating substrate. So-called copper clad laminates that are laminated are used.

[0003]

However, in the case of manufacturing a printed wiring board using the copper clad laminate, after the required circuit pattern is formed by etching the copper foil,
When mounting the required electrical parts in the circuit pattern,
The solder resist film is coated on the circuit pattern, leaving lands for connecting electrical parts.However, as the circuit pattern becomes denser, bridging between adjacent circuits occurs. An invention has been developed in which a high density portion in a pattern is coated with the solder resist film again (Japanese Patent Publication No. 54-411).
62).

In addition, from the through holes for connecting the components, which are opened in the connection lands for mounting the electrical parts,
Since flux or solder enters and unnecessary bridges are generated in the circuit pattern, in order to prevent this, the adhesion of flux or solder is prevented with the purpose of preventing adhesion of flux or solder to the peripheral edge of the through hole. The applicant has already proposed an invention for providing a coating.

Therefore, according to the present invention, an electric component can be formed without forming a double solder resist coating required for mounting the electric component or forming a bridge prevention coating on the periphery of the component insertion hole. It is an object of the present invention to provide a copper-clad laminate capable of carrying out the mounting work of.

[0006]

The copper clad laminate of the present invention comprises:
In a copper-clad laminate obtained by laminating copper foil on one or both sides of an insulating layer formed by laminating a plurality of insulating sheets, an intermediate layer comprising a bridge prevention layer impregnated with silicon and a fluorine resin in the insulating layer. And a bridge prevention film impregnated with silicon and a fluorine resin on the surface layer on the component insertion side.

[0007]

The copper-clad laminate of the present invention has an action of preventing the wetting of flux or solder by the bridge prevention layer impregnated with silicon and fluorine resin provided on the intermediate layer in the insulating layer and the surface layer on the component insertion side. Have.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the copper clad laminate of the present invention will be described below with reference to the drawings. The drawing is a partially enlarged sectional view showing an embodiment of the copper clad laminate of the present invention, in which 1 is an insulating layer formed by laminating a plurality of insulating sheets, and 2 is a copper provided on one surface of the insulating layer 1. It is a foil.

Thus, the bridge prevention layers 3 and 4 are formed by impregnating the intermediate sheet in the insulation sheet forming the insulation layer 1 and the surface layer sheet on the component insertion side with silicon and a fluorine resin. . This anti-bridge layer 3,
In forming the impregnated layer of silicon and fluorine-based resin of 4, when forming the paper phenolic sheet used in forming the conventional insulating layer 1, it is formed by previously impregnating silicon and fluorine-based resin into the sheet, Forming the insulating layer 1 by heating and pressurizing with a plurality of other paper phenol sheets after stacking and stacking this on the intermediate layer forming portion and the surface layer forming portion of the other plurality of paper phenol sheets forming the insulating layer 1 At the same time, it is possible to form the intermediate layer 3 and the surface bridge preventing layers 3 and 4.

Further, it is necessary to form an impregnated layer of a silicon-based resin and a fluorine-based resin formed separately from the above-mentioned paper phenolic sheet by replacing the intermediate layer of the sheet impregnated with a silicon-based resin and a fluorine-based resin. It is also possible to form a sheet for intermediate layer and form the sheet by interposing the sheet at a required position between the sheets for forming the insulating layer 1.

In addition, the impregnating layer can also be implemented by a sheet of silicon and a fluorine-based resin itself. In this case, the insulating layer 1 is an insulating layer in which a silicon-based and a fluorine-based resin sheet is laminated as an intermediate layer and a surface layer. A copper clad laminate composed of 1 can be formed.

Specific examples of the above-mentioned silicon-based and fluorine-based resins are shown below. (Silicone type) Polon L, Polon T, KF96, KS-7
00, KS-701, KS-707, KS-705F,
KS-706, KS-709, KS-709S, KS-
711, KSX-712, KS-62F, KS-62
M, KS-64, Silicolube G-430,
Silicolube G-540, Silicolu
be G-541 or above SH-200, SH-210, SH-1109, SH- manufactured by Shin-Etsu Chemical Co., Ltd.
3109, SH-3107, SH-8011, FS-1
265, Syli-off23, DC panGlaz
More than e620 Tore Silicon Co., Ltd. (Fusso system) Die-free MS-443, MS-543, MS-74
3, MS-043, ME-413, ME-810 or more Fluorine FC-93, FC-95, FC-98, F manufactured by Daikin Industries, Ltd.
C-129, FC-134, FC-430, FC-43
1, FC-721 or more Sumitomo 3M Co., Ltd. Sumiflunon FP-81, FP-81R, FP-8
2, FP-84C, FP-84R, FP-86 and above Sumitomo Chemical Co., Ltd. Surflon SR-100, SR-100X and above Kiyomi Chemical Co., Ltd.

[0013]

According to the copper-clad laminate of the present invention, since the insulating layer is provided with the bridge preventing layer impregnated with silicon and a fluorine-based resin in the intermediate layer and the surface layer of the insulating layer, both bridge preventing layers can be formed. Adhesion of flux or solder at the time of soldering at the time of mounting an electric component in manufacturing a printed wiring board can be appropriately prevented.

[Brief description of drawings]

FIG. 1 is a partially enlarged sectional view showing an embodiment of a copper clad laminate of the present invention.

[Explanation of symbols]

 1 Insulating layer 2 Copper foil 3 Intermediate layer 4 Surface layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirotaka Kokonoki 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture Japan CMC Co., Ltd. (72) Inventor Norihi Mukai 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK Corporation

Claims (1)

[Claims] 1. A copper clad laminate comprising an insulating layer formed by laminating a plurality of insulating sheets and a copper foil laminated on one or both sides of the insulating layer, wherein the insulating layer is impregnated with silicon and a fluorine resin to prevent bridges. A copper-clad laminate characterized by being constituted by providing an intermediate layer consisting of layers and providing an anti-bridge film impregnated with silicon and fluorine resin on the surface layer on the component insertion side.