JPS63281494A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS63281494A JPS63281494A JP11648487A JP11648487A JPS63281494A JP S63281494 A JPS63281494 A JP S63281494A JP 11648487 A JP11648487 A JP 11648487A JP 11648487 A JP11648487 A JP 11648487A JP S63281494 A JPS63281494 A JP S63281494A
- Authority
- JP
- Japan
- Prior art keywords
- woven fabric
- printed wiring
- impregnated
- glass woven
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000002759 woven fabric Substances 0.000 claims abstract description 20
- 239000011342 resin composition Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 7
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 239000004816 latex Substances 0.000 claims abstract description 3
- 229920000126 latex Polymers 0.000 claims abstract description 3
- KVBYPTUGEKVEIJ-UHFFFAOYSA-N benzene-1,3-diol;formaldehyde Chemical compound O=C.OC1=CC=CC(O)=C1 KVBYPTUGEKVEIJ-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 15
- 239000004744 fabric Substances 0.000 abstract description 9
- 239000004745 nonwoven fabric Substances 0.000 abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002966 varnish Substances 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 5
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009833 condensation Methods 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は各種電子機器等に使用されるプリント配線基板
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board used in various electronic devices and the like.
（従来の技術）
従来各種の電子機器等において使用されるＩＣ基板等の
プリント配線基板は、無機繊維質の織布または不織布に
熱硬化性樹脂組成物を含浸させＢ−ｓｔａｇｅプリプレ
グを調製し、該プリプレグを積層した積層体の表面に金
属箔を重ね熱圧着−成型したものが一般的である。(Prior Art) Conventionally, printed wiring boards such as IC boards used in various electronic devices are prepared by impregnating an inorganic fiber woven or nonwoven fabric with a thermosetting resin composition to prepare a B-stage prepreg. Generally, a metal foil is layered on the surface of a laminate made of prepregs and then thermocompression bonded and molded.
ところで特に高周波域の信号を扱うマイクロ波ＩＣ基板
等のプリント配線基板は、機械的特性が安定したいるこ
とと併せて、信号伝搬速度を高速にするために誘電損失
が小さく、即ち誘電率及び誘電正接がともに小さく、更
に温度上昇による基板の電気的特性の低下を防止するた
めに熱伝導率が高く放熱性の良いことが必要である。By the way, printed wiring boards such as microwave IC boards that handle signals in the high frequency range have stable mechanical properties and low dielectric loss in order to increase the signal propagation speed. It is necessary that both tangents are small, and furthermore, that the thermal conductivity is high and the heat dissipation property is good in order to prevent deterioration of the electrical characteristics of the substrate due to temperature rise.
以上の要請に答えるべく、プリント配線基板を構成する
熱硬化性樹脂組成物には様々な改良が加えられている。In order to meet the above demands, various improvements have been made to thermosetting resin compositions that constitute printed wiring boards.
即ち、通常プリント配線基板は前記基材をガラス織布ま
たは不織布とし、前記熱硬化性樹脂組成物ヲエポキシ樹
脂、ジアリルフタレート樹脂、ポリマレイミド樹脂、ポ
リイソシアネート樹脂、ポリエステル樹脂またはこれら
の−°種もしくは二種以上の混合物として製造されるが
、該プリント配線基板は誘電率がかなり高く、従って誘
電損失が大きくしかも熱伝導率が低いため、マイクロ波
ＩＣ基板として不利であった。That is, the printed wiring board usually uses a glass woven fabric or a nonwoven fabric as the base material, and the thermosetting resin composition is an epoxy resin, a diallyl phthalate resin, a polymaleimide resin, a polyisocyanate resin, a polyester resin, or two or more of these. Although manufactured as a mixture of more than one species, the printed wiring board has a fairly high dielectric constant, resulting in large dielectric loss and low thermal conductivity, which is disadvantageous as a microwave IC board.
また、前記熱硬化性樹脂組成物としては、ポリブタジェ
ンもしくはその誘導体を含むものが注目されており、ポ
リブタジェン樹脂は、誘電率及び誘電正接が小さいため
に誘電損失が小さく、ガラス性基材とともに用いマイク
ロ波ＩＣ基板等を製造することも可能である。In addition, as the thermosetting resin composition, those containing polybutadiene or its derivatives are attracting attention.Polybutadiene resin has a small dielectric constant and a small dielectric loss tangent, so it has a small dielectric loss, and can be used with a glass base material. It is also possible to manufacture wave IC boards and the like.
（発明が解決しようとする問題点）
しかしながら、ポリブタジェン樹脂はガラス布との接着
性に劣り、従ってガラス織布又は不織布を基材として用
いたプリント配線基材の機械的強度が低く、大寸法の基
板が製造できないほか、信頼性に欠けるという問題があ
った。(Problems to be Solved by the Invention) However, polybutadiene resin has poor adhesion to glass cloth, and therefore the mechanical strength of printed wiring base materials using glass woven or non-woven fabric as a base material is low, and large-sized In addition to not being able to manufacture the circuit board, there were problems in that it lacked reliability.
