JPH01264811A - Manufacture of electrical laminate - Google Patents
Manufacture of electrical laminateInfo
- Publication number
- JPH01264811A JPH01264811A JP9401688A JP9401688A JPH01264811A JP H01264811 A JPH01264811 A JP H01264811A JP 9401688 A JP9401688 A JP 9401688A JP 9401688 A JP9401688 A JP 9401688A JP H01264811 A JPH01264811 A JP H01264811A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- hole
- metal plate
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims abstract description 63
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 238000001228 spectrum Methods 0.000 claims abstract description 9
- 230000009477 glass transition Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000011049 filling Methods 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000009719 polyimide resin Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000269821 Scombridae Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000019688 fish Nutrition 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 235000020640 mackerel Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本発明は、金属板を基板として用いた多層の電気積層板
の製造方法に関するものである。The present invention relates to a method for manufacturing a multilayer electrical laminate using a metal plate as a substrate.
金属板を基板とする電気積層板においては、スルーホー
ルを形成するために孔明きの金属板が基板として用いら
れる。すなわち、金属板にスルーホールを形成すべき箇
所においてスルーホールの径よりも大きな通孔を設けて
おき、複数枚の金属板をプリプレグを介して重ねで加熱
加圧成形をおこなうことによって、プリプレグに含浸し
た樹脂を硬化させて各金属板を１積層接着すると共にプ
リプレグに含浸した樹脂を金属板の各通孔に流入充填さ
せて硬化させる。このとき各金属板の開には片面プリン
ト配線板や両面プリント配線板、多層プリント配線板な
どの回路を形成した回路板がプリプレグを介して重ねて
あり、各回路板を金属板間に積層接着するようにしであ
る。
そして金属板の通孔に充填させた樹脂の部分においてス
ルーホールを穿孔加工することによって、通孔内の樹脂
で金属板との間の絶縁性が確保されたスルーホールを形
成することができるのである。
さらにスルーホールの内周にはメツキを施してスルーホ
ールメツキ層が形成される。In an electrical laminate using a metal plate as a substrate, a perforated metal plate is used as the substrate to form through holes. In other words, a hole larger than the diameter of the through hole is provided at the location where the through hole is to be formed in the metal plate, and multiple metal plates are stacked and heated and press-formed with the prepreg interposed in between. The impregnated resin is cured to bond each metal plate in one layer, and the resin impregnated into the prepreg is flowed and filled into each through hole of the metal plate and cured. At this time, circuit boards with circuits formed on them, such as single-sided printed wiring boards, double-sided printed wiring boards, and multilayer printed wiring boards, are stacked on the opening of each metal plate via prepreg, and each circuit board is laminated and bonded between the metal plates. That's what I do. Then, by drilling a through hole in the part of the resin filled in the hole in the metal plate, the resin inside the hole can form a through hole that ensures insulation between it and the metal plate. be. Further, the inner periphery of the through hole is plated to form a through hole plating layer.
しかし、上記のようにプリプレグに含浸した樹脂で金属
板を積層すると共に金属板の通孔に樹脂を充填させるこ
とによって作成される電気積層板にあって、樹脂と金属
板とは熱膨張率に差があるために加熱応力によって樹脂
に第３図に示すようにクラック７が発生するおそれがあ
る。第３図において１は通孔、２は金属板、４は通孔内
の樹脂、５はスルーホール、６はスルーホールメツキ層
、９は金属箔である。特に通孔１の部分は樹脂の厚みが
大きいために脆くなっており、通孔１の部分で樹脂にク
ラック７が発生し易いものであり、ポリイミドのように
脆い樹脂の場合はこの傾向が高いものである。
本発明は上記の点に鑑みて為されたものであり、樹脂に
クラックが発生することを低減することができる電気積
層板の製造方法を提供することを目的とするものである
。However, in electrical laminates that are created by laminating metal plates with resin impregnated into prepreg and filling resin into the holes in the metal plates as described above, the resin and metal plates have different coefficients of thermal expansion. Due to the difference, cracks 7 may occur in the resin due to thermal stress as shown in FIG. In FIG. 3, 1 is a through hole, 2 is a metal plate, 4 is a resin inside the through hole, 5 is a through hole, 6 is a through hole plating layer, and 9 is a metal foil. In particular, the resin in the hole 1 area is thick and brittle, and cracks 7 are likely to occur in the resin at the hole 1 area, and this tendency is high in the case of brittle resins such as polyimide. It is something. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing an electrical laminate that can reduce the occurrence of cracks in the resin.
