JPS62176836A - Manufacture of steel-plate base copper-lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a full-area base copper clad laminate with excellent adhesion.

[Conventional technology]

In recent years, the auxiliary tanks of electronic devices have become thinner and more dense, and the electronic components used in these devices have become more densely packaged. The wiring boards on which components are attached are also required to have excellent heat resistance and heat dissipation.

In recent years, printed circuit boards based on metal plates such as aluminum, copper, or iron have come to be used to meet the demands for increased storage capacity.

In particular, in printed circuit boards incorporating small-sized electronic motors or circuits for detecting rotational speed and position, cold-rolled copper plates or silicon steel plates with good ta characteristics are usually used as the base.

However, these steel plates have poor corrosion resistance and are prone to rust, especially in summer and high humidity, so they are usually plated with zinc or other metal, and then treated with chromate or phosphate to further improve corrosion resistance. is commercially available.

[Problem that the invention seeks to solve]

Copper VR laminates made of galvanized steel sheets laminated with copper foil via an adhesive insulating layer have poor adhesion between the steel sheet and the insulating layer, so for example, high-temperature humidification tests are required to confirm long-term lifespan. If this is done, the insulating layer is likely to peel off. There is a problem in that if the drying after etching or cleaning is even slightly insufficient when producing a printed circuit board, the solder IJ7O- tends to swell.

The present invention was devised in view of the above circumstances, and it is an object of the present invention to provide a method of manufacturing a steel sheet-based copper-clad laminate that improves the adhesion between the galvanized steel sheet and the insulating layer.

[Means for solving problems]

According to the invention, the surface of galvanized steel sheets treated with chromates or phosphates is thermally silicified! 1: This is achieved by forming a thin resin layer and laminating a steel foil on top of it with a contact insulating layer interposed therebetween.

The galvanized steel plates used in the present invention are cold-rolled m-plates, hot-rolled steel plates, and other ordinary iron plates, as well as silicon steel plates with excellent electromagnetic properties, which have zinc or zinc-based alloys on their surfaces. This is a steel plate that has been plated and laminated. Zinc coating Mkl 5 = 70 g/m' is desirable, 5
There is no corrosion resistance effect below g/rrf (70 g/m"
If it exceeds this value, peeling will occur more easily than in the zinc metal middle layer during punching using a press. The chromate treatment applied to the housing octopus forms a film made of hydrated chromium oxide, and the phosphate treatment forms a film mainly made of zinc phosphate. These treatments increase corrosion resistance and improve adhesion to resin.

The amount of chromium-attached N in chromate treatment is 10 to 200■
/m is appropriate, and the s group of phosphate treatment is 1 to 5g.
/rrl is preferable. The thermosetting resin applied on this chromate or phosphate treatment includes water-bathable polymer compounds such as alkyd resin, phenol alkyd resin, amino alkyd resin, acrylic resin, epoxyester/L-resin, etc. or epoxy resin phenolic resin,
It is a non-water bathable resin such as unsaturated polyester resin. Further, silicon, titanium, aluminum, or similar materials may be added to prevent the amate film from deteriorating over time and improve corrosion resistance.

The coating amount of these thermosetting resins is α1 to 5 g/rr.
f is desirable. If Q is less than 1 g/rrf, the effect of improving adhesion and corrosion resistance will be small, and if it is more than 3 g/rrf, the adhesion with the absolute R layer will decrease.

Contact insulation used in the present invention/! # indicates epoxy resin, phenolic resin, unsaturated polyester side In! , polyimide resin, etc. may be added with various curing agents, pigments, inorganic fillers, etc.

This insulating layer can be formed by applying these resins to copper foil or the above-mentioned galvanized steel sheet, or by making these resins into adhesive prepreg sheets reinforced with a base material such as glass fiber or polyester fiber paper. A laminate is produced by laminating copper foil through a resin and applying heat and pressure. As the heating and pressing method, a laminated press is usually used, but a continuous pressing steel belt or a roll press may also be used.

The present invention will be explained in more detail below based on examples.

