JPS63199636A - Laminated board - Google Patents
Laminated boardInfo
- Publication number
- JPS63199636A JPS63199636A JP3175887A JP3175887A JPS63199636A JP S63199636 A JPS63199636 A JP S63199636A JP 3175887 A JP3175887 A JP 3175887A JP 3175887 A JP3175887 A JP 3175887A JP S63199636 A JPS63199636 A JP S63199636A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- laminate
- melting point
- inner layer
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 31
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 238000002844 melting Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野１
本発明は多層プリント配線板に使用する積層板に関する
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a laminate used in a multilayer printed wiring board.
［’ｌ！’景技術１
従来より、ｌｒ？ス布基材にエポキシ樹脂あるいはポリ
イミド樹脂を含浸させ乾燥させで形成した樹脂含浸基材
を積層成形してプリント配線板用の積層板が製造されて
いるが、この積層板の誘電率はｊラス／エポキシ系の樹
脂含浸基材を採用した場合には４．５で、〃ラス／ポリ
イミド系で４．０と比較的大きく、従って、プリント配
線板として使用した場合には高周波に対する特性が不充
分で、高周波クロックを用いた高周波演算回路の実装と
か、通信機器回路の実装には制約を受けていた。['l! 'King Technique 1 From the past, lr? Laminated boards for printed wiring boards are manufactured by laminating resin-impregnated base materials formed by impregnating a cloth base material with epoxy resin or polyimide resin and drying them, but the dielectric constant of this laminated board is /When an epoxy-based resin-impregnated base material is used, the value is 4.5, and when a lath/polyimide-based material is used, it is relatively large at 4.0. Therefore, when used as a printed wiring board, the characteristics against high frequencies are insufficient. Therefore, there were restrictions on the implementation of high-frequency arithmetic circuits using high-frequency clocks and the implementation of communication equipment circuits.
このため本発明者らは、既に、絶縁層をフッ素樹脂又は
フッ素樹脂含浸布（不織布）基材で形成して誘電率が小
さく、高周波特性が良好な積層板を開発している。For this reason, the present inventors have already developed a laminate having a low dielectric constant and good high-frequency characteristics by forming an insulating layer from a fluororesin or a fluororesin-impregnated cloth (nonwoven fabric) base material.
しかしながら、高密度実装化にともなって、多層化、即
ち、フッ素樹脂含浸基材で形成した内層材の両面に接着
剤層を介して金属箔を積層一体化させ形成した多層プリ
ント配線板用の積層板は誘電率が小さいものの、寸法変
化率が大きくて寸法安定性が悪く、又多層化に際して眉
間のずれが生じて製品の信頼性が低く、歩留まりも悪く
なるという問題が新たに発生している。However, with the trend toward high-density packaging, multilayer printed wiring boards have become more multi-layered, in other words, metal foils are laminated and integrated on both sides of an inner layer material made of a fluororesin-impregnated base material via an adhesive layer. Although the dielectric constant of the plate is low, the rate of dimensional change is large, resulting in poor dimensional stability, and new problems have arisen, such as misalignment between the eyebrows when multilayering occurs, resulting in low product reliability and poor yield. .
［発明の目的］
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、誘電率が小さくて高周波特性が良好
となり、プリント配線板として使用した場合に高周波演
算回路、通信機回路の実装が可能で、しかも高密度実装
が可能であって寸法安定性に優れ、信頼性及び歩留まり
の高い多層プリント配線板用の積層板を製造することに
ある。[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to provide a low dielectric constant and good high frequency characteristics, so that when used as a printed wiring board, a high frequency arithmetic circuit, The purpose of the present invention is to manufacture a laminate for a multilayer printed wiring board on which a communication device circuit can be mounted, high-density mounting possible, excellent dimensional stability, reliability, and yield.
