JP2003017820A - Relative permittivity stabilized printed wiring board material and use thereof - Google Patents
Relative permittivity stabilized printed wiring board material and use thereofInfo
- Publication number
- JP2003017820A JP2003017820A JP2001197871A JP2001197871A JP2003017820A JP 2003017820 A JP2003017820 A JP 2003017820A JP 2001197871 A JP2001197871 A JP 2001197871A JP 2001197871 A JP2001197871 A JP 2001197871A JP 2003017820 A JP2003017820 A JP 2003017820A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- resin
- relative permittivity
- board material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高度情報・通信分野関
連の機器に要求される特性を備えたプリプレグのような
プリント配線板材料、及びその用途、例えば金属張基板
及び多層プリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board material such as a prepreg having characteristics required for equipment related to the advanced information and communication fields, and its use, for example, a metal-clad board and a multilayer printed wiring board. .
【０００２】[0002]
【従来の技術】近年、情報処理の高速化や移動体通信の
高周波数化が急速に進んでいる。それに伴って、パソコ
ン、液晶、サーバーなどのコンピュータ関連機器及び携
帯電話、交換機などの通信機器に用いられているプリン
ト配線板や多層プリント配線板にも、絶縁信頼性、寸法
安定性などの基本的性能に加えて、高速化や高周波数化
に対応した材料が求められている。2. Description of the Related Art In recent years, the speeding up of information processing and the increasing frequency of mobile communication have been rapidly progressing. Along with that, the printed wiring boards and multilayer printed wiring boards used in computer-related devices such as personal computers, liquid crystals, and servers, and communication devices such as mobile phones and exchanges are basically required to have insulation reliability and dimensional stability. In addition to performance, materials that can handle higher speeds and higher frequencies are required.
【０００３】素子の高速化を図るには、電気信号の伝送
速度を速くすることが必要である。この伝送速度は、多
層プリント配線板材料の誘電率の平方根に反比例する。
したがって、素子の高速化には、材料の比誘電率ばらつ
きを低減する必要がある。In order to increase the speed of the device, it is necessary to increase the transmission speed of electric signals. This transmission rate is inversely proportional to the square root of the dielectric constant of the multilayer printed wiring board material.
Therefore, in order to increase the device speed, it is necessary to reduce the variation in the relative dielectric constant of the material.
【０００４】また、素子の高周波数化を図る場合、周波
数が高くなるにつれ電気信号の移送遅れ（伝送損失）が
大きくなるという問題がある。素子を搭載した機器を正
常に作動させるためには、このような伝送損失（誘電損
失）のばらつきを抑える必要がある。ここで、伝送損失
は、次式：Further, when the frequency of the element is increased, there is a problem that the transfer delay (transmission loss) of the electric signal increases as the frequency increases. In order for a device equipped with an element to operate normally, it is necessary to suppress such variations in transmission loss (dielectric loss). Here, the transmission loss is calculated by the following equation:
【０００５】信号の伝送損失＝（係数）×周波数×√
（比誘電率）×誘電正接Transmission loss of signal = (coefficient) × frequency × √
(Relative permittivity) x dielectric loss tangent
【０００６】で表されるように、比誘電率の平方根に比
例することから、伝送損失のばらつきを小さくするた
め、多層プリント配線板の比誘電率ばらつきを抑える必
要がある。As represented by the formula, since it is proportional to the square root of the relative permittivity, it is necessary to suppress the relative permittivity variation of the multilayer printed wiring board in order to reduce the variation of the transmission loss.
