JP2708821B2 - Electric laminate - Google Patents
Electric laminateInfo
- Publication number
- JP2708821B2 JP2708821B2 JP63286302A JP28630288A JP2708821B2 JP 2708821 B2 JP2708821 B2 JP 2708821B2 JP 63286302 A JP63286302 A JP 63286302A JP 28630288 A JP28630288 A JP 28630288A JP 2708821 B2 JP2708821 B2 JP 2708821B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal foil
- adhesive
- silicon nitride
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電気機器，電子機器，計算機，通信機器
等に用いられる電気用積層板に関する。Description: TECHNICAL FIELD The present invention relates to an electric laminate used for electric equipment, electronic equipment, computers, communication equipment and the like.
樹脂ワニスを基材に含浸してなる樹脂含浸基材からな
る絶縁層（絶縁基板）の表面に銅箔等の金属箔が配設さ
れ、これを積層一体化してなる電気用積層板は、電気・
電子機器，計算機あるいは通信機器等を構成するプリン
ト配線板材料等として汎用されている。A metal foil such as a copper foil is provided on the surface of an insulating layer (insulating substrate) made of a resin-impregnated base material in which a resin varnish is impregnated into a base material.・
It is widely used as a printed wiring board material or the like constituting an electronic device, a computer or a communication device.
従来、上記樹脂含浸基材絶縁基板（樹脂含浸基材から
なる積層体であることが多い）に金属箔を配設するにあ
たり、その樹脂含浸基材に含浸されている樹脂ワニスの
種類に応じて、一般に次のような方法が採られていた。
すなわち、樹脂ワニス中の樹脂がフェノール樹脂、ポリ
イミド樹脂，不飽和ポリエステル樹脂等である場合は、
エポキシ樹脂を主成分とする接着剤を金属箔に塗布し、
この接着剤付金属箔を樹脂含浸基材絶縁基板と重ねて一
体化するようにし、他方、樹脂ワニスがエポキシ樹脂ワ
ニスの場合は、接着剤を塗布せずに金属箔をそのまま用
いるようにするのである。Conventionally, when arranging a metal foil on the above-mentioned resin-impregnated substrate insulating substrate (often a laminate made of the resin-impregnated substrate), depending on the type of resin varnish impregnated on the resin-impregnated substrate, In general, the following method has been adopted.
That is, when the resin in the resin varnish is a phenol resin, a polyimide resin, an unsaturated polyester resin, or the like,
Apply an adhesive mainly composed of epoxy resin to the metal foil,
This metal foil with an adhesive is laminated and integrated with the resin-impregnated base insulating substrate. On the other hand, when the resin varnish is an epoxy resin varnish, the metal foil is used as it is without applying an adhesive. is there.
最近、プリント配線板の高密度化，多層化、あるいは
多層プリント配線板の多用化に伴い、搭載する電子部品
の発熱が基板に蓄積されて基板の劣化を招き、ひいては
LSI等の誤動作の一因ともなって問題化されている。こ
の基板の劣化は、まず、金属箔（回路）の剥離となって
あらわれ、これがプリント配線板の信頼性を大きく左右
しているのである。Recently, with the increase in the density of printed wiring boards, the increase in the number of layers, and the increase in the number of multilayer printed wiring boards, heat generated by electronic components to be mounted is accumulated on the boards, causing deterioration of the boards.
This has been problematic as a cause of malfunctions of LSIs and the like. The deterioration of the substrate first appears as peeling of the metal foil (circuit), which greatly affects the reliability of the printed wiring board.
こうした事情に鑑み、この発明は、金属箔の剥離しに
くい電気用積層板を提供することを課題とする。In view of such circumstances, an object of the present invention is to provide an electric laminate that is difficult to peel off a metal foil.
