JPH0587386B2 - - Google Patents
Info
- Publication number
- JPH0587386B2 JPH0587386B2 JP61018352A JP1835286A JPH0587386B2 JP H0587386 B2 JPH0587386 B2 JP H0587386B2 JP 61018352 A JP61018352 A JP 61018352A JP 1835286 A JP1835286 A JP 1835286A JP H0587386 B2 JPH0587386 B2 JP H0587386B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- steel sheet
- resins
- chromate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000831 Steel Inorganic materials 0.000 claims description 16
- 239000010959 steel Substances 0.000 claims description 16
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 13
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 13
- 239000008397 galvanized steel Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 9
- 229910019142 PO4 Inorganic materials 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 7
- 239000010452 phosphate Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 19
- 238000011282 treatment Methods 0.000 description 11
- 229920000180 alkyd Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910000976 Electrical steel Inorganic materials 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010960 cold rolled steel Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005246 galvanizing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 epoxy ester resins Chemical class 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
〔産業上の利用分野〕
本発明は密着性にすぐれた金属ベース銅張積層
板の製造法に関する。
〔従来の技術〕
近年電機器の軽量、薄形、高密度化が進み、こ
れに使用される電子部品の高密度実装に伴い、単
位表面積あたりの発熱量は著るしく高まつてお
り、これら電子部品をとりつける配線基板も耐熱
性、放熱性にすぐれたものが要求されている。
かゝる要求を満足するものとして近年アルミ、
銅あるいは鉄等の金属板をベースにしたプリント
回路板が用いられるようになつてきた。
特に小型電子化モータあるいは回転数や位置検
出用回路を組込んだプリント回路板においては、
通常冷間圧延鋼板やさらに電磁特性のよい珪素鋼
板がベースに用いられている。
しかしながらこれらの鋼板は耐蝕性に劣つてお
り、特に夏期や多湿時に発錆し易いため、通常は
表面を亜鉛等のメツキを施し、さらに耐蝕性を向
上させるためクロメート処理またはリン酸塩処理
したものが市販されている。
〔発明が解決しようとする問題点〕
このような亜鉛メツキ鋼板を用い接着性絶縁層
を介して銅箔を積層した銅張積層板は、鋼板と絶
縁層との密着性が悪く、例えば長期寿命を確認す
るための高温加湿試験を行なうと、絶縁層が剥離
し易い。またプリント回路板作成時エツチング後
や洗浄後の乾燥が少しでも不十分だとハンダリフ
ローで膨れが発生し易いという問題があつた。
本発明はかゝる状況に鑑みなされたもので亜鉛
メツキ鋼板と絶縁層との密着性を改善した鋼板ベ
ース銅張積層板の製造法を提供せんとするもので
ある。
〔問題点を解決するための手段〕
かゝる目的は本発明によればクロメートまたは
リン酸塩処理された亜鉛メツキ鋼板の表面に、熱
硬化性樹脂の薄膜を形成し、この上に接着性絶縁
層を介して銅箔を積層することにより達せられ
る。
本発明に用いられる亜鉛メツキ鋼板は冷間圧延
鋼板、熱間圧延鋼板等の通常の鉄板、さらに電磁
特性の優れた珪素鋼板の表面に亜鉛または亜鉛を
主体とした台金または複合メツキさらに積層メツ
キ等を施した鋼板である。亜鉛の付着量は5〜70
g/m2が望ましく、5g/m2未満では耐食性の効
果はなく、70g/m2を越えるとプレスによる打抜
加工時に亜鉛メツキ層より剥離が生じ易くなる。
またこの上に施すクロメート処理とはクロム水和
酸化物等の被膜、リン酸塩処理とはリン酸亜鉛等
を主体とした被膜を形成するものである。これら
の処理を施すことにより耐蝕性が増すとともに樹
脂との密着性が向上する。
クロメート処理におけるクロム付着量は10〜
200mg/m2が適当であり、またリン酸塩処理の場
合は1〜5g/m2が望ましい。このクロメートま
