KR100511965B1 - A tin plating method of the tape substrate - Google Patents

Abstract

The tin plating method of the tape substrate according to the present invention includes a first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, a second step of forming a conductive polymer layer on the copper foil pattern formed in the first step; After the conductive polymer layer is formed in the second step, a third step of applying a solder resist to a portion other than the connecting portion, and after the solder resist is applied in the third step, the tin is replaced with the conductive polymer layer to form a tin layer. It is configured to include a fourth step, the conductive polymer layer is reduced due to the internal stress during the tin plating is possible to remove the cause of whiskers, the electrical characteristics change by the dissimilar metal layer when mounting the electronic component is reduced In this case, there is no need for a separate process for preventing the whisker, and thus, the process time and the process cost can be reduced.

Description

A tin plating method of the tape substrate}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tin plating method of a tape substrate on which an electronic component is mounted, and more particularly, to tin coating of a tape substrate capable of plating tin without the occurrence of voids or whiskers in the tin layer to be plated on the pattern portion of the tape substrate. It is about a method.

In general, a tape substrate is a kind of substrate mainly applied to foldable electronic products such as a liquid crystal substrate, a mobile phone or a notebook. As electronic products become smaller and lighter, a tape automated bonding (TAB) substrate and a TVA (TBGA) are used. A variety of substrates have been developed, such as Tape Ball Grid Array (ASC) substrates, Application Specific Integrated Circuit (ASIC) substrates, and Chip on Film (COF) substrates.

1 is a cross-sectional view showing a tape substrate according to the prior art, wherein the tape substrate is a copper foil layer of several tens of micrometers (about 20 micrometers) conductive on the surface of the insulating film 10 made of a material such as polyimide or polyethersulfone. It adhere | attaches by (12), and after photoresist is apply | coated to the surface of the said copper foil layer, a pattern is transferred to the said photoresist by exposing a wiring pattern using a mask to the said photoresist.

When the pattern is transferred as described above, after the desired pattern is formed through copper foil etching, the photoresist is removed to complete formation of the copper foil pattern 20.

Meanwhile, as described above, the solder resist 30 is applied to the completed tape substrate of the copper foil pattern 20 except for the connection portion, and the tin layer 27 is formed to prevent oxidation of the exposed connection portion and to mount the electronic component. Tin is plated by electroless tin plating.

The basic tin precipitation reaction by the electroless tin plating method is one divalent tin ion (Sn 2+) contained in the electroless tin plating solution and two copper (Cu) contained in the copper foil pattern, as shown in Formula 1 shown below. ) Reacts to precipitate tin (Sn) to form two copper ions (Cu +).

That is, in the conventional tin plating method, the copper component and the tin component of the copper foil pattern are substituted and a tin layer is formed.

As described above, the tin layer 27 formed of tin is excellent in flexibility, less toxic to the human body, and has a lower melting point and excellent solderability. In addition, the production cost can be reduced due to low cost, it is easy to form a thin film of 1 μm or less uniformly, liquid management is easy, and the bonding strength of bumps made of gold to electronic components for connection with circuit boards. The range of use is gradually increasing due to high.

However, in the tape substrate and the tin plating method according to the related art, when tin is plated on the tape substrate on which the solder resist 30 is applied, an electroless tin plating solution forms an end portion of the solder resist 30 and the copper foil pattern 20. When the local battery is formed between the copper foil pattern and the electroless tin plating solution, copper is eluted from the copper foil pattern, and a hollow void C is formed and the void C becomes large. There is a problem that the copper foil pattern 20 is disconnected.

Bending stress is applied to the tape substrate due to the recessed void C, and thus the tape substrate is deformed or even the tape substrate is bent and the copper foil pattern is damaged.

In addition, tin or tin alloy typically generates stress due to the stress of the isomer in the plated tin layer and the alloy layer with copper to produce needle-like precipitates called whiskers from immediately after plating to days or years. Although there is a problem of growing and shorting an adjacent pattern and damaging the circuit, a method of suppressing the occurrence of the whisker has not yet been provided.

The heat treatment method or alloy may be performed to suppress the occurrence of the whisker. However, the heat treatment method takes a long time and the productivity decreases, and the substrate may deteriorate according to the heating conditions, which may cause defects. As it is added, the tin-copper alloy layer 23 is formed by being combined with the tin component of the tin layer 27. In order to form the thickness of the pure tin layer 27 to a predetermined thickness, plating is performed for a long time. Should be, there is a problem that the thickness of the tin-copper alloy layer 23 is formed thicker than necessary.

