JPS62176837A - Manufacture of metallic-base copper-lined laminated board - Google Patents
Manufacture of metallic-base copper-lined laminated boardInfo
- Publication number
- JPS62176837A JPS62176837A JP1835186A JP1835186A JPS62176837A JP S62176837 A JPS62176837 A JP S62176837A JP 1835186 A JP1835186 A JP 1835186A JP 1835186 A JP1835186 A JP 1835186A JP S62176837 A JPS62176837 A JP S62176837A
- Authority
- JP
- Japan
- Prior art keywords
- chromate
- copper
- treatment
- steel
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910000680 Aluminized steel Inorganic materials 0.000 claims description 8
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000007739 conversion coating Methods 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- WMYWOWFOOVUPFY-UHFFFAOYSA-L dihydroxy(dioxo)chromium;phosphoric acid Chemical compound OP(O)(O)=O.O[Cr](O)(=O)=O WMYWOWFOOVUPFY-UHFFFAOYSA-L 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 description 14
- 239000010959 steel Substances 0.000 description 14
- 229910052725 zinc Inorganic materials 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000008397 galvanized steel Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 238000007744 chromate conversion coating Methods 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 description 1
- 241000272201 Columbiformes Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は密着性にすぐれた金属ベース鋼張積層板の製造
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a metal-based steel-clad laminate with excellent adhesion.
近年電子機器の軽量、薄形、高密度化が進み、これに使
用される電子部品の高密度実装に伴い、単位表面積あた
りの発熱11は老るしく高まっており、これら電子部品
をとりつける配線基板も耐熱性、放熱性にすぐれたもの
7514J求されている。In recent years, electronic devices have become lighter, thinner, and more dense, and as the electronic components used in these devices have become more densely mounted, the amount of heat generated per unit surface area11 has been steadily increasing. 7514J with excellent heat resistance and heat dissipation is also in demand.
かへる要求を満足するものとして近年アルミ。In recent years, aluminum has been used as a material that satisfies the demand for lightness.
銅あるいは鉄等の金属板をベースにしたプリント回路板
が用いられるようになってきた。Printed circuit boards based on metal plates such as copper or iron have come into use.
特に小型電子化モータある−は回転数や位置検出用回路
を組込んだプリント回路板にお−ては、通常冷間圧延鋼
板やさらに電a%性のよい珪素鋼板がベースに用いられ
ている。In particular, for small electronic motors, printed circuit boards incorporating rotation speed and position detection circuits are usually made of cold-rolled steel sheets or silicon steel sheets with good electric a% properties. .
しかしながらこれらの鋼板は耐蝕性に劣っておシ、特に
夏期や多湿時に発錆し易いため、通常は表面を亜鉛ある
いはアルミニウムをメッキし亜鉛メッキ鋼板あるいはア
ルミメッキ鋼板として市販されている。亜鉛メッキ鋼板
はさらに白錆防止を目的に塗付型のクロメート処理した
ものや塗料との密着性を、L (するためにリン酸塩皮
膜を施したものイ、ン)る。However, these steel plates have poor corrosion resistance and are susceptible to rust, especially in summer or high humidity, so their surfaces are usually plated with zinc or aluminum and sold as galvanized steel plates or aluminized steel plates. Galvanized steel sheets are also coated with chromate treatment to prevent white rust, and those coated with a phosphate film to improve adhesion to paint.
