JP2001277273A - Method for manufacturing laminated sheet - Google Patents
Method for manufacturing laminated sheetInfo
- Publication number
- JP2001277273A JP2001277273A JP2000091311A JP2000091311A JP2001277273A JP 2001277273 A JP2001277273 A JP 2001277273A JP 2000091311 A JP2000091311 A JP 2000091311A JP 2000091311 A JP2000091311 A JP 2000091311A JP 2001277273 A JP2001277273 A JP 2001277273A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- laminate
- melt viscosity
- laminated sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は積層板の製造方法に
関し、特に電気機器、電子機器、通信機器等に使用され
る印刷回路板用として好適な積層板の製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated board, and more particularly to a method of manufacturing a laminated board suitable for a printed circuit board used in electric equipment, electronic equipment, communication equipment and the like.
【0002】[0002]
【従来の技術】プリント回路板については小型化、高機
能化の要求が強くなる反面、価格競争が激しく、特にプ
リント回路板に用いられる多層回路基板やガラス布基材
エポキシ樹脂積層板、あるいはガラス不織布を中間層基
材としガラス織布を表面層基材とした積層板は、いずれ
も価格の低減が大きな課題となっている。従来これら積
層板や多層回路基板の製造工程では、銅箔及びプリプレ
グ或いは積層成形された積層板に回路加工を施した後、
一般に黒化処理と呼ばれる銅箔表面に酸化処理を施した
内層板を所定の長さに裁断し重ね合わせ、鏡面板間に配
置し、これを一組もしくは複数組重ね合わせ熱板間に挿
入し、加熱及び加圧し積層成形を行っている。しかし、
加熱成形時の熱板等積層成形設備治具類及び熱媒の加熱
冷却、製品、積層成形設備表面及び配管系からの放熱に
よる熱損失が大きく、熱源となる燃料の枯渇や、排出さ
れる炭酸ガスによる地球温暖化、硫黄酸化物、窒素酸化
物による環境への汚染等が問題となり、熱源となる燃料
の削減の必要性が問題となっている。2. Description of the Related Art As for printed circuit boards, demands for miniaturization and high functionality are increasing, but price competition is intense. In particular, multilayer circuit boards, glass cloth base epoxy resin laminates, or glass used for printed circuit boards are used. The cost reduction of any laminate using nonwoven fabric as the intermediate layer base material and glass woven fabric as the surface layer base material has been a major issue. Conventionally, in the production process of these laminates and multilayer circuit boards, after performing circuit processing on copper foil and prepreg or laminated laminate,
An inner layer plate obtained by subjecting a copper foil surface, which is generally referred to as a blackening process, to an oxidation treatment is cut to a predetermined length, overlapped, placed between mirror plates, and inserted into a set or a plurality of sets and inserted between hot plates. Heating and pressing are performed to form a laminate. But,
Large heat loss due to heat and cooling of jigs and heating medium for laminated molding equipment such as hot plates during heat molding, heat dissipation from products, laminated molding equipment surface and piping system, depletion of fuel as heat source, and emission of carbon dioxide Global warming due to gas, pollution of the environment by sulfur oxides and nitrogen oxides, and the like have become problems, and the necessity of reducing fuels as heat sources has become a problem.
