JPS63199245A - Laminated board - Google Patents
Laminated boardInfo
- Publication number
- JPS63199245A JPS63199245A JP3175687A JP3175687A JPS63199245A JP S63199245 A JPS63199245 A JP S63199245A JP 3175687 A JP3175687 A JP 3175687A JP 3175687 A JP3175687 A JP 3175687A JP S63199245 A JPS63199245 A JP S63199245A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- cloth
- sheets
- fluororesin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 239000011888 foil Substances 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 8
- 230000008018 melting Effects 0.000 abstract description 8
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 2
- 238000004381 surface treatment Methods 0.000 abstract 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- -1 Ethylene trisulfide chloride Chemical compound 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】 [技術分野1 本発明はプリント配線板に使用する積層板に関する。[Detailed description of the invention] [Technical field 1 The present invention relates to a laminate for use in printed wiring boards.
[背景技術1
従来より、〃ラス布基材にエポキシ樹脂あるいはポリイ
ミド樹脂を含浸させ乾燥させて形成した樹脂含浸基材を
積層成形してプリント配線板用の積層板が製造されてい
るが、この積層板の誘電率はガラス/エポキシ系の樹脂
含浸基材を採用した場合には4.5で、〃ラス/ポリイ
ミド系で4.0と比較的大きく、従って、プリント配線
板として使用した場合には高周波に対する特性が不充分
で、高周波クロックを用いた高周波演算回路の*装とか
、通信機器回路の実装には制約を受けていた。[Background Art 1] Conventionally, laminated boards for printed wiring boards have been manufactured by laminating and molding resin-impregnated base materials formed by impregnating and drying a lath cloth base material with epoxy resin or polyimide resin. The dielectric constant of the laminate is 4.5 when glass/epoxy resin-impregnated base material is used, and 4.0 when laminated glass/polyimide base material is used. Therefore, when used as a printed wiring board, had insufficient high-frequency characteristics, and was restricted in the implementation of high-frequency arithmetic circuits using high-frequency clocks and communication equipment circuits.
このため本発明者らは、既に、絶縁層を7ツ素樹脂含浸
〃ラス布基材で形成して誘電率が小さく、高周波特性が
良好な積層板を開発しているが、この場合ガラス布は含
浸樹脂との密着性を良(して耐熱性を確保するために、
例えば厚み40〜50μ程度の合撚糸ガラス布を採用し
ているが、このガラス布は南側であり、積層板のコスト
を上昇させるだけでなく、厚みが小さいことから寸法安
定性に劣ったものであった。For this reason, the present inventors have already developed a laminate with a low dielectric constant and good high frequency characteristics by forming the insulating layer with a glass cloth base material impregnated with a 7-carbon resin. To ensure good adhesion with the impregnated resin and heat resistance,
For example, a twisted glass cloth with a thickness of about 40 to 50 μm is used, but this glass cloth is on the south side, which not only increases the cost of the laminate, but also has poor dimensional stability due to its small thickness. there were.
[発明の目的]
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、耐熱性、電気絶縁性に優れ誘電率が
小さくて高周波特性が良好となり、プリント配線板とし
て使用した場合に高周波演算回路、通信機回路の実装が
可能であるのはもちろんのこと、寸法安定性に優れ、し
かもコストを抑えることができる積層板を提供すること
にある。[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to provide excellent heat resistance and electrical insulation, a low dielectric constant, and good high frequency characteristics, so that it can be used as a printed wiring board. The object of the present invention is to provide a laminate that not only allows mounting of high-frequency arithmetic circuits and communication circuits when used, but also has excellent dimensional stability and can reduce costs.
[発明の開示]
本発明の積層板は、ガラス基材に7ツ素樹脂を含浸させ
乾燥させて形成した複数枚のプリプレグを積層成形して
形成した積層板であって、プラス基材が厚み0.040
〜0.0601Imの単糸クロλであることを特徴とす
るものであり、この構成により上記目的を達成できたも
のである。[Disclosure of the Invention] The laminate of the present invention is a laminate formed by laminating and molding a plurality of prepregs formed by impregnating a glass base material with a heptad resin and drying it, wherein the plus base material has a thickness of 0.040
It is characterized by a single yarn black λ of ~0.0601 Im, and with this configuration, the above object can be achieved.
以下本発明を添付の図面を参照して詳細に説明する。The present invention will now be described in detail with reference to the accompanying drawings.
本発明で使用するガラス基材は、厚みが0.040〜0
.060m−で単糸により形成されたクロスである。The glass substrate used in the present invention has a thickness of 0.040 to 0.
.. This is a cloth made of a single yarn with a length of 060m.