これらの亜鉛メッキ鋼板をプリント回路板のベースとし
て用いるにあたり、亜鉛メッキの表面に塗付型のクロメ
ート処mt−施した亜鉛メッ中鋼板にあっては絶縁層と
の密着性が悪く、特に耐湿耐熱試験、例えばPCT(プ
レッシャークツカーテスト)や水中に浸漬すると絶縁層
が金属板よシ剥離し易い。またリン酸塩被膜を形成した
亜鉛メッキ鋼板の場合には絶縁層との密着性は良好であ
るが、キズがつき易く前記塗付型のクロメート処理した
ものより耐蝕性に劣っており錆が発生し易い。When using these galvanized steel sheets as a base for printed circuit boards, the galvanized steel sheets, which have been subjected to paint-type chromate treatment on the galvanized surface, have poor adhesion with the insulating layer, and are particularly difficult to resist moisture and heat. When subjected to tests such as PCT (Pressure Test) or immersion in water, the insulating layer tends to peel off from the metal plate. In addition, galvanized steel sheets with a phosphate coating have good adhesion to the insulating layer, but they are easily scratched and are less corrosion resistant than the paint-on chromate-treated ones, resulting in rust. Easy to do.
fたアルミメッキ鋼板を用いる場合も金属板と絶縁層の
密着性が悪く剥離やノ%ンダ膨れなどの問題がありた。Even when an aluminized steel plate is used, there are problems such as poor adhesion between the metal plate and the insulating layer, such as peeling and swelling.
本発明はか〜る状況に鑑みなされたもので、メッキ鋼板
と絶縁層との密着往管改善した金属ベース銅張積膚板の
製造法を提供するものである。The present invention was made in view of the above situation, and provides a method for manufacturing a metal-based copper-clad laminate board in which the close contact between the plated steel sheet and the insulating layer is improved.
C問題点を解決するための手段〕
か〜る目的は本発明によれば亜鉛メッキまたはアルミメ
ッキ鋼板の表面にクロム酸塩系もしくはクロム酸−リン
酸塩系の化成被膜剤でクロメート被at形成し、これを
除去することなくその上に接着性絶縁層を介して銅箔を
積ノーすることにより達せられる。Means for Solving Problem C] According to the present invention, the object is to form a chromate coating on the surface of a galvanized or aluminized steel sheet using a chromate-based or chromic acid-phosphate-based conversion coating agent. This is achieved by depositing a copper foil on top of it via an adhesive insulating layer without removing it.
本発明に用いられる亜鉛メッキ鋼板とは、冷間圧延fl
!48i、 !A間圧延銅板等の通常の鉄板、さらに電
磁特性の優れた珪素銅板の表面に亜鉛または亜鉛を主体
としだ付会または顎付メッキさらに積層メッキ等を施し
た銅板である。この亜鉛メッキの上にさらに耐食性を向
上させるため塗布型のクロメート処理又はリン酸塩処理
か施されていてもよい。The galvanized steel sheet used in the present invention is cold rolled fl
! 48i! These are ordinary iron plates such as A-rolled copper plates, as well as silicon copper plates with excellent electromagnetic properties, and are coated with zinc or zinc as a main component, and plated or barbed, and laminated. On top of this zinc plating, a coating type chromate treatment or phosphate treatment may be applied to further improve corrosion resistance.
アルミメッキ鋼板とは上述の通常の鉄板にアルミニウム
を主体としれ付会又は顎付メッキ等を施した鋼板である
。An aluminized steel plate is a steel plate that is made of aluminum and is plated with chamfers or jaws on the above-mentioned ordinary iron plate.
上述の亜鉛またはアルミメッキ鋼板の表面に施すクロム
酸塩系またはりΩム酸−リン酸塩系の化成被膜処理とは
一般にアルミニウムの表面処理に用いられるアロジン法
といわれるもので、CrOs/F″″系、CrOs/F
″’/CN−系、PO”;/ Cr03/F−系等があ
る。The above-mentioned chromate-based or aluminum acid-phosphate-based chemical conversion coating treatment applied to the surface of zinc or aluminized steel sheets is called the alodine method, which is generally used for aluminum surface treatment, and is CrOs/F''. ” series, CrOs/F
There are "''/CN- series, PO";/Cr03/F- series, etc.
クロメート処理条件は公知の処理条件で行なえばよく、
例えばP Q3.−/ Cro 3/F−系では、P□
S、−が20−100g/j、rが2−6g/l。The chromate treatment may be carried out under known treatment conditions.
