JPH0262383B2 - - Google Patents
Info
- Publication number
- JPH0262383B2 JPH0262383B2 JP60230432A JP23043285A JPH0262383B2 JP H0262383 B2 JPH0262383 B2 JP H0262383B2 JP 60230432 A JP60230432 A JP 60230432A JP 23043285 A JP23043285 A JP 23043285A JP H0262383 B2 JPH0262383 B2 JP H0262383B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- fluororesin
- base material
- impregnated
- tetrafluoroethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 54
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 27
- 230000008018 melting Effects 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 17
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 229920006026 co-polymeric resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229920002313 fluoropolymer Polymers 0.000 claims 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 44
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 44
- 239000004744 fabric Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- 229920001780 ECTFE Polymers 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- -1 polychlorotrifluoroethylene Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
Landscapes
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Description
〔技術分野〕
この発明は、電子機器等に用いられる電気用積
層板の製法に関する。
〔背景技術〕
電気用積層板は、一般に、樹脂含浸基材（プリ
プレグ）を所定枚、必要に応じて金属箔とともに
積層成形することによりつくられる。
〔発明の目的〕
この発明は、成形性が非常に優れたものを得る
ことのできる電気用積層板の製法を提供すること
を目的とする。
〔発明の開示〕
発明者は、従来の製法を改良することにより、
前記目的を達成しようとして研究を重ねた。その
結果、基材に含浸させるフツ素樹脂として、四フ
ツ化エチレン樹脂および四フツ化エチレン樹脂よ
りも融点が低くかつ流動性が良いフツ素樹脂を用
い、樹脂含浸基材の間および最外層の樹脂含浸基
材の外側にフツ素樹脂層を設けるようにし、フツ
素樹脂層の樹脂としても四フツ化エチレン樹脂お
よび四フツ化エチレン樹脂よりも融点が低くかつ
流動性が良いフツ素樹脂を用いて積層成形すれ
ば、成形性が非常に優れるなどいつそう性能が向
上するということを見出し、この発明を完成し
た。
したがつて、この発明は、フツ素樹脂を基材に
含浸させてなる樹脂含浸基材を、間にフツ素樹脂
層を介在させるとともに両外面の樹脂含浸基材の
外側にもフツ素樹脂層を設けるようにして、所定
枚積層成形する電気用積層板の製法であつて、前
記基材に含浸させるフツ素樹脂および前記フツ素
樹脂層の樹脂として、四フツ化エチレン樹脂およ
び四フツ化エチレン樹脂よりも融点が低くかつ流
動性が良いフツ素樹脂を用いることを特徴とする
電気用積層板の製法を要旨としている。
以下に、この発明を詳しく説明する。
なお、ここで、成形性が優れているとは、外観
的に未溶融（不透明）の部分が全くなく、かつ、
板厚精度が優れていることを言う。
この発明で用いる四フツ化エチレン樹脂（以
下、「PTFE」と略す）よりも融点が低くかつ流
動性が良いフツ素樹脂としては、特に限定しない
が、たとえば、四フツ化エチレン−六フツ化プロ
ピレン共重合樹脂（以下、「FEP」と略す）、四
フツ化エチレン−パーフルオロアルキルビニルエ
ーテル共重合樹脂（以下、「PFA」と略す）、ポ
リクロロトリフルオロエチレン（PCTFE）、ポ
リフツ化ビニリデン（PVDF）、ポリフツ化ビニ
ル（PVF）、テトラフルオロエチレン−エチレン
共重合体（ETFE）、クロロトリフルオロエチレ
ン−エチレン共重合体（ECTFE）などがあげら
れ、それぞれ単独でまたは２種以上混合するなど
して用いられる。なかでもFEPとPFAは、融点
以外の特性がPTFEに近く優れているので好まし
い。
この発明にかかる電気用積層板の製法は、
PTFEおよびPTFEよりも融点が低くかつ流動性
が良いフツ素樹脂を基材に含浸させてなる樹脂含
浸基材を用いる。このような樹脂含浸基材は、具
体的には、たとえば、基材を、PTFEとPTFEよ
りも融点が低くかつ流動性が良いフツ素樹脂とを
混合してなる樹脂のデイスパージヨン、または、
PTFEデイスバージヨンにPTFEよりも融点が低
くかつ流動性が良いフツ素樹脂デイスパージヨン
を混合したものなどに漬けたり、PTFEとPTFE
よりも融点が低くかつ流動性が良いフツ素樹脂と
を混合してなる樹脂のデイスパージヨン、また
は、PTFEデイスパージヨンにPTFEよりも融点
が低くかつ流動性が良いフツ素樹脂デイスパージ
ヨンを混合したものなどを基材に塗布したりして
基材にPTFEおよびPTFEよりも融点が低くかつ
流動性が良いフツ素樹脂を含浸させたのち、基材
を加熱して乾燥させたり、または、PTFEよりも
融点が低くかつ流動性が良いフツ素樹脂および
PTFEを溶融させること（焼成）により得ること
ができるが、これらの方法に限られない。
この発明で用いる、基材に含浸させるフツ素樹
脂としては、PTFEおよびPTFEよりも融点が低
くかつ流動性が良いフツ素樹脂であれば特に限定
しないが、PTFEを100重量部（以下、「部」と略
す）に対してPTFEよりも融点が低くかつ流動性
が良いフツ素樹脂を0.5〜100部の割合で混合した
ものが好ましい。その範囲の下限よりも少ない割
合だと成形性の向上がはかれなくなるおそれがあ
り、上限よりも多い割合だと全体の融点が低下
し、耐熱性などが悪くなるおそれがある。
この発明で用いる基材としては、ガラス布等の
布、ガラス布織布等の不織布、紙、その他電気用
積層板の製造用として一般に用いられているもの
が用いられる。
前記のような樹脂含浸基材所定枚を、樹脂含浸
基材間にフツ素樹脂層を介在させるようにして重
ね合わせるとともに、両外面の樹脂含浸基材の外
側にもフツ素樹脂層を設ける。そして、必要に応
じてその少なくとも片面に銅箔等の金属箔を重ね