たはリン酸塩処理の上に塗付される熱硬化性樹脂
としては、アルキツド樹脂、フエノールアルキツ
ド樹脂、アミノアルキツド樹脂、アクリル樹脂、
エポキシエステル樹脂等の水溶性高分化合物、ま
たはエポキシ樹脂フエノール樹脂、不飽和ポリエ
ステル樹脂等の非水溶性樹脂である。さらにクロ
メート皮膜の経時劣化を防止し、耐食性を向上さ
せるためにシリコン、チタン、あるいはアルミニ
ウム等の無機物を添加してもよい。
これら熱硬化性樹脂の塗布量としては0.1〜3
g/m2が望ましい。0.1g/m2未満では密着性、
耐食性の向上効果が小さく、また3g/m2以上で
は絶縁層との密着性が低下する。
本発明に用いる接着性絶縁層はエポキシ系樹
脂、フエノール系樹脂、不飽和ポリエステル系樹
脂、ポリイミド樹脂等で種々の硬化剤、顔料、無
機フイラー等を添加してもよい。
この絶縁層の形成はこれら樹脂を銅箔または上
記亜鉛メツキ鋼板に塗付するか、あるいはこれら
樹脂をガラス繊維、ポリエステル繊維紙等の基材
で補強した接着プレプレグシートにして、これら
樹脂を介して銅箔を積層し加熱加圧して積層板を
製造する。なお加熱加圧法としては通常積層プレ
スを使用するが、連続加圧スチールベルトやロー
ルプレスを用いてもよい。
以下本発明を実施例に基きさらに詳細に説明す
る。
実施例 1
板厚1mmのSPCCに亜鉛付着量20g/m2の亜鉛
メツキを施こした電気亜鉛メツキ鋼板(SECC)
に、CrO3/10g/、H3BO3 5g/、をベー
ス液とし、これに珪フツ化物を還元剤として添加
し、浴温50℃のクロメート液をスプレーしてCr
水和酸化物50m2/m2のクロメート処理を行ない乾
燥した。このクロメート処理面にアクリル変性ア
ルキツド樹脂にシリカゾルを分散させた水溶性高
分子化合物を水溶液をロールコータで塗付、乾燥
し500mg/m2の被膜を形成した。亜鉛メツキ鋼板
を作成した。また35μの銅箔のエポキシ系樹脂液
を塗付、乾燥し、80μの絶縁層付銅箔を作成し、
上記亜鉛メツキ鋼板に重ね合せ、30Kg/cm2、160
℃、2Hrの条件で加熱加圧成形して片面銅張積層
板を得た。
実施例 2
板厚0.5mmの珪素鋼板(JIS C2552−S18)に亜
鉛メツキ20g/m2を施した電気亜鉛メツキ珪素鋼
板を用い、実施例1と同様にして、クロメート処
理50mg/m2、アクリル変成アルキツド樹脂被膜
600mg/m2形成した鋼板を用い、片面銅張積層板
を得た。
実施例 3
板厚/mmのSPCCに亜鉛メツキ付着量20g/
m2、リン酸亜塩処理3g/m2施された市販の電気
亜鉛メツキ鋼板に、絶縁層と同じエポキシ系樹脂
溶液をロールコータで塗付乾燥し、800mg/m2の
形成し、実施例1と同様にして片面銅張積層板を
得た。
比較例 1
板厚1mmのSPCCに亜鉛メツキ付着量20g/
m2、クロメート処理25mg/m2施された市販の電気
亜鉛メツキ鋼板に有機高分子被膜を設けず直接実
施例1と同様にして片面銅張積層板を得た。
比較例 2
実施例3の亜鉛メツキ鋼板において絶縁層と同
じエポキシ系樹脂を5g/m2で塗布した亜鉛メツ
キ鋼板を用い実施例1と同様にして片面銅張積層
板を得た。
比較例 3
実施例1の亜鉛メツキ鋼板にクロメート又はリ
ン酸亜鉛処理を施さず亜鉛メツキの上に直接アク
リル変成アルキツド樹脂を800mg/m2形成した亜
鉛メツキ鋼板を用い、実施例1と同様にして片面
銅張積層板を得た。
比較例 4
比較例1の市販の電気亜鉛メツキ鋼板の片面を
#180のサンドペーパで表面粗化し、その上に実
施例1と同様にして絶縁層を介して銅箔を積層
し、片面銅張積層板を得た。
実施例1〜3、比較例1〜4で得られた銅張積
層板について以下の試験を行ない、その結果を表
−1に示す。
1.耐電圧:JIS C2110による(D.C)
2.ハンダ耐熱:300℃−1分(JIS C6481
に準拠):○:異常なし、
×:フクレ発生
3.PCT(プレツシヤークツカーテスト)
:121℃、2atmの蒸気雰囲気中
○:絶縁層剥離なし、
×:絶縁層剥離
4.煮沸2Hr:沸騰水中に2Hr浸漬
○:絶縁層剥離なし、
×:絶縁層剥離
5.耐指紋性:○:鋼板部を指で触れても
指紋跡が目立たない
×:鋼板部を指で触れると
指紋跡が残る。
6.塩水噴霧:35℃、5%濃度の塩水噴霧48Hr試
験
○:錆の発生なし、
×:錆の発生あり
注)ハンダ耐熱、PCT、煮沸試験は片面銅張積
層板の銅箔をエツチングにより除去した後試験を
行なつた。
[Industrial Application Field] The present invention relates to a method for manufacturing a metal-based copper-clad laminate with excellent adhesion. [Conventional technology] In recent years, electric devices have become lighter, thinner, and more dense, and the electronic components used in these devices have become more densely packaged. As a result, the amount of heat generated per unit surface area has increased significantly. The wiring boards on which electronic components are mounted are also required to have excellent heat resistance and heat dissipation. In recent years, aluminum,