上記課題を解決するために本発明は、通孔１を設けた複
数枚の４１．ＮＬ板２をプリプレグ３を介して重ね、こ
れを加熱加圧成形してプリプレグ３に含浸した樹脂を硬
化させて各金属板２を積層接着すると共にプリプレグ３
に含浸した樹脂を金属板２の各通孔１に流入充填させて
硬化させ、通孔１内の樹脂４の部分においてスルーホー
ル５を穿孔加工するにあたりで、プリプレグ３に含浸す
る樹脂としてその硬化物のグラス転移点での粘弾性スペ
クトロのｔａｎδが０．１以上のものを用いるようにし
たことを特徴とするものである。
以下本発明の詳細な説明する。プリプレグ３はガラスペ
ーパー（ガラス不織布）やガラスクロス（がラス織布）
などの基材に熱硬化性樹脂を含浸して乾燥することによ
って調製されるものであるが、ガラスペーパーはグラス
クロスに比べてｍ織が疎であって、含浸される樹脂を浸
透させて十分な量で保有することがでさるために、ガラ
スペーパーを基材としてプリプレグ３を調製するように
するのがよい、ここで本発明においては、プリプレグ３
を調製する樹脂として硬化物のがラス転移点付近での粘
弾性スペクトロのｔａｎδが０．１以上のものを用いる
ものである。高分子体は弾性（Ｅ′）と粘性（Ｅ′）の
両方の性質を兼ね備えており、粘弾性スペクトロはこの
弾性と粘性を同時に測定するもので、そのｔｉｎδはＥ
’ ／Ｅ’″で表される数値、つまり粘性と弾性の比率
を表す数値である。また加熱しながら粘弾性を測定する
と、ｔａｎδはある温度でピークに達する。これががラ
ス転移点（Ｔｇ）である。そして、ガラス転移点付近で
の粘弾性スペクトａのｊａｎδが０．１以上であるｔＩ
！脂は、可撓性が良好であって後述するようにクラック
が発生することを防止することができるものである。こ
のような樹脂としては主としてエボキン樹脂やエポキシ
変性したポリイミド樹脂などが使用される。
またこの樹脂には無機質の充填剤を配合して用いるのが
好ましい。
しかして上記のような樹脂を含浸して調製したプリプレ
グ３を用い、金属板２を基板とする電気積層板を製造す
るにあたっては、まず、銅板など金属板２にスルーホー
ル５を形成する箇所においてパンチ加工やｒリル加工な
どで通孔１を形成する０通孔１はスルーホール５の直径
よりも大きな直径で形成されるものである。そして第１
図（ａ）のようにプリプレグ３を介して金属板２を数枚
重ね、さらに上下にプリプレグ３を介して銅箔なと金属
箔９を重ねる。このときさらに各金属板２の間には片面
プリント配線板や両面プリント配線板、多層プリント配
線板など譬の回路を形成した回路板１０がプリプレグ３
を介して重ねである。もちろん総ての金属板２間に回路
板１０を配置するような必要はなく、一部の金属板２同
士はプリプレグ３を介して直接重ねられるようにしても
よい。そしてこれを加熱加圧成形することによって、プ
リプレグ３に含浸した樹脂を硬化させて各金属板２と回
路板１０とを交互に積層接着させると共に最外層に金属
Ｍ９を積層接着させ、さらにプリプレグ３に含浸した樹
脂の一部を金属板２の各通孔１内に流入させて第１図（
ｂ）のようにこの樹脂４を通孔１内に充填させる。この
ようにして金属板２の通孔１に樹脂４を充填させた状態
で各金属板２を積層すると共に上下にそれぞれ金属箔９
を積層したのちに、ドリル加工やパンチ加工などで第１
図（ｃ）のようにスルーホール５を穿孔加工する。
スルーホール５は通孔１に充填した樹脂４の部分におい
て通孔１の直径よりも小さい直径で形成されるものであ
り、従ってスルーホール５の内周と金属板２との間の電
気絶縁性は樹脂４に上って確保されることになる。尚、
上記実施例では一部の金属板２にスルーホール５を貫通
させてアースなどをとることができるようにしである。
上記のようにスルーホール５を加工したのちに、スルー
ホール５の内周に銅などのスルーホールメツキを施して
スルーホールメツキ層を形成し、また金属箔９をエツチ
ング処理して回路を形成したりなどすることによって、
金属板２を基板とし回路板１０に形成された内層回路と
金属箔９の加工で形成される外層回路がそれぞれ設けら
れた電気積層板に仕上げるのである。このように形成さ
れる電気積層板にあって、プリプレグ３に含浸した樹脂
中に充填剤を配合しておくことによって、金属板２の通
孔１に充填される用詣４中にも充填剤が含有されるよう
にし、樹脂４の部分においてスルーホール５を穿孔加工
するとスルーホール５の内周に充填剤が露出して凹凸面
が形成されるようにしてアンカー効果でスルーホール７
ツキ層の密着性を高めることができる。そして上記した
ように金属板２の通孔１に充填されている樹脂４は可撓
性が高いために、樹脂４Ｉと金属板２との開の熱膨張率
の差による加熱応力が樹脂４に作用しても緩和され、ｆ
ｌｆＮ４にクラックが発生することを低減で慇るもので
ある。In order to solve the above problems, the present invention provides a plurality of sheets of 41. The NL plates 2 are stacked with the prepreg 3 interposed therebetween, and then heated and pressure molded to harden the resin impregnated into the prepreg 3 to bond each metal plate 2 together and form the prepreg 3.
The resin impregnated with the prepreg 3 is poured into each through hole 1 of the metal plate 2 and cured, and when the through hole 5 is punched in the resin 4 part of the through hole 1, the resin is hardened as the resin impregnated into the prepreg 3. The material is characterized in that the tan δ of the viscoelastic spectrum at the glass transition point of the material is 0.1 or more. The present invention will be explained in detail below. Prepreg 3 is glass paper (glass non-woven fabric) or glass cloth (glass woven fabric)