【０００７】多層プリント配線板の比誘電率は、個々の
固有材料の比誘電率と、その材料の比率によって定ま
る。つまり、ガラス基材と含浸樹脂の材料比率が常に一
定であれば、比誘電率は一定となる。しかし、プリプレ
グ、金属張基板及び多層プリント配線板は、所望の成形
性及び加工性を得るために、樹脂を含浸させたプリプレ
グを用い、内層回路の埋め込みにも樹脂を用いている。
こうして、プリプレグ中のガラス基材と含浸樹脂の材料
比率に偏差が生じ、それを用いた積層板のガラス基材と
含浸樹脂の材料比率にも偏差が生じ、結果として比誘電
率にばらつきが発生していた。そのため、ガラス基材と
含浸樹脂の材料比率を一定に保つことは困難であり、多
層プリント配線板材料の比誘電率を、簡便に一定化する
方法及び材料が求められている。The relative permittivity of the multilayer printed wiring board is determined by the relative permittivity of each specific material and the ratio of the materials. That is, if the material ratio of the glass base material and the impregnated resin is always constant, the relative dielectric constant is constant. However, a prepreg impregnated with a resin is used for the prepreg, the metal-clad substrate, and the multilayer printed wiring board to obtain desired moldability and workability, and the resin is also used for embedding the inner layer circuit.
In this way, a deviation occurs in the material ratio of the glass base material and the impregnated resin in the prepreg, and a deviation also occurs in the material ratio of the glass base material and the impregnated resin of the laminated board using the prepreg, resulting in variations in the relative dielectric constant. Was. Therefore, it is difficult to keep the material ratio of the glass base material and the impregnated resin constant, and there is a demand for a method and a material for easily making the relative permittivity of the multilayer printed wiring board material constant.
【０００８】[0008]
【発明が解決しようとする課題】本発明の目的は、上記
の問題を鑑み、補強材と含浸樹脂の材料比率に影響を受
けずに比誘電率のばらつきを低減したプリント配線板材
料、例えばプリプレグ、及びその用途、例えば金属張基
板及び多層プリント配線板を提供することである。SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a printed wiring board material, such as a prepreg, which has a reduced variation in relative dielectric constant without being affected by the material ratio of the reinforcing material and the impregnated resin. And its applications, such as metal-clad substrates and multilayer printed wiring boards.
【０００９】[0009]
【課題を解決するための手段】本発明は、補強材及び樹
脂を含むプリント配線板材料において、該補強材と該樹
脂の比誘電率（１MHz）の差が、２以内であることを特
徴とする、比誘電率を安定化させたプリント配線板材料
に関する。The present invention is characterized in that in a printed wiring board material containing a reinforcing material and a resin, the difference in relative dielectric constant (1 MHz) between the reinforcing material and the resin is within 2. And a printed wiring board material having a stabilized relative dielectric constant.
【００１０】[0010]
【発明の実施の形態】本発明者は、永年の研究の結果、
樹脂分の比率変化による比誘電率を安定化させるには補
強材と樹脂硬化物の比誘電率（ε、１MHzで計測した。
以下同じ）の差が２以内とすることを見出したものであ
る。DETAILED DESCRIPTION OF THE INVENTION As a result of many years of research, the present inventor
In order to stabilize the relative permittivity by changing the ratio of the resin component, the relative permittivity of the reinforcing material and the cured resin (ε, 1 MHz was measured.
The same applies to the following).
【００１１】本発明によれば、補強材及び樹脂を含むプ
リント配線板材料は、例えば、プリプレグ、ボンディン
グシート、絶縁基板、金属張基板、銅張積層板、多層プ
リント配線板、多層化接着用材料等を意味する。According to the present invention, a printed wiring board material containing a reinforcing material and a resin is, for example, a prepreg, a bonding sheet, an insulating substrate, a metal-clad substrate, a copper-clad laminate, a multilayer printed wiring board, a multilayer adhesive material. Means etc.