Printed circuit boards based on metal plates such as copper or iron have come into use. Especially for printed circuit boards that incorporate small electronic motors or rotation speed and position detection circuits.
Cold-rolled steel plates and silicon steel plates with better electromagnetic properties are usually used for the base. However, these steel plates have poor corrosion resistance and are prone to rust, especially in summer or when it is humid. Therefore, the surface is usually plated with zinc, etc., and then treated with chromate or phosphate to further improve corrosion resistance. is commercially available. [Problems to be solved by the invention] Copper-clad laminates in which copper foil is laminated via an adhesive insulating layer using such galvanized steel sheets have poor adhesion between the steel sheet and the insulating layer, and, for example, have a long lifespan. When performing a high temperature humidification test to confirm this, the insulating layer tends to peel off. Furthermore, there is a problem in that if the drying after etching or cleaning is even slightly insufficient during the production of a printed circuit board, blisters are likely to occur during solder reflow. The present invention was made in view of the above situation, and it is an object of the present invention to provide a method for manufacturing a steel plate-based copper-clad laminate in which the adhesion between the galvanized steel plate and the insulating layer is improved. [Means for Solving the Problems] According to the present invention, the purpose is to form a thin film of thermosetting resin on the surface of a galvanized steel sheet that has been treated with chromate or phosphate, and to apply an adhesive layer thereon. This is achieved by laminating copper foil through an insulating layer. The galvanized steel sheets used in the present invention include ordinary steel sheets such as cold-rolled steel sheets and hot-rolled steel sheets, as well as silicon steel sheets with excellent electromagnetic properties, which are coated with zinc or a base metal or composite plating mainly composed of zinc, and further laminated plating. It is a steel plate that has been treated with The amount of zinc deposited is 5 to 70
g/m 2 is desirable; if it is less than 5 g/m 2 , there will be no corrosion resistance effect, and if it exceeds 70 g/m 2 , peeling will occur more easily than the galvanized layer during punching with a press.
