JPS6369636A - Electrical laminated board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.

[Background technology]

Conventionally, pheno-μ resin and EBOKI V have been applied to paper and glass woven fabrics.
Electrical laminates are manufactured by laminating and molding a laminate of a required number of resin-impregnated substrates impregnated with resin or polyimide resin and dried, and metal foil. The dielectric constant is 5 when using epoxy S'E fat-impregnated guff cloth.
In the case of polyimide resin glass cloth, it is relatively large at 4°O, so when used as a printed wiring board for communication equipment and calculation equipment, the high frequency characteristics are insufficient, and it is not suitable for high frequency arithmetic circuits and communication equipment circuits. As a countermeasure to this constraint, a laminated board made entirely of fluororesin with good high frequency characteristics was considered, but it had the drawback of being expensive and not widely usable.

[Purpose of the invention]

The present invention has been made in view of the above circumstances.The purpose of the present invention is to provide a small dielectric constant and good high frequency characteristics, so that when used as a glint wiring board, it can be used for high frequency calculation circuits and communication circuits. An object of the present invention is to provide an electrical laminate that can be mounted and has excellent insulation properties.

[Disclosure of the invention]

The present invention is a patented laminate which is formed by molding m layers of a required number of fluororesin laminates with metal foil arranged on the upper and/or lower surfaces via a resin layer, and has excellent high frequency characteristics. The present invention will be described in detail below, since the high frequency characteristics of the laminate can be improved because of the fluororesin Sakai.

Resins for the fluororesin laminate used in the present invention include: (c) tetrafluoroethylene resin, tetrafluoroethylene barf μ-orovinyl ether copolymer, tetrafluoroethylene 67-fluoride globylene copolymer, tetrafluoroethylene ethylene # C polymer,
All fluororesins such as trifluorochloroethylene resin can be used, and as base materials, glass, inorganic fibers such as asbestos, polyester, polyamide, polyvinyl resin, acrylic, and fluororesin specialty resins can be used. Organic-containing Ft, ll
Woven fabrics, non-woven fabrics, mats, paper, etc. made of natural fibers such as l1m and cotton can be used, and if necessary, a fluororesin film is added to the resin-impregnated base material in which the above-mentioned base material is impregnated with the above-mentioned resin. It is obtained by laminating and molding a laminate in which a required number of sheets are stacked with the laminates interposed at required positions. Preferably, the surface of the fluororesin laminate is roughened, as this improves interlayer adhesion. The resin layer includes pheno-μ resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene,
Polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide,
A resin coating layer, a resin film, a resin sheet, or a resin-impregnated base material made by impregnating a fair base material with these resins and drying them. However, it is preferable to use a resin-impregnated base material that improves thickness accuracy.

More preferably, by using an epoxy resin, polyimide resin, etc., which has a lower melting point than the fluororesin as the resin for the resin-impregnated base material, the temperature during bond layer forming can be lower than that of the fluororesin laminate. There is. As the metal foil, single or alloy foils such as copper, iron, aluminum, Nifke μ, zinc, etc. are used, and if necessary, an adhesive layer may be provided on one side of the metal foil to further improve adhesion. can.

The present invention will be explained below based on examples.

Example 1 The thickness of the surface roughened by Sandpfust treatment was o,
Glass cloth M#7 resin bond of sat, on the top and bottom of the board, a glass cloth with a thickness of O, 15WR was impregnated with epoxy resin containing a hardening agent and dried.
% (hereinafter simply referred to as %) of epoxy\resin-impregnated gawos cloth 2
A laminate with a 0.0181EIO copper foil interposed therebetween was molded in one layer at a molding pressure of 20 W'cd and 170° C. for 90 minutes to dry up the laminates for use in IM and ¥C.

Example 2 A glass cloth with a thickness of 0.15 μ was impregnated with polyimide resin (manufactured by Rhone Boulin, trade name Ke!imide 601) on the top and bottom surfaces of the same glass cloth base fluororesin laminate as in Example 1.
After interposing two glass cloths impregnated with a polyimide resin with zero resin mass obtained by drying, a laminate with a copper foil having a thickness of 0.0181E1 was molded using a pressure field.
Laminate molding was carried out at C for 90 minutes to obtain electrical grade 6 with a laminated plate.

Comparative Example 1 Eight sheets of the same epoxy resin-impregnated glass cloth as in Example 1 were extensively disposed with 17 x 0.018 txO copper foil on the upper and lower surfaces, and a nine-layered body was molded at a pressure of ◆ billion and 170'C for 90 minutes. Comparative Example 2: 8 pieces of glass cloth impregnated with the same polyimide resin as in Example 2.
A laminate with a large 0.018ffO copper foil on the bottom surface was molded at a pressure of kg/cd at 200°C for 90 minutes.
A laminate of 1 m was formed to obtain an electric/electronic laminate.

The dielectric constants of the electrical laminates of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1.

Table 1 [Effects of the Invention] In the present invention, since the fluororesin laminate is present in the layer, the rust N ratio is small and high/? Since the IL wave characteristics are good, when used as a printed wiring board, it becomes possible to implement a high frequency line 'X circuit and communication circuit using a high frequency clock.

Claims (2)

[Claims] (1) An electrical laminate, characterized in that it is formed by laminating and molding a laminate in which metal foil is disposed on the upper and/or lower surfaces of a required number of fluororesin laminates via a resin layer. (2) The electrical laminate according to claim 1, wherein the resin layer is a resin-impregnated base material.