KR101085576B1 - Method for fabricating printed-circuit-board using metal and printed-circuit-board fabricated using thereof - Google Patents

Abstract

The present invention relates to a method for manufacturing a printed circuit board using a metal and a printed circuit board manufactured using the same, and solves a problem that a conventional prepreg core has a high price and is weak in mechanical properties, thereby inhibiting thinning. To this end, providing a copper clad laminated film (CCL) with a copper foil layer formed on at least one of the upper and lower surfaces of the insulating layer, forming a carrier metal panel on the copper foil layer, Forming a photosensitive material layer on the carrier metal panel, exposing and developing the photosensitive material layer to form a photosensitive material pattern exposing a predetermined area of the via hole, and exposing the photosensitive material layer to an exposed area of the photosensitive material pattern Embedding a plating layer to form a via contact, and separating the copper foil layer and the carrier metal panel, thereby forming the photosensitive water. Forming a substrate including the via contact, forming a dry film on both sides of the substrate, and performing an exposure process, an etching process, and a strip process on the dry film to define a printed circuit pattern. Forming a dry film pattern; forming a circuit pattern by etching the carrier metal panel using the dry film pattern as a mask; and forming a surface treatment layer on the circuit pattern. It is about a method.

Description

METHOD FOR FABRICATING PRINTED-CIRCUIT-BOARD USING METAL AND PRINTED-CIRCUIT-BOARD FABRICATED USING THEREOF}

The present invention relates to a method for manufacturing a printed circuit board using a metal, and a printed circuit board manufactured using the same, by using a metal-based substrate instead of a conventional prepreg, a thin printed circuit board having a high density circuit pattern It relates to a technology that can be easily manufactured.

With the development of the electronics industry, electronic components have become highly functional and miniaturized. In particular, there is an increasing demand for reducing the thickness of components mounted in order to reduce the thickness of portable terminals.

In such a situation, in order to increase the fine pattern formation and the design density of the multilayer printed circuit board and to improve the reliability, a structure for complexing the layer structure of the circuit with the change of the raw material is required. Accordingly, parts are also changed from DIP (Dual In-Line Package) type to Surface Mount Technology (SMT) type, and mounting density is also increasing.

In addition, the portable circuit board has become more complicated, and the design of the printed circuit board has become complicated due to high functionality, internet, video, and high capacity data transmission.

On the other hand, a printed circuit board includes a single-sided PCB in which wiring is formed only on one side of an insulated substrate, a double-sided PCB in which wiring is formed on both sides, and an MLB (Multi Layered Board) which is wired in multiple layers. In the past, single-sided PCBs were used because of simple components and simple circuit patterns. However, in recent years, due to increased complexity of circuits and increased demand for high-density and miniaturized circuits, it is common to use double-sided PCBs or MLBs. have.

The printed circuit board is applied with a circuit pattern for higher density, a via contact and a fine circuit wiring for electrical conduction between circuit pattern layers.

1 is a cross-sectional view showing a printed circuit board structure according to the prior art.

Referring to FIG. 1, a circuit pattern 30 is formed on one surface of a substrate 10, and a solder ball pad 40 for mounting an electronic component is formed on a rear surface of the substrate 10. Next, a via hole penetrating the substrate 10 is formed, and a metal layer is formed on the inner wall of the hole to form a via contact 20 for interlayer conduction. Next, the surface treatment layer 50 and the solder resist 60 for protecting the circuit pattern 30 and the solder ball pad 40 are formed.

Such a printed circuit board is formed based on a prepreg (PPG) core included in a copper clad laminate (CCL), which is a disc. As the prepreg, a resin impregnated with glass fiber is generally used. However, the thus formed prepreg core is expensive and there is a problem that the mechanical properties are very weak. Therefore, a problem may occur that damages the substrate during a drilling process, a copper plating process, a dry film manufacturing process, and a solder mask forming process in the printed circuit board manufacturing process.

In addition, when using an epoxy-based core has a problem that the moisture absorption is good, it is difficult to apply to a multilayer printed circuit board.