合わせ、積層成形して電気用積層板を得る。
この発明で用いるフツ素樹脂層の樹脂として
は、PTFEおよびPTFEよりも融点が低くかつ流
動性が良いフツ素樹脂が用いられ、フツ素樹脂層
を個々にみれば、それら両者のいずれか一方のみ
または両方ともに用いられ（それら両者が混合さ
れて用いられてもよいし、それら両者が別々の層
で互いに重ね合わされていてもよい。）、１つの電
気用積層板全体でみれば、それら両者がともに用
いられる。なお、フツ素樹脂層としては、塗布な
どによつて設けることもできるが、フイルム（フ
ツ素系フイルム）等の形で用いられるとよい。フ
イルムの形で用いるとフツ素樹脂層の厚み調節が
しやすいからである。フイルムは、切削法、カレ
ンダー法、キヤステイング法などにより作製して
用いたり、市販品が用いられたりする。フイルム
を用いる場合、PTFEよりも融点が低くかつ流動
性が良いフツ素樹脂からなるフイルムの使用枚数
は、フイルムの厚み、使用する樹脂含浸基材の枚
数にもよるが、１枚以上樹脂含浸基材枚数以下の
範囲程度で効果がある。PTFEよりも融点が低く
かつ流動性が良いフツ素樹脂からなるフイルムの
使用枚数が１〜４枚程度の場合、任意の位置に設
ければ良いが、成形性を重視する場合は、PTFE
よりも融点が低くかつ流動性が良いフツ素樹脂か
らなるフイルムを設ける位置が、電気用積層板の
表面に近いほど効果が大きくなる。たとえば、
PTFEよりも融点が低くかつ流動性が良いフツ素
樹脂からなるフイルムを、両外面の樹脂含浸基材
の外側および／またはその樹脂含浸基材とそのす
ぐ内側の樹脂含浸基材との間（樹脂含浸基材を２
枚しか使用しない場合はこれらの間）に設けるよ
うにするのがよいが、これに限るものではない。
積層成形の条件は、特に限定しないが、温度
340〜400℃、圧力１〜100Kg／cm2、時間10〜180分
が好ましい。
この発明の電気用積層板の製法によれば、前記
のような樹脂含浸基材を使用し、樹脂含浸基材の
間に前記のようなフツ素樹脂層を介在させるとと
もに両外面の樹脂含浸基材の外側にも前記のよう
なフツ素樹脂層を設けるようにして積層成形する
ようにしているので、未溶融であり不透明な部分
が皆無でしかも板厚精度が向上した、すなわち、
成形性が非常に優れた電気用積層板を得ることが
できる。得られた電気用積層板は、打抜加工性、
耐湿性、耐熱性、電気特性などの他の特性も向上
している。
つぎに、実施例および比較例を示す。
実施例 １
第１表に示す割合で混合したフツ素樹脂をガラ
ス布（日東紡績(株)WE05E）に含浸させたのち焼
成して、レジンコンテント60％、厚み0.06mmの樹
脂含浸基材をつくつた。この樹脂含浸基材を用
い、第１図にみるように、樹脂含浸基材１の間に
PTFEからなるフイルム（厚み0.030mm）３を１
枚ずつ介在させるとともに両外面の樹脂含浸基材
１の外側にPTFEからなるフイルム３を１枚ずつ
設け、さらにその外側にPFAからなるフイルム
（厚み0.025mm）２を１枚ずつ設けるようにして、
樹脂含浸基材１を10枚、PFAからなるフイルム
２を２枚、PTFEからなるフイルム３を11枚、お
よび、銅箔（厚み0.018mm）４を２枚を重ね合わ
せて、温度360℃、圧力20Kg／cm2、時間30分の条
件で積層成形し、電気用積層板をつくつた。
実施例 ２
第１表に示す割合で混合したフツ素樹脂をガラ
ス布（日東紡績(株)WE05E）に含浸させたのち焼
成して、レジンコンテスト50％、厚み0.05mmの樹
脂含浸基材をつくつた。この樹脂含浸基材を用
い、第２図にみるように、樹脂含浸基材１の間に
PTFEからなるフイルム（厚み0.030mm）３を１
枚ずつ介在させるとともに、両外面の樹脂含浸基
材１の外側にPFAからなるフイルム（厚み0.025
mm）２を１枚ずつ設け、さらにその外側にPTFE
からなるフイルム３を１枚ずつ設けるようにし
て、樹脂含浸基材１を10枚、PFAからなるフイ
ルム２を２枚、PTFEからなるフイルム３を11
枚、および、銅箔（厚み0.018mm）４を２枚を重
ね合わせて、温度360℃、圧力20Kg／cm2、時間30
分の条件で積層成形し、電気用積層板をつくつ
た。
実施例 ３
第１表に示す割合で混合したフツ素樹脂をガラ
ス布（日東紡績(株)WE05E）に含浸させたのち焼
成して、レジンコンテスト50％、厚み0.05mmの樹
脂含浸基材をつくつた。この樹脂含浸基材を用
い、第３図にみるように、両外面の樹脂含浸基材
１とそのすぐ内側の樹脂含浸基材１との間に
PFAからなるフイルム（厚み0.025mm）２のみを
１枚ずつ介在させ、その他の樹脂含浸基材１の間
にPTFEからなるフイルム（厚み0.030mm）３を
１枚ずつ介在させるとともに、両外面の樹脂含浸
基材１の外側にPTFEからなるフイルム３を１枚
ずつ設けるようにして、樹脂含浸基材１を10枚、
PFAからなるフイルム２を２枚、PTFEからな
るフイルム３を９枚、および、銅箔（厚み0.018
mm）４を２枚を重ね合わせて、温度360℃、圧力
20Kg／cm2、時間30分の条件で積層成形し、電気用
積層板をつくつた。
比較例 １
第１表に示すようにPTFEのみのフツ素樹脂を
ガラス布（日東紡績(株)WE05E）に含浸させたの
ち焼成して、レジンコンテナント60％、厚み0.06
mmの樹脂含浸基材をつくつた。この樹脂含浸基材
を用い、第４図にみるように、PFAからなるフ
イルムを用いずに、樹脂含浸基材１の間にPTFE
からなるフイルム（厚み0.030mm）３を１枚ずつ
介在させるとともに、両外面の樹脂含浸基材１の
外側にもPTFEからなるフイルム３を１枚ずつ設
けるようにして、樹脂含浸基材１を10枚、PTFE
からなるフイルム３を11枚、および、銅箔（厚み
0.018mm）４を２枚を重ね合わせて、温度370℃、
圧力20Kg／cm2、時間50分の条件で積層成形し、電
気用積層板をつくつた。
比較例 ２
第１表に示すように、PTFEのみのフツ素樹脂
をガラス布に含浸させるようにした他は、実施例
１と同様にして、電気用積層板を得た。
[Technical Field] The present invention relates to a method for manufacturing electrical laminates used in electronic devices and the like. [Background Art] Electrical laminates are generally made by laminating and molding predetermined sheets of resin-impregnated base material (prepreg) together with metal foil as needed. [Object of the Invention] An object of the present invention is to provide a method for producing an electrical laminate that can have extremely excellent formability. [Disclosure of the invention] By improving the conventional manufacturing method, the inventor has
