JPH02277297A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02277297A JPH02277297A JP9835489A JP9835489A JPH02277297A JP H02277297 A JPH02277297 A JP H02277297A JP 9835489 A JP9835489 A JP 9835489A JP 9835489 A JP9835489 A JP 9835489A JP H02277297 A JPH02277297 A JP H02277297A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- layer material
- laminate
- printed wiring
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 33
- 125000001475 halogen functional group Chemical group 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011229 interlayer Substances 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 2
- 238000001962 electrophoresis Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- -1 polybutylene terephthalate Polymers 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用いられるプリント配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、プリント配線板は片面又は両面銅張積層板の銅箔
面に回路形成したものを内層材とし、内層材表面を粗化
、或は黒化処理等をおこなってからプリプレグ層を介し
、最外層に片面銅張積層板や銅Ｗ１を外層材として配設
した積層体を積層成形し一体化して得られるが、従来の
パターン回路間隔では上記方法でよいが、パターン回路
間隔が狭くなるファインパターンでは回路面積が増加し
内層材とプリプレグとの接着性が低下し、ドリル加工等
の穴あけ時の衝悠で開穴部周辺が層間剥離し耐ハロー性
が低下する問題があった。Conventionally, printed wiring boards are made by forming a circuit on the copper foil surface of a single-sided or double-sided copper-clad laminate as an inner layer material, and after roughening or blackening the surface of the inner layer material, the final layer is bonded via a prepreg layer. It is obtained by laminating and integrally molding a laminate in which a single-sided copper-clad laminate or copper W1 is disposed as an outer layer material.The above method is sufficient for conventional pattern circuit spacing, but fine patterns with narrow pattern circuit spacing However, there was a problem in that the circuit area increased, the adhesiveness between the inner layer material and the prepreg decreased, and the impact during drilling etc. caused delamination in the vicinity of the hole, resulting in a decrease in halo resistance.
従来の技術で述べたように、内層材表面をサンドベーパ
ー サンドブラスト等で粗化する方法は均一な粗化がで
きず回路を傷つける欠点があり、黒化処理では粗面表面
の黒色酸化銅被膜のため、耐ハロー性が低下する欠点が
ある。本発明は従来の技術における上述の問題点に鑑み
てなされたもので、その目的とするところは層間接着性
に優れ、且つ耐ハロー性のよめプリント配線板の製造方
法を提供することにある。As mentioned in the conventional technology, the method of roughening the inner layer material surface using sand vapor, sandblasting, etc. has the disadvantage of not being able to uniformly roughen it and damaging the circuit. Therefore, there is a drawback that halo resistance decreases. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing a printed wiring board that has excellent interlayer adhesion and halo resistance.
本発明は内層材表面に電気泳動塗装で樹脂層を形成後、
プリプレグ層を介し、最外層に外層材を配設した積層体
を積層成形し一体化することを特徴とするプリント配線
板の製造方法のため、プリプレグ層と接着性の悪い回路
表面を予じめ電気泳動で強固に接着しておくため層間接
着性を向上させ且つ黒色酸化銅被膜がないので耐ハロー
性を向上させることができたもので、以下本発明の詳細
な説明する。In the present invention, after forming a resin layer on the surface of the inner layer material by electrophoretic coating,
The manufacturing method for printed wiring boards is characterized by laminating and integrating a laminate with an outer layer material on the outermost layer via a prepreg layer, so the circuit surface with poor adhesion to the prepreg layer is prepared in advance. Since the adhesive is firmly bonded by electrophoresis, the interlayer adhesion is improved, and since there is no black copper oxide film, the halo resistance is improved.The present invention will be described in detail below.
本発明に用いる内層材は片面又は両面金属箔張積層板の
金属箔に回路形成したもので、これら積層板及びプリプ
レグとしては樹脂としてフェノール樹脂、クレゾール樹
脂、エポキシ樹脂、不飽和ポリエステル樹脂、メラミン
樹脂、ポリイミド、ポリブタジェン、ポリアミド、ポリ
アミドイミドポリスルフォン、ポリフェニレンサルファ
イドポリフェニレンオキサイド、ポリブチレンテレフタ
レート、ポリブチレンテレフタレート、弗化樹脂等の単
独、変性物、混合物が用りられ、基材としてはガラス、
アスベスト等の無機繊維やポリエステル、ポリアミド、
ポリビニルアルコール、アクリル等の有機合成繊維や木
綿等の天然繊維からなる織布、不織布、マット或は紙又
はこれらの組合せ基材等である。金属箔としては銅、ア
ルミニウム、鉄、ニラケル、亜鉛等が用いられる。外層
材としては片面金属箔張積層板、金属箔を用いることが
できる。積層成形としては多段プレス法、マルチロール
法、ダブルベルト法、ドラム法、無圧連続加熱法等が用
いられ、特に限定するものではない。電気泳動塗装で用
いる樹脂としてはエポキシ樹脂、不飽和ポリエステル樹
脂、フェノール樹脂、ボリイミＦ樹脂、ポリフェニレン
オキサイド、ポリフェニレンサルファイド、ポリエチレ
ンテレフタレート、ポリブチレンテレフタレート等の水
分散埜塗料や水溶性塗料であるが、好ましくはエポキシ
樹脂を用いることが接着性、耐熱性の点でよく望まし−
ことである。塗装樹脂層の厚みは２０〜３００ミクロン
が好ましす、塗装後必要に応じて１２０〜２５０℃で５
〜６０分間焼付は硬化させるものである。The inner layer material used in the present invention is a single-sided or double-sided metal foil-clad laminate with a circuit formed on the metal foil, and the resin used for these laminates and prepregs is phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, and melamine resin. , polyimide, polybutadiene, polyamide, polyamideimide polysulfone, polyphenylene sulfide polyphenylene oxide, polybutylene terephthalate, polybutylene terephthalate, fluorinated resin, etc. alone, modified products, and mixtures are used, and the base material is glass,
Inorganic fibers such as asbestos, polyester, polyamide,
These include woven fabrics, nonwoven fabrics, mats, paper, or combinations of these materials made of organic synthetic fibers such as polyvinyl alcohol and acrylic fibers, and natural fibers such as cotton. Copper, aluminum, iron, Nilacel, zinc, etc. are used as the metal foil. As the outer layer material, a single-sided metal foil-clad laminate or metal foil can be used. For lamination molding, a multi-stage press method, a multi-roll method, a double belt method, a drum method, a pressureless continuous heating method, etc. are used, and the method is not particularly limited. Preferred resins used in electrophoretic coating include water-dispersed paints and water-soluble paints such as epoxy resin, unsaturated polyester resin, phenol resin, Boliimi F resin, polyphenylene oxide, polyphenylene sulfide, polyethylene terephthalate, and polybutylene terephthalate. It is highly desirable to use epoxy resin in terms of adhesiveness and heat resistance.