As described above, in accordance with the trend of high functionality and miniaturization of electronic products, printed circuit boards are also increasingly becoming highly functional, high density, and slim. However, prepreg or epoxy substrate materials that are currently commonly used are limited in following the flow.

The present invention is to form a printed circuit board using a copper foil laminated film, if the conventional method using a prepreg layer of a copper foil laminated film as a core, in the present invention to form a carrier metal panel on the copper foil layer, It is an object of the present invention to provide a method of manufacturing a printed circuit board using a metal which has excellent mechanical properties and prevents moisture absorption by providing a printed circuit board manufacturing method used as a core, and a printed circuit board manufactured using the same. .

Printed circuit board manufacturing method using a metal according to an embodiment of the present invention comprises the steps of providing a copper clad laminated film (Copper Clad Laminated; CCL) is formed on at least one of the upper surface and the lower surface of the insulating layer, and Forming a carrier metal panel on the copper foil layer, forming a photosensitive material layer on the carrier metal panel, and exposing and developing the photosensitive material layer to expose a predetermined region of the via hole. Forming a via contact by embedding a plating layer in an exposed region of the photosensitive material pattern, separating the copper foil layer and the carrier metal panel, and comprising the photosensitive material and including the via contact. Forming a core substrate, forming a dry film on both sides of the core substrate, and exposing the dry film Forming a dry film pattern defining a printed circuit pattern by etching, etching, and stripping processes; forming a circuit pattern by etching the carrier metal panel using the dry film pattern as a mask; and the circuit It characterized in that it comprises the step of forming a surface treatment layer on the pattern.

By using a carrier metal panel instead of a prepreg substrate or an epoxy substrate, the present invention can improve mechanical properties of a printed circuit board, prevent moisture absorption, prevent deformation of the substrate, and easily implement ultra-thin printing. It provides the effect of improving the productivity of the circuit board and reducing the manufacturing cost.

The present invention uses a conventional copper clad laminated film (CCL) as it is, by further forming a carrier metal panel and a photosensitive material layer on the copper foil layer and proceeding to the process of manufacturing a printed circuit board, manufacturing a thin printed circuit board more easily can do.

Hereinafter, a method of manufacturing a printed circuit board using a metal and a printed circuit board manufactured using the same will be described in detail based on the above object of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent with reference to the embodiments and drawings described in detail below. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various different forms, and the present embodiments only make the disclosure of the present invention complete, and it is common in the art to which the present invention pertains. It is provided to fully inform the scope of the invention to those skilled in the art, the invention being defined only by the scope of the claims.

2 is a cross-sectional view showing a printed circuit board structure according to the present invention.

2, the core layer of the printed circuit board according to the present invention is composed of a photosensitive material pattern (100). In the region between the photosensitive material patterns 100, a via contact 120 is formed by a copper plating process, and a circuit pattern 150 formed as a carrier metal panel pattern is formed on one surface of the photosensitive material pattern 100. Next, a solder ball pad 130 may be formed on the via contact 120 of the surface where the circuit pattern 150 is not formed, and the surface treatment layer 140 may be formed on the solder ball pad 130 and the circuit pattern 150. This is further formed.

Compared with FIG. 1, the printed circuit board according to the present invention may be formed in a simpler structure and may be advantageous in thinning. In particular, it can be seen that the drill process for forming the via contact can be omitted, and thus the printed circuit board manufacturing process is optimized for manufacturing a thin substrate.

3A to 3H are cross-sectional views illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 3A, a copper foil laminated film 230 having a copper foil layer 210 formed on one surface of an upper surface and a lower surface of the insulating layer 200 is provided. At this time, the copper foil layer 210 is preferably formed to a thickness of 2 ~ 4㎛. In addition, although the insulating layer 200 may use a conventional prepreg substrate, since the prepreg is inferior in price competitiveness and weak in strength, in the present invention, the insulating layer having higher strength and lower hygroscopicity than the prepreg or epoxy is used. It is preferable to use. In addition, in the prior art, an effort to minimize the thickness of the copper-clad laminated film was required to reduce the thickness of the printed circuit board, but in the present invention, the printed circuit board may be easily manufactured without such an effort. This is possible because the insulating layer 200 of the copper-clad laminated film 230 is not used as the core layer of the printed circuit board in the present invention. In the present invention, a carrier metal panel 220 formed on the copper foil layer 210 is used as a core layer for manufacturing a printed circuit board. Here, the carrier metal panel 220 refers to a metal foil layer which is originally formed to protect the copper foil layer 210, and is preferably formed to have a thickness of 16 to 20 μm. At this time, the carrier metal panel 220 acts as a core layer in the initial stage for the printed circuit board manufacturing process, but is formed as a circuit pattern in the subsequent process, the thickness can be adjusted according to the thickness of the circuit pattern. In addition, it is preferable to use a copper foil (Cu Foil) for the circuit pattern configuration.