（問題点を解決するための手段）
以上の問題点を解決する手段として１本発明は、基材と
して用いるガラス織布又は不織布をレゾルシン・ホルマ
リン縮合樹脂（ＲＦ樹脂）とラテフクスの混合物である
接着剤（ＲＦ Ｌ）により処理した後、該基材にポリブ
タジェン又はその誘導体を含む樹脂組成物を含浸させた
。(Means for Solving the Problems) As a means for solving the above problems, one aspect of the present invention is to bond glass woven fabric or non-woven fabric used as a base material with a mixture of resorcinol/formalin condensation resin (RF resin) and latex. After treatment with agent (RF L), the substrate was impregnated with a resin composition containing polybutadiene or a derivative thereof.
（作用）
ガラス織布又は不織布をＲＦＬで処理することにより、
基材表面と前記樹脂組成物とのぬれ性が向上するため、
ガラス布と樹脂間との接着性に優れたプリント配線基板
が得られる。(Function) By treating glass woven fabric or non-woven fabric with RFL,
Since the wettability between the base material surface and the resin composition is improved,
A printed wiring board with excellent adhesiveness between glass cloth and resin can be obtained.
（実施例） 以下に本発明の実施例を添付図面に基づいて説明する。(Example) Embodiments of the present invention will be described below based on the accompanying drawings.
添付図面は本発明に係るプリント配線基板を示す斜視図
である。The accompanying drawing is a perspective view showing a printed wiring board according to the present invention.
図面からも明らかなように、プリント配線基板ｌは熱硬
化性樹脂組成物２を介してガラス織布３を積層した積層
板４の表面に銅箔５，５を重ねたものである。As is clear from the drawings, the printed wiring board 1 is made by laminating copper foils 5, 5 on the surface of a laminate 4 in which a glass woven fabric 3 is laminated with a thermosetting resin composition 2 interposed therebetween.
このプリント配線基板ｌを形成するには、先ずシランカ
ップリング剤をガラス織布３に含浸させ乾燥した後、Ｒ
ＦＬ液を含浸し再度乾燥させる。To form this printed wiring board l, first impregnate the glass woven fabric 3 with a silane coupling agent and dry it, then R
Impregnate with FL liquid and dry again.
尚、該工程はシランカップリング剤をＲＦＬ液に混合し
ておき一度に行ってもよい。Note that this step may be performed at once by mixing the silane coupling agent with the RFL liquid.
次に熱硬化性樹脂組成物２を硬化剤、硬化促進剤等□と
供に溶剤に混合溶解してワニスを調製し、該ワニスをガ
ラス織布３に含浸させてプリプレグを作製する。Next, a varnish is prepared by mixing and dissolving the thermosetting resin composition 2 together with a curing agent, a curing accelerator, etc. in a solvent, and a glass woven fabric 3 is impregnated with the varnish to produce a prepreg.
更に、該プリプレグを積層して積層板４を形成し、該積
層板４の上下に銅箔５，５を重ね熱圧着を施す。Furthermore, the prepregs are laminated to form a laminate 4, and copper foils 5, 5 are stacked on top and bottom of the laminate 4 and bonded by thermocompression.
ここで以下の表に示す組成で調製されたワニスに、基材
としてガラス織布３を用い」１記方法によりプリプレグ
を調製し、プリント配線基板１を作製し、誘電正接、誘
電率、クロス接着力及び耐煮沸性を測定し、その結果を
同じく表に示した。Here, using a varnish prepared with the composition shown in the table below and a glass woven fabric 3 as a base material, a prepreg was prepared by the method described in 1, and a printed wiring board 1 was prepared, and the dielectric loss tangent, dielectric constant, and cross adhesion were determined. The strength and boiling resistance were measured and the results are also shown in the table.
また比較例として、と同様のワニスを用い、ビニルシラ
ンのみにより表面処理をしたガラス織布に含浸させて調
製したプリプレグを使用したプリント配線基板の諸性性
を共に表に示した。In addition, as a comparative example, the properties of a printed wiring board using a prepreg prepared by impregnating a glass woven fabric surface-treated with vinyl silane alone using the same varnish as in Table 1 are also shown in the table.
尚、誘電率、誘電正接の測定はＪＩＳ ０８４８１に準
じて行うこととする。またクロス接着力は引張試験機［
ＤＯ３−２０００、島津製作所製］によって表面層１枚
の基材カラス織布３を直角方向に引きはがすときの単位
幅あたりの最低荷重を示すものである。ここでは得られ
たプリント配線基板１の銅箔５をエツチングした積層板
４を幅１０ｍｍ±０．５に裁断したものを試料として用
い、表面層のガラス織布３を毎分５０ｍｍの速度で直角
方向に引きはがして測定した。Note that the dielectric constant and dielectric loss tangent are measured in accordance with JIS 08481. In addition, the cross adhesive strength was measured using a tensile tester [
DO3-2000, manufactured by Shimadzu Corporation] indicates the minimum load per unit width when one surface layer of the base material crow woven fabric 3 is peeled off in the right angle direction. Here, a laminate 4 on which the copper foil 5 of the obtained printed wiring board 1 was etched was cut into a width of 10 mm±0.5, and the surface layer glass woven fabric 3 was etched at a right angle at a speed of 50 mm/min. The measurements were taken by peeling it off in the same direction.