［発明の開示１
本発明の積層板は、フッ素樹脂で形成した内層材１の両
面又は片面に接着剤層２を介して金属箔３を配置し加熱
加圧して積層一体化させた積層板であって、接着剤層２
にフッ素樹脂積層体４が配され、接着剤層２の融点が加
熱加圧における成形温度よりも低く、内層材１及びフッ
素樹脂積層体４のフッ素樹脂の融点が加熱加圧における
成形温度よりも高いことを特徴とするものであり、この
構成により上記目的を達成できたものである。[Disclosure of the Invention 1 The laminate of the present invention is a laminate in which a metal foil 3 is placed on both or one side of an inner layer material 1 made of fluororesin via an adhesive layer 2, and is laminated and integrated by heating and pressing. Yes, adhesive layer 2
The fluororesin laminate 4 is disposed in such a way that the melting point of the adhesive layer 2 is lower than the molding temperature during heating and pressing, and the melting point of the fluororesin of the inner layer material 1 and the fluororesin laminate 4 is lower than the molding temperature during heating and pressing. This structure is characterized by high performance and achieves the above object.
以下本発明を添付の図面を参照して詳細に説明する。内
層材１は複数枚の７ツ素樹脂フイルム又は７ツ素樹脂含
浸基材の積層体の両面に常法により導体パターン５を形
成したものである。この内層材１の両面には接着剤層２
が形成される。もちろん接着剤層２は内層材１の片面に
だけ形成されていてもよい、この接着剤層２はフッ素樹
脂フイルム、フッ素樹脂含浸基材、ポリイミド樹脂のよ
うな誘電率の小さいその他の樹脂フィルム、樹脂含浸基
材などにより形成されている。この接着剤層２内に複数
枚のフッ素樹脂フィルム又は７ツ素樹脂含浸基材の積層
体などのフッ素樹脂積層体４が配されている０本発明で
用いるフッ素樹脂としては、三７ツ化塩化エチレン樹脂
（ＣＴＦＥ、融点２１０〜２１２℃）、四７？化エチレ
ン樹脂（ＴＦＥ、融点３２０〜３３５℃）、四７フ化エ
チレンー六７フ化フロピレン共重合体樹脂（ＦＥＰ、融
点２６０〜２８０℃）、四７ツ化エチレンーパーフルオ
ロビニルエーテル共重合体樹脂（ＰＦ＾、融点３０２−
３１０℃）、四７ツ化エチレンーエチレン共重合体樹脂
（ＥＴＦＥ、融点２６０〜２７０℃）などのような融点
が２００℃以上のものが好ましい。接着剤層２を形成し
でいる樹脂はその融点がフッ素樹脂積層体４及び内層材
１のフッ素樹脂の融点よりも低いものである。又、フッ
素樹脂積層体４のフッ素樹脂の融点は内層材１のフッ素
樹脂の融点と同じか低いのが好ましい、そして、後述す
る多層化の加熱加圧における成形温度よりも接着剤Ｍ２
の融点が低く、内層材１及びフッ素樹脂積層体４のフッ
素樹脂の融点が高いことが必須構成要件である。接着剤
層２には金属Ｍ３が貼着されている。金属箔３としては
銅箔、アルミニウム箔、真ちゅう箔、鉄箔、ステンレス
鋼箔、ニッケル箔、ケイ素鋼箔などいずれをも採用でき
る。The present invention will now be described in detail with reference to the accompanying drawings. The inner layer material 1 is a laminate of a plurality of 7-layer resin films or 7-layer resin-impregnated base materials, with conductor patterns 5 formed on both sides by a conventional method. Adhesive layer 2 is on both sides of this inner layer material 1.
is formed. Of course, the adhesive layer 2 may be formed only on one side of the inner layer material 1. This adhesive layer 2 may be made of a fluororesin film, a fluororesin-impregnated base material, other resin films with a low dielectric constant such as polyimide resin, It is formed from a resin-impregnated base material. In this adhesive layer 2, a fluororesin laminate 4 such as a plurality of fluororesin films or a laminate of base materials impregnated with a 7-carbon resin is disposed. Chlorinated ethylene resin (CTFE, melting point 210-212°C), 47? polyethylene resin (TFE, melting point 320-335°C), tetra7fluoroethylene-67fluoropylene copolymer resin (FEP, melting point 260-280°C), tetra7fluoroethylene-perfluorovinyl ether copolymer resin (PF^, melting point 302-
310°C), and those having a melting point of 200°C or higher, such as tetra7tethylene-ethylene copolymer resin (ETFE, melting point 260 to 270°C), are preferable. The resin forming the adhesive layer 2 has a melting point lower than that of the fluororesin of the fluororesin laminate 4 and the inner layer material 1. Further, it is preferable that the melting point of the fluororesin of the fluororesin laminate 4 is the same as or lower than the melting point of the fluororesin of the inner layer material 1, and that the adhesive M2
It is essential that the melting point of the fluororesin of the inner layer material 1 and the fluororesin laminate 4 be high. A metal M3 is adhered to the adhesive layer 2. As the metal foil 3, copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used.