のが必須条件である。このガラス基材のiの他の要件と
しては、重量が40〜60g/ra’、密度が縦30〜
60本/ 1nch、 1l130〜60本/1nch
で合撚糸平織クロスを好適に採用できる。二のガラス基
材はシランカップリング剤で表面処理が施されていても
よい、このガラス基材に7ツ素樹脂を含浸させ乾燥させ
てプリプレグが形成されている。フッ素樹脂としては、
三7ツ化塩化エチレン樹脂(CTFE、融点210〜2
12℃)、四7フ化エチレン樹1ull (TFE、融
点320−335℃)、四7フ化エチレンー六7ツ化プ
ロピレン共重合体樹脂(FEP、融点260〜280℃
)、四7ツ化エチレンーパーフルオロビニルエーテル共
in体樹脂(PF^、融点302〜310℃)、四7フ
化エチレンーエチレン共重会体樹脂(ETFE、融点2
60〜270℃)などのような融点が200℃以上のも
のが好ましい。is an essential condition. Other requirements for i of this glass substrate include a weight of 40 to 60 g/ra' and a density of 30 to 30 g/ra'
60 pieces/1nch, 1l130~60 pieces/1nch
Therefore, a plain weave cloth with twisted yarns can be suitably used. The second glass base material may be surface-treated with a silane coupling agent, and a prepreg is formed by impregnating this glass base material with a heptad resin and drying it. As a fluororesin,
Ethylene trisulfide chloride resin (CTFE, melting point 210-2
12℃), 1ull of 47-fluoroethylene resin (TFE, melting point 320-335℃), 47-fluoroethylene-67-propylene copolymer resin (FEP, melting point 260-280℃)
), tetrafluoroethylene-perfluorovinyl ether copolymer resin (PF^, melting point 302-310°C), tetrafluoroethylene-ethylene copolymer resin (ETFE, melting point 2
Those having a melting point of 200°C or higher, such as 60 to 270°C), are preferable.
このようにし゛て形成したプリプレグが複数枚積層され
、その両面又は片面に金属箔が貼着されて積層板が形成
されている。金属箔としては銅箔、アルミニウム箔、真
ちゅう笛、鉄箔、ステンレス鋼箔、ニッケル箔、ケイ素
鋼箔などいずれをも採用できる。A plurality of prepregs formed in this manner are laminated, and metal foil is adhered to both or one side of the prepreg to form a laminate. As the metal foil, copper foil, aluminum foil, brass whistle, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used.
本発明の積層板は、例えば複数枚のプリプレグを積み重
ねると共にプリプレグ間に接着剤層として7ツ素1/M
脂フィルムとかポリイミド樹脂のような誘電率の小さい
その他の樹脂フィルムを介在させ、更にその両面又は片
面に接着剤層を介して金属箔を順次積み重ね、このもの
を−岨みとして成形プレートを介して複数組み熱盤間に
配置し、200℃以上、20〜150kg/am”、4
0〜100分で加熱加圧して積層一体化させて製造する
。この場合加熱加圧における加熱温度を接着剤層よりも
高くかつプリプレグのフッ素樹脂の融点よりも低くする
ことにより、成形に際してプリプレグの77素樹脂が溶
融しなく、全体の寸法安定性が良好となる。The laminate of the present invention is produced by, for example, stacking a plurality of prepregs and using an adhesive layer between the prepregs with 7 pieces of 1/M
A resin film with a low dielectric constant such as a resin film or a polyimide resin is interposed, and metal foil is successively stacked on both or one side of the film with an adhesive layer interposed therebetween. Placed between multiple sets of heating plates, 200℃ or higher, 20-150kg/am”, 4
It is manufactured by heating and pressing for 0 to 100 minutes to integrate the layers. In this case, by setting the heating temperature during heating and pressing to be higher than that of the adhesive layer and lower than the melting point of the fluororesin of the prepreg, the 77-base resin of the prepreg will not melt during molding, resulting in good overall dimensional stability. .
この積層板は順次、孔明け、無電解めつト、パターン形
成、パターンめっき、レジストめっき、レジスト除去、
エツチング、外形仕上げ、シンボルマーク印刷といった
工程でスルーホールめっきプリント配線板が製造される
。This laminate is sequentially processed by drilling, electroless plating, pattern formation, pattern plating, resist plating, resist removal, and
Through-hole plated printed wiring boards are manufactured through processes such as etching, external finishing, and symbol mark printing.
次に、本発明の実施例を具体的に説明する。Next, examples of the present invention will be specifically described.