In the case of suppressing the occurrence of whiskers by performing the alloy described above, fundamental solutions have not been proposed, such as deterioration of the electrical characteristics and deterioration of solderability resulting in a weakening of the mounting strength of electronic components.

The present invention has been made to solve the above-described problems of the prior art, the electronic component has been developed in a high-density, high-density microcircuit pattern according to the development of the technology, the barrier layer is formed so that whisker generation is suppressed before the tin plating By improving the quality reliability of the microcircuit pattern, preventing the disconnection of the pattern due to void generation, the stress is dispersed to increase the strength of the pattern, and provides a tape substrate and its tin plating method does not occur the electrical characteristics deterioration Its purpose is to.

The tin plating method of the tape substrate according to the present invention for solving the above problems is a first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, and a conductive polymer formed on the copper foil pattern formed in the first step And a third step of applying a solder resist to a portion other than the connection part after the conductive polymer is formed in the second step, and after the solder resist is applied in the third step, the tin is replaced with the conductive polymer. It comprises a fourth step of plating the tin so that it is formed.

In addition, the tin plating method of the tape substrate according to another embodiment of the present invention in the first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, and the portion other than the connection portion of the copper foil pattern formed in the first step A second step of applying a solder resist, a third step of applying a conductive polymer to the connection part after the solder resist is applied in the second step, and after the conductive polymer is applied in the third step, the conductive polymer is substituted with the conductive polymer And a fourth step of plating tin so that a tin layer is formed.

In addition, the tin plating method of the tape substrate according to another embodiment of the present invention is the first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, and applying a conductive polymer to the copper foil pattern formed in the first step And a third step of plating tin so that a tin layer is formed after the conductive polymer is applied in the second step, and a tin layer is formed; and portions other than the connection part after the tin layer is formed in the third step. It comprises a fourth step of applying a solder resist to.

Hereinafter, with reference to the accompanying drawings an embodiment showing a feeding device of the exposure apparatus according to the present invention will be described in detail.

2 is a plan view showing a tape substrate according to the present invention, Figure 3 is a cross-sectional view showing a tape substrate according to the present invention.

In the tape substrate according to the present invention, as shown in FIGS. 2 and 3, a copper foil pattern 70 having a connection part on which an electronic component is mounted is formed on one side of the insulating film 60, to form the copper foil pattern. In order to bond the copper foil using an adhesive 62 having heat resistance, chemical resistance, and predetermined adhesiveness, coating, exposure, and etching are performed to form a pattern.

Solder resists 80 are coated on portions other than the connection portions of the copper foil pattern 70 formed as described above to protect the connection portions, and tin (Sn) to improve the bonding property and solderability with the electronic parts. The plated tin layer 77 is formed.

In more detail, the insulating film 60 is made of a plastic resin film, and is heated in an electroless tin plating solution during the plating process, so that the insulating film 60 is formed of a material having chemical resistance and heat resistance.

Normally, the insulating film 60 is mainly formed of a material such as epoxy, ester or polyimide, polyamide, etc. In the present invention, the insulating film 60 made of polyimide is mainly used.

In addition, the insulating film 60 is usually used for the insulating film 60 having a thickness of less than 10㎛ 100㎛, the insulating film 60 is conveyed by a reel to reel transfer equipment, accurate transfer and alignment The alignment holes 65 are continuously formed at equal intervals at both sides so as to be possible, and are configured to be caught by the alignment pins formed in the transfer equipment.

Figure 4 is a flow chart illustrating a tin plating method of the tape substrate according to the present invention.

In the tin plating method of the tape substrate according to the present invention, as shown in FIG. 4, a first step S11 of forming a copper foil pattern 70 having a connection part on the surface of the insulating film 60 and the first A second step S12 of forming a conductive polymer layer by depositing or spraying a conductive polymer on the copper foil pattern 70 formed in step S11, and forming the conductive polymer layer in the second step S12, and then connecting the terminal. The third step (S13) for applying the solder resist 80 to the other portion, and after the solder resist 80 is applied in the third step (S13) is replaced with the conductive polymer layer and the tin layer 77 is formed It is configured to include a fourth step (S14) to plate the tin.

In the first step (S11), the insulating film 60 is coated with a copper foil to form a copper foil pattern 70, the copper foil is attached by an adhesive 62 having heat resistance, chemical resistance and predetermined adhesiveness Or by electroplating.

