JPH02277289A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02277289A JPH02277289A JP9834489A JP9834489A JPH02277289A JP H02277289 A JPH02277289 A JP H02277289A JP 9834489 A JP9834489 A JP 9834489A JP 9834489 A JP9834489 A JP 9834489A JP H02277289 A JPH02277289 A JP H02277289A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- layer material
- bismuth
- circuit
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 9
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 8
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 31
- 125000001475 halogen functional group Chemical group 0.000 abstract description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011229 interlayer Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- -1 polybutylene terephthalate Polymers 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 229910001451 bismuth ion Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- SULICOHAQXOMED-YDXPQRMKSA-H dibismuth;(2r,3r)-2,3-dihydroxybutanedioate Chemical compound [Bi+3].[Bi+3].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O.[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O.[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O SULICOHAQXOMED-YDXPQRMKSA-H 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BDRTVPCFKSUHCJ-UHFFFAOYSA-N molecular hydrogen;potassium Chemical compound [K].[H][H] BDRTVPCFKSUHCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用いられるプリント配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、プリント配線板は片面又は両面銅張積層板の銅箔
面に回路形成したものを内層材とし、内層材表面を粗化
、或は黒化処理等をおこなってからプリプレグ層を介し
、最外層に片面鋼張積層板や銀箔を外層材として配設し
た積層体を積層成形し一体化して得られるが、従来のパ
ターン回路間隔では上記方法でよいが、パターン回路間
隔が狭くなるファインパターンでは回路面積が増加し内
層材とプリプレグとの接着性が低下し、ドリル加工等の
穴あ行時の衝撃で開穴部周辺が層間剥離し耐ハロー性が
低下する問題があった。Conventionally, printed wiring boards are made by forming a circuit on the copper foil surface of a single-sided or double-sided copper-clad laminate as an inner layer material, and after roughening or blackening the surface of the inner layer material, the final layer is bonded via a prepreg layer. It is obtained by laminating and integrally molding a laminate in which a single-sided steel-clad laminate or silver foil is arranged as an outer layer material.The above method is sufficient for conventional pattern circuit spacing, but for fine patterns where pattern circuit spacing is narrower. There was a problem in that the circuit area increased, the adhesiveness between the inner layer material and the prepreg decreased, and the impact during drilling etc. caused delamination in the vicinity of the hole, resulting in a decrease in halo resistance.
従来の技術で述べたように、内層材表面をサンドベーパ
ー サンドプラ、スト等で粗化する方法は均一な粗化が
できず回路を傷つける欠点があり、黒化処理では粗面表
面の黒色酸化銅皮膜のため、耐ハロー性が低下する欠点
がある。本発明は従来の技術における上述の問題点に鑑
みてなされたもので、その目的とするところは層間接着
性に優れ、且つ耐ハロー性のよいプリント配線板の製造
方法を提供することにある。As mentioned in the conventional technology, the method of roughening the inner layer material surface with sand vapor, sand plastic, strike, etc. has the drawback of not being able to achieve uniform roughening and damaging the circuit. Because it is a film, it has the disadvantage of reduced halo resistance. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing a printed wiring board that has excellent interlayer adhesion and good halo resistance.
本発明は内層材の回路銅表面にビスマス含有銅鍍金を施
し、ビスマスと銅との共折物を析出させた後、該内層材
表面にプリプレグ層を介し最外層に外層材を配設したｒ
Ｊｔ層体を積層成形し一体化することを特徴とするプリ
ント配線板の製造方法のため、内層材の回路表面の接着
性を向上させることができ、且つ表面に黒色酸化銅皮膜
がなりので耐ハロー性を向上させることができたもので
、以下本発明の詳細な説明する。In the present invention, bismuth-containing copper plating is applied to the circuit copper surface of the inner layer material to precipitate a bismuth-copper eutectic product, and then an outer layer material is provided on the surface of the inner layer material through a prepreg layer as the outermost layer.
Since the printed wiring board manufacturing method is characterized by laminating and integrating Jt layers, it is possible to improve the adhesion of the circuit surface of the inner layer material, and the black copper oxide film on the surface makes it highly resistant. This invention was able to improve the halo property, and the present invention will be described in detail below.