また、煮沸外観は、温度ｔｏｏ’ｃの蒸留水に５０ｍｍ
Ｘ５０＋ｎｍの試料を一定時間浸漬した後、常温で２４
時間放置した後外観の変化を調べることにより評価する
。In addition, the boiled appearance is 50mm in distilled water at a temperature too'c.
After immersing a sample of X50+nm for a certain period of time, it was
Evaluation is made by examining changes in appearance after leaving for a period of time.
表からも明らかなように、本実施例のプリント配線基板
１は、例えば、Ｇ−１０グレード［ナショナルエレクト
リ力ルマニファクチャラーズアソシエーション（ＮＥＭ
Ａ）規格Ｊのプリント配線基板の誘電率（４，８）、誘
電正接（０，０２０）と比較して優れた誘電特性を得ら
れ、また、比較例と比較して耐煮沸性及びクロス接着性
に優れる。As is clear from the table, the printed wiring board 1 of this embodiment is, for example, G-10 grade [National Electrical Manufacturers Association (NEM)
A) Excellent dielectric properties were obtained compared to the dielectric constant (4,8) and dielectric loss tangent (0,020) of the standard J printed wiring board, and the boiling resistance and cross adhesion were improved compared to the comparative example. Excellent in sex.
（発明の効果）
以上説明したように、本発明によれば、ＲＦＬを塗布し
たガラス織布又は不織布等のガラス布を基材とし、該基
材にポリブタジェン又はその誘導体を含む樹脂組成物を
含浸させるようにしたため、基材表面の樹脂組成物との
ぬれ性が向上し、ガラス布及び樹脂間の接着性に優れた
銅張積層板を得ることができる。(Effects of the Invention) As explained above, according to the present invention, a glass cloth such as a glass woven cloth or a non-woven cloth coated with RFL is used as a base material, and the base material is impregnated with a resin composition containing polybutadiene or a derivative thereof. As a result, the wettability of the surface of the base material with the resin composition is improved, and a copper-clad laminate with excellent adhesiveness between the glass cloth and the resin can be obtained.
また、本発明は前記樹脂組成物をガラス布に含浸ネせた
プリプレグを用いる種々のプリント配線基板に適用可能
であり、例えば、プリプレグを積層した積層板の中間層
を成すプリプレグをガラス又はアルミナを主成分とする
不織布を基材とするものとし、上下層をガラス織布を基
材とするものとして中間層を形成する場合の作業性がよ
く、更には製造されるプリント配線の機械的強度を向上
させたものとすることができる。Furthermore, the present invention can be applied to various printed wiring boards using prepregs made by impregnating glass cloth with the resin composition. For example, the prepregs forming the intermediate layer of a laminate made of prepregs may be made of glass or alumina. The main component is nonwoven fabric as the base material, and the upper and lower layers are made of glass woven fabric as the base material, which improves workability when forming the intermediate layer, and further improves the mechanical strength of the printed wiring to be manufactured. It can be improved.
添付図面は本発明に係るプリント配線基板の斜視図であ
る。
尚図面中、１はプリント配線基板、２は樹脂組成物、３
はガラス織布、４は積層板、５は銅箔である。The accompanying drawing is a perspective view of a printed wiring board according to the present invention. In the drawings, 1 is a printed wiring board, 2 is a resin composition, and 3 is a printed wiring board.
4 is a glass woven fabric, 4 is a laminate, and 5 is a copper foil.
Claims (1)
組成物を含浸させたプリプレグを用いた積層板に金属箔
を重ね熱圧着成形したプリント配線基板において、前記
ガラス織布は、レゾルシン・ホルマリン縮合樹脂とラテ
ックスとを混合した接着液を塗布した後前記樹脂組成物
を含浸せしめられることを特徴とするプリント配線基板
。In a printed wiring board in which metal foil is laminated and thermocompression molded on a laminate using a prepreg in which a glass woven fabric is impregnated with a resin composition containing polybutadiene and its derivatives, the glass woven fabric is made of resorcinol formalin condensed resin and latex. 1. A printed wiring board characterized in that the printed wiring board is impregnated with the resin composition after applying an adhesive solution mixed with the above resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11648487A JPS63281494A (en) | 1987-05-13 | 1987-05-13 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11648487A JPS63281494A (en) | 1987-05-13 | 1987-05-13 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63281494A true JPS63281494A (en) | 1988-11-17 |
Family
ID=14688253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11648487A Pending JPS63281494A (en) | 1987-05-13 | 1987-05-13 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63281494A (en) |
-
1987
- 1987-05-13 JP JP11648487A patent/JPS63281494A/en active Pending
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