It is prepared by impregnating a thermosetting resin into a base material such as glass paper and drying it, but glass paper has a looser weave than glass cloth, so it is difficult for the impregnated resin to penetrate sufficiently. In order to be able to hold a large amount of prepreg 3, it is preferable to prepare prepreg 3 using glass paper as a base material.
The resin used is one in which the cured product has a viscoelastic spectrum tan δ of 0.1 or more near the lath transition point. Polymers have both elastic (E') and viscous (E') properties, and viscoelastic spectrometry measures both elasticity and viscosity at the same time, and the tin δ is E
It is a numerical value expressed as '/E''', that is, the ratio of viscosity and elasticity. Also, when measuring viscoelasticity while heating, tan δ reaches a peak at a certain temperature. This is the lath transition point (Tg) and tI where jan δ of the viscoelastic spectrum a near the glass transition point is 0.1 or more.
! The oil has good flexibility and can prevent the occurrence of cracks as described later. As such resin, Evokin resin, epoxy-modified polyimide resin, etc. are mainly used. Moreover, it is preferable to use this resin in combination with an inorganic filler. Therefore, when manufacturing an electrical laminate using the metal plate 2 as a substrate using the prepreg 3 prepared by impregnating the resin as described above, first, at the location where the through hole 5 is to be formed in the metal plate 2 such as a copper plate. The through hole 1, which is formed by punching, r-rilling, etc., has a diameter larger than that of the through hole 5. and the first
As shown in Figure (a), several metal plates 2 are stacked with prepregs 3 interposed therebetween, and metal foils 9 such as copper foils are stacked above and below with prepregs 3 interposed therebetween. At this time, between each metal plate 2, a circuit board 10 on which a circuit is formed, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, is placed on the prepreg 3.
It is layered through. Of course, it is not necessary to arrange the circuit board 10 between all the metal plates 2, and some of the metal plates 2 may be directly stacked on each other with the prepreg 3 interposed therebetween. Then, by heating and press-molding this, the resin impregnated into the prepreg 3 is cured, each metal plate 2 and the circuit board 10 are laminated and bonded alternately, and the metal M9 is laminated and bonded to the outermost layer. A portion of the resin impregnated with the resin is flowed into each through hole 1 of the metal plate 2,
The resin 4 is filled into the through hole 1 as in b). In this way, each metal plate 2 is laminated with the resin 4 filled in the through hole 1 of the metal plate 2, and the metal foil 9 is placed on the top and bottom respectively.