For example, P Q3. -/Cro 3/F- system, P□
S, - is 20-100 g/j, r is 2-6 g/l.
CrOs が6〜20 g/l、処理条件としては20
へ60℃で1S−5分処理すればよい。処理後は直ちに
水洗し乾燥することによりりΩメートの化成被11#を
形成することができる。CrOs is 6-20 g/l, treatment conditions are 20
What is necessary is just to process at 60 degreeC for 1S-5 minutes. Immediately after the treatment, it is washed with water and dried to form a conversion coating 11# of Ωmate.
なお、化成被膜処理を行なう前に脱脂することが望まし
い。脱脂液とし゛てはアルカリ系、トリクレンやフレオ
ン等の溶剤タイプか適している。Note that it is desirable to degrease before performing the chemical conversion coating treatment. Suitable degreasing liquids are alkaline and solvent types such as trichlene and freon.
本発明で用いる接層性絶縁層はエポキシ系樹脂、フェノ
ール系樹脂、不飽和ポリエステル系樹脂、ポリイミド系
樹脂等の樹脂である。これらの樹脂に種々の硬化剤、ゴ
ム、顔料、カップリング剤等を添加してもよい上記樹脂
の溶液を銅箔または上記処理を施した鋼板に血性するか
、あるいはこれら樹脂をカラス繊維、ポリエステル繊維
、紙等の基材で補強した接着プリプレグシートにして、
これら樹脂を介して銅箔を積層し加熱加圧して積層板を
製造する。なお加圧法としでは通常積層プレスを使用す
るが、連続加圧スチールベルトやロールプレスを用いて
も工い。The contact insulating layer used in the present invention is made of resin such as epoxy resin, phenol resin, unsaturated polyester resin, or polyimide resin. Various curing agents, rubbers, pigments, coupling agents, etc. may be added to these resins. A solution of the above resins may be applied to copper foil or a steel plate that has undergone the above treatment, or these resins may be mixed with glass fibers or polyester. Made of adhesive prepreg sheets reinforced with base materials such as fibers and paper,
Copper foils are laminated via these resins and heated and pressed to produce a laminate. Note that a laminated press is usually used as the pressing method, but a continuous pressing steel belt or roll press may also be used.
以下本発明を実施例に基き詳細に説明する。The present invention will be explained in detail below based on examples.
実施?IJは片面に鋼箔を接着した例を示したが、両面
に接着してもよい。implementation? Although IJ has shown an example in which steel foil is bonded to one side, it may be bonded to both sides.
〔実施例1〕
板厚1闘の5pccに亜鉛付S量20g/醪の亜鉛メッ
キを施した市販の電気亜鉛メッキ鋼板(SECC)を脱
脂処理を施した後、PO!″″:CrO3:F−: 8
20が40:10:50:1000(重量比)の比率の
りン1−クロム酸塩系の処理間に浸し処理した。処理条
件は50℃で1分間行なった。その後直ちに水洗し、8
0℃で乾燥を行ない、クロメート反映を形成した。また
65μの銅箔にエポキシ系樹脂を塗付、乾燥し、80μ
の絶縁層付銅箔を作成し、上記クロメート被膜付亜鉛メ
ッキ鋼板に重ね台せ、30kg/an’、160℃、2
Hrの条件で加熱加圧酸形して片面銅張積鳩板を得た。[Example 1] After degreasing a commercially available electrogalvanized steel sheet (SECC), which is a 5 pcc plate with a thickness of 1 mm and galvanized with a zinc-coated S amount of 20 g/mold, PO! ″″:CrO3:F-: 8
20 was immersed in the phosphorus 1-chromate system in a ratio of 40:10:50:1000 (weight ratio). The processing conditions were 50° C. for 1 minute. After that, immediately wash with water,
Drying was carried out at 0°C to form a chromate reflection. In addition, epoxy resin was applied to 65μ copper foil, dried, and 80μ
A copper foil with an insulating layer of
A single-sided copper-clad laminated pigeon board was obtained by heating and pressurizing the product in an acid form under the conditions of Hr.
