JPH03177584A - Steel sheet for printed base plate - Google Patents
Steel sheet for printed base plateInfo
- Publication number
- JPH03177584A JPH03177584A JP31520489A JP31520489A JPH03177584A JP H03177584 A JPH03177584 A JP H03177584A JP 31520489 A JP31520489 A JP 31520489A JP 31520489 A JP31520489 A JP 31520489A JP H03177584 A JPH03177584 A JP H03177584A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- steel sheet
- steel plate
- printed circuit
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 45
- 239000010959 steel Substances 0.000 title claims abstract description 45
- 238000007747 plating Methods 0.000 claims abstract description 22
- 239000013078 crystal Substances 0.000 claims abstract description 10
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 238000011282 treatment Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 4
- 230000001105 regulatory effect Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Motor Or Generator Frames (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、小型精密モータ用のプリント基板に用いられ
る鋼板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a steel plate used for a printed circuit board for a small precision motor.
（従来の技術）
小型精密モータは、ビデオやオーディオなどの制御用と
して大きく伸びている分野であり、プリント基板が小型
モータのステータあるいは、シールド材として用いられ
る。しかしながら、そのプリント基板用として要求され
る性能を充分に発揮した材料は、未だ使用されていない
。(Prior Art) Small precision motors are a rapidly growing field for controlling video, audio, etc., and printed circuit boards are used as stators or shielding materials for small motors. However, a material that fully exhibits the performance required for printed circuit boards has not yet been used.
従来、プリント基板の鋼板としては普通の冷薄系の軟鋼
０．５〜１．５ｍｍ厚や、一部２％８１程度の電磁鋼板
の０．５〜１，５ｍｍ厚が用いられ、それぞれ表面被覆
処理が施される。電磁鋼板を用いる技術としては、特開
昭８１−１４２９３９号公報にモータ効率が良く、絶縁
層との密着性が優れたプリント基板用鋼板が提案されて
いる。Conventionally, as steel plates for printed circuit boards, ordinary cold and thin mild steel with a thickness of 0.5 to 1.5 mm and some 2% 81 electromagnetic steel sheets with a thickness of 0.5 to 1.5 mm have been used, and each has a surface coating. Processing is performed. As a technology using electromagnetic steel sheets, Japanese Patent Application Laid-Open No. 81-142939 proposes a steel sheet for printed circuit boards that has good motor efficiency and excellent adhesion to an insulating layer.
一方、特開昭８１−１７６８３８号公報により、クロメ
ート処理された亜鉛メッキ鋼板の表面に、熱硬化性樹脂
の薄膜を形成し、その上に接着性絶縁層を介して銅箔を
積層する鋼板ベース銅張積層板の製造方法が提案されて
いる。On the other hand, according to Japanese Unexamined Patent Publication No. 81-176838, a steel plate base in which a thin film of thermosetting resin is formed on the surface of a chromate-treated galvanized steel plate, and copper foil is laminated thereon via an adhesive insulating layer. A method for manufacturing copper-clad laminates has been proposed.
（発明が解決しようとする課題）
しかしながら、これらの鋼板ではプリント基板で重要と
なる磁気シールド性が充分でなく、またプリント基板用
鋼板製造時のメッキの付着不良が多発し、更にプリント
基板製造時の打抜き工程で重要な金型寿命が短い問題点
があった。(Problems to be Solved by the Invention) However, these steel sheets do not have sufficient magnetic shielding properties, which are important in printed circuit boards, and often fail to adhere to the plating when manufacturing steel sheets for printed circuit boards. An important problem in the punching process was the short life of the mold.
本発明は上記の点に鑑み、シールド性能が優れ、メッキ
の付着性が良好で、且つ打抜きがし易い、全ての条件を
同時に満足させるプリント基板用鋼板を提供する。In view of the above points, the present invention provides a steel plate for printed circuit boards that has excellent shielding performance, good adhesion of plating, and is easy to punch out, all of which are satisfied at the same time.
