JPS63199245A - Laminated board - Google Patents

Abstract

PURPOSE:To obtain a laminated board, having excellent heat resistance, electrical insulating properties, high-frequency characteristics and dimensional stability at a low cost, by laminating and molding sheets of prepreg formed by impregnating a glass substrate consisting of a single yarn cloth with a fluororesin and drying the resin. CONSTITUTION:(A) A glass substrate consisting of single filament cloth having 0.04-0.06mm thickness and preferably double twisted plain weave cloth, having preferably 40-60g/m<2> weight and a density of 30-60 warps/inch and 30-60 wefts/inch and, as necessary, subjected to surface treatment with a silane coupling agent, is impregnated with (B) a fluororesin, preferably having >=200 deg.C melting point (e.g. tetrafluoroethylene resin) and the resin is dried to form plural sheets of prepreg, which are then placed on top of each other. Resin films as adhesive layers are placed between the sheets of the prepreg and a metal foil or foils are placed on one or both sides thereof through adhesive layers and laminated and integrated to produce the aimed laminated board.

Description

[Detailed description of the invention] [Technical field 1 The present invention relates to a laminate for use in printed wiring boards.

[Background Art 1] Conventionally, laminated boards for printed wiring boards have been manufactured by laminating and molding resin-impregnated base materials formed by impregnating and drying a lath cloth base material with epoxy resin or polyimide resin. The dielectric constant of the laminate is 4.5 when glass/epoxy resin-impregnated base material is used, and 4.0 when laminated glass/polyimide base material is used. Therefore, when used as a printed wiring board, had insufficient high-frequency characteristics, and was restricted in the implementation of high-frequency arithmetic circuits using high-frequency clocks and communication equipment circuits.

For this reason, the present inventors have already developed a laminate with a low dielectric constant and good high frequency characteristics by forming the insulating layer with a glass cloth base material impregnated with a 7-carbon resin. To ensure good adhesion with the impregnated resin and heat resistance,
For example, a twisted glass cloth with a thickness of about 40 to 50 μm is used, but this glass cloth is on the south side, which not only increases the cost of the laminate, but also has poor dimensional stability due to its small thickness. there were.

[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to provide excellent heat resistance and electrical insulation, a low dielectric constant, and good high frequency characteristics, so that it can be used as a printed wiring board. The object of the present invention is to provide a laminate that not only allows mounting of high-frequency arithmetic circuits and communication circuits when used, but also has excellent dimensional stability and can reduce costs.

[Disclosure of the Invention] The laminate of the present invention is a laminate formed by laminating and molding a plurality of prepregs formed by impregnating a glass base material with a heptad resin and drying it, wherein the plus base material has a thickness of 0.040
It is characterized by a single yarn black λ of ~0.0601 Im, and with this configuration, the above object can be achieved.

The present invention will now be described in detail with reference to the accompanying drawings.

The glass substrate used in the present invention has a thickness of 0.040 to 0.
．． This is a cloth made of a single yarn with a length of 060m.

is an essential condition. Other requirements for i of this glass substrate include a weight of 40 to 60 g/ra' and a density of 30 to 30 g/ra'
60 pieces/1nch, 1l130~60 pieces/1nch
Therefore, a plain weave cloth with twisted yarns can be suitably used. The second glass base material may be surface-treated with a silane coupling agent, and a prepreg is formed by impregnating this glass base material with a heptad resin and drying it. As a fluororesin,
Ethylene trisulfide chloride resin (CTFE, melting point 210-2
12℃), 1ull of 47-fluoroethylene resin (TFE, melting point 320-335℃), 47-fluoroethylene-67-propylene copolymer resin (FEP, melting point 260-280℃)
), tetrafluoroethylene-perfluorovinyl ether copolymer resin (PF^, melting point 302-310°C), tetrafluoroethylene-ethylene copolymer resin (ETFE, melting point 2
Those having a melting point of 200°C or higher, such as 60 to 270°C), are preferable.

A plurality of prepregs formed in this manner are laminated, and metal foil is adhered to both or one side of the prepreg to form a laminate. As the metal foil, copper foil, aluminum foil, brass whistle, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used.

The laminate of the present invention is produced by, for example, stacking a plurality of prepregs and using an adhesive layer between the prepregs with 7 pieces of 1/M
A resin film with a low dielectric constant such as a resin film or a polyimide resin is interposed, and metal foil is successively stacked on both or one side of the film with an adhesive layer interposed therebetween. Placed between multiple sets of heating plates, 200℃ or higher, 20-150kg/am”, 4
It is manufactured by heating and pressing for 0 to 100 minutes to integrate the layers. In this case, by setting the heating temperature during heating and pressing to be higher than that of the adhesive layer and lower than the melting point of the fluororesin of the prepreg, the 77-base resin of the prepreg will not melt during molding, resulting in good overall dimensional stability. .

This laminate is sequentially processed by drilling, electroless plating, pattern formation, pattern plating, resist plating, resist removal, and
Through-hole plated printed wiring boards are manufactured through processes such as etching, external finishing, and symbol mark printing.

Next, examples of the present invention will be specifically described.

(Example) Thickness 0.05mm, weight 50g/m'', density 59 in length
Single thread plain weave cloth (1 nch), 48 strands/1 nch (width)
r14E-05EJ, manufactured by Nitto Boseki Co., Ltd.), thickness 0.0
6w+m P T F E li fat film (product name [
Nidoflon No. 9004 (manufactured by Nitto Denko Corporation) was impregnated and fired to form a prepreg.

P with a thickness of 0.04m on both sides of the two prepregs and on the interlock.
A TFE 7-layer mJIl ilm ("Nido 70n") was placed, and copper foil with a thickness of 0.018 mm was placed on both sides, followed by lamination molding to produce a copper-clad laminate. The dimensional change rate (heated at 170° C. for 60 minutes) of this copper-clad laminate was measured.

The results are shown in Table 1.

(Comparative example) Thickness 0.05-loop twisted yarn plain weave cloth (rWE-108
Prepreg and copper-clad laminates were made in the same manner as in the example except that Nitto Boseki Co., Ltd.) was used! ! I left it behind.

The dimensional change rate of this copper-clad laminate was measured. The result is ＠
It is shown in Table 1.

Table 1 Dimensional change rate (%) [Effects of the invention] The present invention has a small dielectric constant, good high frequency characteristics, and when used as a printed wiring board, it is easy to mount high frequency arithmetic circuits and communication circuits. It has excellent insulation properties, and since the glass base material is a single yarn cloth with a thickness of 0.040 to 0.060 mm, it has good adhesion with the impregnated If resin, has excellent dimensional stability and heat resistance, and is cost-effective. It is something that can be suppressed.

Claims (1)

[Claims] (1) A laminate formed by laminating and molding multiple sheets of prepreg formed by impregnating a glass base material with a fluororesin and drying it, the glass base material having a thickness of 0.040 to 0.060.
A laminate board characterized by being made of a single thread cloth of mm.