Many studies have been conducted in an attempt to achieve the above objective. As a result, we used tetrafluoroethylene resin and a fluorocarbon resin that has a lower melting point and better fluidity than tetrafluoroethylene resin as the fluororesin to be impregnated into the base material. A fluororesin layer is provided on the outside of the resin-impregnated base material, and a fluorocarbon resin having a lower melting point and better fluidity than a tetrafluoroethylene resin and a tetrafluoroethylene resin is used as the resin for the fluorocarbon resin layer. They discovered that if they were laminated and molded, the performance would be significantly improved, such as extremely good moldability, and they completed this invention. Therefore, the present invention provides a resin-impregnated base material obtained by impregnating a base material with a fluororesin, with a fluororesin layer interposed therebetween, and also a fluororesin layer on the outside of the resin-impregnated base material on both outer surfaces. A method for producing an electrical laminate in which a predetermined number of sheets are laminated and molded, wherein the base material is impregnated with a fluororesin and the fluororesin layer is made of a tetrafluoroethylene resin and a tetrafluoroethylene resin. The gist of this paper is a method for manufacturing electrical laminates, which is characterized by using a fluororesin that has a lower melting point and better fluidity than resins. This invention will be explained in detail below. Note that excellent moldability means that there are no unmelted (opaque) parts in appearance, and
It is said that the plate thickness accuracy is excellent. The fluororesin that has a lower melting point and better fluidity than the tetrafluoroethylene resin (hereinafter abbreviated as "PTFE") used in this invention is not particularly limited, but examples include tetrafluoroethylene-hexafluoropropylene. Copolymer resin (hereinafter abbreviated as "FEP"), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin (hereinafter abbreviated as "PFA"), polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF) , polyvinyl fluoride (PVF), tetrafluoroethylene-ethylene copolymer (ETFE), chlorotrifluoroethylene-ethylene copolymer (ECTFE), etc., and each can be used alone or in a mixture of two or more. It will be done. Among these, FEP and PFA are preferable because their properties other than melting point are close to those of PTFE. The method for manufacturing an electrical laminate according to this invention is as follows:
A resin-impregnated base material is used, which is obtained by impregnating the base material with PTFE and a fluororesin that has a lower melting point and better fluidity than PTFE. Specifically, such a resin-impregnated base material is, for example, a resin dispersion made by mixing the base material with PTFE and a fluororesin that has a lower melting point than PTFE and has good fluidity, or
Soaking in a mixture of PTFE dispersion and fluororesin dispersion, which has a lower melting point and better fluidity than PTFE, or mixing PTFE and PTFE