【0003】また、プリント回路板に用いられる多層回
路基板やガラス布基材エポキシ樹脂積層板、あるいはガ
ラス不織布を中間層基材としガラス織布を表面層基材と
した積層板の積層成形する場合には熱盤内に銅箔、プリ
プレグ、鏡面板等を何枚も重ねて配置しているため、各
積層板の熱盤内での位置により積層成形時に各積層板に
かかる熱履歴が異なるため、成形性、反り、寸法変化率
等の品質に於いて差が生じ、品質のバラツキの少ない製
品を供給することは困難であった。また従来前記品質バ
ラツキの少ない積層板を成形する場合には、熱盤内にも
積層板1枚で成形する方法があるが生産効率が悪く非実
用的である。そこでプリプレグの1枚または複数枚およ
び金属箔またはフィルムを重ね合わせ、加熱したロール
間に挿入し連続積層成形する事により上記の問題を解決
する事を試みたが、ボイドを内在するという問題が発生
した。そこで鋭意検討した結果ロール間に挿入し積層成
形する時の樹脂の溶融粘度を調節することでボイドを無
くすことが可能であることを見出した。[0003] Further, when a multilayer circuit board used for a printed circuit board, a glass cloth base epoxy resin laminate, or a laminate using a glass nonwoven fabric as an intermediate layer base material and a glass woven fabric as a surface layer base material is formed by lamination. Because many layers of copper foil, prepreg, mirror surface plate, etc. are placed in a hot plate in the hot plate, the heat history applied to each laminate during lamination molding differs depending on the position of each laminate in the hot plate. There is a difference in quality such as moldability, warpage, and dimensional change rate, and it has been difficult to supply products with less variation in quality. Conventionally, in the case of forming a laminate having a small variation in quality, there is a method in which a single laminate is formed in a hot plate, but the production efficiency is low and this is impractical. Then, one or more sheets of prepreg and a metal foil or film were superimposed, and inserted between heated rolls to perform continuous lamination molding, and an attempt was made to solve the above problem. However, a problem that voids were inherent occurred. did. Therefore, as a result of intensive studies, it has been found that voids can be eliminated by adjusting the melt viscosity of the resin when the resin is inserted between rolls and laminated and formed.
【0004】[0004]
【発明が解決しようとする課題】本発明は、従来の熱盤
プレスによる成形の問題点、即ち、積層成形における使
用エネルギーが大きく、製品間の品質バラツキが大きい
という問題を解決し、安価且つ各性能の安定した積層板
の製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention solves the problems of molding by a conventional hot platen press, that is, the problem that the energy used in laminating molding is large and the quality variation between products is large, and it is inexpensive and has a low cost. It is an object of the present invention to provide a method for manufacturing a laminate having stable performance.
【0005】[0005]
【課題を解決するための手段】本発明は、プリプレグの
1枚または複数枚および金属箔またはフィルムを重ね合
わせ、加熱したロール間に挿入し積層成形する積層板の
製造方法において、ロール温度におけるプリプレグの樹
脂の溶融粘度が1〜800ポイズであることを特徴とす
る積層板の製造方法に関するものである。即ち、本発明
は、プリプレグの樹脂溶融粘度を調節しロール成形する
工程が主要な特徴であり、シート状基材への含浸性に優
れているという特長を有する。本発明はロール成形時溶
融粘度を調節することで低圧のロール成形でもボイドが
無く成形できる特徴がある。SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a laminated board in which one or a plurality of prepregs and a metal foil or a film are laminated, and inserted between heated rolls to form a laminate. A resin having a melt viscosity of 1 to 800 poise. That is, the main feature of the present invention is a step of adjusting the resin melt viscosity of the prepreg and performing roll forming, and has a feature of being excellent in impregnation into a sheet-like substrate. The present invention has a feature that by adjusting the melt viscosity at the time of roll forming, molding can be performed without voids even in low-pressure roll forming.
【0006】本発明において、繊維材よりなるシート状
基材としては、ガラス織布、ガラス不繊布、ガラスペー
パー等のガラス繊維基材の他、紙、合成繊維等からなる
織布や不織布、金属繊維、カーボン繊維、鉱物繊維等か
らなる織布、不織布、マット類等が挙げられ、これらの
基材の原料は単独又は混合して使用してもよい。プリプ
レグを製造するためにこれらのシート状基材に塗布する
樹脂としては、一般的に、熱硬化性樹脂であり、エポキ
シ樹脂、ポリイミド樹脂、フェノール樹脂、メラミン樹
脂およびこれらの変性樹脂が好ましく使用されるが、そ
の他、熱可塑性樹脂、天然樹脂等の樹脂も使用され、そ
れらに限定されるものではない。熱硬化性樹脂の場合、
必要に応じて硬化剤、硬化促進剤を配合する。また、充
填材、着色剤、補強材を配合することができる。充填材
として無機充填材を加えると耐トラッキング性、耐熱
性、熱膨張率の低下等の特性を付与することが出来る。
かかる無機充填材としては、水酸化アルミニウム、水酸
化マグネシウム、炭酸カルシウム、タルク、ウォラスト
ナイト、アルミナ、シリカ、未焼成クレー、焼成クレ
ー、硫酸バリウム等がある。In the present invention, the sheet-like substrate made of a fiber material may be a glass fiber substrate such as a glass woven fabric, a glass non-woven fabric, a glass paper, a woven fabric or a nonwoven fabric made of paper, synthetic fiber, or the like. Woven fabrics, nonwoven fabrics, mats, and the like made of fibers, carbon fibers, mineral fibers, and the like are mentioned, and these base materials may be used alone or in combination. As a resin to be applied to these sheet-like substrates to produce a prepreg, generally, a thermosetting resin is used, and an epoxy resin, a polyimide resin, a phenol resin, a melamine resin, and a modified resin thereof are preferably used. However, other resins such as a thermoplastic resin and a natural resin are also used, and the present invention is not limited thereto. For thermosetting resin,
If necessary, a curing agent and a curing accelerator are blended. Further, a filler, a coloring agent, and a reinforcing material can be blended. When an inorganic filler is added as the filler, characteristics such as tracking resistance, heat resistance, and a decrease in coefficient of thermal expansion can be imparted.