本発明に用いる内層材としてはフェノール樹脂クレゾー
ル樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ポリ
イミド樹脂、ポリブタジェン樹脂、ポリフェニレンサル
ファイド樹脂、ポリブチレンテレフタレート樹脂、ポリ
エチレンテレフタレート樹脂、弗化樹脂等の樹脂と、ガ
ラス、アスベスト等の無機繊維やポリニスデル、ポリア
クリル、ポリアミド、ポリビニルアルコール等の有機合
成繊維や木綿等の天然繊維からなる織布、不織布、マー
Ｉト或は紙又はこれらの組合せ基材とからなる片面又は
両面銅張積層板に電気回路を形成したもので、回路銅表
面にビスマス含有銅鍍金を施し回路銅表面に微細凹凸状
のビスマスと銅との共折物を析出させてから、該内層材
表面に前記樹脂と基材とからなるプリプレグを所要枚数
介し、最外層に片面金属張積層板や金属箔からなる外層
材を配設した積層体を多段プレス法、マルチロール法、
ダブルベルト法、ドラム法、無圧連続加熱法等で積層成
形し一体化するものである。ビスマス含有鋼鍍金として
はビスマス酸水素カリウム、酒石酸ビスマス等のような
ビスマス化合物を含む銅鍍金を施すもので、ビスマスイ
オンをＱ、０００１〜０．０３モル／ｌ 含有するもの
が好まし込。Inner layer materials used in the present invention include resins such as phenolic resin cresol resin, epoxy resin, unsaturated polyester resin, polyimide resin, polybutadiene resin, polyphenylene sulfide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, and fluorinated resin, glass, Single-sided or non-woven fabric made of inorganic fibers such as asbestos, organic synthetic fibers such as polynisdel, polyacrylic, polyamide, polyvinyl alcohol, natural fibers such as cotton, paper, paper, or a combination thereof. An electric circuit is formed on a double-sided copper-clad laminate.The surface of the circuit copper is coated with bismuth-containing copper plating to precipitate a bismuth-copper symbiotic substance with fine irregularities on the surface of the circuit copper. A laminate in which a required number of prepregs made of the above-mentioned resin and base material are interposed and an outer layer material made of a single-sided metal-clad laminate or metal foil is provided as the outermost layer is prepared by a multi-stage pressing method, a multi-roll method,
They are laminated and integrated using a double belt method, drum method, pressureless continuous heating method, etc. The bismuth-containing steel plating includes copper plating containing a bismuth compound such as potassium bismuthate, bismuth tartrate, etc., and preferably contains bismuth ions in an amount of Q, 0001 to 0.03 mol/l.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み１ｍの両面銅張ガラス布エポキシ樹脂積層板の両面
に回路形成した内１−材をプラ・Ｉシング、脱脂してか
ら陰極とし、ビスマス酸水素カリウムをビスマスイオン
で０．Ｏｌ モル／ｌ含有する銅鍍金液で鍍金処理し
回路銅表面に微細凹凸状のビスマスと銅との共折物を析
出させた後、該内層材の上下面に厚さ０．１ｆｌのガラ
ス布エポキシ樹脂プリプレグを夫々２枚づつ介し最外層
に厚さ３５ミクロンの銅箔を配設した積層体を４０ Ｋ
９／ｄ 、 １６５℃で６０分間積層成形して４層回
路プリント配線板を得た。Example A 1-meter-thick double-sided copper-clad glass cloth epoxy resin laminate with circuits formed on both sides was used as a cathode after being plasticized and degreased, and potassium hydrogen bismuthate was mixed with bismuth ions to form a cathode. After plating with a copper plating solution containing Ol mol/l to precipitate a bismuth-copper co-recipitate with fine irregularities on the surface of the circuit copper, a glass cloth with a thickness of 0.1 fl is placed on the upper and lower surfaces of the inner layer material. A laminate consisting of two epoxy resin prepregs each with a 35 micron thick copper foil on the outermost layer was heated at 40K.
9/d, laminate molding was performed at 165° C. for 60 minutes to obtain a four-layer circuit printed wiring board.
比較例
実施例と同じ回路形成した内層材をプラーｌシングして
から９０℃に加熱したアルカリ性亜塩素酸ナトリウム水
溶液に１０分間浸漬して回路銅に酸化第２銅皮膜を形成
後、その上下面に厚さ０． ｉ ｎのガラス布エポキシ
樹脂プリプレグを夫々２枚づつ介した以外は実施例と同
様に処理して４層回路プリント配線板を得た。Comparative Example The inner layer material with the same circuit formed as in the example was plated and then immersed in an alkaline sodium chlorite aqueous solution heated to 90°C for 10 minutes to form a cupric oxide film on the circuit copper. thickness 0. A four-layer circuit printed wiring board was obtained in the same manner as in the example except that two sheets of each glass cloth epoxy resin prepreg were interposed.
実施例及び比較例のプリント配線板の性能は第１表のよ
うである。The performances of the printed wiring boards of Examples and Comparative Examples are shown in Table 1.
求の範囲第１項に記載したプリント配線板の製造方法に
よって得られるプリント配線板は層間接着性及び耐へロ
ー性が向上する効果がある。A printed wiring board obtained by the method for producing a printed wiring board described in Item 1 has the effect of improving interlayer adhesion and herrotation resistance.
Claims (1)
、ビスマスと銅との共折物を析出させた後、該内層材表
面にプリプレグ層を介し最外層に外層材を配設した積層
体を積層成形し一体化することを特徴とするプリント配
線板の製造方法。(1) Laminate in which bismuth-containing copper plating is applied to the circuit copper surface of the inner layer material to precipitate a bismuth-copper co-recipitate, and then the outer layer material is placed on the surface of the inner layer material through a prepreg layer and the outermost layer. A method for manufacturing a printed wiring board, characterized by laminating and integrating the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9834489A JPH02277289A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9834489A JPH02277289A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02277289A true JPH02277289A (en) | 1990-11-13 |
Family
ID=14217288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9834489A Pending JPH02277289A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02277289A (en) |
-
1989
- 1989-04-18 JP JP9834489A patent/JPH02277289A/en active Pending
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