A resin dispersion made by mixing a fluororesin with a lower melting point and better fluidity than PTFE, or a PTFE dispersion mixed with a fluororesin dispersion that has a lower melting point and better fluidity than PTFE. After impregnating the base material with PTFE and a fluorocarbon resin that has a lower melting point and better fluidity than PTFE by applying a mixture etc. to the base material, the base material is heated and dried, or Fluororesin with a lower melting point and better fluidity than PTFE and
It can be obtained by melting (sintering) PTFE, but is not limited to these methods. The fluororesin used in this invention to be impregnated into the base material is not particularly limited as long as it is PTFE and a fluororesin with a lower melting point than PTFE and good fluidity, but 100 parts by weight of PTFE (hereinafter referred to as "parts by weight") It is preferable to mix 0.5 to 100 parts of a fluororesin with a lower melting point and better fluidity than PTFE. If the proportion is less than the lower limit of the range, there is a risk that the improvement in moldability will not be achieved, and if the proportion is greater than the upper limit, the overall melting point may be lowered and heat resistance etc. may be deteriorated. As the base material used in this invention, cloth such as glass cloth, non-woven fabric such as woven glass cloth, paper, and other materials commonly used for manufacturing electrical laminates are used. A predetermined number of resin-impregnated substrates as described above are stacked one on top of the other with a fluororesin layer interposed between the resin-impregnated substrates, and fluororesin layers are also provided on both outer surfaces of the resin-impregnated substrates. Then, if necessary, a metal foil such as copper foil is overlaid on at least one side of the laminate and laminated to form an electrical laminate. As the resin for the fluororesin layer used in this invention, PTFE and a fluororesin having a lower melting point and better fluidity than PTFE are used, and when looking at each fluororesin layer individually, only one of them is used. Or both may be used (they may be used as a mixture, or they may be stacked on top of each other in separate layers), and when looking at one electrical laminate as a whole, both of them may be used. Both are used. Note that the fluororesin layer can be provided by coating or the like, but it is preferably used in the form of a film (fluorine-based film) or the like. This is because the thickness of the fluororesin layer can be easily adjusted when used in the form of a film. The film may be produced by a cutting method, a calendar method, a casting method, or the like, or a commercially available product may be used. When using a film, the number of films made of fluororesin, which has a lower melting point and better fluidity than PTFE, to be used depends on the thickness of the film and the number of resin-impregnated base materials used; It is effective within the range of less than the number of pieces of wood. When using 1 to 4 films made of fluororesin, which has a lower melting point and better fluidity than PTFE, it can be installed at any position, but if moldability is important, PTFE
