JPH09123345A - Copper-clad laminated plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve interface adhesion between a copper foil and a prepreg and restrain flow of a thermosetting resin of the interface so as to prevent generation of wrinkle by using a copper foil having a thermosetting resin layer which is previously formed on its treating face as a copper foil of a copper-clad laminated plate. SOLUTION: A glass base material such as a glass cloth and a glass paper is coated with a resin such as a phenol resin, an epoxy resin and a thermosetting resin of these resin compositions, impregnated, and dried so as to form a prepreg 5. The coated thermosetting resin is dried so as to form a semi-cured thermosetting resin layer 2, and it is made to be a copper foil 3 attached to the thermosetting resin layer, which is arranged at both sides of the prepreg 5 and integrated with heat and pressure so as to form a double-sided copper-clad laminated plate. Accordingly, wrinkle in the copper foil at molding is not generated and appearance is excellent, and adhesion property to the prepreg is excellent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper-clad laminate which prevents wrinkles on a copper foil.

[0002]

2. Description of the Related Art Conventionally, in the production of copper-clad laminates, a plurality of prepregs obtained by impregnating and drying a glass substrate with a thermosetting resin are stacked, and a copper foil is placed on at least one surface of the prepreg and heated and heated. It is molded integrally with pressure. In the production of multilayer copper-clad laminates, one or more inner layer plates with wiring patterns formed on the front and back sides, prepregs and outer layer copper foils are superposed and sandwiched between stainless steel plates for integrated heating and pressure. The method of molding was taken. In the case of paper phenolic resin copper-clad laminate, glued copper foil is used because of its weak adhesion, but in the case of glass-based thermosetting resin copper-clad laminate, bare copper foil is used. There is.

[0003]

In the above-mentioned method for molding a glass base thermosetting resin copper clad laminate, the outermost copper foil is adhered by the thermosetting resin in the prepreg. The thermosetting resin of No. 1 melts as it is heated and becomes fluid when it reaches a completely molten state, and the flow at that time has the drawback of causing wrinkling of the copper foil during molding. .

The present invention has been made to solve the above-mentioned drawbacks, and improves the adhesion at the interface between the copper foil and the prepreg and suppresses the flow of the thermosetting resin at the interface to cause wrinkles. The present invention is intended to provide a copper clad laminate that prevents the above.

[0005]

Means for Solving the Problems As a result of earnest studies to achieve the above object, the present inventor has found that the use of a copper foil having a thermosetting resin layer formed on the treated surface in advance has The present invention has been completed by finding out that the above object is achieved.

That is, the present invention provides a copper-clad laminate in which a prepreg obtained by impregnating and drying a glass substrate with a thermosetting resin and a copper foil are integrally formed. It is a copper clad laminate characterized by using a copper foil having a thermosetting resin layer formed on the treated surface side.

Hereinafter, the present invention will be described in detail.

Examples of the glass substrate used in the present invention include glass cloth and glass paper, and these may be used alone or in combination of two or more depending on the combination of prepregs.

Examples of the thermosetting resin for impregnating the prepreg used in the present invention include phenol resin, epoxy resin, polyimide resin and resin compositions thereof, which may be used alone or in combination of two or more. You can Of these, an epoxy resin is particularly preferably used. Examples of the epoxy resin include bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin,
Examples thereof include brominated bisphenol A type epoxy resins and resin compositions thereof, and these can be used alone or in combination of two or more kinds. The glass substrate is coated with, impregnated with, and dried with the thermosetting resin to form a prepreg.

The copper foil used in the present invention is not particularly limited as long as it is a copper foil usually used for laminated plates, and electrolytic copper foil, rolled copper foil and the like are used. The above-mentioned copper foil is surface-treated on one side, but a thermosetting resin is applied to the treated side and dried to form a thermosetting resin layer for use. Examples of the thermosetting resin that can be used to apply to the copper foil include the same examples of the thermosetting resin that impregnates the glass substrate, but a composition containing a component that enhances adhesion with the copper foil treated surface. Can be

Next, the copper clad laminate of the present invention will be described with reference to the drawings.

