JPS63111699A - Manufacture of metal foil cladded laminated board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a thermosetting resin metal foil-clad laminate having an electromagnetic shielding layer (hereinafter abbreviated as "shield layer").

Conventional technology A thermosetting resin copper-clad laminate with a shield layer is produced by etching the copper foil of a single-sided or double-sided copper-clad laminate.
After forming the required circuit, in order to provide inner layer adhesive strength, the circuit and the surface of the laminate, which is the board, are surface-treated, and several sheets of prepreg are placed on both sides and copper foil is placed on the outermost surface. It is manufactured by heating and pressurizing the structure.

Problems to be Solved by the Invention However, in the conventional manufacturing method, as described above, a copper-clad laminate is prepared in advance to be placed in the inner layer, a predetermined circuit is formed by etching, and then the circuit surface of the copper foil and the substrate are formed. The surface is treated to improve the adhesion with the prepreg, and then a predetermined number of prepregs such as epoxy resin-impregnated cloth are placed on both sides and heated and pressed (laminated) to form a predetermined copper-clad laminate. get. For this reason, compared to ordinary copper-clad laminates, work processes such as etching processing and surface treatment of copper foil circuits are required, and waste liquid treatment of etching solution and other surface treatment agents for copper foil circuits is required, which reduces work man-hours and equipment. There is a big difference in terms of costs. In addition, in terms of characteristics, the manufacturing process of the inner layer circuit board involves many processes that adversely affect the characteristics of the board, such as using etching liquid, dipping in other liquids, and drying, and there are unstable factors in electrical characteristics, warpage and torsion, and dimensional accuracy. many. For this reason,
Laminated plates produced by this type of method have limitations in terms of performance and range of use.

In view of the above points, it is an object of the present invention to simplify the manufacturing process of a metal foil-clad laminate having a shield layer, and to provide a laminate with excellent characteristics.

Means for Solving the Problems In order to achieve the above object, the present invention involves coating a conductive resin in a predetermined shape on one or both sides of a pre-formed laminate with a thickness of O,l = 0.4 m. do.

It is characterized in that a prepreg is placed on both sides, a metal foil is placed on the surface, and heat and pressure molding is performed.

Function As described above, in the present invention, since the inner shield layer is formed of a conductive resin, an etching process and a waste liquid treatment process are unnecessary, and the manufacturing process is simplified. Furthermore, since the inner layer laminate is not subjected to chemical treatment, a highly reliable laminate without deterioration can be manufactured.

In a laminated plate coated with a conductive resin, the thickness of the laminate changes depending on the dimensions of the shield layer formed of the conductive resin. Also, the thickness is 0
．． If the number of fins exceeds four, the unevenness in the layer structure of the finally obtained laminate will be accentuated, and the warpage will become large.

In addition, conductive resin is applied directly to the prepreg in a predetermined shape,
It is also conceivable to position this in the middle of the prepreg layer and mold it. However, in this method, the shape of the shield layer formed of conductive resin is easily deformed due to the flow of the resin during hot-press molding, and there are certain restrictions on dimensional accuracy and pattern shape of the shield layer.

Example The thermosetting resin used for the laminate in the present invention is preferably an epoxy resin due to the nature of the product, but other examples include epoxy-modified phenolic resins, thermosetting polyester resins, polyimide resins, phenolic resins, etc. . Base materials for prepreg include glass cloth, glass nonwoven fabric, paper, and the like.

Regarding the effect of the shield layer made of conductive resin, if the thickness of the conductive resin is set appropriately, it is possible to obtain the same grounding effect as in the case of conventional copper foil.

Example 1 100 parts by weight of bisphenol type epoxy resin (trade name Ebico Gogo 1001, manufactured by Yuka Shell), 4 parts by weight of dicyandiamide as a hardening agent, 0.3 parts by weight of 2-ethyl-4-methylimidazole as a hardening accelerator, Methyl ethyl ketone and methyl cellosolve were added to obtain a varnish. Then - this varnish is treated with epoxy silane to a thickness of 0
．． A prepreg having a resin content of 455 parts by weight was obtained by impregnating a 19-gold glass cloth and drying it by heating.