【００１２】本発明で用いる樹脂には、公知の樹脂を用
いることができる。例えば、エポキシ樹脂、フッ素樹
脂、ポリイミド樹脂、フェノール樹脂、ポリ（フェニレ
ン）オキシドのような芳香族エーテル、これらの変性
物、これらの混合物が挙げられる。例えば、エポキシ樹
脂として、ビスフェノールＡ型エポキシ樹脂、ビスフェ
ノールＦ型エポキシ樹脂、ノボラック型エポキシ樹脂、
これらの変性物が挙げられる。As the resin used in the present invention, known resins can be used. Examples thereof include epoxy resins, fluororesins, polyimide resins, phenol resins, aromatic ethers such as poly (phenylene) oxide, modified products thereof, and mixtures thereof. For example, as the epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin,
These modified products are mentioned.
【００１３】本発明で用いる補強材は、公知の補強材を
用いることができる。例えば、紙、合成繊維布、ガラス
布、ガラス不織布などのガラス基材等が挙げられる。ガ
ラス基材の場合、例えば、Ｓガラス（ε＝５．３）、Ｄ
ガラス（ε＝４．１）、低誘電ガラス織布ε＝４．６）
が挙げられる。As the reinforcing material used in the present invention, a known reinforcing material can be used. Examples thereof include glass substrates such as paper, synthetic fiber cloth, glass cloth, and glass non-woven cloth. In the case of a glass substrate, for example, S glass (ε = 5.3), D
Glass (ε = 4.1), low dielectric glass woven fabric ε = 4.6)
Is mentioned.
【００１４】本発明によれば、プリント配線板材料、例
えばプリプレグは、補強材に樹脂を含浸させ、Ｂステー
ジまで硬化させて、シート状のプリプレグを形成するこ
とができる。プレプリグのようなボンディングシートを
積層、接着して得た絶縁基板について、片面又は両面を
金属箔で覆い、プリント配線板用の絶縁基板である金属
張基板を形成することができる。金属張基板に導体パタ
ーンを形成して、内層用配線板を得て、これを多層重ね
て多層プリント配線板を形成することができる。According to the present invention, a printed wiring board material, for example, a prepreg, can be formed into a sheet-like prepreg by impregnating a reinforcing material with a resin and curing it to the B stage. An insulating substrate obtained by laminating and adhering a bonding sheet such as a prepreg can be covered on one side or both sides with a metal foil to form a metal-clad substrate which is an insulating substrate for a printed wiring board. A conductor pattern can be formed on a metal-clad substrate to obtain an inner layer wiring board, which can be laminated in multiple layers to form a multilayer printed wiring board.
【００１５】本発明のプリント配線板材料において、補
強材と樹脂の比誘電率の差Δεを２以下とするには、そ
れぞれの比誘電率を考慮して組み合わせる。いずれか一
方の材料を選択し、一方の比誘電率から他方の材料に所
要の比誘電率を求めて、他方の材料を選択することが好
ましい。比誘電率の差Δεは２以下であるが、Δε＜
１．５が好ましく、Δε＜１．０がより好ましい。In the printed wiring board material of the present invention, in order to make the difference Δε in relative permittivity between the reinforcing material and the resin 2 or less, the respective relative permittivities are taken into consideration in combination. It is preferable to select one of the materials, obtain the required relative permittivity of the other material from the relative permittivity of the one, and select the other material. The difference in relative permittivity Δε is 2 or less, but Δε <
1.5 is preferable, and Δε <1.0 is more preferable.
