JPS62176836A - Manufacture of steel-plate base copper-lined laminated board - Google Patents
Manufacture of steel-plate base copper-lined laminated boardInfo
- Publication number
- JPS62176836A JPS62176836A JP1835286A JP1835286A JPS62176836A JP S62176836 A JPS62176836 A JP S62176836A JP 1835286 A JP1835286 A JP 1835286A JP 1835286 A JP1835286 A JP 1835286A JP S62176836 A JPS62176836 A JP S62176836A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- steel
- resin
- manufacture
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 16
- 239000010959 steel Substances 0.000 claims description 16
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 11
- 239000008397 galvanized steel Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 7
- 229910019142 PO4 Inorganic materials 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 5
- 239000010452 phosphate Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 2
- 238000011282 treatment Methods 0.000 description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 229920000180 alkyd Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910000976 Electrical steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 3
- 229910000165 zinc phosphate Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000982822 Ficus obtusifolia Species 0.000 description 1
- 241000238413 Octopus Species 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は密着性にすぐれた全域ベース銅張積層板の製造
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a full-area base copper clad laminate with excellent adhesion.
近年電子機器の補槽、薄形、i%密度化が進み、これに
使用される電子部品の高密度実装に伴い、単位表面揖あ
たりの発熱量は著るしく烏まってお夕、これら電子部品
をとりつける配線基板も耐熱性、放熱性にすぐれたもの
が要求されている。In recent years, the auxiliary tanks of electronic devices have become thinner and more dense, and the electronic components used in these devices have become more densely packaged. The wiring boards on which components are attached are also required to have excellent heat resistance and heat dissipation.
かへる要求を満足するものとして近年アルミ、銅あるい
は鉄等の金属板をベースにしたプリント回路板が用いら
れるようになってきた。In recent years, printed circuit boards based on metal plates such as aluminum, copper, or iron have come to be used to meet the demands for increased storage capacity.
特に小型電子化モータあるいは回転数や位置検出用回路
を組込んだプリント回路板においては、通常冷間圧延銅
板やさらにta特性のよい珪素鋼板がベースに用いられ
ている。In particular, in printed circuit boards incorporating small-sized electronic motors or circuits for detecting rotational speed and position, cold-rolled copper plates or silicon steel plates with good ta characteristics are usually used as the base.
しかしながらこれらの鋼板は耐蝕性に劣っており、特に
夏期や多湿時に発錆し易いため、通常は表面を亜鉛等の
メッキを施し、さらに耐蝕性を向上させるためクロメー
ト処理またはリン酸塩処理したものが市販されている。However, these steel plates have poor corrosion resistance and are prone to rust, especially in summer and high humidity, so they are usually plated with zinc or other metal, and then treated with chromate or phosphate to further improve corrosion resistance. is commercially available.
このような亜鉛メッキ鋼板を用い接着性絶縁層を介して
銅箔を積層した銅VR積層板に、鋼板と絶縁層との密着
性が悪く、例えは長期寿命を確認するための高温加湿試
験を行なうと、絶縁層が剥離し易い。牙だプリント回路
板作成時エツチング後や洗浄後の乾燥が少しでも不十分
だとハンダIJ 7 o−で膨れか発生し易いという問
題があった。Copper VR laminates made of galvanized steel sheets laminated with copper foil via an adhesive insulating layer have poor adhesion between the steel sheet and the insulating layer, so for example, high-temperature humidification tests are required to confirm long-term lifespan. If this is done, the insulating layer is likely to peel off. There is a problem in that if the drying after etching or cleaning is even slightly insufficient when producing a printed circuit board, the solder IJ7O- tends to swell.
本発明はか〜る状況に鑑みたさjしたもので亜鉛メッキ
鋼板と絶縁層との密着性を改善した鋼鈑ベース銅張積層
叛の製造法を提供せんとするものである。The present invention was devised in view of the above circumstances, and it is an object of the present invention to provide a method of manufacturing a steel sheet-based copper-clad laminate that improves the adhesion between the galvanized steel sheet and the insulating layer.