That's true. The thickness of the coating resin layer is preferably 20 to 300 microns.
Bake for ~60 minutes to harden.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み１ｆｆの両面銅張ガラス布エポキシ樹脂積層板の両
面に回路形成して内層材とし、該内層材の両面に樹脂厚
が５０ミクロンになるようにエポキシ樹脂エマルジョン
を電気泳動塗装後１８０℃で３０分間焼付硬化させた後
、該内層材の上下面に厚さ０．１ｎのガラス布エポキシ
樹脂プリプレグを夫々２枚づつ介し最外層に厚さ３５ミ
クロンの銅箔を配設した積層体を４０ Ｋｑ／ｃ１１．
１６５℃で６０分間積層成形して４層回路プリント配線
板を得た。Example A circuit was formed on both sides of a double-sided copper-clad glass cloth epoxy resin laminate with a thickness of 1 ff to form an inner layer material.Epoxy resin emulsion was electrophoretically coated on both sides of the inner layer material so that the resin thickness was 50 microns, and then heated at 180°C. After curing by baking for 30 minutes, a laminate was prepared in which two sheets of glass cloth epoxy resin prepreg with a thickness of 0.1 nm were interposed on the upper and lower surfaces of the inner layer material, and a copper foil with a thickness of 35 microns was placed on the outermost layer. 40 Kq/c11.
Lamination molding was performed at 165° C. for 60 minutes to obtain a four-layer circuit printed wiring board.
比較例
厚みｌｆｌの両面銅張ガラス布エポキシ樹脂積層板の両
面に回路形成し、アルカリ性亜塩素酸ナトリウム水溶液
に３分間浸漬して黒化処理した内層材を用いた以外は実
施例と則様に処理して４層回路プリント配線板を得た。Comparative Example Same as the example except that circuits were formed on both sides of a double-sided copper-clad glass cloth epoxy resin laminate with a thickness of lfl, and an inner layer material that was blackened by immersing it in an alkaline sodium chlorite aqueous solution for 3 minutes was used. A four-layer circuit printed wiring board was obtained by processing.
実施例及び比較例のプリント配線板の性能は第１表のよ
うである。The performances of the printed wiring boards of Examples and Comparative Examples are shown in Table 1.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載したプリント配線板の製造方法によって得
られるプリント配線板は層間接着性及び耐ハロー性が向
上する効果がある。The present invention is constructed as described above. The printed wiring board obtained by the printed wiring board manufacturing method described in claim 1 has the effect of improving interlayer adhesion and halo resistance.
Claims (1)
リプレグ層を介し、最外層に外層材を配設した積層体を
積層成形し一体化することを特徴とするプリント配線板
の製造方法。(1) Manufacture of a printed wiring board characterized by forming a resin layer on the surface of the inner layer material by electrophoretic coating, and then laminating and forming a laminate in which the outer layer material is provided as the outermost layer via a prepreg layer and integrating the layer. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9835489A JPH02277297A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9835489A JPH02277297A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02277297A true JPH02277297A (en) | 1990-11-13 |
Family
ID=14217554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9835489A Pending JPH02277297A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02277297A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008182273A (en) * | 2003-11-14 | 2008-08-07 | Hitachi Chem Co Ltd | Method of forming insulating resin layer on metal |
| US7615277B2 (en) | 2003-11-14 | 2009-11-10 | Hitachi Chemical Company, Ltd. | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
-
1989
- 1989-04-18 JP JP9835489A patent/JPH02277297A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008182273A (en) * | 2003-11-14 | 2008-08-07 | Hitachi Chem Co Ltd | Method of forming insulating resin layer on metal |
| JP2008235923A (en) * | 2003-11-14 | 2008-10-02 | Hitachi Chem Co Ltd | Method of producing printed wiring board and multilayer wiring board |
| JP2008258636A (en) * | 2003-11-14 | 2008-10-23 | Hitachi Chem Co Ltd | Internal layer conductor circuit treatment method |
| US7615277B2 (en) | 2003-11-14 | 2009-11-10 | Hitachi Chemical Company, Ltd. | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| US7818877B2 (en) | 2003-11-14 | 2010-10-26 | Hitachi Chemical Company, Ltd. | Formation method of metal layer on resin layer |
| US7964289B2 (en) | 2003-11-14 | 2011-06-21 | Hitachi Chemical Company, Ltd. | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
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