JPH02277294A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02277294A JPH02277294A JP9834989A JP9834989A JPH02277294A JP H02277294 A JPH02277294 A JP H02277294A JP 9834989 A JP9834989 A JP 9834989A JP 9834989 A JP9834989 A JP 9834989A JP H02277294 A JPH02277294 A JP H02277294A
- Authority
- JP
- Japan
- Prior art keywords
- layer material
- inner layer
- circuit
- printed wiring
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 abstract description 32
- 125000001475 halogen functional group Chemical group 0.000 abstract description 7
- 239000011229 interlayer Substances 0.000 abstract description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 2
- 239000005050 vinyl trichlorosilane Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用すられるプリント配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、プリント配線板は片面又は両面銅張積層板の銅箔
面に回路形成したものを内層材とし、内層材表面を粗化
、或は黒化処理等をおこなってからプリプレグ層を介し
、最外層に片面鋼張積層板や銅箔を外層材として配設し
た積層体を積層成形し一体化して得られるが、従来のパ
ターン回路間隔では上記方法でよいが、パターン回路間
隔が狭くなるファインパターンでは回路面積が増加し内
層材とプリプレグとの接着性が低下し、ドリル加工等の
穴あけ時の衝撃で開穴部周辺が層間剥離し耐ハロー性が
低下する問題があった。Conventionally, printed wiring boards are made by forming a circuit on the copper foil surface of a single-sided or double-sided copper-clad laminate as an inner layer material, and after roughening or blackening the surface of the inner layer material, the final layer is bonded via a prepreg layer. It is obtained by laminating and integrally molding a laminate in which a single-sided steel-clad laminate or copper foil is arranged as an outer layer material.The above method is sufficient for conventional pattern circuit spacing, but fine patterns with narrow pattern circuit spacing However, there was a problem in that the circuit area increased, the adhesiveness between the inner layer material and the prepreg decreased, and the impact during drilling etc. caused delamination in the vicinity of the hole, resulting in a decrease in halo resistance.
従来の技術で述べたように、内層材表面をサンドベーパ
ー サンドブラスト等で粗化する方法は均一な粗化がで
きず回路を傷つける欠点があり、黒化処理では粗面表面
の黒色酸化鋼級膜のため、耐ハロー性が低下する欠点が
ある。本発明は従来の技術における上述の問題点に鑑み
てなされたもので、その目的とするところは層間接着性
に優れ、且つ耐ハロー性のよいプリント配線板の製造方
法を提供することにある。As described in the conventional technology, the method of roughening the inner layer material surface using sand vapor, sandblasting, etc. has the drawback that it cannot achieve uniform roughening and damages the circuit. Therefore, there is a drawback that halo resistance decreases. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing a printed wiring board that has excellent interlayer adhesion and good halo resistance.
本発明は内層材の回路鋼表面をシランカーｌプリング剤
で処理してから、内層材表面にプリプレグ層を介し最外
層に外層材を配設した積層体を積層成形し一体化するこ
とを特徴とするプリント配線板の製造方法のため、内層
材の回路表面の接着性を向上させることができ、且つ表
面に黒色酸化銅皮膜がないので耐ハロー性を向上させる
ことができたもので、以下本発明の詳細な説明する。The present invention is characterized in that the circuit steel surface of the inner layer material is treated with a silancar l pulling agent, and then a laminate in which the outer layer material is disposed on the outermost layer with a prepreg layer interposed on the surface of the inner layer material is laminated and integrated. This method of manufacturing printed wiring boards improves the adhesion of the circuit surface of the inner layer material, and since there is no black copper oxide film on the surface, it improves halo resistance. Detailed description of the invention.