か〜る目的Vゴ不発明によればクロメートfたはリン酸
塩処理された亜鉛メッキ鋼板の表面に、熱硅化!l:樹
脂の薄腰を形成し、この上に接層性絶縁層を介して鋼箔
を積層することによシ違せられる。According to the invention, the surface of galvanized steel sheets treated with chromates or phosphates is thermally silicified! 1: This is achieved by forming a thin resin layer and laminating a steel foil on top of it with a contact insulating layer interposed therebetween.
本発明に用いられる亜鉛メクキ峻板は冷間圧延m版、熱
間圧延鋼板等の通常の鉄板、さらに電磁特性の優れた珪
素鋼板の表面に亜鉛または亜鉛を主体とした合金fたは
シ付メッキさらに積層メッキ等を施した鋼板である。亜
鉛の付層Mkl 5= 70 g/m’が望ましく、5
g/rrf未満では耐食性の効果はな(,70g/m”
を越えるとプレスによる打抜加工時に亜鉛メツ中層より
剥離が生じ易くなる。筐たこの上に施すクロメート処理
とはクロム水和酸化物等の被膜、リン酸塩処理とはリン
酸亜鉛等を主体とした被膜を形成するものである。これ
らの処理を施すことにより耐蝕性が増すとともに樹脂と
の密着性が向上する。The galvanized steel plates used in the present invention are cold-rolled m-plates, hot-rolled steel plates, and other ordinary iron plates, as well as silicon steel plates with excellent electromagnetic properties, which have zinc or zinc-based alloys on their surfaces. This is a steel plate that has been plated and laminated. Zinc coating Mkl 5 = 70 g/m' is desirable, 5
There is no corrosion resistance effect below g/rrf (70 g/m"
If it exceeds this value, peeling will occur more easily than in the zinc metal middle layer during punching using a press. The chromate treatment applied to the housing octopus forms a film made of hydrated chromium oxide, and the phosphate treatment forms a film mainly made of zinc phosphate. These treatments increase corrosion resistance and improve adhesion to resin.
クロメート処理におけるクロム付N量は10〜200■
/mが適当であり、またリン酸塩処理のs会は1へ5g
/rrlが望fしい。このクロメートまたはリン酸塩処
理の上に塗付される熱硬化性樹脂としては、アルキッド
樹脂、フェノールアルキッド樹脂、アミノアルキッド樹
脂、アクリル樹脂、エポキシエステ/L−樹脂等の水浴
性高分子化合物、fたはエポキシ樹脂フェノール樹脂、
不飽和ポリエステルミ4脂等の非水浴性樹脂である。さ
らにりaメート皮膜の経時劣化を防止し、耐食性を向上
させるためにシリコン、チタン、あるいはアルミニウム
等の類機vlJを添加してもよい。The amount of chromium-attached N in chromate treatment is 10 to 200■
/m is appropriate, and the s group of phosphate treatment is 1 to 5g.
/rrl is preferable. The thermosetting resin applied on this chromate or phosphate treatment includes water-bathable polymer compounds such as alkyd resin, phenol alkyd resin, amino alkyd resin, acrylic resin, epoxyester/L-resin, etc. or epoxy resin phenolic resin,
It is a non-water bathable resin such as unsaturated polyester resin. Further, silicon, titanium, aluminum, or similar materials may be added to prevent the amate film from deteriorating over time and improve corrosion resistance.
これら熱硬化性樹脂の塗布量としてはα1〜5g/rr
fが望ましい。Q1g/び未満では密着性、耐食性の向
上効果が小さく、また3g/rrf以上でに絶R層との
密着性が低下する。The coating amount of these thermosetting resins is α1 to 5 g/rr.
f is desirable. If Q is less than 1 g/rrf, the effect of improving adhesion and corrosion resistance will be small, and if it is more than 3 g/rrf, the adhesion with the absolute R layer will decrease.
本発明に用いる接層性絶縁/!#はエポキシ系樹脂、フ
ェノール系樹脂、不飽和ポリエステル系側In!、ポリ
イミド樹脂等で棟々の硬化剤、顔料、無機ンイラー等を
伶加してもよい。Contact insulation used in the present invention/! # indicates epoxy resin, phenolic resin, unsaturated polyester side In! , polyimide resin, etc. may be added with various curing agents, pigments, inorganic fillers, etc.