Typically, the thickness of the copper foil formed through electroplating is formed to a thickness of less than 6㎛ 25㎛, in the case of fine patterns, copper foil is deposited through a sputtering method to thin the thickness.

As described above, the copper foil-bonded insulating film 60 is formed of a copper foil pattern 70 through a photolithography process through coating, exposure, development, etching, and peeling.

As described above, the copper foil pattern 70 formed in the first step S11 passes through the second step S12 in which the conductive polymer layer is formed.

The conductive polymer is composed of an organic polymer having a double bond, an aromatic, a heteroaromatic ring or a triple bond, derivatives thereof and the like.

Examples of the derivative polymer include polydiacetylene, polyacetylene, polylipoll, polyaniline, polythiophene, polyisothianaphorene, polyheteroarylenevinylene, polyphenylene, polyphenylene sulfide, polyperinaphthalene, and polypythalosi And derivatives thereof, copolymers with other monomers thereof, and physical mixtures thereof, and the like, and exist in various states and are formed through oxidation, reduction or acid / base reactions, or formed into complex compounds.

In addition, the conductive polymer has a very good electrical conductivity (1S / cm or more), and is formed into grains having a size of generally 10nm to less than 1000nm.

Figure 5 is a process diagram showing the manufacturing process of the conductive polymer according to the present invention.

Looking at the formation process of the conductive polymer layer in more detail, as shown in Figure 5, first, the conductive polymer consisting of a polyacetylene or polyrilol, etc. is mixed with an acid solution to form a conductive polymer salt.

The conductive polymer salt prepared as described above is composed of a conductive polymer (A) having typical metal properties, and the water-soluble compound (B) is bonded in a cyclic bond, mixed with water, and dispersed in an aqueous solution.

6 is an exemplary diagram schematically showing a process of forming a conductive polymer layer according to the present invention.

As shown in FIG. 6, the conductive polymer dispersed in the aqueous solution as described above forms a cyclic bond, is distributed in small particles of about 80 nm (0.08 μm) or less, and has a strong acid solution such as H ₂ SO ₄ , HCl, and the like. Or an alkali solution such as NaOH or metal components such as Fe, Sn and Cu to aggregate or disperse.

The conductive polymer configured as described above is deposited or sprayed on the surface of the copper foil pattern 70 to form a layer.

Here, the conductive polymer interacts with the copper component of the copper foil pattern 70, wherein the surface of the copper foil pattern 70 is rapidly oxidized to form an oxide film made of copper ions (Cu ⁺ ), and the emitted electrons. Decomposes the cyclic bond of the conductive polymer.

On the other hand, in the conductive polymer in which the cyclic bond is decomposed, the decomposed ring is bonded to the copper ion (Cu ⁺ ) ion and forms a copper-conductive polymer oxide film and is maintained in a stable state.

Here, the thickness of the copper-conducting polymer oxide film is determined according to the grain size of the conductive polymer. The smaller the grain size of the conductive polymer is, the thinner the thickness of the copper-conducting polymer oxide film is formed, so that the fine tin layer 77 is formed. Formation is possible.

For example, when the grain size of the conductive polymer is 10 nm, the copper-conductive polymer oxide film is formed to a thickness of about 20 nm, and when the grain size of the conductive polymer is 20 nm, the copper-conductive polymer oxide film is about 50 nm thick. Is formed.

When the conductive polymer layer is formed in the second step (S12) as described above, the third application of the solder resist 80 is applied to prevent the oxidation of the copper foil pattern 70 and to electrically insulate the copper foil pattern 70. Step S13 is performed.

Here, the solder resist 80 is generally used epoxy, polyimide, urethane, etc., a material that can be easily adhered to the copper foil pattern 70 or the insulating film 60 is used. In addition, the solder resist 80 may be a cured resin that is cured by ultraviolet rays or heat after application.

On the other hand, the solder resist 80 is applied to a portion other than the connection portion for the electrical connection of the electronic component, wherein the connection portion is covered with a screen mask on the upper side of the connection portion so that the solder resist 80 is not applied After that, a solder resist 80 is applied.

Here, the solder resist 80 is applied to a thickness of less than 5㎛ 50㎛, the solder resist 80 made of a thermosetting resin is heated for about 30 minutes or more at a temperature of 120 ℃ to less than 160 ℃.