Such inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, talc, wollastonite, alumina, silica, unfired clay, fired clay, barium sulfate and the like.
【0007】プリプレグの樹脂量は、シート状繊維基材
の繊維材質、性状、重量(単位面積当たり)により異な
るが、通常、シート状繊維基材の重量の40〜60%程
度である。本発明において、プリプレグの樹脂のロール
温度における溶融粘度が1〜800ポイズ、更に好まし
くは、50〜600ポイズであることを特徴とする。溶
融粘度が1ポイズより低い場合は、ロール成形後にプリ
プレグと金属箔或いはシート間で剥離を起こすことがあ
るため好ましくない。800ポイズより高い場合は、金
属箔或いはシートに対する樹脂の濡れが悪くなりボイド
を内在するため好ましくない。ここで、本発明における
溶融粘度とは、コーンプレート粘度計により測定を行っ
た結果である。具体的には、コーンプレート粘度計を所
定のロール温度に設定した後、回転数750rph(5
0Hz)の条件で測定した。この樹脂の溶融粘度の調節
方法としては、プリプレグ作製時の樹脂の塗布乾燥条件
及び又はロール成形時においてロール温度を調製して行
うことができるが、熱硬化性樹脂の場合、ロール成形時
に樹脂の反応が進行するため、できるだけ低温で成形を
行うことが望まれるため、塗布乾燥条件によりプリプレ
グの樹脂の反応状態、即ち溶融粘度を制御することが好
ましい。[0007] The amount of resin of the prepreg varies depending on the fiber material, properties and weight (per unit area) of the sheet-like fiber base material, but is usually about 40 to 60% of the weight of the sheet-like fiber base material. In the present invention, the melt viscosity of the prepreg resin at the roll temperature is 1 to 800 poise, more preferably 50 to 600 poise. If the melt viscosity is lower than 1 poise, peeling may occur between the prepreg and the metal foil or sheet after roll forming, which is not preferable. If it is higher than 800 poise, the wetting of the resin to the metal foil or sheet becomes poor and voids are inherent, which is not preferable. Here, the melt viscosity in the present invention is a result measured by a cone plate viscometer. Specifically, after setting the cone plate viscometer to a predetermined roll temperature, the rotation speed was 750 rpm (5 rpm).
0 Hz). As a method for adjusting the melt viscosity of the resin, the application and drying conditions of the resin at the time of preparing the prepreg and / or the roll temperature can be adjusted at the time of roll forming. Since the reaction proceeds, it is desired to perform molding at a temperature as low as possible. Therefore, it is preferable to control the reaction state of the resin of the prepreg, that is, the melt viscosity, by the application and drying conditions.
【0008】以上によりに得られたプリプレグは、通常
巻き取り機等により巻き取られたのち、あるいは、その
まま1枚または複数枚に重ねられ、必要により銅箔等の
金属箔あるいはフィルムを重ね合わせ、加熱して積層板
に成形される。ロールプレスの場合、裁断された内層回
路板及びプリプレグを使用することも可能であるが巻き
取ったものを使用し、連続的に成形する方が好ましい。
この場合は、1対あるいは複数対のロール間を通して成
形する。ロールの材質は金属、ゴム等がある。The prepreg obtained as described above is usually wound up by a winder or the like, or is directly stacked on one or more sheets, and if necessary, a metal foil or a film such as a copper foil is laminated. Heated to form a laminate. In the case of a roll press, it is possible to use a cut inner layer circuit board and a prepreg, but it is preferable to use a rolled one and form it continuously.