この絶縁層の形成はこれら樹脂を銅箔または上記亜鉛メ
ッキ鋼板に塗付するか、あるいをヱこれら樹脂をガラス
繊維、ポリエステル繊維紙等の基材で補強した接着プレ
プレグシートにして、こ扛ら樹脂を介して銅箔を積層し
加熱加圧して積層板を製造する。なお加熱加圧法として
は通常積層プレスを使用するが、連続加圧スチールベル
トやロールプレスを用いてもよい。This insulating layer can be formed by applying these resins to copper foil or the above-mentioned galvanized steel sheet, or by making these resins into adhesive prepreg sheets reinforced with a base material such as glass fiber or polyester fiber paper. A laminate is produced by laminating copper foil through a resin and applying heat and pressure. As the heating and pressing method, a laminated press is usually used, but a continuous pressing steel belt or a roll press may also be used.
以下本発明を実施例に基きさらに詳細に説明する。The present invention will be explained in more detail below based on examples.
〔実施例1〕
板# l ff1mの5pccに亜鉛付W童20g/n
fの亜鉛メッキを施こした電気亜鉛メッキ鋼板(SEC
CJに、Crys/ I Q g/ 1. HsBOs
5 g/l、をベース液とし、これに珪7ツ化物を還
元剤として添加し、浴温50℃のクロメート液をスプレ
ーしてCr水水和化化物50d/rrlクロメート処理
を行ない乾燥した。このクロメート処理面にアクリル変
性アルキッド樹脂にシリカゾルを分散させた水溶性高分
子化合物を水浴液をロールコータで塗付、乾燥し500
ff1g/扉の被膜を形成した。亜鉛メッキ鋼板を作成
した。[Example 1] Plate #l ff1m 5pcc with zinc 20g/n
Electrogalvanized steel sheet (SEC
To CJ, Crys/I Q g/1. HsBOs
5 g/l was used as a base liquid, to which silicate heptadide was added as a reducing agent, and a chromate solution having a bath temperature of 50°C was sprayed to perform chromate treatment of 50 d/rrl of Cr water hydrate, followed by drying. A water-soluble polymer compound made by dispersing silica sol in acrylic-modified alkyd resin was applied to this chromate-treated surface using a water bath solution, and dried for 500 min.
A coating of ff1g/door was formed. Made of galvanized steel sheet.
また35μの銅箔にエポキシ系樹脂tLを塗付、乾燥し
、80μの絶縁層付銅箔を作成し、上記亜鉛メッキ釧板
に重ね甘せ、50kg/at、160℃、2Hrの条件
で加熱加圧成形して片面銅張積層板を得た。In addition, epoxy resin tL was applied to a 35μ copper foil, dried to create an 80μ copper foil with an insulating layer, layered on the above galvanized board, and heated at 50kg/at, 160℃, 2Hr. Pressure molding was performed to obtain a single-sided copper-clad laminate.
〔実施例2〕
lfj厚Q、5IIII11の珪素鋼板(JIS C
2552−518)に亜鉛メッキ20g/m”を施した
電気亜鉛メッキ珪素鋼板を用い、実施例1と同様にして
、クロメート処理501111g/ffl’、アクリル
変成アルキッド樹脂被膜60011g/酢形成した鋼板
を用い1片面銅張積層板を得た。[Example 2] Silicon steel plate (JIS C
2552-518) with galvanization of 20 g/m", and a steel plate treated with chromate treatment of 501111 g/ffl' and acrylic modified alkyd resin coating of 60011 g/vinegar in the same manner as in Example 1. A single-sided copper-clad laminate was obtained.
〔実施例5〕
板厚/ mmの5pccに亜鉛メッキ付潰量20g/r
n”、 リン酸亜鉛処j15g/m”施さnた市販の
電気亜鉛メッキ鋼版に、絶縁層と同じエポキシ系4I!