Referring to FIG. 3B, a photosensitive material layer 240 is formed on the carrier metal panel 220. In this case, since the photosensitive material layer 240 serves as a substantial core of the substrate in a subsequent process, the thickness of the photosensitive material layer 240 may be adjusted to freely adjust the thickness of the printed circuit board. In addition, the photosensitive material layer is preferably formed using a kind of material including a dry film solder resist (DFSR) or a liquid photosensitive material. Here, when the DFSR material is used, the photosensitive material layer 240 is formed by a lamination process, and when the liquid photosensitive material is used, the photosensitive material layer 240 is formed by a coating and drying process.

Referring to FIG. 3C, the photosensitive material layer 240 is exposed and developed to form a photosensitive material pattern 245 exposing the via hole predetermined region. In this case, the exposure and development processes exposing the predetermined area of the via hole are substituted for the conventional drill process, and have more advantageous characteristics in terms of stability and cost.

Referring to FIG. 3D, a copper plating process is performed to fill the exposed via hole planning area. In the present invention, the via contact 260 may be easily formed by such a process.

Referring to FIG. 3E, the copper foil layer 210 and the carrier metal panel 220 are separated to form a core substrate 270 for manufacturing a printed circuit board. Here, the carrier metal panel 220 is responsible for the core layer supporting the printed circuit board. In this case, since the carrier metal panel 220 acts as a release layer, separation with the copper foil layer 210 may be easily performed.

Referring to FIG. 3F, dry films 280 and 285 are formed on both surfaces of the core substrate 270. At this time, in order to manufacture a single-sided printed circuit board having a printed circuit pattern on only one surface, the dry film on the surface on which the circuit pattern is formed and the surface on which the circuit pattern is not formed should be controlled. In this case, since the carrier metal panel 220 is patterned to form a circuit pattern, a dry film pattern defining a printed circuit pattern is formed by performing exposure and development processes on the lower dry film 285 adjacent thereto.

Referring to FIG. 3G, the carrier metal panel 220 is etched using the lower dry film 285 as a mask to form a circuit pattern 290. Next, a strip process is performed to remove all the dry films 280 and 285 remaining on the upper and lower portions of the photosensitive material pattern 245.

Here, the developing process (Develop) and the etching of the carrier metal panel 220 and the strip process (Strip) to remove the dry film of Figure 3f collectively referred to as a DES process, Figures 3f and 3g It should be shown between, but it is omitted because it is a process generally used in the method of manufacturing a printed circuit board.

Referring to FIG. 3H, a surface treatment layer 295 may be formed to protect the exposed via contact 260 and the circuit pattern 290.

Next, a routing and punching process is performed as a finishing process.

The printed circuit board manufactured by such a process is given mechanical properties by the carrier metal panel, thereby easily overcoming the damage caused in the via contact and circuit pattern forming process. In addition, since the thickness of the printed circuit board can be freely adjusted by adjusting the thickness of the photosensitive material layer, the thin printed circuit board can be freely formed in accordance with the latest trend.

In addition, a single-sided printed circuit board was formed by using the copper foil laminated film having the copper foil layer formed on the cross section as described above, and the productivity may be doubled by using the double-sided copper foil laminated film. In addition, when using a double-sided copper foil laminated film, it is also possible to easily form a double-sided printed circuit board.

4A through 4E are cross-sectional views illustrating a method of manufacturing a printed circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 4A, a double-sided copper foil laminated film 330 having first and second copper foil layers 310 and 320 formed on the top and bottom surfaces of the insulating layer 300, respectively.