The closer the film made of fluororesin, which has a lower melting point and better fluidity, is provided to the surface of the electrical laminate, the greater the effect will be. for example,
A film made of fluororesin, which has a lower melting point and better fluidity than PTFE, is placed on the outside of the resin-impregnated base material on both outer surfaces and/or between the resin-impregnated base material and the resin-impregnated base material immediately inside the resin-impregnated base material. 2 impregnated base materials
If only one sheet is used, it is preferable to provide it between these sheets, but this is not restrictive. The conditions for lamination molding are not particularly limited, but the temperature
Preferably, the temperature is 340 to 400°C, the pressure is 1 to 100 Kg/cm 2 , and the time is 10 to 180 minutes. According to the method for manufacturing an electrical laminate of the present invention, the resin-impregnated base material as described above is used, the fluorocarbon resin layer as described above is interposed between the resin-impregnated base materials, and the resin-impregnated base material on both outer surfaces is provided. Since the above-mentioned fluororesin layer is also provided on the outside of the material and laminated molding is performed, there are no unmelted and opaque parts, and the thickness accuracy is improved.
An electrical laminate with very excellent formability can be obtained. The obtained electrical laminate has good punching workability,
Other properties such as moisture resistance, heat resistance, and electrical properties have also been improved. Next, Examples and Comparative Examples will be shown. Example 1 Glass cloth (WE05E, Nitto Boseki Co., Ltd.) was impregnated with fluororesin mixed in the proportions shown in Table 1, and then fired to create a resin-impregnated base material with a resin content of 60% and a thickness of 0.06 mm. Ivy. Using this resin-impregnated base material, as shown in FIG.
PTFE film (thickness 0.030mm) 3 to 1
One film 3 made of PTFE is provided on the outside of the resin-impregnated base material 1 on both outer surfaces, and one film 2 made of PFA (thickness 0.025 mm) is provided on the outside thereof.
10 sheets of resin-impregnated base material 1, 2 sheets of film 2 made of PFA, 11 sheets of film 3 made of PTFE, and 2 sheets of copper foil (thickness 0.018 mm) 4 were stacked together at a temperature of 360°C and under pressure. Laminate molding was carried out under conditions of 20Kg/cm 2 and 30 minutes to produce an electrical laminate. Example 2 Glass cloth (WE05E, Nitto Boseki Co., Ltd.) was impregnated with fluororesin mixed in the proportions shown in Table 1, and then fired to create a resin-impregnated base material with a resin content of 50% and a thickness of 0.05 mm. Ivy. Using this resin-impregnated base material, as shown in FIG.
PTFE film (thickness 0.030mm) 3 to 1
At the same time, a PFA film (thickness 0.025
mm) 2 each, and then PTFE on the outside.
10 sheets of the resin-impregnated base material 1, 2 sheets of the film 2 of PFA, and 11 sheets of the film 3 of PTFE
and two sheets of copper foil (thickness 0.018 mm) 4 were placed on top of each other at a temperature of 360℃, a pressure of 20Kg/cm 2 , and a time of 30 minutes.