（課題を解決するための手段）
本発明は板厚０．５〜１．５開の鋼板両面に第１層とし
てメッキ層、第２層としてクロメート処理層、第３層と
して有機樹脂層を有するプリント基板用の鋼板において
、上記鋼板の８１含有量が０．５％以下、結晶粒径がフ
ェライト粒度で７番以下であることを特徴とするプリン
ト基板用鋼板である。(Means for Solving the Problems) The present invention has a plating layer as a first layer, a chromate treatment layer as a second layer, and an organic resin layer as a third layer on both sides of a steel plate having a thickness of 0.5 to 1.5 mm. The steel plate for printed circuit boards is characterized in that the steel plate has an 81 content of 0.5% or less and a crystal grain size of ferrite grain size of No. 7 or less.
本発明は鋼板両面に第１層〜第３層の表面処理を実施す
るが、これは各々の層同士の密着性を向上させることに
より、鋼板と皮膜が剥離しないようにするためである。In the present invention, surface treatments of the first to third layers are carried out on both sides of the steel plate, and this is to improve the adhesion between each layer to prevent the steel plate and the coating from peeling off.
まず、第１層については、Ｚｎ、Ｃｒ、Ｃｕ。First, for the first layer, Zn, Cr, and Cu.
Ｎｌ、Ｓｎから選ばれた１種または２種以上を、０．５
〜１５０ｇ／ｒｆの量（片面）でメッキすることが好ま
しい。０．５ｇ／ｒｒｆ未満では、常態でも良好な密着
性が得られず、また耐錆性も不十分である。One or more selected from Nl and Sn at 0.5
Preferably, it is plated in an amount of ~150 g/rf (one side). If it is less than 0.5 g/rrf, good adhesion cannot be obtained even under normal conditions, and rust resistance is also insufficient.
一方、 Ｌ５Ｑｇｌｒｄ超では、コストと密着性の問題
がある。On the other hand, above L5Qglrd, there are problems with cost and adhesion.
第２層は、金属Ｃｒ換算でＩＯ〜２００■／ボのクロメ
ート処理を施すことが好ましい。１０■／ｄ未満でも、
２００■／ｒＹ′１″超でも密着性の改善効果がなくな
るためである。The second layer is preferably subjected to a chromate treatment of IO to 200 .mu./bo in terms of metal Cr. Even if it is less than 10■/d,
This is because even if it exceeds 200 .mu./rY'1", the effect of improving adhesion is lost.
第３層としては、有機樹脂を片面（銅箔／絶縁層の側）
に、０．５〜ＬＤｇ／ｒｄ、その反対側に３〜１０ｇ／
ｄをそれぞれ塗布することが好ましい。銅箔／絶縁層の
側に、０．５〜ＬＯｇ／ｒｄ塗布で、密着性とコストが
満足され、また、その反対側をやや多めの３〜Ｌｏｇ／
ｒｒ？にすることで、密着性を確保し、銅箔エツチング
時の鋼板やメッキ層の溶解を防ぐ。As the third layer, organic resin is applied on one side (copper foil/insulating layer side).
0.5~LDg/rd on the other side, 3~10g/rd on the other side.
It is preferable to apply d respectively. Adhesion and cost are satisfied by applying 0.5 to LOg/rd on the copper foil/insulating layer side, and applying slightly more 3 to LOg/rd on the other side.
rr? This ensures adhesion and prevents the steel plate and plating layer from dissolving during copper foil etching.
本発明者らは、磁気シールド性能、メッキ付着性、打抜
き性を付与することについて、種々の検討を行った。こ
こで、磁気シールドとは、モータ回路で発生した磁束が
外部に漏れることを遮蔽する意味である。特に、小型の
精密モータの周辺には他の電子機器、例えば、音響用制
御回路やＯＡ機器などが配置されることが多く、これら
に対する誤操作磁場が問題となる。本発明者らは、磁気
シールド性は鋼板の結晶粒径と内部応力に依存し、８１
などの成分の影響はないことを見出した。即ち、結晶粒
径をフェライト粒度番号７（フェライト結晶粒度は、Ｊ
ＩＳ Ｇ ０５５２による）以下の粗大粒とすることに
より、優れたシールド性能を持たせることができる。The present inventors conducted various studies on imparting magnetic shielding performance, plating adhesion, and punchability. Here, the term "magnetic shield" refers to shielding the magnetic flux generated in the motor circuit from leaking to the outside. In particular, other electronic devices, such as audio control circuits and office automation equipment, are often placed around small precision motors, and erroneous operation of these devices by magnetic fields poses a problem. The present inventors found that the magnetic shielding property depends on the crystal grain size and internal stress of the steel sheet, and 81
It was found that there was no effect of other ingredients. That is, the crystal grain size is determined by the ferrite grain size number 7 (the ferrite grain size is J
According to IS G 0552) or less coarse grains, excellent shielding performance can be provided.