Next, a first carrier metal panel 315 and a second carrier metal panel 325 are formed on the first and second copper foil layers 310 and 320, respectively.

Referring to FIG. 4B, a first photosensitive material layer 340 and a second photosensitive material layer 350 are formed on the first carrier metal panel 315 and the second carrier metal panel 325, respectively.

Referring to FIG. 4C, a first photosensitive material pattern 345 and a second photosensitive material pattern exposing and developing a via contact region by exposing and developing the first photosensitive material layer 340 and the second photosensitive material layer 350. 355 are formed respectively. In this case, the via hole formed in the first photosensitive material layer 340 and the via hole formed in the second photosensitive material layer 345 may be matched in a symmetrical form.

Referring to FIG. 4D, a copper plating process is performed to fill a region between the first photosensitive material pattern 345 and the second photosensitive material pattern 355, and the first via contact 360 and the second via contact 370. To form.

Referring to FIG. 4E, the first copper foil layer 310 and the first carrier metal panel 315 are separated to form a first core substrate, and the second copper foil layer 320 and the second carrier metal panel 325. Are separated to form a second core substrate.

Here, the first core board and the second core board may be formed of a single-sided printed circuit board as shown in FIG. 3H when used independently of each other.

As described above, according to the method for manufacturing a printed circuit board according to the present invention, it is possible to easily manufacture a single-sided printed circuit board or a double-sided printed circuit board having a circuit pattern on both sides by using a double-sided copper foil laminated film. This is made possible by solving the problem in the present invention by using a prepreg layer of a copper foil laminated film as a core layer of a printed circuit board. In other words, by forming a carrier metal panel on the copper-clad laminated film in the subsequent process, the carrier metal panel to act as a core layer in the intermediate process for manufacturing a printed circuit board, to improve the mechanical strength and to obtain a moisture absorption prevention effect It is. In addition, if the mechanical strength is improved, since the thickness of the printed circuit board can be reduced by a corresponding amount of strength, the printed circuit board manufacturing method according to the present invention has an advantage of being easily thinned at low cost. to provide.

In addition, by using the core substrate consisting of the carrier metal panel and the photosensitive material layer used in the present invention, the MLB (Multi Layered Board) can be easily manufactured by applying the above-described substrate manufacturing method.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments and can be modified in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a cross-sectional view showing a printed circuit board structure according to the prior art.

Figure 2 is a cross-sectional view showing a printed circuit board structure according to the present invention.

3A to 3H are cross-sectional views illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.

4A to 4E are cross-sectional views illustrating a method of manufacturing a printed circuit board according to another exemplary embodiment of the present invention.

Claims (6)

Providing a copper clad laminated film (CCL) having a copper foil layer formed on at least one of an upper surface and a lower surface of the insulating layer; Forming a carrier metal panel having a thickness of 16 to 20 μm on the copper foil layer; Forming a photosensitive material layer on the carrier metal panel; Exposing and developing the photosensitive material layer to form a photosensitive material pattern exposing the via hole predetermined region; Embedding a plating layer in an exposed region of the photosensitive material pattern to form a via contact; Separating the copper foil layer and the carrier metal panel to form a core substrate made of the photosensitive material and including the via contact; Forming a dry film on both sides of the core substrate; Forming a dry film pattern defining a printed circuit pattern by performing an exposure process, an etching process, and a strip process on the dry film; Etching the carrier metal panel using the dry film pattern as a mask to form a circuit pattern; And Printed circuit board manufacturing method using a metal comprising the step of forming a surface treatment layer on the circuit pattern. The method of claim 1, Printed circuit board manufacturing method using a metal, characterized in that the copper foil layer is formed to a thickness of 2 ~ 4㎛. delete The method of claim 1, The carrier metal panel is a printed circuit board manufacturing method using a metal, characterized in that using a copper foil (Cu foil). The method of claim 1, The photosensitive material layer (Photosensitive Material) is a printed circuit board manufacturing method using a metal, characterized in that made of a material containing a dry film solder resist (DFSR) or a liquid photosensitive material. Printed circuit board manufactured by the method of claim 1.

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