The solder resist 80 is bubbled during the heating process, the heating temperature is properly raised so that no bubbles are generated and at the same time the resist solvent contained in the solder resist 80 is exposed in the curing heating process to expose the copper foil pattern 70 ), Do not remain.

7 is a schematic diagram illustrating a process of plating tin according to the present invention. When the solder resist 80 is applied in the third step S13 as described above, the solder resist 80 is not applied. A fourth step (S14) of plating the tin by the electroless tin plating method on the connection part is performed. In the second step (S12), the tape substrate on which the conductive polymer layer is formed is a portion other than the connection part in the third step (S13). After the solder resist is applied to, it is immersed in the electroless tin plating solution in the fourth step (S14) to replace the conductive polymer and tin and plating is performed.

The tin precipitation reaction by the electroless tin plating method is performed by the conductive polymer contained in the copper-conductive polymer oxide film, as shown in Formula 2, to one divalent tin ion (Sn 2+) contained in the electroless tin plating solution. It is substituted with two electrons. When the conductive polymer is combined with the copper ions contained in the copper-conductive polymer oxide film and dispersed in the electroless tin plating solution, tin is deposited on the copper ions remaining in the copper foil pattern 70.

When tin forms a conductive polymer layer on the copper foil pattern 70 as described above, a monovalent or divalent copper oxide layer (CuO / Cu ₂ O) is formed on the surface of the copper foil pattern 70, and the copper oxide layer (CuO). The amount of copper ions (Cu ⁺ ) contained in / Cu ₂ O) eluted by the acid solution and the amount of divalent tin (Sn ²⁺ ) always appear as a constant molar ratio. In addition, in the process of forming the tin layer 77, the copper oxide layer (CuO / Cu ₂ O) remaining on the copper foil pattern 70 and tin are uniformly bonded and an alloy layer is formed. The alloy layer is formed of Cu ₆ Sn _5. Since the Cu ₃ Sn or Cu ₆ Sn ₅ generated when the conductive polymer is not coated is not mixed, the tin layer 77 plated on the alloy layer has a low plating deviation and improved quality. .

In addition, since the tin layer 77 has a large grain size and a low surface roughness, the copper foil pattern 70 is not easily oxidized and is easily mounted when the final electronic component is mounted.

In particular, since the conductive polymer is used when the tin layer 77 is formed, whiskers are generated without a separate heat treatment process because an effect of suppressing non-uniformity of internal stress generated when copper (Cu) and tin (Sn) are combined. Can be suppressed, and the pure tin layer 77 of a predetermined thickness can be formed in a short time, and the time required for plating of tin (Sn) is reduced, so that the copper (Cu) component is eluted more than necessary, It is prevented from forming.

In addition, the conductive polymer is eluted and substituted with divalent tin ions (Sn ²⁺ ) in the plating process, so that the plating reliability is not lowered due to the remaining of the conductive polymer.

The tin layer 77 plated by the electroless tin plating solution as described above is formed to a thickness of 0.01 μm to less than 1 μm, preferably, a thickness of 0.05 μm to less than 0.5 μm.

As described above, the tin plating method of the tape substrate according to the present invention has been described with reference to the illustrated drawings. However, the present invention is not limited by the embodiments and drawings disclosed herein, and by those skilled in the art within the technical scope of the present invention. Various modifications can be made, including materials.

The tin plating method of the tape substrate may be changed in process order. For example, FIG. 8 is a flowchart illustrating a tin plating method of the tape substrate according to another embodiment of the present invention.

In the tin plating method of the tape substrate according to another embodiment of the present invention, as shown in Figure 8, after forming a copper foil pattern having a connection portion on the surface of the heat-resistant film (S21), the portion other than the connection portion of the copper foil pattern A solder resist is applied to the conductive polymer layer (S22), and a conductive polymer layer is formed by depositing or spraying the conductive polymer on the connection portion (S23). When the conductive polymer is formed as described above, tin (Sn) may be plated to be substituted with the conductive polymer to form a tin layer (S24).

That is, in the tin plating method of the tape substrate according to another embodiment of the present invention, as compared with the embodiment of the present invention, the order of the process in which the solder resist is applied is changed, and the process sequence of the solder resist is applied. By converting, the surface area on which tin (Sn) is plated may be reduced, thereby reducing costs.