次に、メッキ付着性とは、鋼板とメッキ層との間の密着
性のことである。特に、５ｌｆｆｉが０．５％を超える
と、常態でもメッキ層にブップッのふくれが発生する。Next, plating adhesion refers to the adhesion between the steel plate and the plating layer. In particular, when 5lffi exceeds 0.5%, blistering occurs in the plating layer even under normal conditions.
この理由は、表面のＳｉＯ２層がメッキの密着性を劣化
させるためであろう。従って、Ｓｌは０．５％以下とし
なければならない。The reason for this is probably that the SiO2 layer on the surface deteriorates the adhesion of plating. Therefore, Sl must be 0.5% or less.
更に、打抜き性とは、プリント基板製造の銅箔エツチン
グの前または後で実施される打抜き工程で問題となる金
型摩耗、即ち金型寿命のことである。金型の寿命は、５
ｉｆｆｉに大きく依存するため、０．５％以下が良い。Furthermore, punchability refers to mold wear, ie, mold life, which is a problem in the punching process performed before or after copper foil etching for printed circuit board manufacturing. The life of the mold is 5
Since it largely depends on iffi, it is preferably 0.5% or less.
以下、発明の限定理由について説明する。The reasons for the limitations of the invention will be explained below.
本発明者らは、各種Ｓｌ量を含有し、最終焼鈍した結晶
粒径が異なる鋼板に、調質圧延率１％を実施したものと
しないものを造り、鋼板をＨ２ＳＯ４５％で２秒酸洗後
、Ｚｎを１ｇ／ｒｒｆメッキし、次いで金属Ｃｒ換算で
５０■／ｄのクロメート処理、更に有機を２ｇ／ｒｒ？
被覆後、エポキシ樹脂を１００−を絶縁層として施し、
銅箔を貼り、エツチング等の所定の工程を経て、プリン
ト基板を製作した。The present inventors made steel sheets containing various amounts of Sl and having different grain sizes after final annealing, with and without skin pass rolling of 1%, and after pickling the steel sheets with 45% H2SO for 2 seconds. , Zn plating at 1 g/rrf, then chromate treatment at 50 μ/d in terms of metal Cr, and then organic at 2 g/rr?
After coating, apply epoxy resin 100- as an insulating layer,
A printed circuit board was manufactured by pasting copper foil and going through certain steps such as etching.
これをＶＴＲ用のブラシレス周対向型のモータに試作し
て、ステータに約１２０００ガウスの磁束密度を発生さ
せて、プリント基板から漏洩する最大磁束を、ｌａｍ離
してガウスメータで測定した。This was prototyped into a brushless circumferentially opposed motor for a VTR, a magnetic flux density of about 12,000 Gauss was generated in the stator, and the maximum magnetic flux leaking from the printed circuit board was measured using a Gaussmeter at a distance of lam.
成分を第１表に、実験結果を第１図に示す。The ingredients are shown in Table 1, and the experimental results are shown in Figure 1.
第 １ 表
（ｖｔ％）
試料 ＳＩ Ａρ Ｃ凡 伊ｊ調質なし 調
質あり
Ａ ３．１２ ０．００２ ０．００２３ ０
・Ｂ １．Ｌ３ ０．００３ ０．００４２
Δ ムＣＯ，０３０，００５０，００１８口
■第１図に示す如く、シールド性能は５Ｉｆ
ｆｉによらず、結晶粒径が大きい程良いこと、また調質
圧延が無いほうが良い。とくに、結晶粒径が７番以下の
粗大粒で、漏洩磁束が１ガウスを切っている。Table 1 (vt%) Sample SI Aρ C General Ij Without tempering With tempering A 3.12 0.002 0.0023 0
・B 1. L3 0.003 0.0042
Δ Mu CO, 030, 0050, 0018 ports ■As shown in Figure 1, the shielding performance is 5 If
Regardless of fi, the larger the grain size, the better, and the absence of temper rolling. In particular, for coarse grains with a crystal grain size of 7 or less, the leakage magnetic flux is less than 1 Gauss.
