JPS63261795A - Manufacture of multilayer interconnection board - Google Patents
Manufacture of multilayer interconnection boardInfo
- Publication number
- JPS63261795A JPS63261795A JP9655987A JP9655987A JPS63261795A JP S63261795 A JPS63261795 A JP S63261795A JP 9655987 A JP9655987 A JP 9655987A JP 9655987 A JP9655987 A JP 9655987A JP S63261795 A JPS63261795 A JP S63261795A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor
- resin
- manufacture
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000004020 conductor Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000012298 atmosphere Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- -1 polyoxypropylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、エレクトロニクス機器に用いる多層プリント
配線板に関するもので、とくに、その第１層厚体を熱硬
化性材料で形成し、第２層を接着剤付銅箔で形成する技
術に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multilayer printed wiring board used in electronic equipment, and in particular, the first thick layer is formed of a thermosetting material and the second layer is bonded. This article relates to a technology for forming copper foil with a chemical agent.
従来の技術
従来、多層配線板は、プリプレク材、銅箔を順次積み重
ねておき、これを−挙に加熱加圧成型して形成される。BACKGROUND OF THE INVENTION Conventionally, multilayer wiring boards are formed by sequentially stacking prepreg materials and copper foils and molding them together under heat and pressure.
また低コストな方法として、樹脂絶縁層を印刷し、導体
をその上にめっきすることを繰り返して製造する方法も
ある。前者は、コストが高（、製造に設備投資が大きく
なる欠点がある。後者は低コストではあるが、樹脂絶縁
層をスクリーン印刷形成するため気泡が残り、樹脂絶縁
層に欠陥を生じやすい。また、第１層に銀粉−樹脂系、
炭素粉−樹脂系の導電粉−樹脂系導体を用い、第２層に
接着剤付銅箔を用いる場合がある。この場合、第２層の
接着剤はＢステイジ硬化状態のものであり、気泡の有無
はあらかじめ検査できる利点がある。第１層が銅箔導体
であってもよいが、導電粉−樹脂系導体表面の方が接着
性良く、コスト的に安価である。Another low-cost method is to repeatedly print a resin insulating layer and plate a conductor thereon. The former has the disadvantage of high cost (and large capital investment for manufacturing).The latter has the disadvantage of being low in cost, but since the resin insulating layer is formed by screen printing, air bubbles remain and the resin insulating layer is prone to defects. , silver powder-resin system in the first layer,
A carbon powder-resin type conductive powder-resin type conductor may be used, and an adhesive-coated copper foil may be used as the second layer. In this case, the adhesive of the second layer is in a B-stage cured state, and there is an advantage that the presence or absence of air bubbles can be checked in advance. Although the first layer may be a copper foil conductor, a conductive powder-resin conductor surface has better adhesion and is cheaper in cost.
発明が解決しようとする問題点
ここで問題となるのは、第１層の導電粉−樹脂系導体を
印刷後熱硬化するに当って、基板の樹脂、導電粉−樹脂
系導体の樹脂が、分解ガスを生じ、それが第１層の導体
面に汚れとして付着すると、第２層の接着性が悪くなる
点である。洗浄工程を加えるにしても第１層が銅箔導体
である場合にくらべて酸洗浄により第１層の導電粉−樹
脂系導体中に酸がトラップされ腐食の原因となる。本発
明はこの点を解決した多層配線板を提供するものである
。Problems to be Solved by the Invention The problem here is that when the first layer of conductive powder-resin conductor is thermally cured after printing, the resin of the substrate and the resin of the conductive powder-resin conductor are If decomposed gas is generated and it adheres as dirt to the conductor surface of the first layer, the adhesion of the second layer will deteriorate. Even if a cleaning step is added, compared to the case where the first layer is a copper foil conductor, acid cleaning traps acid in the conductive powder-resin conductor of the first layer, causing corrosion. The present invention provides a multilayer wiring board that solves this problem.
問題点を解決するための手段
本発明は、絶縁基板上に第１層厚体として導体粉−樹脂
系ペイントを形成したのち、不活性溶液の蒸気中で硬化
処理するものである。不活性溶液として弗化ポリオキシ
プロピレンの１５０℃に沸点を有するものを加熱し、１
５０℃の熱硬化用蒸気雰囲気として用い、この時、密閉
容器内を２．１〜２．２気圧とする。Means for Solving the Problems In the present invention, a conductive powder-resin paint is formed as a first thick layer on an insulating substrate, and then cured in the vapor of an inert solution. As an inert solution, fluorinated polyoxypropylene having a boiling point of 150°C is heated, and 1
It is used as a steam atmosphere for thermosetting at 50°C, and at this time, the inside of the closed container is set at 2.1 to 2.2 atmospheres.