〔実施例2〕
板厚l mmの5PCCに亜鉛付着1120g/rrf
とその上にクロメート処理25fQg/m”施されてい
る市販の電気亜鉛メッキ鋼板を脱脂処理を行なった後、
市販のクロム酸塩系の化成被膜剤(アロジン1000:
日本ペイント■)0.075%水溶液中に浸しクロメー
ト処理を行なった。[Example 2] Zinc adhesion 1120 g/rrf on 5PCC with plate thickness 1 mm
After degreasing a commercially available electrogalvanized steel sheet that has been subjected to a chromate treatment of 25 fQg/m,
Commercially available chromate-based conversion coating agent (Alodin 1000:
Nippon Paint ■) 0.075% aqueous solution for chromate treatment.
処理条件は50℃で40秒間であった。その後直ちに水
洗し、80℃で乾燥を行ないクロメート被膜を形成した
。この鋼板を用い実施例1と同様にして片面銅張積層板
を得た。The treatment conditions were 50°C for 40 seconds. Thereafter, it was immediately washed with water and dried at 80°C to form a chromate film. Using this steel plate, a single-sided copper-clad laminate was obtained in the same manner as in Example 1.
〔実施例3〕
板厚o、 s mmの珪素鋼板に亜鉛付着量20g/岬
とその上にリン酸亜鉛処l/A5g/rrf施されてい
る市販の電気亜鉛メッキ珪素銅板に脱脂処理を行なった
後、実施例2と同様にしてクロメート処理を行ない、実
施例1と同様にして片面鋼張積層板を得た。[Example 3] Degreasing was carried out on a commercially available electrogalvanized silicon copper plate, which had a zinc coating amount of 20 g/misaki on a silicon steel plate with a thickness of o, s mm, and a zinc phosphate treatment l/A5 g/rrf applied thereon. After that, chromate treatment was performed in the same manner as in Example 2, and a single-sided steel-clad laminate was obtained in the same manner as in Example 1.
〔実施例4〕
板厚1mnの市販のアルミメッキ鋼板に脱脂処理を行な
った後、市販のクロム酸塩系の化成被膜剤(アロジン#
1000 ) 0.1%水浴液中に浸しクロメート処
理を行なった。処理条件は50℃で1分間でありだ。そ
の後直ちに水洗し、80℃で乾燥を行ない、クロメート
被膜を形成し、実施例1と同様にして片面銅張積層板を
得た。[Example 4] After degreasing a commercially available aluminized steel plate with a thickness of 1 mm, a commercially available chromate-based conversion coating agent (Alodine #
1000) Chromate treatment was performed by immersing it in a 0.1% water bath solution. The treatment conditions were 50°C for 1 minute. Immediately thereafter, it was washed with water and dried at 80°C to form a chromate film, and a single-sided copper-clad laminate was obtained in the same manner as in Example 1.
〔比較例1〕
実施例2で用いた市販の電気亜鉛メッキ鋼板に、クロメ
ートの化成被膜処理を施さず、脱脂後直接実施例1と同
様にして片面鋼張積層板を作成した。[Comparative Example 1] The commercially available electrogalvanized steel sheet used in Example 2 was degreased without being subjected to chromate conversion coating treatment, and then a single-sided steel clad laminate was produced in the same manner as in Example 1.
〔比較例2〕
実施例3で用いた市販の電気亜鉛メッキ銅板に、クロメ
ートの化成被膜処理を施さず直接実施例1と同様にして
片面銅張積層板を得た。[Comparative Example 2] A single-sided copper-clad laminate was obtained directly from the commercially available electrogalvanized copper plate used in Example 3 in the same manner as in Example 1 without applying the chromate conversion coating treatment.