ＶＴＲ用や自動車の音響機器などプリント基板が磁気シ
ールド材として利用されるケースが多いため、漏洩磁束
は少ない方が良いが、１ガウス程度以下が目安となって
いる。なお、測定方向の地磁気は０，２ガウスであった
。Since printed circuit boards for VTRs and automobile audio equipment are often used as magnetic shielding materials, it is better to have as little leakage magnetic flux as possible, but the standard is around 1 Gauss or less. Note that the geomagnetism in the measurement direction was 0.2 Gauss.
シールド性が結晶粒径と圧延に依存する理由は、鋼板の
励磁され易さ程度との関連で考えることが可能であろう
から、粒界のミクロな内部応力と圧延のマクロな内部応
力が磁壁移動を抑制するためと考えている。The reason why the shielding property depends on the grain size and rolling can be considered in relation to the degree of susceptibility of the steel sheet to excitation. Therefore, the microscopic internal stress of grain boundaries and the macroscopic internal stress of rolling I believe this is to restrict movement.
結晶粒度を７番より小さくする方法は、例えば、最終の
焼鈍温度を上げることによって得られ、８００℃以上が
好ましい。A method for making the grain size smaller than No. 7 is, for example, by increasing the final annealing temperature, which is preferably 800° C. or higher.
なお、従来の冷薄系のプリント基板用鋼板の結晶粒度は
８〜１０程度で、調圧も実施しているためシールド性能
が悪い。Note that the grain size of conventional cold and thin steel sheets for printed circuit boards is about 8 to 10, and the shielding performance is poor because the pressure is adjusted.
更に、第２表に示すＳ１量を変更した鋼板を用いて、メ
ッキ性と打抜き金型の寿命試験を行った。Further, plating properties and punching die life tests were conducted using steel plates with different amounts of S1 as shown in Table 2.
メッキ付着性の評価は、鋼板をＨ２ＳＯ４５％で２秒酸
洗後、Ｃｒを３ｇ／ｒｒ？、３０（７）角のサンプルに
メッキした表面外観を見て、メッキふくれの不良箇所が
一箇所でもあれば×、無ければ○とした。The plating adhesion was evaluated by pickling the steel plate with 45% H2SO for 2 seconds, then adding 3g/rr of Cr. , 30 (7) Square samples were plated, and the appearance of the plated surface was evaluated. If there was even one defective part of plating blistering, it was marked as "×", and if there was none, it was marked as "○".
また、打抜き性については、プリント基板製造の銅箔エ
ツチングを完了した段階で、打抜きを行って評価した。In addition, punching performance was evaluated by punching after completing copper foil etching for printed circuit board production.
打抜き金型はスチール、角抜き、無塗油、クリアランス
は３％とし、金型寿命はかえり高さが３０−を超える点
とした。The punching die was made of steel, square cut, without oil, the clearance was 3%, and the die life was defined as the point at which the burr height exceeded 30.
第２表に示すように、８１％が０．５％まではメッキ付
着性、金型寿命とも良好であるが０．５％を超えると劣
化する。更に、曲げ加工や絞り加工でも鋼板の割れもな
く容易に成形が可能である。As shown in Table 2, when 81% reaches 0.5%, both the plating adhesion and mold life are good, but when it exceeds 0.5%, it deteriorates. Furthermore, the steel plate can be easily formed without cracking during bending or drawing.