本発明の積層板Ａは、たとえば内層材１の両面に、接着
剤層２として３枚の７ツ素樹１１フイルムを配置し、こ
のフッ素８１Ｍフィルム開にそれぞれフッ素樹脂積層体
４を挾み、フッ素樹脂フィルムに金属Ｍ３を積み重ね、
このものを−組みとして成形プレートを介して複数組み
熱盤間に配置し、２００℃以上、２０〜１５０ｋｇ／ａ
ｍ”、４０−１００分で加熱加圧して積層一体化させて
製造する。この場合加熱加圧における加熱温度を接着剤
層２のフッ索樹脂フイルムよりも高くかつフッ素樹脂積
層体４及び内層材１のフッ素樹脂の融点よりも低くする
。これにより、成形に際してフッ素樹脂積層体４及び内
層材１のフッ素樹脂が溶融しなく、従って、接着剤層２
及び内層材１の寸法変化が小さく、全体の寸法安定性が
良好となり、しかもフッ素樹脂積層体４及び内層材１の
フッ素樹脂が溶融しないことから層間のずれが少なくな
るのである。又、内層材１の表面を表面処理剤で粗化さ
せて接着剤層２との接着性を向上させておいてもよい０
表面処理剤としては金属ナトリウム・アンモニアとか金
属ナトリウム混合・テトラヒドロ７ランとか、あるいは
テトラエッチ（商品名、潤工社株式会社製）などを挙げ
ることができる。テトラエッチによる処理を説明すると
、まず内層材１の表面の汚れをアセトンなどでおとし、
乾燥させる。この後内層材１をテトラエッチに浸すが、
金属又はポリエチレノのへらで塗布する。処理時間は内
層材１のフッ素樹脂の種類により異なるが５〜１０秒程
度である。In the laminate A of the present invention, for example, three 7-carbon resin 11 films are arranged as adhesive layers 2 on both sides of an inner layer material 1, and a fluororesin laminate 4 is sandwiched between the 81M fluorine film and the 81M fluorine film is opened. Stack metal M3 on resin film,
A plurality of sets of this material are placed between hot platens via forming plates, and the temperature is 200°C or higher and 20 to 150 kg/a.
m", and is manufactured by heating and pressing for 40 to 100 minutes to integrate the laminate. In this case, the heating temperature during heating and pressing is higher than that of the fluorine resin film of the adhesive layer 2, and the fluororesin laminate 4 and the inner layer material The melting point of the fluororesin 1 is lower than the melting point of the fluororesin 1.This prevents the fluororesin laminate 4 and the inner layer material 1 from melting during molding, so that the adhesive layer 2
The dimensional change of the inner layer material 1 is small, and the overall dimensional stability is good. Moreover, since the fluororesin of the fluororesin laminate 4 and the inner layer material 1 do not melt, misalignment between the layers is reduced. Additionally, the surface of the inner layer material 1 may be roughened with a surface treatment agent to improve its adhesion with the adhesive layer 2.
Examples of the surface treatment agent include metallic sodium/ammonia, metallic sodium mixture/tetrahydro7ran, and Tetraetch (trade name, manufactured by Junkosha Co., Ltd.). To explain the Tetra Etch treatment, first remove dirt on the surface of the inner layer material 1 with acetone, etc.
dry. After this, inner layer material 1 is soaked in Tetra Etch,
Apply with a metal or polyethylene spatula. The processing time varies depending on the type of fluororesin of the inner layer material 1, but is about 5 to 10 seconds.
この積層板Ａは順次、孔明け、無電解めっき、パターン
形成、パターンめっき、レジストめっき、レノスト除去
、エツチング、外形仕上げ、シンボルマーク印刷といっ
た工程でスルーホールめっき多層プリント配線板が製造
される。This laminate A is manufactured into a through-hole plated multilayer printed wiring board through the following steps: hole drilling, electroless plating, pattern formation, pattern plating, resist plating, renost removal, etching, external finishing, and symbol mark printing.