Layer these two sheets of prepreg together and heat and pressurize them using the usual method.
．． A laminate with a thickness of 4 tm was prepared, and both surfaces were roughened with #200 Scotchbride to obtain an inner layer laminate.

As shown in Figure 1, a thermosetting conductive resin (product name: Citron E-3073 manufactured by Dr. Shinrai Paint) was applied to this inner layer laminate, and heat-cured to form a shield layer and a conductive circuit. . 1 indicates a laminate, and 2 indicates a conductive resin. The conductive resin was applied by spraying a patterned paper pattern having the shape of a shield layer and a conductive circuit on top of the laminate.

4 sheets of prepreg on the shield layer side of the above inner layer laminate,
Two sheets of prepreg were placed on the side without the shield layer, and electrolytic copper foil with a thickness of 18 μm was placed on both surfaces and molded under heat and pressure to obtain a copper-clad laminate having a shield layer.

Example 2, Comparative Example 1.2 In Example 1, the thickness of the inner layer laminate was changed to 0.1wt5 (
Example 2), 0.0 mm (Comparative Example 1), and 0.6 mm (Comparative Example 2). In Example 2, four sheets of prepreg were placed on the side of the shield layer, and one sheet of prepreg was placed on the side without the shield layer. 3
In Comparative Example 1, four prepregs were placed on the shield layer side and on the side without the shield layer, and in Comparative Example 2, four prepregs were placed on the shield layer side and one prepreg was placed on the side without the shield layer. A copper-clad laminate having a shield layer was obtained in the same manner as in Example 1 in other respects.

Comparative Example 3 A paper pattern of the pattern used in Example 1 was placed on one sheet of the prepreg used in Example 1, and a quick-drying conductive resin was sprayed from above to obtain a prepreg having a shield layer and a conductive circuit. With this prepreg as an intermediate layer, 4 sheets of prepreg are placed on the side of the shield layer, 3 sheets of prepreg are placed on the opposite side, and l is placed on the top surface.
An electrolytic copper foil with a thickness of 8 tt was placed and molded under heat and pressure to obtain a copper-clad laminate having a shield layer.

Conventional Example 1 18 tt was applied to one side of the two prepregs used in Example 1.
A single-sided copper-clad laminate was obtained by stacking thick electrolytic copper foils and molding them under heat and pressure. The copper foil of this laminate was etched to form a shield layer and a conductive circuit having the same shape as in Example 1, thereby obtaining an inner layer circuit board.

After roughening the substrate surface (laminate surface) of the inner layer circuit board with #200 Scotchbride and roughening the copper foil surface by oxidation treatment, a prepreg similar to that in Example 1 was applied to the shield layer side. A copper-clad laminate having a shield layer was obtained by heat-pressing molding by placing four sheets of prepreg, two sheets of prepreg on the side without the shield layer, and placing copper foil with a thickness of 18 μm on both surfaces of one sheet. Table 1 shows the properties of the laminates obtained on each side.

Table 1 ○ Good × Poor or Bad Effects of the invention In the present invention, a pattern to be used as a shield layer is formed with a conductive resin on the surface of a laminate of 0.1 to 0.4 sam prepared in advance, and this is used as an inner layer plate. A metal foil-clad laminate with a shield layer is obtained by placing prepreg and metal foil on both sides and heat-pressing molding, eliminating the need for etching, chemical treatment, and waste liquid treatment processes that were previously required. As a result, the manufacturing process can be simplified. In terms of performance, warpage and twisting are suppressed, and as there is no chemical treatment as described above, a reliable metal foil-clad laminate can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a laminate used as an inner layer in an embodiment of the present invention. l is a laminate, 2 is a conductive paint

Claims (1)

[Claims] Conductive resin is applied to one or both sides of a pre-formed laminate with a thickness of 0.1 to 0.4 mm in a predetermined shape, prepreg is placed on both sides, metal foil is placed on the surface and heated. A method for manufacturing a metal foil-clad laminate, which is characterized by pressure forming.