After laminating the layers, the first step is performed by drilling or punching.
A through hole 5 is drilled as shown in Figure (c). The through hole 5 is formed with a smaller diameter than the diameter of the through hole 1 in the portion of the resin 4 filled in the through hole 1, and therefore the electrical insulation between the inner periphery of the through hole 5 and the metal plate 2 is poor. will rise to the resin 4 and be secured. still,
In the above embodiment, a through hole 5 is passed through a part of the metal plate 2 so that it can be grounded. After processing the through hole 5 as described above, the inner periphery of the through hole 5 is plated with copper or the like to form a through hole plating layer, and the metal foil 9 is etched to form a circuit. By doing things like
Using the metal plate 2 as a substrate, an electrical laminated board is completed in which an inner layer circuit formed on the circuit board 10 and an outer layer circuit formed by processing the metal foil 9 are respectively provided. In the electrical laminate formed in this way, by adding a filler to the resin impregnated into the prepreg 3, the filler can also be added to the filler 4 filled into the through hole 1 of the metal plate 2. When the through-hole 5 is drilled in the resin 4, the filler is exposed on the inner periphery of the through-hole 5 and an uneven surface is formed.
The adhesion of the veneer layer can be improved. As mentioned above, since the resin 4 filled in the through hole 1 of the metal plate 2 is highly flexible, the resin 4 is subjected to heating stress due to the difference in thermal expansion coefficient between the resin 4I and the metal plate 2. Even if it acts, it is relaxed, f
This reduces the occurrence of cracks in lfN4.
以下本発明を実施例によって具体的に説明する。
Ｘ１且上
硬化剤としてノシアンノアミドを含有するエポキシυ（
脂フェス（ＦＲ−４）に充填剤として中心粒径（粒径分
布の中央値）が１０μのＡｌｚＯ，・３Ｈ２粉粒体を５
０ＰＨＲの配合量で配合した。このエポキシ樹脂はその
硬化物のプラス転移点付近での粘弾性スペクトロのｔａ
ｎδが第２図に示すように１であった。
次にこのエポキシ樹脂ワニスに基材としてプラスペーパ
ー（日本バイリーン！！ＥＰ−４０７５ニア５ｇ／曽２
）を浸漬し、次いで乾燥することによって、７８０ｇ／
鰺’のプリプレグを作成した。ここで乾燥の条件はプリ
プレグ中の樹脂の１３０℃での溶融粘度が３００〜７０
０ボイズに、１７０℃、２０ ｋｇ／ ｃｍ”、１０分
間の条件でのグリニス（樹脂流れ性）が２０〜２５％に
なるように設定した。
一方、金属板として５００＋ｍＸ４００＋５ｍＸ０゜５
−醜の銅板を用い、直径が１．５１の通孔を１．８１ピ
ツチで縦１００Ｘ横６０の個数設けた。そしてこの金属
板を３枚、両面銅張ポリイミド樹脂積層板の銅箔をエツ
チング加工して回路を設けることによって形成した両面
プリント配線板を回路板として２枚用い、これらを第１
図（、）のように上記プリプレグを介して交互に重ねる
と共に上下にプリプレグを介して銅箔を重ね、２０ｋｇ
／ｃｓ”の加圧条件を維持しつつ１４０℃で２０分間、
１７０℃で９０分間加熱すると共に２０分間を要して冷
却して積層成形をおこなうことによって、金属板と回路
板とを交互に積層し表面に銅箔を張った多層積層板を得
た。
こののちに金属板の通孔の部分において多層積層板に直
径が０ 、９ ｍｍのスルーホールをドリル加工し、そ
してさらに銅メツキをおこなってスルーホールの内周に
スルーホールメツキを施した。
Ｋ１燵見
末端官能型イミド樹脂（住人化学社製ＴＭＳ−２０）２
００重量部、液状エポキシ樹脂１４９重を部、ブロム化
／ボラック樹脂１３６重量部、ルイス酸化合物８２重１
部、不飽和ビスマレイミド２０重量部を混合し、９０℃
で５０分間加熱したのちに常温にまで冷却して３０分間
攪拌下反応させることによってエポキシ変性ポリイミド
樹脂フェスを調製した。このエポキシ変性ポリイミド樹
脂はその硬化物のプラス転移点付近での粘弾性スペクト
ロのｔａｎδが第２図に示すように０．１であった。そ
してこのエポキシ変性ポリイミド樹脂フエスを用いてプ
リプレグを作成し、あとは実施例１と同様にした。
駁１蝕
ポリイミド樹脂フェス（ローヌブーラン社製ケルイミド
６０１）を用いてプリプレグを作成するようにした他は
実施例１と同様にした。このポリイミド樹脂はその硬化
物のガラス転移点付近での粘弾性スペクトロのｔａｎδ
が第２図に示すように０．０５であった。
上記実施例１〜２及び比較例で得た多層積層板について
２６０℃、６０秒間の加熱処理した後の金属板の通孔内
での樹脂部分のクラックの発生状第１表
○：クラック無し Ｘ：クラック発生
第１表の結果にみちれるように、ｔａｎδが０．１以上
の樹脂を用いた実施例１．２のものでは、樹脂の可視性
によって応力緩和がなされて加熱後にクラックが発生す
ることを防止できることが確認される。The present invention will be explained in detail below using examples. X1 and an epoxy υ containing nocyanamide as a curing agent (