FIG. 9 is a flowchart illustrating a tin plating method of a tape substrate according to another embodiment of the present invention. After forming a copper foil pattern having a connection portion on a surface of an insulating film (S31), a conductive polymer layer is formed on the copper foil pattern. Form (S32),

When the conductive polymer layer is formed as described above, tin plating is performed to replace the conductive polymer layer to form a tin layer (S33) and to apply a solder resist to a portion other than the connection portion (S34).

An experimental example of tin plating formed by the tin plating method of the tape substrate according to the present invention will be described in detail as follows.

Experimental Example 1

A 80 nm conductive polymer layer was formed on the entire surface of the copper foil pattern made of copper foil having a thickness of 18 μm on the polyimide film, and the solder resist was printed at a thickness of 30 μm, and then cured at a temperature of 150 ° C. for 60 minutes. Sn) The thickness of the tin layer formed in the plating bath was 0.2, 0.3, and 0.4 mu m, respectively, and as a result, no voids and whiskers were generated at the solder resist interface, and whiskers were not generated after 10 days of aging.

Experimental Example 2

Printed and coated solder resist on the front surface of all parts except the connection part on the copper foil pattern made of copper foil having a thickness of 18 μm on the polyimide film, and then cured at a temperature of 150 ° C. for 60 minutes. After the layer was formed, the tin (Sn) layer in the tin (Sn) plating bath at a temperature of 60 ° C. was 0.2, 0.3, and 0.4 μm, respectively, and the generation of voids and whiskers on the solder resist interface was significantly reduced, and bonding was performed. The characteristics and appearance were very good.

Experimental Example 3

Print and apply solder resist on the front surface of all parts except the connection part on the copper foil pattern made of copper foil having a thickness of 18 µm on the polyimide film, and apply the cured resin at a temperature of 150 ° C for 60 minutes, and then apply a thickness of 80 nm. After the conductive polymer layer was formed, the thickness of the tin layer in the tin (Sn) plating bath at 60 ° C. was 0.2, 0.3, and 0.4 μm, respectively, and the result was good even when dried at 120 ° C. for 120 minutes.

Experimental Example 4

Print and apply solder resist on the front surface of all parts except the connection part on the copper foil pattern made of copper foil having a thickness of 18 µm on the polyimide film, and apply the cured resin at a temperature of 150 ° C for 60 minutes, and then apply a thickness of 80 nm. After the conductive polymer layer was formed, the tin layer was plated to have a thickness of 0.1 μm, and then dried first at a temperature of 120 ° C. for 120 minutes, and then secondly plated with tin (Sn) to obtain a pure tin layer having a thickness of 0.1. The plating was carried out so that it was 占 퐉, and no problems were found.

In a similar manner to Experimental Example 4, the conductive polymer layer and the tin layer were each 0.1 μm thick before printing the solder resist, and dried at a temperature of 150 ° C. after printing the solder resist for 60 minutes, and then the thickness of the pure tin layer was 0.1. Good results were obtained even when the thickness was made to be 탆.

In the electroless tin plating treatment of the above experimental example, in order to form an optimal conductive polymer layer, the tape substrate on which the copper foil pattern was formed was desorbed at 45 ° C. for 60 seconds in a solution containing sulfuric acid (H ₂ SO ₄ ) as a main component. After washing with pure water at room temperature, micro-etching for removing the oxide film on the copper surface and a conductive polymer layer were formed after washing, and in the case of tin plating, tin containing 15% of MSA (Methane Sulfonic Acid) was prepared for surface gloss. After plating for 60 seconds at a temperature of 60 ℃ using a plating solution, it was dried after washing for 30 seconds at 45 ℃ temperature.

Even when the conductive polymer layer and the tin (Sn) plating are separately performed, there is no difference in the above implementation conditions.

As a result of the ILB test using the above test specimens, the bonding property with the electronic parts was not abnormal even under the same process conditions as the existing products, and the appearance state of the ILB was also good.

As a method of evaluating the bonding property, a good result was obtained in a lead test of about 5-12 g.

Copper foil pattern of the tape substrate, that is, the final evaluation after tin plating, electrical signal inspection of the appearance, bonding strength, short circuit / disconnection after bonding, and reliability test (thermal shock: -55 ℃ ~ 125 ℃ / 500 cycle, constant temperature and humidity: 85 ℃ , 85% RH / 300Hr, PCT: 121 ℃, 2 atm, 100% / 96Hr) after checking the electrical properties and appearance was confirmed that there is no abnormality.