【００１６】本発明によれば、本発明のプリント配線板
材料に用いる補強材及び樹脂硬化物の組合せとして、エ
ポキシ樹脂と比誘電率１〜６のガラス基材が挙げられ
る。エポキシ樹脂の場合、樹脂硬化物の比誘電率εが３
〜４である。したがって、用いるガラス基材として、比
誘電率εは１〜６が好ましく、ε＝１．５〜５．５がよ
り好ましく、ε＝２〜５が更に好ましい。このようなガ
ラス基材としては、例えば、Ｓガラス（ε＝５．３）、
Ｄガラス（ε＝４．１）、日東紡績製低誘電ガラス織布
（ε＝４．６）が挙げられる。例えば、エポキシ樹脂よ
りもガラス基材の比誘電率の方が大きい場合、エポキシ
樹脂の比誘電率３〜４に対し、ガラス基材の比誘電率は
３〜６、好ましくは３〜５．５、より好ましくは３〜５
とすることができる。According to the present invention, as the combination of the reinforcing material and the cured resin used in the printed wiring board material of the present invention, an epoxy resin and a glass base material having a relative dielectric constant of 1 to 6 can be mentioned. In the case of epoxy resin, the relative permittivity ε of the cured resin is 3
~ 4. Therefore, as the glass substrate used, the relative permittivity ε is preferably 1 to 6, more preferably ε = 1.5 to 5.5, and further preferably ε = 2 to 5. Examples of such a glass substrate include S glass (ε = 5.3),
Examples include D glass (ε = 4.1) and low dielectric glass woven fabric (ε = 4.6) manufactured by Nitto Boseki. For example, when the relative dielectric constant of the glass base material is larger than that of the epoxy resin, the relative dielectric constant of the glass base material is 3 to 6, while the relative dielectric constant of the glass base material is 3 to 4, and preferably 3 to 5.5. , And more preferably 3 to 5
Can be
【００１７】本発明によれば、本発明の樹脂に、本発明
の目的を阻害しない範囲で、添加剤を含有させることが
できる。例えば、硬化促進剤、希釈剤、可撓性付与剤、
充填剤、難燃剤等が挙げられる。According to the present invention, the resin of the present invention can contain additives within the range not impairing the object of the present invention. For example, a curing accelerator, a diluent, a flexibility-imparting agent,
Examples include fillers and flame retardants.
【００１８】本発明のプリント配線板材料は、誘電特性
のばらつきを抑えたい層に、又は全ての層に用いること
ができる。絶縁基板、金属張基板の積層体、多層プリン
ト配線板、多層化接着用に用いることができる。本発明
によれば、上記の基板又は配線板等において、一つの製
品においては、同一の樹脂系プリプレグを用いることが
好ましい。The printed wiring board material of the present invention can be used for a layer in which variations in dielectric properties are desired to be suppressed, or for all layers. It can be used for an insulating substrate, a laminate of metal-clad substrates, a multilayer printed wiring board, and a multilayer adhesive. According to the present invention, it is preferable to use the same resin-based prepreg in one product in the above-mentioned substrate or wiring board.
【００１９】[0019]
【実施例】下記の実施例により、本発明を詳細に説明す
るが、これらの例はいかなる意味においても本発明を限
定するものではない。なお、実施例中、特に断らない限
り、部は重量部を意味する。The present invention will be described in detail by the following examples, but these examples do not limit the present invention in any sense. In the examples, "parts" means "parts by weight" unless otherwise specified.
【００２０】実施例１〜５
（ａ）臭素化ビスフェノールＡ型エポキシ樹脂１００
部、ジシアンジアミド３部、２−エチル−４−メチルイ
ミダゾール０．２部、エチレングリコールモノメチルエ
ーテル２５部、及びＮ，Ｎ−ジメチルホルムアミド２５
部を混合して、エポキシ樹脂ワニスを得た。
（ｂ）このエポキシ樹脂ワニス中に、１００μm厚さの
低誘電ガラス織布（日東紡績製、ε＝４．６、坪量９４
g/m2）を含浸させ、温度１５０℃の乾燥器中で４分間乾
燥させ、５cm角のＢ−ステージ状態のプリプレグ１（樹
脂分５２％）を得た。
（ｃ）プリプレグ１を２枚重ね、それらの外側に３５μ
m厚さの銅箔を配し、３MPa、１８０℃で加熱加圧し、積
層体を形成して、厚さ０．２mmの両面銅張積層板を得
た。
これを繰り返して、特性測定用試料を得て、任意に５枚
取り出し、実施例１〜５の試料とした。Examples 1 to 5 (a) Brominated bisphenol A type epoxy resin 100
Parts, dicyandiamide 3 parts, 2-ethyl-4-methylimidazole 0.2 parts, ethylene glycol monomethyl ether 25 parts, and N, N-dimethylformamide 25.