〔比較例3〕
実施f!14で用いた市販のアルミメッキ鋼板に、クロ
メートの化成被膜処理を施さず直接実施例1と同様にし
て片面鋼張積層板を得た。[Comparative Example 3] Implementation f! A single-sided steel clad laminate was obtained directly from the commercially available aluminized steel plate used in Example 14 in the same manner as in Example 1 without applying the chromate conversion coating treatment.
〔比較例4〕
実施例2で用いた市販の電気亜鉛メッキ鋼板の片面’に
#:180のサンドペーパで表面粗化し、その上に実施
例1と同様にして片面鋼張積層板を得た。[Comparative Example 4] One side of the commercially available electrogalvanized steel sheet used in Example 2 was roughened with #180 sandpaper, and a single-sided steel clad laminate was obtained in the same manner as in Example 1.
実施例1〜4、比較例1〜4で得られた銅張積層板につ
いて次の試験を行ない、その結果を表−1に示す。The following tests were conducted on the copper-clad laminates obtained in Examples 1 to 4 and Comparative Examples 1 to 4, and the results are shown in Table 1.
(1)耐電圧:JIS C2110による( D、C
,)(2)ハンダ耐熱:JIS C6451に準拠。(1) Withstand voltage: According to JIS C2110 (D, C
, ) (2) Solder heat resistance: Compliant with JIS C6451.
500℃−1分で評価
O:異常なし、×:フクレ発生
(37PCT(プレッシャークツカーテスト):121
℃、2atmの蒸気雰囲気
中
O:絶縁層剥離なし、×:絶縁
層剥離
(4)煮沸試験:沸騰水中に浸漬
○:絶縁層剥離なし、×:絶縁
層剥離
(支)(2)〜(4)の試験は片面銅張積層板の銅箔を
エツチングにより除去した後、試験を行なった。Evaluation at 500°C for 1 minute: O: No abnormality, ×: Blistering (37 PCT (pressure shoe test): 121
°C, in a steam atmosphere of 2 atm O: No peeling of the insulation layer, ×: Peeling of the insulation layer (4) Boiling test: Immersion in boiling water ○: No peeling of the insulation layer, ×: Peeling of the insulation layer (support) (2) to (4) ) The test was conducted after removing the copper foil from the single-sided copper-clad laminate by etching.
以下余白
〔発明の名称〕
表−1に示す結果からも明らかなように本発明圧よれば
耐電圧特性、ノ・ンダ耐熱特性に優れ、かつ絶縁層の密
着性にすぐれた金属ペース銅張積層板を提供することが
可能になった。Blank space below [Name of the invention] As is clear from the results shown in Table 1, the pressure of the present invention is a metal-based copper-clad laminate that has excellent voltage resistance and heat resistance, as well as excellent adhesion of the insulating layer. It is now possible to provide boards.
Claims (1)
、クロム酸塩系またはクロム酸−リン酸塩系の化成皮膜
剤でクロメート皮膜を形成し、この上に接着性絶縁層を
介して銅箔を積層することを特徴とする金属ベース銅張
積層板の製造法。1. A chromate film is formed on the surface of a galvanized or aluminized steel plate using a chromate-based or chromic acid-phosphate-based chemical conversion coating agent, and a copper foil is placed on top of this through an adhesive insulating layer. A method for manufacturing a metal-based copper-clad laminate characterized by lamination.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1835186A JPS62176837A (en) | 1986-01-30 | 1986-01-30 | Manufacture of metallic-base copper-lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1835186A JPS62176837A (en) | 1986-01-30 | 1986-01-30 | Manufacture of metallic-base copper-lined laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62176837A true JPS62176837A (en) | 1987-08-03 |
Family
ID=11969251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1835186A Pending JPS62176837A (en) | 1986-01-30 | 1986-01-30 | Manufacture of metallic-base copper-lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62176837A (en) |
-
1986
- 1986-01-30 JP JP1835186A patent/JPS62176837A/en active Pending
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