4脂溶液をロールコータで脇付乾燥し、800■/m’
の形成し、実施例1と同様にして片面@張積層板を得た
。[Example 5] Plate thickness/mm 5pcc with galvanized crushing amount 20g/r
A commercially available electrogalvanized steel plate with zinc phosphate treatment of 15 g/m was coated with 4I epoxy, the same as the insulating layer.
4. Dry the fat solution with a roll coater and coat it at 800cm/m'.
A single-sided @stretched laminate was obtained in the same manner as in Example 1.
〔比較例1〕
板厚1ffIIIlの5PCCに亜鉛メッキ付N量20
g/rn”、クロメート処jl!2511!/−施され
た市販の電気亜鉛メッキ鋼板に有機高分子被膜を設けず
直接実施例1と同様にして片面銅張積層板を得た。[Comparative Example 1] 5PCC with plate thickness of 1ffIIIl and galvanized with N amount of 20
A single-sided copper-clad laminate was obtained directly in the same manner as in Example 1 without providing an organic polymer coating on a commercially available electrogalvanized steel sheet that had been subjected to chromate treatment jl!2511!/-.
〔比較例2〕
実施例3の亜鉛メッキ鋼板において絶縁層と同じエポキ
シ系樹脂を5g/m’で塗布した亜鉛メッキ鋼版を用い
実施例1と同様にして片面銅張積層板を得た。[Comparative Example 2] A single-sided copper-clad laminate was obtained in the same manner as in Example 1 using the galvanized steel plate of Example 3 coated with the same epoxy resin as the insulating layer at 5 g/m'.
〔比較例3〕
実施例1の亜鉛メッキ鋼板にクロメート又はリン酸亜鉛
処理を施さず亜鉛メッキの上に直接アクリル変成アルキ
ッド樹脂を800 mg/m’形成した亜鉛メッキ鋼板
を用い、実施例1と同様にして片面銅張積層板を得た。[Comparative Example 3] Using a galvanized steel sheet in which 800 mg/m' of acrylic modified alkyd resin was directly formed on the zinc plating without applying chromate or zinc phosphate treatment to the galvanized steel sheet of Example 1, the galvanized steel sheet of Example 1 and A single-sided copper-clad laminate was obtained in the same manner.
〔比較例4〕
比較例1の市販の電気亜鉛メッキ鋼板の片面を#180
のサンドペーパで表面粗化し、その上に実施例1と同様
にして絶縁層を介して銅箔を積層し、片面銅張積層板を
得た。[Comparative Example 4] One side of the commercially available electrogalvanized steel sheet of Comparative Example 1 was coated with #180
The surface was roughened with sandpaper, and a copper foil was laminated thereon via an insulating layer in the same manner as in Example 1 to obtain a single-sided copper-clad laminate.
実施例1〜3、比較例1〜4で得られた銅張積層板につ
いて以下の試験を行ない、その結果を表−1に示す。The following tests were conducted on the copper-clad laminates obtained in Examples 1 to 3 and Comparative Examples 1 to 4, and the results are shown in Table 1.
1、 耐電圧:JIS C2110に:よる<D、C
)2、ハンダ耐熱:300℃−1分(JIS C64
81に準拠)二〇二異常なし、
×:フクレ発生
N PCT(プレッシャークツカーテスト):。1. Withstand voltage: According to JIS C2110: <D, C
) 2. Soldering heat resistance: 300℃ - 1 minute (JIS C64
81) 202 No abnormalities, ×: Blisters N PCT (Pressure Test):.
121℃、2atmの蒸気雰囲気中
○:絶縁層剥離なし、×:絶縁層
剥離
4、煮沸2Hr :佛廣水中に2Hr浸漬O:絶縁ノー
剥離なし、×:絶縁層
剥離
5、 劇6に’i紋注:○:銅板部を指で触れても指紋
跡が目立たない
×:鋼板部を指で触すると指級跡
が残る。In a steam atmosphere at 121°C and 2 atm ○: No insulation layer peeling, ×: Insulation layer peeling 4, boiling for 2 hours: Immersed in Butsuhiro water for 2 hours O: No insulation peeling, ×: Insulating layer peeling 5, Dramatic 6. Crest note: ○: Fingerprint marks are not noticeable even when the copper plate part is touched with a finger. ×: Fingerprint marks remain when the steel plate part is touched with a finger.