[Example 1] Plate #l ff1m 5pcc with zinc 20g/n
Electrogalvanized steel sheet (SEC
To CJ, Crys/I Q g/1. HsBOs
5 g/l was used as a base liquid, to which silicate heptadide was added as a reducing agent, and a chromate solution having a bath temperature of 50°C was sprayed to perform chromate treatment of 50 d/rrl of Cr water hydrate, followed by drying. A water-soluble polymer compound made by dispersing silica sol in acrylic-modified alkyd resin was applied to this chromate-treated surface using a water bath solution, and dried for 500 min.
A coating of ff1g/door was formed. Made of galvanized steel sheet.

In addition, epoxy resin tL was applied to a 35μ copper foil, dried to create an 80μ copper foil with an insulating layer, layered on the above galvanized board, and heated at 50kg/at, 160℃, 2Hr. Pressure molding was performed to obtain a single-sided copper-clad laminate.

[Example 2] Silicon steel plate (JIS C
2552-518) with galvanization of 20 g/m", and a steel plate treated with chromate treatment of 501111 g/ffl' and acrylic modified alkyd resin coating of 60011 g/vinegar in the same manner as in Example 1. A single-sided copper-clad laminate was obtained.

[Example 5] Plate thickness/mm 5pcc with galvanized crushing amount 20g/r
A commercially available electrogalvanized steel plate with zinc phosphate treatment of 15 g/m was coated with 4I epoxy, the same as the insulating layer.
4. Dry the fat solution with a roll coater and coat it at 800cm/m'.
A single-sided @stretched laminate was obtained in the same manner as in Example 1.

[Comparative Example 1] 5PCC with plate thickness of 1ffIIIl and galvanized with N amount of 20
A single-sided copper-clad laminate was obtained directly in the same manner as in Example 1 without providing an organic polymer coating on a commercially available electrogalvanized steel sheet that had been subjected to chromate treatment jl!2511!/-.

[Comparative Example 2] A single-sided copper-clad laminate was obtained in the same manner as in Example 1 using the galvanized steel plate of Example 3 coated with the same epoxy resin as the insulating layer at 5 g/m'.

[Comparative Example 3] Using a galvanized steel sheet in which 800 mg/m' of acrylic modified alkyd resin was directly formed on the zinc plating without applying chromate or zinc phosphate treatment to the galvanized steel sheet of Example 1, the galvanized steel sheet of Example 1 and A single-sided copper-clad laminate was obtained in the same manner.

[Comparative Example 4] One side of the commercially available electrogalvanized steel sheet of Comparative Example 1 was coated with #180
The surface was roughened with sandpaper, and a copper foil was laminated thereon via an insulating layer in the same manner as in Example 1 to obtain a single-sided copper-clad laminate.

The following tests were conducted on the copper-clad laminates obtained in Examples 1 to 3 and Comparative Examples 1 to 4, and the results are shown in Table 1.

1. Withstand voltage: According to JIS C2110: <D, C
) 2. Soldering heat resistance: 300℃ - 1 minute (JIS C64
81) 202 No abnormalities, ×: Blisters N PCT (Pressure Test):.

In a steam atmosphere at 121°C and 2 atm ○: No insulation layer peeling, ×: Insulation layer peeling 4, boiling for 2 hours: Immersed in Butsuhiro water for 2 hours O: No insulation peeling, ×: Insulating layer peeling 5, Dramatic 6. Crest note: ○: Fingerprint marks are not noticeable even when the copper plate part is touched with a finger. ×: Fingerprint marks remain when the steel plate part is touched with a finger.

& salt water! J fog: 48 hours of salt water spray at 35℃ and 5% mist
r test: ○: No rust occurred;

〔Effect of the invention〕

As is clear from the results shown in Table 1, according to the present invention, it is possible to provide a steel plate-based borosilicate laminate with excellent voltage resistance properties, /sunder heat resistance, and insulating layer adhesion. Ta.

Claims (1)

[Claims] 1. A thin film of thermosetting resin is formed on the surface of a galvanized steel sheet treated with chromate or phosphate, and copper foil is laminated thereon via an adhesive insulating layer. Features: A manufacturing method for steel plate-based copper-clad laminates. 2. The weight of the thermosetting resin thin film is 0.1 to 3 g/m^2
A method for manufacturing a steel plate-based copper-clad laminate according to claim 1.