JPH10135590A - Substrate for printed circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent unevenness generated by, for example, a cloth base and dimension change, warpage, and twist generated when machining a printed circuit board and mounting parts by laminating a glass plate or a plurality of glass plates via an adhesion resin and then forming a substrate for printed circuit SOLUTION: Approximately 1-8 sheet glasses with a proper thickness are laminated according to the plate thickness of a printed circuit board, and for example resin layer is provided on one surface of the outermost layer or at both sides. Also, a copper foil can be laminated via or not via the resin layer. The sheet glass may as well be thinner in terms of hole machining. The resin layer may be made of any resin including thermosetting resin and photosetting resin. A lamination plate is formed between the sheet glasses and further between the sheet glass and a copper foil, and between the sheet glass and the resin layer via a resin for adhesion and by press or laminate formation. The resin for adhesion may be made of a curing resin such as thermosetting resin and photosetting resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board using a glass sheet.

[0002]

2. Description of the Related Art Conventionally, printed circuit boards have been made of woven or paper products such as glass woven cloth, glass non-woven cloth, and paper.
It is obtained by laminating a prepreg obtained by impregnating a thermosetting resin such as epoxy, phenol, polyester or the like together with a copper foil, and performing heat and pressure molding with a press, a roll or the like. However, unevenness due to the presence and absence of fibers of the base material, dimensional shrinkage during processing of the printed circuit board, and warpage and twisting may become obstacles in producing a printed circuit board having a high-density fine line pattern and mounting components. .

[0004]

DISCLOSURE OF THE INVENTION The present invention relates to unevenness caused by using a woven or paper product as a base material, dimensional change occurring during processing of a printed circuit board and mounting of components, warpage, or the like.
This is to solve the twist.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a printed circuit board characterized in that one sheet glass or a plurality of sheets of glass are laminated via an adhesive resin.

[0006] In the present invention, the glass sheet is laminated with 1 to 8 sheets having an appropriate thickness according to the thickness of the printed circuit board.
A resin layer may be provided on one side or both sides of the outermost layer. Further, a copper foil may be laminated with or without a resin layer. The thickness of the sheet glass is preferably thinner from the viewpoint of drilling workability, but is preferably 0.2 mm or less. Although any resin can be used for the resin layer, a curable resin such as a thermosetting resin or a photocurable resin is preferably used.

[0007] Between glass plates, further between glass plates and copper foil,
A laminated plate is obtained between the glass plate and the resin layer by pressing or laminating via a resin for adhesion. As the resin for bonding, a curable resin such as a thermosetting resin or a photocurable resin is preferably used, similarly to the resin of the resin layer.

[0008] The printed circuit board obtained by the present invention is mainly made of sheet glass. Therefore, features such as strength, surface smoothness, dimensional stability, small warpage and twist, and high glass transition temperature of the sheet glass appear on the circuit board and have excellent characteristics.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below. The mixing ratio is part by weight.

<Embodiment 1> 1. Glass plate 0.1mm thick 2. Adhesive resin Brominated phenoxy resin (bromination ratio 25%, average molecular weight 30,000) 100 parts Bisphenol F type epoxy resin 50 parts (Dai Nippon Ink Chemical's Epicron 830) 2-methylimidazole 5 parts Titanate coupling agent (manufactured by Ajinomoto) KR-46B) 0.3 part Calcium carbonate 30 parts The above materials are mixed uniformly using MEK as a diluting solvent, and coated on a surface of a PET film having a thickness of 40 μm with a comma coater so as to have a dry resin thickness of 50 μm. Was used as a carrier to obtain an adhesive sheet. 3. Copper foil with adhesive The above adhesive resin was similarly applied to a roughened surface of a copper foil having a thickness of 18 µm with a comma coater so as to have a dry resin thickness of 50 µm, to obtain a copper foil with an adhesive. Next, P between two glass plates
The adhesive sheet from which the ET film was peeled was sandwiched, and laminated between hard rolls under the conditions of a temperature of 100 ° C., a pressure of 1 kg / cm ² , and a laminating speed of 0.8 m / min.
The two glass plates were bonded. Further, a copper foil with an adhesive was bonded to the laminated glass plate outer layer under the above conditions,
A thermosetting was performed at 30 ° C. for 30 minutes to prepare a copper-clad laminate for a printed circuit having a thickness of 0.4 mm.

(Comparative Example 1) Glass cloth 180 μm thick glass woven cloth (Nittobo 7628 type) Epoxy resin Brominated epoxy resin (EP-1046 manufactured by Yuka Shell) 100 parts Dicyandiamide 3 parts 2 Ethyl 4-methylimidazole 0.1 part Methyl cellosolve 36 parts The above materials are uniformly mixed with acetone as a diluting solvent to obtain a varnish. Next, the varnish was impregnated and dried in a glass woven fabric so that the resin content was 40 to 50%, to obtain a prepreg. Next, two prepregs are laminated, and a thickness of 1
8μm copper foil is stacked, forming temperature 165 ℃, pressure 60kg /
It was laminated and molded at 90 cm ² for 90 minutes to obtain a copper-clad laminate having a thickness of 0.4 mm.

In Examples and Comparative Examples, the properties of the obtained copper-clad laminates are as shown in Table 1.

[0013]

[Table 1]

(Note 1): Rz was measured by a surface roughness meter to determine the surface roughness. (Note 2): After measuring the dimension (A) by making two holes in the copper-clad laminate of size 330 × 330 mm in the vertical and horizontal directions, measuring the dimension (A), etching the front surface, and heating at 180 ° C. for 30 minutes. The measured dimension (B) is measured. Then, the length between two points was obtained from each coordinate, and the dimensional change rate was obtained by the following equation. (Length of BA) / (length of A) x 100 (%)

[0015]

The printed circuit board of the present invention uses a flat glass substrate as a main material, and therefore has high strength, excellent surface smoothness, excellent dimensional stability, small warpage and twist, and a high glass transition point. , BGA, MCM, etc.

Claims (5)

[Claims] 1. A printed circuit board comprising a single sheet of glass or a plurality of sheets of glass laminated via an adhesive resin. 2. A printed circuit board according to claim 1, wherein a resin layer is provided on the surface of the printed circuit board. 3. A printed circuit board obtained by laminating a copper foil on the surface of the printed circuit board according to claim 1 via an adhesive resin. 4. A printed circuit board obtained by laminating a copper foil on the surface of the printed circuit board according to claim 2. 5. The printed circuit board according to claim 1, wherein the thickness of the plate glass is 0.2 mm or less.