(実施例)
厚み0.05mm、重量が50g/m”、密度が縦59
本/1nch、横48本/1nchの単糸平織クロス(
r14E−05EJ、日東紡績(株)製)、厚み0,0
6w+mのP T F E li脂フィルム(商品名[
ニドフロンNo、9004、日東電工(株)製)を含浸
焼成してプリプレグを形成した。(Example) Thickness 0.05mm, weight 50g/m'', density 59 in length
Single thread plain weave cloth (1 nch), 48 strands/1 nch (width)
r14E-05EJ, manufactured by Nitto Boseki Co., Ltd.), thickness 0.0
6w+m P T F E li fat film (product name [
Nidoflon No. 9004 (manufactured by Nitto Denko Corporation) was impregnated and fired to form a prepreg.
二枚のプリプレグの両面及び閏に厚み0.04m−のP
TFE 7ツ素mJIlイルム(「ニド70ン」)を配
置し、更に両面に厚み0.018mmの銅箔を配置して
積層成形して銅張り積層板を製造した。 この銅張り積
層板の寸法変化率(170℃で60分加熱)を測定した
。P with a thickness of 0.04m on both sides of the two prepregs and on the interlock.
A TFE 7-layer mJIl ilm ("Nido 70n") was placed, and copper foil with a thickness of 0.018 mm was placed on both sides, followed by lamination molding to produce a copper-clad laminate. The dimensional change rate (heated at 170° C. for 60 minutes) of this copper-clad laminate was measured.
結果を第1表に示す。The results are shown in Table 1.
(比較例)
厚み0.05−輪の合撚糸平織クロス(rWE−108
J、日東紡績(株)製)を採用した以外は実施例と同様
にしてプリプレグ及び銅張り積層板を!!遺した。(Comparative example) Thickness 0.05-loop twisted yarn plain weave cloth (rWE-108
Prepreg and copper-clad laminates were made in the same manner as in the example except that Nitto Boseki Co., Ltd.) was used! ! I left it behind.
この銅張り積層板の寸法変化率を測定した。結果をj@
1表に示す。The dimensional change rate of this copper-clad laminate was measured. The result is @
It is shown in Table 1.
第1表
寸法変化率(%)
[発明の効果]
本発明にあっては、誘電率が小さく、高周波特性が良好
となり、プリント配線板として使用した場合に高周波演
算回路、通信機回路の実装が可能な絶縁特性に優れ、し
かもガラス基材が厚み0.040〜0.060mmの単
糸クロスであるので、含浸If脂との密着性が良好で寸
法安定性及び耐熱性に優れ、しかもコストを抑えること
ができるものである。Table 1 Dimensional change rate (%) [Effects of the invention] The present invention has a small dielectric constant, good high frequency characteristics, and when used as a printed wiring board, it is easy to mount high frequency arithmetic circuits and communication circuits. It has excellent insulation properties, and since the glass base material is a single yarn cloth with a thickness of 0.040 to 0.060 mm, it has good adhesion with the impregnated If resin, has excellent dimensional stability and heat resistance, and is cost-effective. It is something that can be suppressed.
Claims (1)
成した複数枚のプリプレグを積層成形して形成した積層
板であって、ガラス基材が厚み0.040〜0.060
mmの単糸クロスであることを特徴とする積層板。(1) A laminate formed by laminating and molding multiple sheets of prepreg formed by impregnating a glass base material with a fluororesin and drying it, the glass base material having a thickness of 0.040 to 0.060.
A laminate board characterized by being made of a single thread cloth of mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3175687A JPS63199245A (en) | 1987-02-14 | 1987-02-14 | Laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3175687A JPS63199245A (en) | 1987-02-14 | 1987-02-14 | Laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63199245A true JPS63199245A (en) | 1988-08-17 |
Family
ID=12339866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3175687A Pending JPS63199245A (en) | 1987-02-14 | 1987-02-14 | Laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63199245A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03220239A (en) * | 1988-11-25 | 1991-09-27 | Nichias Corp | Fiber-reinforced resin composite material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60235844A (en) * | 1984-05-08 | 1985-11-22 | Hitachi Ltd | Prepreg sheet and laminate thereof |
JPS60239228A (en) * | 1984-05-14 | 1985-11-28 | Matsushita Electric Works Ltd | Manufacture of laminated plate for electric application |
JPS6144632A (en) * | 1984-08-10 | 1986-03-04 | 松下電工株式会社 | Adhesive prepreg for multilayer printed wiring board |
-
1987
- 1987-02-14 JP JP3175687A patent/JPS63199245A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60235844A (en) * | 1984-05-08 | 1985-11-22 | Hitachi Ltd | Prepreg sheet and laminate thereof |
JPS60239228A (en) * | 1984-05-14 | 1985-11-28 | Matsushita Electric Works Ltd | Manufacture of laminated plate for electric application |
JPS6144632A (en) * | 1984-08-10 | 1986-03-04 | 松下電工株式会社 | Adhesive prepreg for multilayer printed wiring board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03220239A (en) * | 1988-11-25 | 1991-09-27 | Nichias Corp | Fiber-reinforced resin composite material |
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