5 pieces of AlzO, 3H2 powder with a center particle size (median value of particle size distribution) of 10μ was added to Fat Face (FR-4) as a filler.
It was blended in an amount of 0 PHR. This epoxy resin has a viscoelastic spectrometer ta near the plus transition point of the cured product.
nδ was 1 as shown in FIG. Next, this epoxy resin varnish was coated with plus paper (Japan Vilene!! EP-4075 Nia 5g/So 2) as a base material.
) by soaking and then drying 780g/
I made prepreg of mackerel. Here, the drying conditions are such that the melt viscosity of the resin in the prepreg at 130°C is 300 to 70.
The setting was such that the Glinnis (resin flowability) was 20 to 25% under the conditions of 170°C, 20 kg/cm", and 10 minutes at 0 voids. On the other hand, as a metal plate, 500+mX400+5mX0°
-Using an ugly copper plate, holes with a diameter of 1.51 were provided at a pitch of 1.81, 100 in length x 60 in width. Then, three of these metal plates and two double-sided printed wiring boards formed by etching the copper foil of a double-sided copper-clad polyimide resin laminate to form a circuit were used as circuit boards, and these were used as circuit boards.
As shown in the figure (,), the above prepregs are layered alternately, and the copper foil is layered on top and bottom through the prepregs.
/cs” at 140°C for 20 minutes while maintaining the pressurized condition.
By heating at 170° C. for 90 minutes and cooling for 20 minutes to perform lamination molding, a multilayer laminate in which metal plates and circuit boards were alternately laminated and copper foil was spread on the surface was obtained. Thereafter, through-holes with a diameter of 0.9 mm were drilled in the multilayer laminate at the through-hole portions of the metal plates, and copper plating was further performed to plate the inner periphery of the through-holes. K1 Tatsumi terminal functional imide resin (TMS-20 manufactured by Sumima Kagaku Co., Ltd.) 2
00 parts by weight, 149 parts by weight of liquid epoxy resin, 136 parts by weight of brominated/borac resin, 82 parts by weight of Lewis acid compound
20 parts by weight of unsaturated bismaleimide and heated to 90°C.
An epoxy-modified polyimide resin face was prepared by heating for 50 minutes, cooling to room temperature, and reacting with stirring for 30 minutes. This epoxy-modified polyimide resin had a viscoelastic spectrum tan δ of 0.1 near the positive transition point of the cured product, as shown in FIG. Then, a prepreg was prepared using this epoxy-modified polyimide resin fabric, and the rest was carried out in the same manner as in Example 1. Example 1 was carried out in the same manner as in Example 1, except that a prepreg was made using a polyimide resin face (Kelimide 601, manufactured by Rhone Boulin). This polyimide resin has a viscoelastic spectrum of tan δ near the glass transition point of its cured product.
was 0.05 as shown in FIG. Table 1: Occurrence of cracks in the resin part within the through holes of the metal plate after the multilayer laminates obtained in Examples 1 and 2 and Comparative Examples were heat-treated at 260°C for 60 seconds Table 1: No cracks : Occurrence of cracks As shown in the results in Table 1, in Example 1.2 using a resin with tan δ of 0.1 or more, cracks occur after heating due to stress relaxation due to the visibility of the resin. It is confirmed that this can be prevented.