The parts were mixed to obtain an epoxy resin varnish. (B) In this epoxy resin varnish, 100 μm thick low dielectric glass woven fabric (manufactured by Nitto Boseki, ε = 4.6, basis weight 94)
g / m 2 ) and impregnated with it for 4 minutes in a dryer at a temperature of 150 ° C. to obtain prepreg 1 (resin content: 52%) in a B-stage state of 5 cm square. (C) Two prepregs 1 are piled up, and 35 μ is placed outside them.
A copper foil having a thickness of m was arranged, heated and pressed at 3 MPa and 180 ° C. to form a laminate, and a double-sided copper-clad laminate having a thickness of 0.2 mm was obtained. By repeating this, a sample for characteristic measurement was obtained, and five samples were arbitrarily taken out to obtain samples of Examples 1 to 5.
【００２１】比誘電率の測定：得られたエポキシ樹脂ワ
ニスを、３MPa、１８０℃で１時間加熱加圧して、樹脂
ワニスの硬化物を得て、ＪＩＳ Ｃ−６４８１ ５．１
２に準拠し、１MHzでの比誘電率εを測定して、ε＝
３．７を得た。試料の板厚及び比誘電率の測定：板厚
（銅箔を含む全体厚）及び比誘電率を測定した。表１
に、結果を示す。Measurement of relative permittivity: The obtained epoxy resin varnish was heated and pressed at 3 MPa and 180 ° C. for 1 hour to obtain a cured product of the resin varnish, and JIS C-6481 5.1.
Based on 2, measure the relative permittivity ε at 1MHz and obtain ε =
I got 3.7. Measurement of plate thickness and relative permittivity of sample: Plate thickness (total thickness including copper foil) and relative permittivity were measured. Table 1
The results are shown in.
【００２２】比較例１〜５
実施例１（ｂ）において、１００μm厚さのＥ−ガラス
織布（日東紡績製、ε＝６．６、坪量１０４g/m2）を用
いた以外は、実施例１と同様にして、プリプレグ２（樹
脂分５２％）を得て、両面板を形成し、比較試料１〜５
を得た。比誘電率及び板厚を実施例と同様にして測定
し、その結果を表１に示す。Comparative Examples 1 to 5 Comparative Examples 1 to 5 were carried out except that 100 μm thick E-glass woven fabric (manufactured by Nitto Boseki, ε = 6.6, basis weight 104 g / m 2 ) was used. In the same manner as in Example 1, a prepreg 2 (resin content: 52%) was obtained, and a double-sided plate was formed.
Got The relative permittivity and the plate thickness were measured in the same manner as in the examples, and the results are shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】表１から明らかなように、ガラス基材と樹
脂ワニスの比誘電率の差Δεが、０．９である本発明の
実施例１〜５の試料は、プリント配線板材料の配合比率
（板厚）にばらつきがあっても、比誘電率はほぼ安定し
て、ε＝４．１５〜４．１７であった。しかし、Δε
が、２．９である比較例１〜５の試料は、プリント配線
板材料の配合比率のばらつきが本発明の半分であるにも
かかわらず、比誘電率は安定せず、ε＝４．４２〜４．
５９とばらつきが約５倍であった。As is apparent from Table 1, the samples of Examples 1 to 5 of the present invention in which the difference Δε in the relative dielectric constant between the glass base material and the resin varnish is 0.9 are the compounding ratios of the printed wiring board materials. Even if there were variations in (plate thickness), the relative permittivity was almost stable and was ε = 4.15 to 4.17. However, Δε
However, in the samples of Comparative Examples 1 to 5 with 2.9, the relative permittivity is not stable even though the variation in the compounding ratio of the printed wiring board material is half of that of the present invention, and ε = 4.42. ~ 4.