第 ２ 表
５１ｗｔ％ メッキ付着性 金型寿命
０．０２ ０ １５万回
０．２５ ０ １２万回０．４０
０ ｌＯ万四回０６５ Ｘ
５万回０．９６ Ｘ １万回り
、５１ Ｘ ５千回３．０２
Ｘ ３千回Ｓ１以外の成分、例えば、Ｃ，Ｍ
ｎ、ＡＮ、Ｓ。Table 2 51wt% Plating adhesion Mold life 0.02 0 150,000 times 0.25 0 120,000 times 0.40
0 lO million four times 065 X
50,000 times 0.96 x 10,000 times, 51 x 5,000 times 3.02
X 3,000 times Components other than S1, e.g. C, M
n, AN, S.
Ｎ、Ｐ、Ｂ、ＴＩ 、Ｓｎ、Ｓｂ、Ｎｂなど特に限定し
ないが、添加しても本発明の効果を損なうものではない
。N, P, B, TI, Sn, Sb, Nb, etc. are not particularly limited, but their addition does not impair the effects of the present invention.
（実 施 例）
Ｓｌを第３表の量に調整した溶鋼を、連続鋳造でスラブ
を造り、熱延でホットコイルにした。これを、冷延し焼
鈍して、１關の鋼板を製造した。(Example) Molten steel in which the Sl content was adjusted to the amount shown in Table 3 was continuously cast to form a slab, and hot rolled into a hot coil. This was cold rolled and annealed to produce one steel plate.
この時、焼鈍温度を７００〜１１００℃に変更して、第
３表の結晶粒径を得た。また、最終の調質圧延０．５％
を実施したものと、しない鋼板を造った。At this time, the annealing temperature was changed to 700 to 1100°C to obtain the crystal grain sizes shown in Table 3. In addition, the final temper rolling 0.5%
Some steel plates were made with and without.
この鋼板を、Ｈ２Ｓ Ｏ４５％で２秒酸洗後、第３表の
ＺｎまたはＣｕの両面メッキ（メッキ量は片面）をした
。This steel plate was pickled with 45% H2SO for 2 seconds, and then plated on both sides with Zn or Cu (the amount of plating was on one side) as shown in Table 3.
メッキふくれがないかの外観検査をしたのち、金属Ｃｒ
換算で５０■／ｒｒｆのクロメート処理、更にエポキシ
樹脂を５ｇ／ｒｄ被覆してプリント基板用の鋼板とした
。After performing a visual inspection to ensure that there is no plating blistering, the metal Cr
The steel plate was treated with chromate at a rate of 50 mm/rrf and further coated with epoxy resin at a rate of 5 g/rd to produce a steel plate for printed circuit boards.
このプリント基板用の鋼板に対して、エポキシ樹脂を１
５０．ＣＺｌｌを絶縁層として施し、銅箔を貼り、エツ
チング等の所定の工程を経て打抜きを行い、プリント基
板を製作した。これをＶＴＲ用のブラシレス周対向型の
モータに試作して、ステータに約１２０００ガウスの磁
束密度を発生させて、プリント基板から漏洩する最大磁
束を、１（７）離してガウスメータで測定して、シール
ド性を調査した。Add 1 epoxy resin to this printed circuit board steel plate.
50. CZll was applied as an insulating layer, copper foil was pasted, and punching was performed through predetermined processes such as etching to produce a printed circuit board. We prototyped this as a brushless circumferentially opposed motor for a VTR, generated a magnetic flux density of about 12,000 gauss in the stator, and measured the maximum magnetic flux leaking from the printed circuit board with a gaussmeter at a distance of 1 (7). We investigated shielding properties.
実験Ｎｏ、 １〜３は、Ｓｉ＞０．５％のため、鋼板と
メッキ層の間でふくれが発生し、また、金型寿命（第２
表で用いた金型と同じものを使用し、評価も同じ方法）
も短い結果である。In Experiment Nos. 1 to 3, because Si>0.5%, blistering occurred between the steel plate and the plating layer, and the mold life (second
(Use the same mold as the one used in the table and use the same evaluation method)
is also a short result.
実験に４〜５は、本発明範囲のため、どの評価でも良好
であり、実験Ｎｏ、６〜７は、結晶粒径が小さいため、
シールド性に問題があり、実験Ｎ０１８では、Ｃｕメッ
キを行ったが本発明範囲のため、いずれの評価でも良好
な結果となった。Experiment Nos. 4 to 5 are within the scope of the present invention, so any evaluation is good, and experiment No. 6 to 7 is because the crystal grain size is small.