上述のように本発明にあっては、プリプレグに含浸する
樹脂としてその硬化物のが２ス転移魚での粘弾性スペク
トロのｔａｎδが０．１以上のものを用いるようにした
ので、金属板の通孔に充ｊｊＥされる樹脂は可撓性が高
（、樹脂と金属板との間の熱膨張率の差による加熱応力
が樹脂に作用しても緩和され、樹脂が破壊されてクラッ
クが発生することを低減できるものである。As mentioned above, in the present invention, as the resin impregnated into the prepreg, a cured product having a tan δ of 0.1 or more in the viscoelastic spectrum in a two-span transition fish is used. The resin that fills the through holes is highly flexible (even if the thermal stress applied to the resin due to the difference in thermal expansion coefficient between the resin and the metal plate is relaxed, the resin is destroyed and cracks occur. It is possible to reduce the amount of
第１図（ａ）（ｂＨｃ）は電気積層板の製造の各工程を
示す断面図、第２図は粘弾性スペクトロのｔａｎδを示
すグラフ、第３図は従来例の一部の拡大断面図である。
１は通孔、２は金属板、３はプリプレグ、４は通孔内の
樹脂、５はスルーホールである。Figures 1 (a) and (bHc) are cross-sectional views showing each process of manufacturing an electric laminate, Figure 2 is a graph showing tan δ of viscoelastic spectroscopy, and Figure 3 is an enlarged cross-sectional view of a part of a conventional example. be. 1 is a through hole, 2 is a metal plate, 3 is a prepreg, 4 is a resin in the through hole, and 5 is a through hole.
Claims (1)
して重ね、これを加熱加圧成形してプリプレグに含浸し
た樹脂を硬化させて各金属板を積層接着すると共にプリ
プレグに含浸した樹脂を金属板の各通孔に流入充填させ
て硬化させ、通孔内の樹脂の部分においてスルーホール
を穿孔加工するにあたって、プリプレグに含浸する樹脂
としてその硬化物のガラス転移点での粘弾性スペクトロ
のｔａｎδが０．１以上のものを用いるようにしたこと
を特徴とする電気積層板の製造方法。(1) Layer multiple metal plates with through holes through prepreg, heat and pressure mold them, harden the resin impregnated in the prepreg, and laminate and bond each metal plate, as well as resin impregnated in the prepreg. is injected into each through hole of the metal plate and cured, and when drilling a through hole in the resin part of the through hole, the viscoelastic spectrum at the glass transition point of the cured product is used as the resin to be impregnated into the prepreg. A method for manufacturing an electrical laminate, characterized in that a material having a tan δ of 0.1 or more is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63094016A JP2675810B2 (en) | 1988-04-15 | 1988-04-15 | Manufacturing method of electric laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63094016A JP2675810B2 (en) | 1988-04-15 | 1988-04-15 | Manufacturing method of electric laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01264811A true JPH01264811A (en) | 1989-10-23 |
| JP2675810B2 JP2675810B2 (en) | 1997-11-12 |
Family
ID=14098705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63094016A Expired - Lifetime JP2675810B2 (en) | 1988-04-15 | 1988-04-15 | Manufacturing method of electric laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2675810B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001277273A (en) * | 2000-03-29 | 2001-10-09 | Sumitomo Bakelite Co Ltd | Method for manufacturing laminated sheet |
| JP2008235375A (en) * | 2007-03-16 | 2008-10-02 | Furukawa Electric Co Ltd:The | Metal core multilayer printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62158715A (en) * | 1986-01-08 | 1987-07-14 | Hitachi Ltd | Thermosetting resin composition and prepreg and laminated sheet using the same |
-
1988
- 1988-04-15 JP JP63094016A patent/JP2675810B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62158715A (en) * | 1986-01-08 | 1987-07-14 | Hitachi Ltd | Thermosetting resin composition and prepreg and laminated sheet using the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001277273A (en) * | 2000-03-29 | 2001-10-09 | Sumitomo Bakelite Co Ltd | Method for manufacturing laminated sheet |
| JP2008235375A (en) * | 2007-03-16 | 2008-10-02 | Furukawa Electric Co Ltd:The | Metal core multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2675810B2 (en) | 1997-11-12 |
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