本発明に用いる内層材としてはフェノール樹脂クレゾー
ル樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ポリ
イミド樹脂、ポリブタジェン樹脂、ポリフェニレンサル
ファイド樹脂、ポリエチレンテレフタレート樹脂、ポリ
エチレンテレフタレート樹脂、弗化樹脂等の樹脂と、ガ
ラス、アスベスト等の無機繊維やポリエステル、ポリア
クリル、ポリアミド、ポリビニルアルコール等の有機合
成繊維や木綿等の天然繊維からなる織布、不織布、マッ
ト或は紙又はこれらの胡合せ基材とからなる片面又は両
面銅張積層板に電気回路を形成したもので、回路鋼表面
にビニルトリクロロシランビニルトリスベータメトキシ
エトキシシラン等のシランカーフプリング剤を水或はア
ルコール、ケトン類の溶媒に溶解或は分散した溶液をス
プレー噴霧、塗布、浸漬、流延等で処理してから、該内
層材表面に前記樹脂と基材とからなるプリプレグを所要
枚数介し、最外層に片面金属張積層板や金属箔からなる
外層材を配設した積層体を多段プレス法、マルチロール
法、タプルベルト法、ドラム法、無圧連続加熱法等で積
層成形し一体化するものである。Inner layer materials used in the present invention include resins such as phenolic resin cresol resin, epoxy resin, unsaturated polyester resin, polyimide resin, polybutadiene resin, polyphenylene sulfide resin, polyethylene terephthalate resin, polyethylene terephthalate resin, and fluorinated resin, glass, and asbestos. Woven fabrics, non-woven fabrics, mats or paper made of inorganic fibers such as polyester, polyacrylic, polyamide, polyvinyl alcohol, etc., organic synthetic fibers such as cotton, natural fibers such as cotton, or single-sided or double-sided copper fabrics made of these mating base materials. An electric circuit is formed on a stretched laminate, and a solution of a silane kerf pulling agent such as vinyltrichlorosilane vinyltrisbetamethoxyethoxysilane dissolved or dispersed in water, alcohol, or ketone solvent is sprayed onto the surface of the circuit steel. After processing by spraying, coating, dipping, casting, etc., a required number of prepregs made of the resin and base material are interposed on the surface of the inner layer material, and an outer layer material made of a single-sided metal-clad laminate or metal foil is applied as the outermost layer. The arranged laminates are laminated and integrated by a multi-stage press method, a multi-roll method, a tuple belt method, a drum method, a pressureless continuous heating method, etc.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み１ｆｌの両面銅張ガラス布エポキシ樹脂積層板の両
面に回路形成した内層材をブラッシングしてからビニル
トリクロロシランの０．１重ｉｔ係エチルアルコール溶
液でスプレー噴霧処理後、該内層材の上下面に厚さ０．
１ｆｆのガラス布エポキシ樹脂プリプレグを夫々２枚づ
つ介し最外層に厚さ３５ミクロンの銅箔を配設した積層
体を４０ Ｋｑ／ｄ 、 １６５℃で６０分間積層底
形して４層回路プリント配線板を得た。Example After brushing the inner layer material with circuits formed on both sides of a 1 fl thick double-sided copper-clad glass cloth epoxy resin laminate, the inner layer material was sprayed with a 0.1 weight ethyl alcohol solution of vinyltrichlorosilane. Thickness 0 on the top and bottom surfaces.
A laminate consisting of two 1ff glass cloth epoxy resin prepregs each with a 35 micron thick copper foil on the outermost layer was laminated at 40 Kq/d at 165°C for 60 minutes to form a 4-layer circuit printed wiring. Got the board.
比較例
実施例と同じ回路形成した内層材をブラッシングしてか
ら９０℃に加熱したアルカリ性亜塩素酸ナトリウム水溶
液に１０分間浸漬して回路銅に醸化第２銅皮膜を形成後
、その上下面に厚さ０．１龍のガラス布エポキシ樹脂プ
リプレグを夫々２枚づつ介した以外は実施例と同様に処
理して４層面路プリント配線板を得た。Comparative Example The same circuit-formed inner layer material as in the example was brushed and immersed in an alkaline sodium chlorite aqueous solution heated to 90°C for 10 minutes to form a cupric film on the circuit copper. A four-layer printed wiring board was obtained in the same manner as in the example except that two sheets of glass cloth epoxy resin prepreg each having a thickness of 0.1 mm were interposed.
実施例及び比較例のプリント配線板の性能は第１表のよ
うである。The performances of the printed wiring boards of Examples and Comparative Examples are shown in Table 1.
注 棗 穴あけ後、鍍金液処理後の水溶液のしみこみ。note Natsumi: Aqueous solution seeps in after drilling and plating solution treatment.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載したプリント配線板の製造方法によって得
られるプリント配線板は層間接着性及び耐ハロー性が向
上する効果がある。The present invention is constructed as described above. The printed wiring board obtained by the printed wiring board manufacturing method described in claim 1 has the effect of improving interlayer adhesion and halo resistance.
Claims (1)
理してから、内層材表面にプリプレグ層を介し最外層に
外層材を配設した積層体を積層成形し一体化することを
特徴とするプリント配線板の製造方法。(1) The circuit copper surface of the inner layer material is treated with a silane coupling agent, and then a laminate in which the outer layer material is disposed on the outermost layer with a prepreg layer interposed on the surface of the inner layer material is laminated and integrated. A method for manufacturing a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9834989A JPH02277294A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9834989A JPH02277294A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02277294A true JPH02277294A (en) | 1990-11-13 |
Family
ID=14217424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9834989A Pending JPH02277294A (en) | 1989-04-18 | 1989-04-18 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02277294A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147482A (en) * | 1993-11-24 | 1995-06-06 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| JPH07161867A (en) * | 1993-12-10 | 1995-06-23 | Nec Corp | Semiconductor package |
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
-
1989
- 1989-04-18 JP JP9834989A patent/JPH02277294A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147482A (en) * | 1993-11-24 | 1995-06-06 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| JPH07161867A (en) * | 1993-12-10 | 1995-06-23 | Nec Corp | Semiconductor package |
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
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