In this case, forming is performed through one or a plurality of pairs of rolls. The material of the roll includes metal, rubber and the like.
【0009】[0009]
【実施例】以下、本発明について、実施例及び比較例に
より説明する。The present invention will be described below with reference to examples and comparative examples.
【0010】(実施例1)樹脂組成がエポキシ樹脂(油
化シェルエポキシ(株)製臭素化エポキシ樹脂Ep504
8,エポキシ当量675)100重量部、硬化剤(ジシ
アンジアミド)5重量部、及び硬化促進剤(2−エチル
−4−メチルイミダゾール)1重量部の物を使用し10
0g/m2 のガラス織布に塗布してプリプレグを得
た。このプリプレグの樹脂の溶融粘度は140℃で15
0ポイズであった。このようにして得られたプリプレグ
の上下面に厚さ18μmの銅箔を重ね合わせ、温度14
0℃ 間隙0.14mmの2つの加熱ロール間を通過さ
せ加圧成形し、180℃で1時間加熱する事により0.
1mmの積層板を作製した。(Example 1) The resin composition was an epoxy resin (brominated epoxy resin Ep504 manufactured by Yuka Shell Epoxy Co., Ltd.)
8, epoxy equivalent 675) 100 parts by weight, a curing agent (dicyandiamide) 5 parts by weight, and a curing accelerator (2-ethyl-4-methylimidazole) 1 part by weight.
It was applied to a glass woven fabric of 0 g / m2 to obtain a prepreg. The melt viscosity of the resin of this prepreg is 15 at 140 ° C.
It was 0 poise. A copper foil having a thickness of 18 μm was overlaid on the upper and lower surfaces of the prepreg thus obtained,
By passing through between two heating rolls having a gap of 0.14 mm at 0 ° C. to form a pressure, the mixture is heated at 180 ° C. for 1 hour to form a 0.1 mm.
A 1 mm laminate was made.
【0011】(比較例1)実施例1で使用したプリプレ
グをロール温度110℃(110℃における樹脂の溶融
粘度950ポイズ)で同様に成形し積層板を作製た。Comparative Example 1 The prepreg used in Example 1 was similarly molded at a roll temperature of 110 ° C. (the melt viscosity of the resin at 110 ° C. was 950 poise) to produce a laminate.
【0012】(比較例2)実施例1で使用したプリプレ
グをロール温度180℃(180℃における樹脂の溶融
粘度0.5ポイズ)で同様に成形し積層板を作製した。Comparative Example 2 The prepreg used in Example 1 was similarly molded at a roll temperature of 180 ° C. (melt viscosity of the resin at 180 ° C .: 0.5 poise) to produce a laminate.
【0013】これらの実施例及び比較例において、成形
性を評価した。In these examples and comparative examples, moldability was evaluated.
【表1】 [Table 1]
【0014】(測定方法)プリプレグ樹脂の溶融粘度:
コーンプレート粘度計により測定を行った。 成形性:エッチング後の透過観察及び断面観察で評価し
た。 連続成形性:上記方法において、2時間連続成形したと
きの状態を観察した。比較例3は30分で樹脂のゲル化
が発生した。(Measurement method) Melt viscosity of prepreg resin:
The measurement was performed using a cone plate viscometer. Formability: Evaluated by transmission observation and cross-section observation after etching. Continuous moldability: In the above-described method, the state of continuous molding for 2 hours was observed. In Comparative Example 3, gelling of the resin occurred in 30 minutes.