There was a problem with shielding performance, and in Experiment No. 018, Cu plating was performed, but since it was within the scope of the present invention, good results were obtained in all evaluations.
（発明の効果）
本発明によれば、磁気シールド性、メッキ付着性そして
打抜き性に優れた、高性能なプリント基板用の鋼板を提
供することができるものである。(Effects of the Invention) According to the present invention, it is possible to provide a high-performance steel plate for printed circuit boards that has excellent magnetic shielding properties, plating adhesion properties, and punching properties.
４、4,
第１図は結晶粒径と漏洩磁束に及ぼす影響を示した図表
である。
代
理
人FIG. 1 is a chart showing the influence of crystal grain size on leakage magnetic flux. agent
Claims (1)
ッキ層、第２層としてクロメート処理層、第３層として
有機樹脂層を有するプリント基板用の鋼板において、上
記鋼板のＳｉ含有量が０．５％以下、結晶粒径がフェラ
イト粒度で７番以下であることを特徴とするプリント基
板用鋼板。In a steel plate for a printed circuit board having a plating layer as a first layer, a chromate treatment layer as a second layer, and an organic resin layer as a third layer on both sides of a steel plate with a thickness of 0.5 to 1.5 mm, the Si content of the steel plate described above A steel sheet for printed circuit boards, characterized in that the crystal grain size is 0.5% or less, and the ferrite grain size is No. 7 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1315204A JPH0645903B2 (en) | 1989-12-06 | 1989-12-06 | Steel plate for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1315204A JPH0645903B2 (en) | 1989-12-06 | 1989-12-06 | Steel plate for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03177584A true JPH03177584A (en) | 1991-08-01 |
| JPH0645903B2 JPH0645903B2 (en) | 1994-06-15 |
Family
ID=18062659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1315204A Expired - Lifetime JPH0645903B2 (en) | 1989-12-06 | 1989-12-06 | Steel plate for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645903B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135061A (en) * | 2004-11-05 | 2006-05-25 | Nippon Steel Corp | Electromagnetic steel plate having small relative permeability in board thickness direction |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5546507A (en) * | 1978-09-28 | 1980-04-01 | Nisshin Steel Co Ltd | Magnetic and electromagnetic shield aluminum plated steel plate and method of manufacturing same |
| JPS55130200A (en) * | 1979-03-29 | 1980-10-08 | Nisshin Steel Co Ltd | Magnetic and electromagnetic shield material and process for producing same |
| JPS61142939A (en) * | 1984-12-12 | 1986-06-30 | Kawasaki Steel Corp | Steel plate suitable for printed board for miniature precision motor |
| JPS62176836A (en) * | 1986-01-30 | 1987-08-03 | 日立化成工業株式会社 | Manufacture of steel-plate base copper-lined laminated board |
| JPS6334745A (en) * | 1986-07-28 | 1988-02-15 | Sharp Corp | Optical information detector |
-
1989
- 1989-12-06 JP JP1315204A patent/JPH0645903B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5546507A (en) * | 1978-09-28 | 1980-04-01 | Nisshin Steel Co Ltd | Magnetic and electromagnetic shield aluminum plated steel plate and method of manufacturing same |
| JPS55130200A (en) * | 1979-03-29 | 1980-10-08 | Nisshin Steel Co Ltd | Magnetic and electromagnetic shield material and process for producing same |
| JPS61142939A (en) * | 1984-12-12 | 1986-06-30 | Kawasaki Steel Corp | Steel plate suitable for printed board for miniature precision motor |
| JPS62176836A (en) * | 1986-01-30 | 1987-08-03 | 日立化成工業株式会社 | Manufacture of steel-plate base copper-lined laminated board |
| JPS6334745A (en) * | 1986-07-28 | 1988-02-15 | Sharp Corp | Optical information detector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135061A (en) * | 2004-11-05 | 2006-05-25 | Nippon Steel Corp | Electromagnetic steel plate having small relative permeability in board thickness direction |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0645903B2 (en) | 1994-06-15 |
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