JPH0732543A - Coppered laminate - Google Patents

Abstract

PURPOSE:To prevent bridges between circuits from occurring by inhibiting a flux or solder which enters from a through hole at the time of component- mounting in the manufacturing process of a print patch-board. CONSTITUTION:For a coppered lamiante of a print patchboard, for which on one surface or both surfaces of an insulating layer 1 formed by laminating a copper foil 2 on one surface or both surfaces of an insulating layer 1 formed by laminating a plurality of insulating sheets, an intermediate layer consisting of a bridge-preventing layer for which a fluorocarbon resin is impregnated is provided in the insulating layer 1. At the same time, a bridge-preventing layer 4 for which the fluorocarbon resin is impregnated is provided on the surface layer on the side where a component is inserted, to constitute the coppered laminate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper clad laminate used for forming a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a printed wiring board used for manufacturing a printed wiring board usually has a plurality of paper phenolic resin sheets which are heated and pressed to form an insulating substrate, and a copper foil is formed on one or both sides of the insulating substrate. So-called copper clad laminates that are laminated are used.

[0003]

However, in the case of manufacturing a printed wiring board using the copper clad laminate, after the required circuit pattern is formed by etching the copper foil,
When mounting the required electrical parts in the circuit pattern,
The solder resist film is coated on the circuit pattern, leaving lands for connecting electrical parts.However, as the circuit pattern becomes denser, bridging between adjacent circuits occurs. An invention has been developed in which a high density portion in a pattern is coated with the solder resist film again (Japanese Patent Publication No. 54-411).
62).

In addition, from the through holes for connecting the components, which are opened in the connection lands for mounting the electrical parts,
Since flux or solder enters and unnecessary bridges are generated in the circuit pattern, in order to prevent this, the adhesion of flux or solder is prevented with the purpose of preventing adhesion of flux or solder to the peripheral edge of the through hole. The applicant has already proposed an invention for providing a coating.

Therefore, according to the present invention, an electric component can be formed without forming a double solder resist coating required for mounting the electric component or forming a bridge prevention coating on the periphery of the component insertion hole. It is an object of the present invention to provide a copper-clad laminate capable of carrying out the mounting work of.

[0006]

The copper clad laminate of the present invention comprises:
In a copper clad laminate obtained by laminating a copper foil on one or both sides of an insulating layer formed by laminating a plurality of insulating sheets, an intermediate layer composed of a bridge prevention layer impregnated with a fluorine resin is provided in the insulating layer. In addition, a bridge prevention layer impregnated with a fluororesin is provided on the surface layer on the component insertion side.

[0007]

The copper clad laminate of the present invention has the function of preventing the flux or solder from getting wet by the bridge prevention layer impregnated with the fluorine-based resin provided on the intermediate layer in the insulating layer and the surface layer on the component insertion side.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the copper clad laminate of the present invention will be described below with reference to the drawings. The drawing is a partially enlarged sectional view showing an embodiment of the copper clad laminate of the present invention, in which 1 is an insulating layer formed by laminating a plurality of insulating sheets, and 2 is a copper provided on one surface of the insulating layer 1. It is a foil.

Thus, the intermediate sheet in the insulating sheet forming the insulating layer 1 and the surface layer sheet on the component insertion side are impregnated with a fluorine resin to form the bridge preventing layers 3 and 4. When forming the impregnated layer of the fluorine-based resin of the bridge prevention layers 3 and 4, when forming the paper phenol sheet used for forming the conventional insulating layer 1, it is formed by impregnating the fluorine-based resin with the sheet in advance. The insulating layer 1 is formed by interposing and stacking it on the intermediate layer forming portion and the surface layer forming portion of the other plurality of paper phenol sheets forming the insulating layer 1, and then heating and pressing with the other plurality of paper phenol sheets. It is possible to form the bridge preventing layers 3 and 4 simultaneously with the formation of the above.

Further, a sheet for an intermediate layer necessary for forming an impregnated layer of a fluorine-based resin formed separately from the sheet phenolic sheet impregnated with the fluorine-based resin in place of the intermediate layer of the sheet. It is also possible to form by interposing this at a required position between the sheets for forming the insulating layer 1.

In addition, the bridging prevention layers 3 and 4 can also be implemented by using a fluorine resin sheet itself. In this case, the insulating layer 1 has a fluorine resin layer as an intermediate layer and a surface layer. It is possible to form a copper clad laminate made of.

Specific examples of the above-mentioned fluorine-based resin are shown below. (Fusso type) Die-free MS-443, MS-54
3, MS-743, MS-043, ME-413, ME
-810 or more Fluorine FC-93, FC-95, FC-98, F manufactured by Daikin Industries, Ltd.
C-129, FC-134, FC-430, FC-43
1, FC-721 or more Sumitomo 3M Co., Ltd. Sumiflunon FP-81, FP-81R, FP-8
2, FP-84C, FP-84R, FP-86 and above Sumitomo Chemical Co., Ltd. Surflon SR-100, SR-100X and above Kiyomi Chemical Co., Ltd.

[0013]

According to the copper clad laminate of the present invention, since the bridge preventing layer impregnated with the fluorine resin is provided in the intermediate layer and the surface layer of the insulating layer, the bridge preventing layers of both of the two prevent the printed wiring board from forming. Adhesion of flux or solder during soldering processing during mounting of electric components during manufacturing can be properly prevented.

[Brief description of drawings]

FIG. 1 is a partially enlarged sectional view showing an embodiment of a copper clad laminate of the present invention.

[Explanation of symbols]

 1 Insulating layer 2 Copper foil 3 Intermediate layer 4 Surface layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirotaka Kokonoki 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture Japan CMC Co., Ltd. (72) Inventor Norihi Mukai 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK Corporation

Claims (1)

[Claims] 1. A copper clad laminate comprising an insulating layer formed by laminating a plurality of insulating sheets and copper foil laminated on one or both sides of the insulating layer, wherein the insulating layer is impregnated with a fluorine resin to prevent bridging. A copper clad laminate, characterized in that a bridge prevention layer impregnated with a fluororesin is provided on the surface layer on the component insertion side while providing the intermediate layer.