JPH02303191A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02303191A JPH02303191A JP12521089A JP12521089A JPH02303191A JP H02303191 A JPH02303191 A JP H02303191A JP 12521089 A JP12521089 A JP 12521089A JP 12521089 A JP12521089 A JP 12521089A JP H02303191 A JPH02303191 A JP H02303191A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- copper
- layer material
- circuit
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 28
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 125000001475 halogen functional group Chemical group 0.000 abstract description 5
- 239000011229 interlayer Substances 0.000 abstract description 3
- 229910001432 tin ion Inorganic materials 0.000 abstract description 3
- YXTDAZMTQFUZHK-ZVGUSBNCSA-L (2r,3r)-2,3-dihydroxybutanedioate;tin(2+) Chemical compound [Sn+2].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O YXTDAZMTQFUZHK-ZVGUSBNCSA-L 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 150000003606 tin compounds Chemical class 0.000 abstract description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 1
- 229910052700 potassium Inorganic materials 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- -1 polybutylene terephthalate Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229940071182 stannate Drugs 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用すられるプリント配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、プリント配線板は片面又は両面銅張積層板の銅箔
面に回路形成したものを内層材とし、内層材表面を粗化
、或は黒化処理等をおこなってからプリプレグ層を介し
、最外層に片面鋼張積層板や銅箔を外層材として配設し
た積層体を積層成形し一体化して得られるが、従来のパ
ターン回路間隔では上記方法でよいが、パターン回路間
隔が狭くなるファインパターンでは回路面積が増加し内
層材とプリプレグとの接着性が低下し、ドリル加工等の
穴あけ時の衝撃で開穴部周辺が層間剥離し、耐ハロー性
が低下する問題があった。Conventionally, printed wiring boards are made by forming a circuit on the copper foil surface of a single-sided or double-sided copper-clad laminate as an inner layer material, and after roughening or blackening the surface of the inner layer material, the final layer is bonded via a prepreg layer. It is obtained by laminating and integrally molding a laminate in which a single-sided steel-clad laminate or copper foil is arranged as an outer layer material.The above method is sufficient for conventional pattern circuit spacing, but fine patterns with narrow pattern circuit spacing However, there was a problem in that the circuit area increased, the adhesiveness between the inner layer material and the prepreg decreased, and the impact during drilling etc. caused delamination of the layers around the hole, resulting in a decrease in halo resistance.
。 従来の技術で述べたように、内層材表面をサンドペ
ーパー、サンドブラスト等で粗化する方法は均一な粗化
ができず回路を傷つける欠点があり、黒化処理では粗面
表面の黒色酸化銅被膜のため、耐ハロー性が低下する欠
点がある。本発明は従来の技術における上述の問題点に
鑑みてなされたもので、その目的とするところは層間接
置性に優れ、且つ耐ハロー性のよりプリント配線板の製
造方法を提供することにある。. As mentioned in the conventional technology, the method of roughening the inner layer material surface using sandpaper, sandblasting, etc. has the disadvantage that it cannot achieve uniform roughening and damages the circuit. Therefore, there is a drawback that halo resistance decreases. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a method for manufacturing a printed wiring board that has excellent interlayer bonding properties and is more resistant to halo. .
本発明は内層材の回路鋼表面に錫含有銅鍍金を施し、錫
と銅との共折物を析出させた後、該内層材表面にプリプ
レグNを介し最外層に外層材を配設した積層体を積層成
形し一体化5することを特徴とするプリント配線板の製
造方法のため、内層材の回路表面の接着性を向上させる
ことができ、且つ表面に黒色酸化銅皮膜がないので耐ノ
飄ロー性を向上させることができたもので、以下本発明
の詳細な説明する。The present invention is a laminated structure in which tin-containing copper plating is applied to the circuit steel surface of the inner layer material to precipitate a symbiotic substance of tin and copper, and then the outer layer material is disposed on the surface of the inner layer material through prepreg N. Since the printed wiring board manufacturing method is characterized by laminated and integrated 5 parts, it is possible to improve the adhesion of the circuit surface of the inner layer material, and since there is no black copper oxide film on the surface, it is resistant to corrosion. The present invention will be described in detail below as it has been able to improve the rolling properties.