次に、本発明の実施例を具体的に説明する。Next, examples of the present invention will be specifically described.
（実施例）
融点が３２７℃のＴＦＥを使用したフッ素樹脂含浸基材
と７ツ累樹脂フイルムとで形成した内層材の両面に、接
着剤層として融点が２７５℃のＦＥＰから形成した二枚
のフッ素樹脂フィルムを配置し、この二枚の７ツ累樹脂
フイルム間に融点が３２７℃のＴＦＥを使用したフッ素
樹脂含浸基材からなる７−／素樹脂積層体を配し、その
上に銅箔を積み重ね、このものを−組として熱盤間に複
数組み配置して加熱加圧成形してＷ４ｔｉ張り積層板を
形成した。加熱加圧条件は、３２０℃、２０ｋｇ／ａｍ
２．１２０分であった。１電率を測定した（ＪＩＳ Ｃ
６４８１による）ところ２．７であった。又、板厚のば
らつき（５００＋＊ｍＸ５００ｍ■内）は０．０２ｍ−
であり、寸法変化率は０．１％で、歩留まりは６０％で
あった。(Example) Two sheets of FEP with a melting point of 275°C were attached as adhesive layers on both sides of an inner layer material formed of a fluororesin-impregnated base material using TFE with a melting point of 327°C and a 7-layer resin film. A fluororesin film is arranged, and a 7-/base resin laminate made of a fluororesin-impregnated base material using TFE with a melting point of 327°C is arranged between these two 7-layer resin films, and a copper foil is placed on top of it. They were stacked up, and a plurality of sets were arranged between hot platens and molded under heat and pressure to form a W4ti laminate. Heating and pressurizing conditions are 320℃, 20kg/am
2. It was 120 minutes. 1 electric current was measured (JIS C
According to 6481), it was 2.7. Also, the variation in plate thickness (within 500+*m x 500m) is 0.02m-
The dimensional change rate was 0.1% and the yield was 60%.
（比較例）
接着剤層を融点が３２７℃のＴＦＥから形成した三枚の
フッ素樹脂フィルムとＴＦＥを含浸させて形成した三枚
のフッ素樹脂含浸基材とを交互に配置して形成し、加熱
加圧における加熱温度を３フＯ℃とした以外は実施例と
同様にして銅箔張り積層体を形成した誘電率を測定した
（ＪＩＳ Ｃ６４８１による）ところ２．７であった。(Comparative example) An adhesive layer was formed by alternately arranging three fluororesin films made of TFE with a melting point of 327°C and three fluororesin-impregnated base materials impregnated with TFE, and heated. The dielectric constant of a copper foil-clad laminate formed in the same manner as in the example except that the heating temperature during pressurization was 3°C was measured (according to JIS C6481) and found to be 2.7.
又、板厚のばらり％ （５００ｅｅ−×５００−一内）
は０．０５−輪であり、寸法変化率は１．５％で、歩留
まりは３０％であった。Also, variation in board thickness (500ee-×500-1)
was 0.05-ring, the dimensional change rate was 1.5%, and the yield was 30%.
［発明の効果１
本発明にあっては、誘電率が小さく、高周波特性が良好
となり、プリント配線板として使用した場合に高周波演
算回路、通信機回路の実装が可能な絶縁特性に優れ、し
かも多層であり高密度実装が可能な多層プリント配線板
用の積層板であって、接着剤層にフッ素樹脂積層体が配
され、フッ素樹脂積層体により接着剤層の寸法安定性が
高くなり、しかも接着剤層の融点が加熱加圧における成
形温度よりも低く、内層材及びフッ素樹脂積層体のフッ
素樹脂の融点が加熱加圧の成形温度よりも高いので、多
層化に際してフッ素樹脂積層体と内層材のフッ素樹脂が
溶融しなく、従って眉間の位置すれかなく、寸法安定性
に優れ、信頼性及び歩留まりが高くなるものである。[Effect of the invention 1] The present invention has a low dielectric constant, good high frequency characteristics, excellent insulation characteristics that allow mounting of high frequency arithmetic circuits and communication circuits when used as a printed wiring board, and a multilayer structure. This is a laminate for multilayer printed wiring boards that allows high-density mounting.A fluororesin laminate is arranged on the adhesive layer, and the fluororesin laminate increases the dimensional stability of the adhesive layer. The melting point of the agent layer is lower than the molding temperature in heating and pressing, and the melting point of the fluororesin in the inner layer material and the fluororesin laminate is higher than the molding temperature in heating and pressing. The fluororesin does not melt, and therefore only lies between the eyebrows, resulting in excellent dimensional stability, high reliability, and high yield.