Further, the chromate treatment applied thereto forms a film of hydrated chromium oxide, etc., and the phosphate treatment forms a film mainly composed of zinc phosphate or the like. These treatments increase corrosion resistance and improve adhesion to resin. The amount of chromium deposited in chromate treatment is 10~
200 mg/m 2 is suitable, and in the case of phosphate treatment, 1 to 5 g/m 2 is desirable. Thermosetting resins applied over this chromate or phosphate treatment include alkyd resins, phenolic alkyd resins, amino alkyd resins, acrylic resins,
These are water-soluble polymer compounds such as epoxy ester resins, or water-insoluble resins such as epoxy resins, phenolic resins, and unsaturated polyester resins. Furthermore, inorganic substances such as silicon, titanium, or aluminum may be added to prevent the chromate film from deteriorating over time and improve corrosion resistance. The coating amount of these thermosetting resins is 0.1 to 3
g/m 2 is desirable. Adhesion is less than 0.1g/ m2 ;
The effect of improving corrosion resistance is small, and if it exceeds 3 g/m 2 , the adhesion with the insulating layer decreases. The adhesive insulating layer used in the present invention is made of epoxy resin, phenolic resin, unsaturated polyester resin, polyimide resin, etc., and various hardening agents, pigments, inorganic fillers, etc. may be added thereto. This insulating layer can be formed by applying these resins to copper foil or the above-mentioned galvanized steel sheet, or by making these resins into adhesive prepreg sheets reinforced with a base material such as glass fiber or polyester fiber paper, and applying these resins through the resin. A laminate is produced by laminating copper foil and applying heat and pressure. As the heating and pressing method, a laminated press is usually used, but a continuous pressing steel belt or a roll press may also be used. The present invention will be explained in more detail below based on examples. Example 1 Electrolytic galvanized steel sheet (SECC) made of SPCC with a thickness of 1 mm and galvanized with a zinc coating amount of 20 g/m 2
Then, CrO 3 /10g/, H 3 BO 3 5g/, were used as a base liquid, silicate was added as a reducing agent, and a chromate solution at a bath temperature of 50°C was sprayed to reduce Cr.
The hydrated oxide was subjected to chromate treatment of 50 m 2 /m 2 and dried. An aqueous solution of a water-soluble polymer compound prepared by dispersing silica sol in an acrylic modified alkyd resin was applied to the chromate-treated surface using a roll coater, and dried to form a film of 500 mg/m 2 . A galvanized steel plate was created. In addition, epoxy resin liquid of 35μ copper foil was applied and dried to create a copper foil with an 80μ insulating layer.
Overlaid on the above galvanized steel plate, 30Kg/cm 2 , 160
A single-sided copper-clad laminate was obtained by heat-pressing molding at ℃ for 2 hours. Example 2 An electrogalvanized silicon steel plate (JIS C2552-S18) with a thickness of 0.5 mm and galvanized at 20 g/m 2 was used in the same manner as in Example 1, but chromate treatment was applied at 50 mg/m 2 and acrylic was applied. Modified alkyd resin coating
A single-sided copper-clad laminate was obtained using a steel plate formed at 600 mg/m 2 . Example 3 Galvanizing amount 20g/mm on SPCC plate thickness/mm
m 2 , the same epoxy resin solution as the insulating layer was applied with a roll coater to a commercially available electrogalvanized steel sheet that had been subjected to subsalt phosphate treatment at 3 g/m 2 and dried to form a layer of 800 mg/m 2 . A single-sided copper-clad laminate was obtained in the same manner as in 1. Comparative example 1 Galvanizing amount 20g/1mm plate thickness SPCC
A single - sided copper-clad laminate was obtained directly in the same manner as in Example 1 without providing an organic polymer coating on a commercially available electrogalvanized steel sheet that had been subjected to a chromate treatment of 25 mg/m 2 . Comparative Example 2 A single-sided copper-clad laminate was obtained in the same manner as in Example 1 using a galvanized steel sheet coated with the same epoxy resin as the insulating layer at 5 g/m 2 in the galvanized steel sheet of Example 3. Comparative Example 3 The galvanized steel sheet of Example 1 was treated in the same manner as in Example 1, using a galvanized steel sheet in which 800 mg/m 2 of acrylic modified alkyd resin was directly formed on the galvanized surface without chromate or zinc phosphate treatment. A single-sided copper-clad laminate was obtained. Comparative Example 4 One side of the commercially available electrogalvanized steel sheet of Comparative Example 1 was surface roughened with #180 sandpaper, and copper foil was laminated thereon via an insulating layer in the same manner as in Example 1, resulting in single-sided copper clad lamination. Got the board. The following tests were conducted on the copper-clad laminates obtained in Examples 1 to 3 and Comparative Examples 1 to 4, and the results are shown in Table 1. 1. Withstanding voltage: According to JIS C2110 (DC) 2. Soldering heat resistance: 300℃ - 1 minute (according to JIS C6481): ○: No abnormality, ×: Blistering 3. PCT (pressure vacuum test): 121 ℃, in a steam atmosphere at 2 atm ○: No peeling of the insulation layer, ×: Peeling of the insulation layer 4. Boiling for 2 hours: Immersed in boiling water for 2 hours ○: No peeling of the insulation layer, ×: Peeling of the insulation layer 5. Fingerprint resistance: ○: Steel plate Fingerprint marks are not noticeable even when you touch the steel plate part with your finger ×: Fingerprint marks remain when you touch the steel plate part with your finger. 6. Salt water spray: 35℃, 5% concentration salt water spray test for 48 hours ○: No rust, ×: Rust occurred Note) Solder heat resistance, PCT, and boiling tests were performed by etching the copper foil of a single-sided copper-clad laminate. Tests were conducted after removal.