本発明に周込る内層材としてはフェノール樹脂、クレゾ
ール樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ポ
リイミド樹脂、ポリブタジェン樹脂、ポリフェニレンサ
ルファイド樹脂、ポリブチレンテレフタレートm脂、ポ
リエチレンテレフタレート樹脂、弗化樹脂等の樹脂と、
ガラス、アスベスト等の無機繊維やポリエステル、ポリ
アクリル、ポリアミド、ポリビニルアルコール等の有機
合成繊維や木綿等の天然繊維からなる織布、不織布、マ
、ソト或は紙又はこれらの組合せ基材とからなる片面又
は両面鋼張積層板に電気回路を形成したもので、回路銅
表面に錫含有銅鍍金を施し、回路銅表面に微細凹凸状の
錫と銅との共折物を・析出させてから、該内層材表面に
前記樹脂と基材とからなるプリプレグを所要枚数介し最
外層に片面金属張積層板や金属箔からなる外層材を配設
した積層体を多段プレス法、マルチロール法、ダブルベ
ルト法、ドラム法、無圧連続加熱法等で積層成形し一体
化するものである。錫含有銅鍍金としては酒石酸錫、錫
酸水素カリウム等のような錫化合物を含む銅鍍金を施す
もので錫イオンを0.0001〜0.Ofモル/l
含有することが好ましい。Inner layer materials included in the present invention include resins such as phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, polyimide resin, polybutadiene resin, polyphenylene sulfide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, and fluorinated resin. and,
Made of woven fabric, non-woven fabric, magenta, sotho, paper, or a combination of these materials made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyacrylic, polyamide, and polyvinyl alcohol, and natural fibers such as cotton. An electric circuit is formed on a single-sided or double-sided steel-clad laminate, and the circuit copper surface is plated with tin-containing copper, and a finely uneven co-reciprocal compound of tin and copper is precipitated on the circuit copper surface. A laminate in which a required number of prepregs made of the above-mentioned resin and base material are interposed on the surface of the inner layer material and an outer layer material made of a single-sided metal-clad laminate or metal foil is placed on the outermost layer is prepared using a multi-stage press method, a multi-roll method, or a double belt method. They are laminated and integrated using methods such as the drum method, pressureless continuous heating method, etc. The tin-containing copper plating is a copper plating containing a tin compound such as tin tartrate, potassium hydrogen stannate, etc., and the tin ion is 0.0001 to 0. Ofmol/l
It is preferable to contain.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み1顛の両面銅張ガラス布エポキシ樹脂積層板の両面
に回路形成した内層材をプラーJシング、脱脂してから
陰極とじ錫酸水素カリウムを錫イオンでQ、001モル
/l 含有する銅鍍金液で鍍金処理し回路@表面に微細
凹凸状の錫と銅との共折物全析出させた後、該内層材の
上下面に厚さQ、 1 ffのガラス布エポキシ樹脂プ
リプレグを夫々2枚づつ介し最外層に厚さ35ミクロン
の銅箔を配設した積層体を40Kq/d 、 165
℃で60分間積層成形して4開回路プリント配線板を得
た。Example: An inner layer material with circuits formed on both sides of a 1-thick double-sided copper-clad glass cloth epoxy resin laminate was put on a puller J-sing, degreased, and then used as a cathode. Potassium hydrogen stannate was added as a tin ion at a concentration of Q, 001 mol/l. After plating with a copper plating solution to fully precipitate a co-rectate of tin and copper in the form of fine irregularities on the surface of the circuit, a glass cloth epoxy resin prepreg with a thickness of Q and 1 ff was applied to the upper and lower surfaces of the inner layer material, respectively. A laminate with 35 micron thick copper foil placed on the outermost layer between two sheets at 40Kq/d, 165
Lamination molding was performed at ℃ for 60 minutes to obtain a 4-open circuit printed wiring board.
比較例
実施例と同じ回路形成した内層材をブラーJ、7ングし
てから90℃に加熱したアルカリ性亜塩素酸ナトリウム
水溶液に10分間浸漬して回路銅に酸化第2銅皮膜を形
成後、その上下面に厚さ0、IHのガラス布エポキシ樹
脂プリプレグを夫々2枚づつ介した以外は実施例と同様
に処理して4開回路プリント配線板を得た。Comparative Example The inner layer material with the same circuit formed as in the Example was subjected to Blur J 7 immersion, and then immersed in an alkaline sodium chlorite aqueous solution heated to 90°C for 10 minutes to form a cupric oxide film on the circuit copper. A 4-open circuit printed wiring board was obtained in the same manner as in the example except that two glass cloth epoxy resin prepregs of 0 thickness and IH were interposed on the upper and lower surfaces.
実施例及び比較例のプリント配線板の性能は第1表のよ
うである。The performances of the printed wiring boards of Examples and Comparative Examples are shown in Table 1.
注 ※ 穴あけ後、鍍金液処理後の水溶液のしみこみ。note *Aqueous solution seeps in after drilling and plating solution treatment.
本発明は上述した如く構成されている。特許請求の範囲
@1項に記載したプリント配線板の創造方法によって得
られるプリント配線板は層間接着性及び耐ハロー性が向
上する効果がある。The present invention is constructed as described above. The printed wiring board obtained by the method for creating a printed wiring board described in claim 1 has the effect of improving interlayer adhesion and halo resistance.
Claims (1)
銅との共折物を析出させた後、該内層材表面にプリプレ
グ層を介し最外層に外層材を配設した積層体を積層成形
し一体化することを特徴とするプリント配線板の製造方
法。(1) Laminate in which tin-containing copper plating is applied to the circuit copper surface of the inner layer material to precipitate a symbiotic substance of tin and copper, and then the outer layer material is placed on the surface of the inner layer material via a prepreg layer and the outermost layer. A method for manufacturing a printed wiring board, characterized by laminating and integrating the body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12521089A JPH02303191A (en) | 1989-05-18 | 1989-05-18 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12521089A JPH02303191A (en) | 1989-05-18 | 1989-05-18 | Manufacture of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02303191A true JPH02303191A (en) | 1990-12-17 |
Family
ID=14904608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12521089A Pending JPH02303191A (en) | 1989-05-18 | 1989-05-18 | Manufacture of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02303191A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495184B1 (en) * | 2002-12-02 | 2005-06-14 | 엘지마이크론 주식회사 | A tape substrate and tin plating method of the tape substrate |
KR100511965B1 (en) * | 2002-12-13 | 2005-09-02 | 엘지전자 주식회사 | A tin plating method of the tape substrate |
-
1989
- 1989-05-18 JP JP12521089A patent/JPH02303191A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495184B1 (en) * | 2002-12-02 | 2005-06-14 | 엘지마이크론 주식회사 | A tape substrate and tin plating method of the tape substrate |
KR100511965B1 (en) * | 2002-12-13 | 2005-09-02 | 엘지전자 주식회사 | A tin plating method of the tape substrate |
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