Laminate molding was carried out under the following conditions to create an electrical laminate. Example 3 Glass cloth (WE05E, Nitto Boseki Co., Ltd.) was impregnated with fluororesin mixed in the proportions shown in Table 1, and then fired to create a resin-impregnated base material with a resin content of 50% and a thickness of 0.05 mm. Ivy. Using this resin-impregnated base material, as shown in FIG.
Only one film 2 (thickness 0.025 mm) made of PFA is interposed, and one film 3 made of PTFE (thickness 0.030 mm) is interposed between the other resin-impregnated base material 1, and the resin on both outer surfaces is 10 sheets of resin-impregnated base material 1 were prepared, with one film 3 made of PTFE provided on the outside of the impregnated base material 1.
Two films 2 made of PFA, nine films 3 made of PTFE, and copper foil (thickness 0.018
mm) 4 on top of each other at a temperature of 360°C and a pressure of
Laminate molding was carried out under conditions of 20Kg/cm 2 and 30 minutes to produce an electrical laminate. Comparative Example 1 As shown in Table 1, a glass cloth (Nittobo Co., Ltd. WE05E) was impregnated with a fluororesin containing only PTFE and then fired, resulting in a resin content of 60% and a thickness of 0.06.
A resin-impregnated base material of mm was made. Using this resin-impregnated base material, as shown in Figure 4, PTFE was inserted between the resin-impregnated base material 1 without using a PFA film.
(thickness: 0.030 mm), and one film 3 made of PTFE was also provided on the outside of the resin-impregnated base material 1 on both outer surfaces. sheet, PTFE
11 sheets of film 3 consisting of
0.018mm) 4 on top of each other, temperature 370℃,
Laminate molding was carried out under conditions of a pressure of 20 kg/cm 2 and a time of 50 minutes to produce an electrical laminate. Comparative Example 2 As shown in Table 1, an electrical laminate was obtained in the same manner as in Example 1, except that the glass cloth was impregnated with a fluororesin consisting only of PTFE.
この発明の電気用積層板の製法は、以上にみて
きたように、基材に含浸させるフツ素樹脂、およ
び、樹脂含浸基材の間に介在させるとともに両外
面の樹脂含浸基材の外側に設けるフツ素樹脂層の
フツ素樹脂として、PTFEおよびPTFEよりを融
点が低くかつ流動性が良いフツ素樹脂を用いるよ
うにしているので、この製法によれば、未溶融で
不透明な部分が皆無でしかも板厚精度が向上した
電気用積層板を得ることができる。得られた電気
用積層板は、それらの成形性以外にも、打抜加工
性、耐湿性、耐熱性および電気特性も向上したも
のとなつている。
As described above, the manufacturing method of the electrical laminate of the present invention includes a fluororesin impregnated into a base material, and a fluorocarbon resin provided between the resin-impregnated base materials and on the outside of the resin-impregnated base materials on both outer surfaces. As the fluororesin in the fluororesin layer, we use PTFE and a fluororesin with a lower melting point and better fluidity than PTFE, so this manufacturing method eliminates any unmelted and opaque parts. An electrical laminate with improved plate thickness accuracy can be obtained. The obtained electrical laminates have improved punching workability, moisture resistance, heat resistance, and electrical properties in addition to their formability.
第１図〜第３図は、実施例での電気用積層板を
つくる際の構成を模式的にあらわす側面図、第４
図は比較例での電気用積層板をつくる際の構成を
模式的にあらわす側面図である。
１……樹脂含浸基材、２……PFAからなるフ
イルム、３……PTFEからなるフイルム。
Figures 1 to 3 are side views schematically showing the structure of the electrical laminate in the example;
The figure is a side view schematically showing the configuration when manufacturing an electrical laminate in a comparative example. 1... Resin-impregnated base material, 2... Film made of PFA, 3... Film made of PTFE.