表−1に示す結果からも明らかなように本発明
によれば、耐電圧特性、ハンダ耐熱性並びに絶縁
層の密着性にすぐれた鋼板ベース銅張積層板を提
供することが可能になつた。
As is clear from the results shown in Table 1, according to the present invention, it has become possible to provide a steel plate-based copper-clad laminate with excellent voltage resistance, solder heat resistance, and insulating layer adhesion.
Claims (1)
ツキ鋼板の表面に、0.1〜3g/m2の割合で熱硬
化性樹脂を適用することにより、厚みが0.1〜
2.5μmである薄膜を形成し、この上に接着性絶縁
層を介して銅箔を積層することを特徴とする鋼板
ベース銅張積層板の製造法。1 By applying a thermosetting resin at a rate of 0.1 to 3 g/ m2 to the surface of a chromate or phosphate treated galvanized steel sheet, the thickness is reduced to 0.1 to 3 g/m2.
A method for producing a steel sheet-based copper-clad laminate, which is characterized by forming a thin film of 2.5 μm and laminating copper foil on top of the thin film through an adhesive insulating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1835286A JPS62176836A (en) | 1986-01-30 | 1986-01-30 | Manufacture of steel-plate base copper-lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1835286A JPS62176836A (en) | 1986-01-30 | 1986-01-30 | Manufacture of steel-plate base copper-lined laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62176836A JPS62176836A (en) | 1987-08-03 |
JPH0587386B2 true JPH0587386B2 (en) | 1993-12-16 |
Family
ID=11969283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1835286A Granted JPS62176836A (en) | 1986-01-30 | 1986-01-30 | Manufacture of steel-plate base copper-lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62176836A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0247052A (en) * | 1988-08-09 | 1990-02-16 | Nippon Steel Corp | Sheet suitable for iron based printed board |
JPH03133633A (en) * | 1989-10-20 | 1991-06-06 | Nippon Steel Corp | Steel sheet suitable for iron-based printed board |
JPH0645903B2 (en) * | 1989-12-06 | 1994-06-15 | 新日本製鐵株式会社 | Steel plate for printed circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034842A (en) * | 1983-08-05 | 1985-02-22 | 住友ベークライト株式会社 | Metallic base copper lined plate |
JPS61271890A (en) * | 1985-05-27 | 1986-12-02 | 株式会社神戸製鋼所 | Substrate for formation of electric circuit |
-
1986
- 1986-01-30 JP JP1835286A patent/JPS62176836A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034842A (en) * | 1983-08-05 | 1985-02-22 | 住友ベークライト株式会社 | Metallic base copper lined plate |
JPS61271890A (en) * | 1985-05-27 | 1986-12-02 | 株式会社神戸製鋼所 | Substrate for formation of electric circuit |
Also Published As
Publication number | Publication date |
---|---|
JPS62176836A (en) | 1987-08-03 |
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