第１図は本発明の一実施例を示す概略分解断面図であっ
て、Ａは積層板、１は内層材、２は接着剤層、３は金属
箔、４はフッ素樹脂積層体である。
代理人 弁理士 石 １）長 七
Ａ・・・積層板
１−・・内層材
２・・・接着剤層
３・・・金属箔
４・・・７ツ素用Ｍ積層体
第１図FIG. 1 is a schematic exploded sectional view showing one embodiment of the present invention, in which A is a laminate, 1 is an inner layer material, 2 is an adhesive layer, 3 is a metal foil, and 4 is a fluororesin laminate. Agent Patent Attorney Ishi 1) Chief 7A...Laminated board 1--Inner layer material 2...Adhesive layer 3...Metal foil 4...7 M laminate for 7-piece material Figure 1
Claims (2)
着剤層を介して金属箔を配置し加熱加圧して積層一体化
させた積層板であつて、接着剤層にフッ素樹脂積層体が
配され、接着剤層の融点が加熱加圧における成形温度よ
りも低く、内層材及びフッ素樹脂積層体のフッ素樹脂の
融点が加熱加圧における成形温度よりも高いことを特徴
とする積層板。(1) A laminate in which metal foil is placed on one or both sides of an inner layer material made of fluororesin via an adhesive layer, and the fluororesin laminate is integrated by heating and pressing. 1. A laminate, wherein the melting point of the adhesive layer is lower than the molding temperature during heating and pressing, and the melting point of the fluororesin of the inner layer material and the fluororesin laminate is higher than the molding temperature during heating and pressing.
とする特許請求の範囲第１項記載の積層板。(2) The laminate according to claim 1, wherein the adhesive layer is a fluororesin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3175887A JPS63199636A (en) | 1987-02-14 | 1987-02-14 | Laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3175887A JPS63199636A (en) | 1987-02-14 | 1987-02-14 | Laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63199636A true JPS63199636A (en) | 1988-08-18 |
Family
ID=12339922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3175887A Pending JPS63199636A (en) | 1987-02-14 | 1987-02-14 | Laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63199636A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02237197A (en) * | 1989-03-10 | 1990-09-19 | Hitachi Ltd | Multilayer circuit board and manufacture and use thereof |
| JPH03283492A (en) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | Multilayered printed circuit board and manufacture thereof |
| JPH06344503A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and composite film for laminated sheet |
| JP2001328205A (en) * | 2000-05-19 | 2001-11-27 | Nippon Pillar Packing Co Ltd | Laminated sheet and method for manufacturing the same |
| WO2007066788A1 (en) * | 2005-12-05 | 2007-06-14 | Junkosha Inc. | Fluororesin laminate substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831742A (en) * | 1981-08-18 | 1983-02-24 | 日立電線株式会社 | Copper lined laminated board |
| JPS60257596A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
-
1987
- 1987-02-14 JP JP3175887A patent/JPS63199636A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831742A (en) * | 1981-08-18 | 1983-02-24 | 日立電線株式会社 | Copper lined laminated board |
| JPS60257596A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02237197A (en) * | 1989-03-10 | 1990-09-19 | Hitachi Ltd | Multilayer circuit board and manufacture and use thereof |
| JPH03283492A (en) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | Multilayered printed circuit board and manufacture thereof |
| JPH06344503A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and composite film for laminated sheet |
| JP2001328205A (en) * | 2000-05-19 | 2001-11-27 | Nippon Pillar Packing Co Ltd | Laminated sheet and method for manufacturing the same |
| WO2007066788A1 (en) * | 2005-12-05 | 2007-06-14 | Junkosha Inc. | Fluororesin laminate substrate |
| JP2007157965A (en) * | 2005-12-05 | 2007-06-21 | Junkosha Co Ltd | Fluororesin lamination substrate |
| JP4545682B2 (en) * | 2005-12-05 | 2010-09-15 | 株式会社潤工社 | Fluorine resin laminated substrate |
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