FIG. 1, FIG. 2 and FIG. 3 show sectional views for explaining the copper clad laminate of the present invention. In FIG. 1, the thermosetting resin is applied to the treated surface of the copper foil 1 and dried to form a thermosetting resin layer 2 in a semi-cured state.
I got For example, one or more glass epoxy prepregs 5 are laminated, the thermosetting resin layer-attached copper foils 3 are arranged on both sides of the prepregs, and the double-sided copper-clad laminate is manufactured by heating and pressurizing integrally by a conventional method. can do. In addition, as shown in FIG. 2, two glass epoxy prepregs 5 are laminated on both sides of the inner layer board 4 on which a circuit is formed in advance, and the copper foil 3 with the thermosetting resin layer is further arranged on both sides thereof and heated. The multilayer copper clad laminate can be manufactured by integrally molding under pressure. Further, as shown in FIG. 3, one glass epoxy prepreg 5 is laminated on both sides of the inner layer board 4, and the thermosetting resin layer-coated copper foil 3 is arranged on both sides of the inner layer board 4 to integrally form the heat and pressure. Thus, a thin multilayer copper clad laminate can be manufactured.

[0013]

The copper-clad laminate of the present invention uses a copper foil having a thermosetting resin layer formed on the treated surface thereof to prevent wrinkling of the copper foil during molding due to the flow of the thermosetting resin of the prepreg. In addition, the adhesion of the prepreg interface can be improved.

[0014]

Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

EXAMPLE On a treated surface of an electrolytic copper foil having a thickness of 18 μm, 100 parts by weight of a brominated epoxy resin Araldite AER8014 (manufactured by Ciba Geigy, trade name), 7 parts by weight of DDS, 0.5 part by weight of boron trifluoride monomethylamine complex. Part, a polyvinyl butyral resin BX-1 (manufactured by Sekisui Chemical Co., Ltd., trade name) 30 parts by weight of a resin composition is applied to a thickness of 25 μm with a coater to obtain a copper foil having a thermosetting resin layer formed thereon. It was

A copper foil 3 having a glass epoxy prepreg having a thickness of 18 μm laminated on both sides of an inner layer plate on which a wiring pattern is formed in advance, and further having the thermosetting resin layer formed on the outside thereof.
The layers were laminated, and integrally molded by heating and pressurizing to manufacture a 4-layered copper clad laminate having a thickness of 0.7 mm.

Comparative Example In the same manner as in Example, except that an electrolytic copper foil having a thickness of 18 μm was used in place of the copper foil having the thermosetting resin layer formed thereon, four layers having a thickness of 0.7 mm were prepared. A multilayer copper clad laminate was produced.

The multilayer copper clad laminates obtained in Examples and Comparative Examples were visually inspected to see if wrinkles were generated. The results are shown in Table 1.

[0019]

[Table 1] * 1: 25 lots of 500 mm x 500 mm per lot, and lot n = 6, 6 lots for a total of 150 sheets. ○: No wrinkles, △: 1 to 5 wrinkles, ×: 5 or more wrinkles.

[0020]

As is clear from the above description and Table 1, the copper clad laminate of the present invention has a good appearance without wrinkling of the copper foil at the time of molding, and has excellent adhesion to the prepreg. Is.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view illustrating a layer structure of a copper clad laminate of the present invention.

FIG. 2 is a schematic sectional view illustrating a layer structure of a multilayer copper-clad laminate according to the present invention.

FIG. 3 is a schematic cross-sectional view illustrating the layer structure of another embodiment of the multilayer copper-clad laminate of the present invention.

[Explanation of symbols]

 1 copper foil 2 thermosetting resin layer 3 copper foil with thermosetting resin layer 4 inner layer board 5 prepreg

Claims (1)

[Claims] 1. A copper clad laminate in which a glass substrate is impregnated and dried with a thermosetting resin and a prepreg and a copper foil are integrally molded, and the copper foil is preheated to the treated surface side of the copper foil. A copper-clad laminate characterized by using a copper foil having a curable resin layer formed thereon.