The variation was 59 times, about 5 times.
【００２５】[0025]
【発明の効果】本発明によれば、板厚や層間厚み、プリ
ント配線板材料の配合比率のばらつきが大きくとも、そ
の影響が比誘電率に反映されにくいプリプレグ、金属張
基板、及び多層プリント配線板を得ることができる。According to the present invention, the prepreg, the metal-clad substrate, and the multi-layered printed wiring are less likely to be affected by the relative permittivity even if there are large variations in the board thickness, the interlayer thickness, and the mixing ratio of the printed wiring board materials. The board can be obtained.
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Claims (4)
料において、該補強材と該樹脂の比誘電率（１MHz）の
差が、２以内であることを特徴とする、比誘電率を安定
化させたプリント配線板材料。1. A printed wiring board material containing a reinforcing material and a resin, wherein the difference in relative dielectric constant (1 MHz) between the reinforcing material and the resin is within 2 and the relative dielectric constant is stabilized. Printed wiring board material made.
該樹脂の比誘電率が、１〜６である、請求項１記載のプ
リント配線板材料。2. The dielectric constant of the reinforcing material is 3 to 4,
The printed wiring board material according to claim 1, wherein the resin has a relative dielectric constant of 1 to 6.
該樹脂が、エポキシ樹脂である、請求項１又は２記載の
プリント配線板材料。3. The printed wiring board material according to claim 1, wherein the reinforcing material is a glass base material, and the resin is an epoxy resin.
ント配線板材料を用いた金属張積層板。4. A metal-clad laminate using the printed wiring board material according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001197871A JP2003017820A (en) | 2001-06-29 | 2001-06-29 | Relative permittivity stabilized printed wiring board material and use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001197871A JP2003017820A (en) | 2001-06-29 | 2001-06-29 | Relative permittivity stabilized printed wiring board material and use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003017820A true JP2003017820A (en) | 2003-01-17 |
Family
ID=19035406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001197871A Pending JP2003017820A (en) | 2001-06-29 | 2001-06-29 | Relative permittivity stabilized printed wiring board material and use thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003017820A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006232952A (en) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | Prepreg containing polyphenylene resin composition and laminate |
| EP2913354A4 (en) * | 2014-01-14 | 2017-01-25 | Shengyi Technology Co., Ltd. | Circuit substrate and preparation method thereof |
| JP2017073460A (en) * | 2015-10-07 | 2017-04-13 | 日立化成株式会社 | Multilayer transmission line plate |
| WO2018061736A1 (en) * | 2016-09-27 | 2018-04-05 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, printed wiring board and metal foil with resin |
-
2001
- 2001-06-29 JP JP2001197871A patent/JP2003017820A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006232952A (en) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | Prepreg containing polyphenylene resin composition and laminate |
| EP2913354A4 (en) * | 2014-01-14 | 2017-01-25 | Shengyi Technology Co., Ltd. | Circuit substrate and preparation method thereof |
| KR101819805B1 (en) | 2014-01-14 | 2018-01-17 | 셍기 테크놀로지 코. 엘티디. | Circuit substrate and Process for Preparing the same |
| JP2017073460A (en) * | 2015-10-07 | 2017-04-13 | 日立化成株式会社 | Multilayer transmission line plate |
| WO2018061736A1 (en) * | 2016-09-27 | 2018-04-05 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, printed wiring board and metal foil with resin |
| JP2018052111A (en) * | 2016-09-27 | 2018-04-05 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, printed wiring board and metal foil with resin |
| JP6994660B2 (en) | 2016-09-27 | 2022-01-14 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate and printed wiring board |
| US11351755B2 (en) | 2016-09-27 | 2022-06-07 | Panasonic Intellectual Property Management Co., Ltd. | Metal-clad laminate, printed wiring board and metal foil with resin |
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