In the tin plating method of the tape substrate according to the present invention configured as described above, the copper foil pattern is connected to the electroless tin plating solution by coating a conductive polymer layer on the copper foil pattern to form a copper-glass additive oxide film and then plating tin. Since the time is reduced, the copper component is prevented from being eluted, so that disconnection due to voids is not generated, plating efficiency is increased due to the barrier layer, and the thickness of the alloy layer is thinned, thereby facilitating formation of the pure tin layer. As well as the productivity increase due to the shortening of the process time, the thickness of the copper foil pattern can be lowered, which is advantageous for the formation of a fine circuit pattern.

In addition, due to the conductive polymer layer, the internal stress is reduced during tin plating to remove the cause of whiskers, a change in electrical characteristics due to dissimilar metal layers when mounting electronic components, and a separate process for preventing the whiskers Since this is not necessary, there is an effect of reducing process time and process cost.

1 is a cross-sectional view showing a tape substrate according to the prior art,

2 is a plan view showing a tape substrate according to the present invention;

3 is a cross-sectional view showing a tape substrate according to the present invention;

4 is a flowchart illustrating a tin plating method of a tape substrate according to the present invention;

Figure 5 is a process diagram showing the manufacturing process of the conductive polymer according to the present invention.

6 is an exemplary diagram schematically showing a process of forming a conductive polymer layer according to the present invention.

7 is a schematic diagram illustrating a process of plating tin according to the present invention;

8 is a flowchart illustrating a tin plating method of a tape substrate according to another embodiment of the present invention;

9 is a flowchart illustrating a tin plating method of a tape substrate according to another embodiment of the present invention.

<Explanation of symbols on main parts of the drawings>

60: insulating film 62: adhesive

65: alignment hole 70: copper foil pattern

75: copper-tin alloy layer 77: tin layer

80: solder resist

Claims (12)

A first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, A second step of forming a conductive polymer layer on the copper foil pattern formed in the first step; A third step of applying a solder resist to a portion other than the connection part after the conductive polymer layer is formed in the second step; And a fourth step of plating tin so that a tin layer is formed after the solder resist is applied in the third step and replaced with the conductive polymer layer. The method of claim 1, The conductive polymer layer is a tin-plating method of the tape substrate, characterized in that composed of a conductive polymer, such as an organic polymer having a double bond, aromatic, heteroaromatic ring or triple bond and derivatives thereof. The method of claim 2, The conductive polymer is tin plating method of the tape substrate, characterized in that formed from crystal grains having a size of less than 10nm to 1000nm. The method of claim 1, The tin layer is tin plating method of the tape substrate, characterized in that formed in a thickness of less than 0.01㎛ 1㎛. A first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, A second step of applying a solder resist to a portion other than the connection portion of the copper foil pattern formed in the first step; A third step of forming a conductive polymer layer on the connection part after the solder resist is applied in the second step; And a fourth step of plating tin to form a tin layer after the conductive polymer layer is applied in the third step. The conductive polymer layer is replaced with the conductive polymer layer. The method of claim 5, The conductive polymer layer is a tin-plating method of the tape substrate, characterized in that composed of a conductive polymer, such as an organic polymer having a double bond, aromatic, heteroaromatic ring or triple bond and derivatives thereof. The method of claim 6, The conductive polymer is tin plating method of the tape substrate, characterized in that formed from crystal grains having a size of less than 10nm to 1000nm. The method of claim 5, The tin layer is tin plating method of the tape substrate, characterized in that formed in a thickness of less than 0.01㎛ 1㎛. A first step of forming a copper foil pattern having a connection portion on the surface of the insulating film, A second step of forming a conductive polymer layer on the copper foil pattern formed in the first step; A third step of plating tin so that after the conductive polymer layer is applied in the second step, the tin is replaced with the conductive polymer layer; And a fourth step of applying a solder resist to a portion other than the connecting portion after the tin layer is formed in the third step. The method of claim 9, The conductive polymer layer is a tin-plating method of the tape substrate, characterized in that composed of a conductive polymer, such as an organic polymer having a double bond, aromatic, heteroaromatic ring or triple bond and derivatives thereof. The method of claim 10, The conductive polymer is tin plating method of the tape substrate, characterized in that formed from crystal grains having a size of less than 10nm to 1000nm. The method of claim 9, The tin layer is tin plating method of the tape substrate, characterized in that formed in a thickness of less than 0.01㎛ 1㎛.