【0015】[0015]
【発明の効果】本発明の方法は、設備の小型化に伴う使
用燃料の削減により、エネルギーコストの削減、熱源設
備からの排出ガスによる大気汚染が少なく、省資源化す
ることができる。また、積層板製造時において、溶融粘
度の調節により連続成形の実現により得られた製品間で
の品質が良好となる。さらにロールプレス等の連続成形
等により任意の長さに裁断できるため従来発生していた
耳等の部分が減り歩留まりの向上になる。そして、原材
料及び設備、工程の低コスト化の点で優れており、工業
的な積層板の製造方法として好適である。The method of the present invention can reduce energy cost, reduce air pollution due to exhaust gas from heat source equipment, and save resources by reducing fuel consumption accompanying downsizing of equipment. Further, at the time of manufacturing a laminate, the quality between products obtained by realizing continuous molding is improved by adjusting the melt viscosity. Furthermore, since it can be cut to an arbitrary length by continuous molding such as a roll press or the like, a portion such as an ear which has conventionally occurred is reduced, and the yield is improved. And it is excellent in terms of cost reduction of raw materials, equipment and processes, and is suitable as an industrial production method of a laminated board.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B29K 105:22 B29K 105:22 B29L 31:34 B29L 31:34 C08L 87:00 C08L 87:00 Fターム(参考) 4F072 AA01 AA06 AA07 AB03 AB04 AB05 AB09 AD13 AD21 AD23 AD45 AD51 AG03 AL09 4F204 AA39 AB03 AB17 AC03 AD03 AD05 AD08 AH36 AP16 AR17 FA06 FB02 FB13 FB24 FB28 FF01 FG03 FG09 FN15 FN17 FQ26 FQ32 FW06 FW16 FW33──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B29K 105: 22 B29K 105: 22 B29L 31:34 B29L 31:34 C08L 87:00 C08L 87:00 F term ( 4F072 AA01 AA06 AA07 AB03 AB04 AB05 AB09 AD13 AD21 AD23 AD45 AD51 AG03 AL09 4F204 AA39 AB03 AB17 AC03 AD03 AD05 AD08 AH36 AP16 AR17 FA06 FB02 FB13 FB24 FB28 FF01 FG03 FG09 FN15 FN17 FW33 FW32
Claims (1)
属箔またはフィルムを重ね合わせ、加熱したロール間に
挿入し積層成形する積層板の製造方法において、ロール
温度におけるプリプレグの樹脂の溶融粘度が1〜800
ポイズであることを特徴とする積層板の製造方法。1. A method for producing a laminated board, comprising laminating one or more prepregs and a metal foil or a film, inserting between heated rolls and laminating and molding, wherein the melt viscosity of the prepreg resin at the roll temperature is 1 to 1. 800
A method for producing a laminate, which is a poise.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000091311A JP2001277273A (en) | 2000-03-29 | 2000-03-29 | Method for manufacturing laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000091311A JP2001277273A (en) | 2000-03-29 | 2000-03-29 | Method for manufacturing laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001277273A true JP2001277273A (en) | 2001-10-09 |
Family
ID=18606782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000091311A Pending JP2001277273A (en) | 2000-03-29 | 2000-03-29 | Method for manufacturing laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001277273A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009302459A (en) * | 2008-06-17 | 2009-12-24 | Fujitsu Ltd | Wiring board, and manufacturing method thereof |
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JPS63267524A (en) * | 1987-04-24 | 1988-11-04 | Toray Ind Inc | Method and apparatus for manufacturing metal clad laminated sheet |
JPH01214413A (en) * | 1988-02-20 | 1989-08-28 | Matsushita Electric Works Ltd | Manufacture of electrical laminate |
JPH01264811A (en) * | 1988-04-15 | 1989-10-23 | Matsushita Electric Works Ltd | Manufacture of electrical laminate |
JPH04345813A (en) * | 1991-05-23 | 1992-12-01 | Hitachi Chem Co Ltd | Continuous production of laminated plate and equipment thereof |
JPH09186457A (en) * | 1995-12-28 | 1997-07-15 | Matsushita Electric Works Ltd | Production of laminate having inner layer circuit |
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JPS54163359A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
JPS63267524A (en) * | 1987-04-24 | 1988-11-04 | Toray Ind Inc | Method and apparatus for manufacturing metal clad laminated sheet |
JPH01214413A (en) * | 1988-02-20 | 1989-08-28 | Matsushita Electric Works Ltd | Manufacture of electrical laminate |
JPH01264811A (en) * | 1988-04-15 | 1989-10-23 | Matsushita Electric Works Ltd | Manufacture of electrical laminate |
JPH04345813A (en) * | 1991-05-23 | 1992-12-01 | Hitachi Chem Co Ltd | Continuous production of laminated plate and equipment thereof |
JPH09186457A (en) * | 1995-12-28 | 1997-07-15 | Matsushita Electric Works Ltd | Production of laminate having inner layer circuit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009302459A (en) * | 2008-06-17 | 2009-12-24 | Fujitsu Ltd | Wiring board, and manufacturing method thereof |
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