& 塩水l!J霧:35℃、5%嬢度の塩水噴霧48H
r試験
○:錆の発生なし、X:錆の発生
あり
注ノハンダ耐熱、PCT、煮沸試叡は片面銅張積層板の
銅箔をエツチングにより除去した後試験を行なった。& salt water! J fog: 48 hours of salt water spray at 35℃ and 5% mist
r test: ○: No rust occurred;
表−1に示す結果からも明らかなように本発明によれば
、耐電圧特性、/Sンダ耐熱性並びに絶縁層の密着性に
すぐれた鋼板ペース硼張積層板を提供することが可能に
なった。As is clear from the results shown in Table 1, according to the present invention, it is possible to provide a steel plate-based borosilicate laminate with excellent voltage resistance properties, /sunder heat resistance, and insulating layer adhesion. Ta.
Claims (1)
板の表面に、熱硬化性樹脂の薄膜を形成し、この上に接
着性絶縁層を介して銅箔を積層することを特徴とする鋼
板ベース銅張積層板の製造法。 2、熱硬化性樹脂の薄膜の重量が0.1〜3g/m^2
である特許請求の範囲第1項記載の鋼板ベ ース銅張積層板の製造法。[Claims] 1. A thin film of thermosetting resin is formed on the surface of a galvanized steel sheet treated with chromate or phosphate, and copper foil is laminated thereon via an adhesive insulating layer. Features: A manufacturing method for steel plate-based copper-clad laminates. 2. The weight of the thermosetting resin thin film is 0.1 to 3 g/m^2
A method for manufacturing a steel plate-based copper-clad laminate according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1835286A JPS62176836A (en) | 1986-01-30 | 1986-01-30 | Manufacture of steel-plate base copper-lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1835286A JPS62176836A (en) | 1986-01-30 | 1986-01-30 | Manufacture of steel-plate base copper-lined laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62176836A true JPS62176836A (en) | 1987-08-03 |
JPH0587386B2 JPH0587386B2 (en) | 1993-12-16 |
Family
ID=11969283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1835286A Granted JPS62176836A (en) | 1986-01-30 | 1986-01-30 | Manufacture of steel-plate base copper-lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62176836A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0247052A (en) * | 1988-08-09 | 1990-02-16 | Nippon Steel Corp | Sheet suitable for iron based printed board |
JPH03133633A (en) * | 1989-10-20 | 1991-06-06 | Nippon Steel Corp | Steel sheet suitable for iron-based printed board |
JPH03177584A (en) * | 1989-12-06 | 1991-08-01 | Nippon Steel Corp | Steel sheet for printed base plate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034842A (en) * | 1983-08-05 | 1985-02-22 | 住友ベークライト株式会社 | Metallic base copper lined plate |
JPS61271890A (en) * | 1985-05-27 | 1986-12-02 | 株式会社神戸製鋼所 | Substrate for formation of electric circuit |
-
1986
- 1986-01-30 JP JP1835286A patent/JPS62176836A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034842A (en) * | 1983-08-05 | 1985-02-22 | 住友ベークライト株式会社 | Metallic base copper lined plate |
JPS61271890A (en) * | 1985-05-27 | 1986-12-02 | 株式会社神戸製鋼所 | Substrate for formation of electric circuit |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0247052A (en) * | 1988-08-09 | 1990-02-16 | Nippon Steel Corp | Sheet suitable for iron based printed board |
JPH03133633A (en) * | 1989-10-20 | 1991-06-06 | Nippon Steel Corp | Steel sheet suitable for iron-based printed board |
JPH0588669B2 (en) * | 1989-10-20 | 1993-12-24 | Nippon Steel Corp | |
JPH03177584A (en) * | 1989-12-06 | 1991-08-01 | Nippon Steel Corp | Steel sheet for printed base plate |
Also Published As
Publication number | Publication date |
---|---|
JPH0587386B2 (en) | 1993-12-16 |
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