作用
本発明によると、第１層厚体層を接着剤付銅箔でおおい
加熱、加圧処理をおこなっても、接着剤は、第１導体層
の表面に良好な接着性を示すと共に、絶縁層部分に対し
ては、充填性すなわち濡れの良さがみられる。According to the present invention, even if the first thick body layer is covered with an adhesive-coated copper foil and subjected to heating and pressure treatment, the adhesive exhibits good adhesion to the surface of the first conductor layer and is not insulating. The layer portion shows good filling properties, that is, good wettability.
実施例
図面は本発明の実施例で用いた積層配線板の断面図であ
る。The embodiment drawings are cross-sectional views of laminated wiring boards used in embodiments of the present invention.
紙基材フェノール樹脂の基板絶縁基板１に、炭素粉−樹
脂系の導体材料（３０Ω／口）第１導体２を抑制して第
１導体層２を形成し、１５０℃。A first conductor layer 2 was formed on a paper-based phenol resin substrate insulating substrate 1 by suppressing the first conductor 2 using a carbon powder-resin conductor material (30Ω/hole) at 150°C.
３０分の条件で、前記樹脂板と共に硬化炉に入れる。こ
の硬化炉の雰囲気として弗化ポリオキシプロピレンの１
５０℃沸点の飽和蒸気を採用し、密閉容器内で２．１〜
２．２気圧とする。前記基板をとり出し冷却したのち厚
さ３５μの銅箔導体４に、厚さ１５μのエポキシ樹脂の
接着剤（例えば芳香族アミン硬化剤配合物）３を塗布し
、Ｂステイジ化したものを前記基板の全面をおおうよう
重ね、プレスによって加熱加圧（１４５℃、１１．７ｋ
ｇ／ｃ＋ｊ、３０分）処理する。The resin plate was placed in a curing oven for 30 minutes. As the atmosphere of this curing furnace, fluorinated polyoxypropylene
Adopts saturated steam with a boiling point of 50℃, and 2.1~
The pressure is 2.2 atm. After the board is taken out and cooled, a 15 μm thick epoxy resin adhesive (for example, an aromatic amine curing agent compound) 3 is applied to a 35 μm thick copper foil conductor 4 to form a B stage. Stacked to cover the entire surface, heated and pressed using a press (145℃, 11.7k)
g/c+j, 30 minutes).
次表には、多層成型時の雰囲気として第１導体層を窒素
気中で硬化したものならびに、常圧空気中で硬化したも
のを比較例として、本発明実施例の結果を示す。対象物
は、いずれも、３０Ω／口規格の抵抗性導体上に、前記
３５μの銅箔を裏面のＢステイジ接着剤を用いて、積層
プレスしたものの第１導体層との間の引きはがし強さを
数値で示したものである。The following table shows the results of the examples of the present invention, using comparative examples in which the first conductor layer was cured in nitrogen atmosphere and in normal pressure air as the atmosphere during multilayer molding. The peel strength between the objects and the first conductor layer was obtained by laminating and pressing the 35μ copper foil on a resistive conductor with a 30Ω/hole standard using B-stage adhesive on the back side. is shown numerically.
表
ｎ＝１０
発明の効果
本発明によれば、導体粉−樹脂系ペイントで導体層を印
刷形成したのち、不活性溶液の蒸気中で硬化熱処理する
ことにより、同上に第２層導電体を積層形成する際の付
着性向上が達成され、多層。Table n=10 Effects of the Invention According to the present invention, after printing a conductor layer with a conductor powder-resin paint, a second layer conductor is laminated thereon by curing heat treatment in vapor of an inert solution. Improved adhesion is achieved when forming multilayers.
配線板の形成が容易、確実である。Forming a wiring board is easy and reliable.
図面は本発明実施例で用いた積層配線板の断面図である
。
■・・・・・・絶縁基板、２・・・・・・第１導体、３
・・・・・・接着剤、４・・・・・・銅箔導体。
１−一一光オ＆基仄
２−７１ 岑イ（ζThe drawing is a cross-sectional view of a laminated wiring board used in an example of the present invention. ■...Insulating substrate, 2...First conductor, 3
...Adhesive, 4...Copper foil conductor. 1-11 Mitsuo & Moto2-71 岑い(ζ
Claims (1)
から発生する蒸気中で熱処理して形成したのち、第２層
として接着剤付銅箔を接着する工程をそなえた多層配線
板の製造方法。A multilayer wiring board comprising a step of forming a first conductor layer on a first insulating substrate by heat-treating it in vapor generated from an inert heat medium, and then bonding an adhesive-coated copper foil as a second layer. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9655987A JPS63261795A (en) | 1987-04-20 | 1987-04-20 | Manufacture of multilayer interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9655987A JPS63261795A (en) | 1987-04-20 | 1987-04-20 | Manufacture of multilayer interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63261795A true JPS63261795A (en) | 1988-10-28 |
Family
ID=14168404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9655987A Pending JPS63261795A (en) | 1987-04-20 | 1987-04-20 | Manufacture of multilayer interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63261795A (en) |
-
1987
- 1987-04-20 JP JP9655987A patent/JPS63261795A/en active Pending
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