上記課題を解決するために検討を重ねた結果、金属箔
を接着している接着層の熱劣化を防止すればよく、その
ためには接着層の熱伝導率を高める必要があることを見
出して、この発明を完成させるに至った。As a result of repeated studies to solve the above problems, it is sufficient to prevent thermal deterioration of the adhesive layer bonding the metal foil, and found that it is necessary to increase the thermal conductivity of the adhesive layer, The present invention has been completed.
したがって、この発明は、絶縁基板の少なくとも片面
に接着層を介して金属箔が積層されてなる電気用積層板
であって、前記絶縁基板の基材がガラス布およびガラス
不織布から選ばれる少なくとも１つからなり、前記接着
層が、窒化ケイ素を３〜50重量％含有するエポキシ系接
着剤により構成されていることを特徴とする。Therefore, the present invention provides an electric laminate in which a metal foil is laminated on at least one surface of an insulating substrate via an adhesive layer, wherein the base material of the insulating substrate is at least one selected from glass cloth and glass nonwoven fabric. Wherein the adhesive layer is made of an epoxy adhesive containing 3 to 50% by weight of silicon nitride.
この発明にかかる電気用積層板の金属箔用接着層は、
熱放散性に優れた窒化ケイ素を含有する接着剤により構
成されているため、同層の熱伝導率が向上して熱劣化が
防止される。すなわち、金属箔の剥離が抑えられる。The adhesive layer for metal foil of the electric laminate according to the present invention,
Since the layer is made of an adhesive containing silicon nitride having excellent heat dissipation properties, the thermal conductivity of the layer is improved and thermal deterioration is prevented. That is, peeling of the metal foil is suppressed.
上記接着剤中の窒化ケイ素含有量は、３〜50重量％
（以下、単に「％」と記す）に設定され、３％に満たな
い場合は添加効果が得られず、50％を越えると接着剤の
接着性が低下する。なお、上記含有量は、接着剤乾燥後
の重量（あるいは固形分量）を基準としている。The silicon nitride content in the adhesive is 3 to 50% by weight
(Hereinafter simply referred to as “%”). When the amount is less than 3%, the effect of addition cannot be obtained, and when it exceeds 50%, the adhesiveness of the adhesive decreases. In addition, the said content is based on the weight (or solid content) after adhesive drying.
以下に、この発明を詳しく説明する。 Hereinafter, the present invention will be described in detail.
まず、絶縁基板の基材としては、ガラス布およびガラ
ス不織布から選ばれる少なくとも１つが用いられる。First, as the base material of the insulating substrate, at least one selected from glass cloth and glass nonwoven fabric is used.
基材に含浸させる樹脂には、特に限定はされないが、
フェノール樹脂，ポリイミド樹脂，不飽和ポリエステル
樹脂，エポキシ樹脂，ポリブタジエン樹脂，フッ素樹
脂，ケイ素樹脂,PPO（ポリフェニレンオキシド）樹脂等
が適しており、これらを複数種併用してもよい。The resin to be impregnated into the base material is not particularly limited,
Phenol resin, polyimide resin, unsaturated polyester resin, epoxy resin, polybutadiene resin, fluororesin, silicon resin, PPO (polyphenylene oxide) resin and the like are suitable, and plural kinds thereof may be used in combination.
上記樹脂の基材への含浸方法は、特に限定されること
はなく、常法に従って上記樹脂に硬化剤，硬化助剤，溶
媒等を加えて樹脂ワニスを調製し、以下、浸漬法，スク
イズ法，キッス法等の任意の方法により含浸される。必
要に応じては、１次,2次含浸と分割含浸させることによ
り、含浸性が一層向上する。樹脂の含浸量についても、
特に限定はされないが、乾燥後の樹脂量で40〜60％程度
となることが好ましい。The method of impregnating the base material with the resin is not particularly limited, and a resin varnish is prepared by adding a curing agent, a curing aid, a solvent, and the like to the resin according to a conventional method. , Kiss method, etc. If necessary, primary and secondary impregnation and divided impregnation further improve the impregnation. Regarding the resin impregnation amount,
Although not particularly limited, the resin amount after drying is preferably about 40 to 60%.
以上のようにして得られる樹脂含浸基材からなる絶縁
基板は、通常、必要に応じて複数枚の樹脂含浸基材が積
層されてなることが多いが、もちろん樹脂含浸基材１枚
から構成されていてもよい。さらに、上記樹脂含浸基材
以外の材料、たとえば絶縁性の樹脂シート等が併用され
ていてもよく、その構成等、特に限定されることはな
い。The insulating substrate made of the resin-impregnated base material obtained as described above is usually formed by laminating a plurality of resin-impregnated base materials as needed. May be. Further, a material other than the resin-impregnated base material, for example, an insulating resin sheet or the like may be used in combination, and the configuration and the like are not particularly limited.
上記絶縁基板の少なくとも片面（上面および／または
下面）には、上述のように、窒化ケイ素を３〜50％含有
する接着剤からなる接着層を介して金属箔が積層され
る。そして、得られた積層体が一体化されて、この発明
にかかる電気用積層板が得られる。なお、上記金属箔と
しては、特に限定はされず、銅，アルミニウム，ニッケ
ル等の任意の金属箔を用いることができる。As described above, a metal foil is laminated on at least one surface (upper surface and / or lower surface) of the insulating substrate via an adhesive layer made of an adhesive containing 3 to 50% of silicon nitride. And the obtained laminated body is integrated, and the electric laminated board according to the present invention is obtained. The metal foil is not particularly limited, and any metal foil such as copper, aluminum, and nickel can be used.
上記接着剤は、上記所定量の窒化ケイ素を含有するエ
ポキシ系接着剤であれば、特に限定はない。上記窒化ケ
イ素は、磁性分量200ppm以下のものを用いることが好ま
しく、さらには、平均粒径１〜50μm,最大粒径150μｍ
以下のものを用いることが推奨されるが、これらに限定
されることはない。また、その化学組成等は、特に限定
はされず、たとえばSi2N2,SiN,Si3N4等を単独で、ある
いは複数組み合わせて用いることができる。なお、この
発明では、接着剤中の上記３〜50％の窒化ケイ素の一部
が、その他の熱放散性のよい物質で置き換わっていても
よい。すなわち、その他の熱放散性のよい物質が窒化ケ
イ素と併用されていてもよく、その際、任意の併用物質
と窒化ケイ素との総量が、接着剤中の50％を越えないよ
うに設定されることが好ましい。The adhesive is not particularly limited as long as it is an epoxy-based adhesive containing the predetermined amount of silicon nitride. The silicon nitride preferably has a magnetic content of 200 ppm or less, and more preferably has an average particle size of 1 to 50 μm and a maximum particle size of 150 μm.
It is recommended to use, but not limited to: The chemical composition and the like are not particularly limited, and for example, Si 2 N 2 , SiN, Si 3 N 4 and the like can be used alone or in combination. In the present invention, a part of the above 3 to 50% of silicon nitride in the adhesive may be replaced by another substance having a good heat dissipation property. That is, other materials having good heat dissipation properties may be used in combination with silicon nitride, and in this case, the total amount of any combination material and silicon nitride is set so as not to exceed 50% of the adhesive. Is preferred.
構成される接着層については、その厚み（塗布量）
等、特に限定されることはない。なお、接着層は、予め
金属箔上に形成されていることが好ましい。この接着層
付金属箔を配設した後の積層一体化は、通常の積層プレ
ス工程に添って行われ、特に限定されることはない。The thickness (coating amount) of the constituted adhesive layer
There is no particular limitation. Note that the adhesive layer is preferably formed on a metal foil in advance. The lamination and integration after disposing the metal foil with the adhesive layer is performed according to a usual lamination pressing step, and is not particularly limited.
以下に、この発明のさらに詳しい実施例について、比
較例と併せて説明するが、この発明にかかる電気用積層
板が、同実施例に限定されるものではないことは言うま
でもない。Hereinafter, more detailed examples of the present invention will be described together with comparative examples, but it goes without saying that the electrical laminate according to the present invention is not limited to the examples.
−実施例１〜３− 下記の各成分（「部」は重量部を表す） からなる樹脂ワニスを調製し、これを、乾燥後重量が50
％になるように、厚さ0.2mmのガラス布に含浸させ、乾
燥させた。-Examples 1-3-The following components ("part" represents part by weight) A resin varnish consisting of
% And impregnated in a 0.2 mm thick glass cloth and dried.
得られた樹脂含浸基材を７枚積層し、その上下に、第
１表に示した組成の窒化ケイ素入りエポキシ系接着剤が
塗布（250g/m2）された、厚さ0.035mmの銅箔をそれぞれ
配設し、得られた積層体を成形圧力40kg/cm2，温度165
℃で120分間積層成形して電気用積層板を得た。なお、
窒化ケイ素は、日本電工（株）製のもの（組成：Si3N4
98％以上,Si0.3％。,Fe0.6％,Al0.2％,Ca0.1％,C0.1
％、平均粒径30μm,最大粒径100μｍ）を用いた。A copper foil having a thickness of 0.035 mm, in which seven resin-impregnated substrates obtained are laminated, and an epoxy-based adhesive containing silicon nitride having a composition shown in Table 1 is applied (250 g / m 2 ) on and under the resin-impregnated base material And the obtained laminate is molded at a molding pressure of 40 kg / cm 2 and at a temperature of 165.
Laminate molding was performed at 120 ° C. for 120 minutes to obtain a laminate for electric use. In addition,
Silicon nitride is manufactured by Nippon Denko Corporation (composition: Si 3 N 4
98% or more, Si 0.3%. , Fe0.6%, Al0.2%, Ca0.1%, C0.1
%, Average particle size 30 μm, maximum particle size 100 μm).
−比較例− エポキシ系接着剤として、窒化ケイ素を含まないもの
を用いるようにする他は、上記実施例と同様にして、電
気用積層板を作製した。-Comparative Example- An electric laminate was produced in the same manner as in the above example, except that an epoxy-based adhesive containing no silicon nitride was used.
上記得られた実施例および比較例の電気用積層板につ
いて、160℃×500時間後の銅箔ピーリング強度および接
着層の熱伝導率を測定した。With respect to the electric laminates obtained in Examples and Comparative Examples, the copper foil peeling strength and the thermal conductivity of the adhesive layer after 160 ° C. for 500 hours were measured.
結果を、同じく第１表に示す。 The results are also shown in Table 1.
第１表にみるように、銅箔を接着する接着剤として窒
化ケイ素を含むエポキシ系接着剤が用いられている実施
例の電気用積層板は、比較例に比べ、同接着剤により構
成される接着層の熱伝導率に優れ、銅箔ピーリング強度
の大きい、すなわち銅箔の剥がれにくいものになってい
る。 As shown in Table 1, the electrical laminate of the example in which the epoxy adhesive containing silicon nitride is used as the adhesive for bonding the copper foil is configured by the same adhesive as the comparative example. The adhesive layer has excellent thermal conductivity and high copper foil peeling strength, that is, the copper foil is hardly peeled off.
以上のように、この発明にかかる電気用積層板では、
熱放散性に優れた窒化ケイ素を含有するエポキシ系接着
剤が用いられているため、金属箔を接着している接着層
の熱伝導率が向上してその熱劣化が防止され、金属箔の
剥離が抑えられる。したがって、この発明の電気用積層
板を用いて、たとえば、回路の脱落等のない、信頼性の
高いプリント配線板や多層プリント配線板を実現するこ
とが可能となる。As described above, in the electric laminate according to the present invention,
Since an epoxy adhesive containing silicon nitride with excellent heat dissipation is used, the thermal conductivity of the adhesive layer that adheres the metal foil is improved, the thermal deterioration is prevented, and the metal foil is peeled. Is suppressed. Therefore, using the electrical laminate of the present invention, it is possible to realize a highly reliable printed wiring board or multilayer printed wiring board without, for example, dropping out of a circuit.
Claims (1)
て金属箔が積層されてなる電気用積層板であって、前記
絶縁基板の基材がガラス布およびガラス不織布から選ば
れる少なくとも１つからなり、前記接着層が、窒化ケイ
素を３〜50重量％含有するエポキシ系接着剤により構成
されていることを特徴とする電気用積層板。1. An electric laminate comprising a metal foil laminated on at least one surface of an insulating substrate via an adhesive layer, wherein the base material of the insulating substrate is at least one selected from glass cloth and glass nonwoven fabric. Wherein the adhesive layer is made of an epoxy adhesive containing 3 to 50% by weight of silicon nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63286302A JP2708821B2 (en) | 1988-11-11 | 1988-11-11 | Electric laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63286302A JP2708821B2 (en) | 1988-11-11 | 1988-11-11 | Electric laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02130143A JPH02130143A (en) | 1990-05-18 |
| JP2708821B2 true JP2708821B2 (en) | 1998-02-04 |
Family
ID=17702621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63286302A Expired - Lifetime JP2708821B2 (en) | 1988-11-11 | 1988-11-11 | Electric laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2708821B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4244298C2 (en) * | 1992-12-28 | 2003-02-27 | Alstom | Electrical tape and process for its manufacture |
| KR20160140996A (en) * | 2009-09-29 | 2016-12-07 | 히타치가세이가부시끼가이샤 | Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
| JPH0631162B2 (en) * | 1985-12-20 | 1994-04-27 | 株式会社クボタ | Adhesive for bonding silicon nitride ceramic sinter and bonding method |
| JPH0635565B2 (en) * | 1986-02-07 | 1994-05-11 | いすゞ自動車株式会社 | Heat resistant adhesive or coating agent |
| JPS62290087A (en) * | 1986-06-06 | 1987-12-16 | 松下電器産業株式会社 | Panel heater |
-
1988
- 1988-11-11 JP JP63286302A patent/JP2708821B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02130143A (en) | 1990-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3051700B2 (en) | Method of manufacturing multilayer wiring board with built-in element | |
| JP5344022B2 (en) | Epoxy resin composition, prepreg, laminate, resin sheet, printed wiring board, and semiconductor device | |
| JPH11126978A (en) | Multilayered wiring board | |
| JP2708821B2 (en) | Electric laminate | |
| JP3728059B2 (en) | Multilayer wiring board | |
| JPH02130146A (en) | Electrical laminate | |
| JP2957786B2 (en) | Method for manufacturing metal substrate with insulating layer | |
| JPH02130145A (en) | Electrical laminate | |
| JPH1034806A (en) | Laminate material and laminate | |
| JP2000238162A (en) | Laminate | |
| JPH07297509A (en) | Metallic base substrate and its manufacture | |
| JPH0553628B2 (en) | ||
| JPH02130144A (en) | Electrical laminate | |
| JPS61287198A (en) | Manufacture of metal based printed wiring board | |
| JPH0655477B2 (en) | Method for manufacturing ceramic coat laminate | |
| JPS60214953A (en) | Metallic base printed wiring substrate | |
| JPH0557754B2 (en) | ||
| JPS6369636A (en) | Electrical laminated board | |
| JPH07226593A (en) | Multilayer wiring board and its manufacture | |
| JPS59141283A (en) | Metal foil insulating adhesive sheet | |
| JPS63261795A (en) | Manufacture of multilayer interconnection board | |
| JPH0191488A (en) | Substrate for composite circuit | |
| JPS60136297A (en) | Multilayer circuit board | |
| JPH09153665A (en) | Heat-radiation printed circuit board and its manufacturing method | |
| JPH04119684A (en) | Metal circuit board |