Claims (1)
基材を、間にフツ素樹脂層を介在させるとともに
両外面の樹脂含浸基材の外側にもフツ素樹脂層を
設けるようにして、所定枚積層成形する電気用積
層板の製法であつて、前記基材に含浸させるフツ
素樹脂および前記フツ素樹脂層の樹脂として、四
フツ化エチレン樹脂および四フツ化エチレン樹脂
よりも融点が低くかつ流動性が良いフツ素樹脂を
用いることを特徴とする電気用積層板の製法。 ２ 基材に含浸させるフツ素樹脂として、四フツ
化エチレン樹脂100重量部に対して、四フツ化エ
チレン樹脂よりも融点が低くかつ流動性が良いフ
ツ素樹脂を0.5〜100重量部の割合で混合したもの
を用いる特許請求の範囲第１項記載の電気用積層
板の製法。 ３ フツ素樹脂層が、四フツ化エチレン樹脂から
なるフイルムと四フツ化エチレン樹脂よりも融点
が低くかつ流動性が良いフツ素樹脂からなるフイ
ルムからなる特許請求の範囲第１項または第２項
記載の電気用積層板の製法。 ４ 四フツ化エチレン樹脂よりも融点が低くかつ
流動性が良いフツ素樹脂からなるフイルムが、両
外面の樹脂含浸基材の外側またはその樹脂含浸基
材とそのすぐ内側の樹脂含浸基材との間に設けら
れる特許請求の範囲第３項記載の電気用積層板の
製法。 ５ 四フツ化エチレン樹脂よりも融点が低くかつ
流動性が良いフツ素樹脂が、四フツ化エチレン−
六フツ化プロピレン共重合樹脂および四フツ化エ
チレン−パーフルオロアルキルビニルエーテル共
重合樹脂からなる群の中から選ばれた少なくとも
１種である特許請求の範囲第１項ないし第４項の
いずれかに記載の電気用積層板の製法。[Scope of Claims] 1. A resin-impregnated base material obtained by impregnating a base material with a fluororesin, with a fluororesin layer interposed therebetween, and also a fluororesin layer on the outside of the resin-impregnated base material on both outer surfaces. A method for producing an electrical laminate in which a predetermined number of sheets are laminated and molded in such a manner that the substrate is impregnated with a fluororesin and the resin of the fluororesin layer is a tetrafluoroethylene resin and a tetrafluoroethylene resin. A method for manufacturing an electrical laminate, characterized by using a fluororesin that has a lower melting point and better fluidity than fluoroplastics. 2 As the fluororesin to be impregnated into the base material, a fluororesin having a lower melting point and better fluidity than the tetrafluoroethylene resin is used at a ratio of 0.5 to 100 parts by weight per 100 parts by weight of the tetrafluoroethylene resin. A method for producing an electrical laminate according to claim 1, using a mixture. 3. Claims 1 or 2, in which the fluororesin layer comprises a film made of a tetrafluoroethylene resin and a film made of a fluororesin that has a lower melting point and better fluidity than the tetrafluoroethylene resin. The method for manufacturing the electrical laminate described. 4. A film made of a fluororesin having a lower melting point and better fluidity than tetrafluoroethylene resin is placed on the outside of the resin-impregnated base material on both outer surfaces or between the resin-impregnated base material and the resin-impregnated base material immediately inside it. A method for manufacturing an electrical laminate according to claim 3, which is provided in between. 5. Tetrafluoroethylene is a fluorocarbon resin that has a lower melting point and better fluidity than tetrafluoroethylene.
Claims 1 to 4 are at least one selected from the group consisting of hexafluoropropylene copolymer resin and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin. A manufacturing method for electrical laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60230432A JPS6287329A (en) | 1985-10-15 | 1985-10-15 | Manufacture of electrical laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60230432A JPS6287329A (en) | 1985-10-15 | 1985-10-15 | Manufacture of electrical laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6287329A JPS6287329A (en) | 1987-04-21 |
| JPH0262383B2 true JPH0262383B2 (en) | 1990-12-25 |
Family
ID=16907805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60230432A Granted JPS6287329A (en) | 1985-10-15 | 1985-10-15 | Manufacture of electrical laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6287329A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2577389B2 (en) * | 1987-07-16 | 1997-01-29 | 日本バルカ−工業株式会社 | How to use fluororesin laminate |
| JP2746568B2 (en) * | 1996-07-15 | 1998-05-06 | 日本バルカー工業株式会社 | Fluororesin laminate |
| JP4465841B2 (en) * | 2000-09-21 | 2010-05-26 | 富士電機ホールディングス株式会社 | Hazardous gas treatment sheet and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5551551A (en) * | 1978-10-06 | 1980-04-15 | Chiyuukou Kasei Kogyo Kk | Preparation of copper lined laminated board |
-
1985
- 1985-10-15 JP JP60230432A patent/JPS6287329A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5551551A (en) * | 1978-10-06 | 1980-04-15 | Chiyuukou Kasei Kogyo Kk | Preparation of copper lined laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6287329A (en) | 1987-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |