JPH02130144A - Electrical laminate - Google Patents
Electrical laminateInfo
- Publication number
- JPH02130144A JPH02130144A JP28630388A JP28630388A JPH02130144A JP H02130144 A JPH02130144 A JP H02130144A JP 28630388 A JP28630388 A JP 28630388A JP 28630388 A JP28630388 A JP 28630388A JP H02130144 A JPH02130144 A JP H02130144A
- Authority
- JP
- Japan
- Prior art keywords
- magnesium silicate
- adhesive
- metal foil
- resin
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 239000011888 foil Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000391 magnesium silicate Substances 0.000 claims abstract description 21
- 229910052919 magnesium silicate Inorganic materials 0.000 claims abstract description 21
- 235000019792 magnesium silicate Nutrition 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004202 carbamide Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052620 chrysotile Inorganic materials 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- CWBIFDGMOSWLRQ-UHFFFAOYSA-N trimagnesium;hydroxy(trioxido)silane;hydrate Chemical compound O.[Mg+2].[Mg+2].[Mg+2].O[Si]([O-])([O-])[O-].O[Si]([O-])([O-])[O-] CWBIFDGMOSWLRQ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 fluororesin Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電気機器、電子機器、計算機１通信機器等
に用いられる電気用積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, computer communication equipment, etc.
樹脂フェスを基材に含浸してなる樹脂含浸基材からなる
絶縁層（絶縁基板）の表面に銅箔等の金属箔が配設され
、これを積層一体化してなる電気用積層板は、電気・電
子機器、計算機あるいは通信ｔａ器等を構成するプリン
ト配線板材料等として汎用されている。Electrical laminates are made by laminating metal foil such as copper foil on the surface of an insulating layer (insulating substrate) made of a resin-impregnated base material, which is made by impregnating the base material with a resin face.・It is widely used as a printed wiring board material for electronic equipment, computers, communication devices, etc.
従来、上記樹脂含浸基材絶縁基板（樹脂含浸基材からな
る積層体であることが多い）に金属箔を配設するにあた
り、その樹脂含浸基材に含浸されている樹脂ワニスの種
類に応じて、一般に次のような方法が採られていた。す
なわち、樹脂フェス中の樹脂がフェノール樹脂、ポリイ
ミド樹脂、不飽和ポリエステル樹脂等である場合は、エ
ポキシ樹脂を主成分とする接着剤を金属箔に塗布し、こ
の接着剤付金属箔を樹脂含浸基材絶縁基板と重ねて一体
化するようにし、他方、樹脂フェスがエポキシ樹脂ワニ
スの場合は、接着剤を塗布せずに金属箔をそのまま用い
るようにするのである。Conventionally, when disposing metal foil on the resin-impregnated base insulating substrate (often a laminate made of resin-impregnated base materials), depending on the type of resin varnish that is impregnated into the resin-impregnated base material, Generally, the following method was adopted. That is, when the resin in the resin face is phenolic resin, polyimide resin, unsaturated polyester resin, etc., an adhesive mainly composed of epoxy resin is applied to the metal foil, and this adhesive-coated metal foil is attached to the resin-impregnated base. On the other hand, if the resin face is made of epoxy resin varnish, the metal foil is used as is without applying adhesive.
最近、プリント配線板の高密度化、多層化、あるいは多
層プリント配線板の多用化に伴い、搭載する電子部品の
発熱が基板に蓄積されて基板の劣化を招き、ひいてはＬ
ＳＩ等の誤動作の一因ともなって問題化されている。こ
の基板の劣化は、まず、金属箔（回路）の剥離となって
あられれ、これがプリント配線板の信頼性を大きく左右
しているのである。Recently, with the increasing density and multilayering of printed wiring boards, and the increased use of multilayer printed wiring boards, the heat generated by mounted electronic components accumulates on the board, causing deterioration of the board, and even causing L
This has become a problem as it is a cause of malfunctions in SI and the like. This deterioration of the board first results in peeling of the metal foil (circuit), which greatly affects the reliability of the printed wiring board.
こうした事情に鑑み、この発明は、金属箔の剥離しにく
い電気用積層板を提供することを課題とする。In view of these circumstances, it is an object of the present invention to provide an electrical laminate whose metal foil is difficult to peel off.
上記課題を解決するために検討を重ねた結果、金属箔を
接着している接着層の熱劣化を防止すればよく、そのた
めには接着層の熱伝導率を高める必要があることを見出
して、この発明を完成させるに至った。As a result of repeated studies to solve the above problems, we discovered that it is only necessary to prevent thermal deterioration of the adhesive layer that adheres the metal foil, and to do so, it is necessary to increase the thermal conductivity of the adhesive layer. This invention was completed.
したがって、この発明は、樹脂含浸基材からなる絶縁基
板の少なくとも片面に接着層を介して金属箔が積層され
てなる電気用積層板であって、前記接着層が、ケイ酸マ
グネシウムを３〜５０重量％含有する接着剤により構成
されているようにする。Therefore, the present invention provides an electrical laminate in which a metal foil is laminated on at least one side of an insulating substrate made of a resin-impregnated base material via an adhesive layer, the adhesive layer containing 3 to 50% of magnesium silicate. % by weight of adhesive.
この発明にかかる電気用積層板の金属箔用接着層は、熱
放散性に優れたケイ酸マグネシウムを含有する接着剤に
より構成されているため、同層の熱伝導率が向上して熱
劣化が防止され、金属箔の剥離が抑えられる。The adhesive layer for metal foil of the electrical laminate according to the present invention is composed of an adhesive containing magnesium silicate, which has excellent heat dissipation properties, so the thermal conductivity of the layer is improved and thermal deterioration is prevented. This prevents the metal foil from peeling off.
上記接着剤中のケイ酸マグネシウム含有量は、３〜５０
重量％（以下、単に「％」と記す）に設定され、３％に
満たない場合は添加効果が得られず、５０％を越えると
接着剤の接着性が低下する。なお、上記含有量は、接着
剤乾燥後の重量（あるいは固形分量）を基準としている
。The magnesium silicate content in the adhesive is 3 to 50
It is set in weight percent (hereinafter simply referred to as "%"), and if it is less than 3%, no effect can be obtained, and if it exceeds 50%, the adhesiveness of the adhesive will decrease. Note that the above content is based on the weight (or solid content) of the adhesive after drying.
以下に、この発明の詳細な説明する。 The present invention will be explained in detail below.
まず、樹脂含浸基材を構成する基材としては、ガラス布
、ガラス不織布２舎成繊維布９合成繊維不織布２紙等の
一般的なものが用いられ、特に限定されることはない。First, as the base material constituting the resin-impregnated base material, common materials such as glass cloth, 2 glass nonwoven fabrics, 9 synthetic fiber cloths, 9 synthetic fiber nonwoven fabrics, and 2 paper are used, and there are no particular limitations.
また、必要に応じては、上記基材を各種紐み合わせるこ
ともできる。Moreover, if necessary, the above-mentioned base materials can be tied together in various ways.
基材に含浸させる樹脂には、特に限定はされないが、フ
ェノール樹脂、ポリイミド樹脂、不飽和ポリエステル樹
脂、エポキシ樹脂、ポリブタジェン樹脂、フッ素樹脂、
ケイ素樹脂、ＰＰＯ（ポリフェニレンオキシド）樹脂等
が適しており、これらを複数種併用してもよい。The resin to be impregnated into the base material is not particularly limited, but includes phenol resin, polyimide resin, unsaturated polyester resin, epoxy resin, polybutadiene resin, fluororesin,
Silicone resins, PPO (polyphenylene oxide) resins, and the like are suitable, and a plurality of these may be used in combination.
上記樹脂の基材への含浸方法は、特に限定されることは
なく、常法に従って上記樹脂に硬化剤。The method for impregnating the base material with the resin is not particularly limited, and a curing agent is added to the resin according to a conventional method.
硬化助剤、溶媒等を加えて樹脂フェスを調製し、以下、
浸漬法、スクイズ法、キツス法等の任意の方法により含
浸される。必要に応じては、１次。A resin face is prepared by adding curing aids, solvents, etc., and the following is done.
Impregnation is carried out by any method such as dipping method, squeeze method, kitsu method, etc. Primary if necessary.
２次合浸と分割含浸させることにより、含浸性が一層向
上する。樹脂の含浸量についても、特に限定はされない
が、乾燥後の樹脂量で４０〜６０％程度となることが好
ましい。The impregnating properties are further improved by performing the secondary combined impregnation and the divided impregnation. The amount of resin impregnated is also not particularly limited, but the amount of resin after drying is preferably about 40 to 60%.
以上のようにして得られる樹脂含浸基材からなる絶縁基
板は、通常、必要に応じて複数枚の樹脂含浸基材が積層
されてなることが多いが、もちろん樹脂含浸基材１枚か
ら構成されていてもよい。The insulating substrate made of the resin-impregnated base material obtained as described above is usually made up of a plurality of resin-impregnated base materials laminated as required, but of course it is made up of a single resin-impregnated base material. You can leave it there.
さらに、上記樹脂含浸基材以外の材料、たとえば絶縁性
の樹脂シート等が併用されていてもよく、その構成等、
特に限定されることはない。Furthermore, materials other than the above-mentioned resin-impregnated base material, such as an insulating resin sheet, may be used in combination, and the structure, etc.
There are no particular limitations.
上記絶縁基板の少なくとも片面（上面および／または下
面）には、上述のように、ケイ酸マグネシウムを３〜５
０％含有する接着剤からなる接着層を介して金属箔が積
層される。そして、得られたＭ屠体が一体化されて、こ
の発明にかかる電気用積層板が得られる。なお、上記金
属箔としては、特に限定はされず、銅、アルミニウム、
ニッケル等の任意の金属箔を用いることができる。At least one surface (upper surface and/or lower surface) of the insulating substrate is coated with 3-5% magnesium silicate as described above.
Metal foils are laminated via an adhesive layer made of an adhesive containing 0%. The obtained M carcasses are then integrated to obtain an electrical laminate according to the present invention. Note that the metal foil is not particularly limited, and may include copper, aluminum,
Any metal foil such as nickel can be used.
上記接着剤は、上記所定量のケイ酸マグネシウムを含有
しているものであれば特に限定されることなく、エポキ
シ系、フェノール系、レゾルシノール系、ユリア系等の
任意のものを選択できる。The adhesive is not particularly limited as long as it contains the predetermined amount of magnesium silicate, and any adhesive such as epoxy, phenol, resorcinol, urea, etc. can be selected.
上記ケイ酸マグネシウムとしては、クリソタイル（クリ
ソタイト）や、結晶水を含んだ含水ケイ酸マグネシウム
等を好ましく用いることができ、その含有成分の種類お
よび割合等は特に限定されるものではない。すなわち、
組成的には５ｉ（ｈとＭｇＯを主成分としているが、そ
の他、上記の含水型のもののように結晶水等として水を
含んだり、Ｃａｂ。As the above-mentioned magnesium silicate, chrysotile (chrysotite), hydrated magnesium silicate containing water of crystallization, etc. can be preferably used, and the types and proportions of the components contained therein are not particularly limited. That is,
Compositionally, the main components are 5i (h) and MgO, but in addition, it may contain water as crystal water, etc., as in the above-mentioned water-containing type, or Cab.
Ａｌ−０ｓ等を含んでいてもよく、たとえばゼオライト
を用いることも好ましい。市販品としては、昭和鉱業■
製’ ミ７Ｌ／：２ ンＪ （ＭｇｓＳｉ＋＊Ｏｓ＊
（ＯＨ）＋（Ｏｌｌｘ）４・８８．０） 、式日薬品側
製「ニーシブラス１ 〔主成分ＳｉＯ□、ＭｇＯ，Ａ１
ｔＯｘ）等が好例として挙げられる。It may contain Al-0s, etc., and it is also preferable to use zeolite, for example. As a commercially available product, Showa Mining ■
M7L/:2NJ (MgsSi+*Os*
(OH) + (Ollx) 4・88.0), manufactured by Shikinichi Yakuhin “Nice Brass 1 [Main components SiO□, MgO, A1
tOx) etc. are mentioned as a good example.
さらには、平均粒径１〜５０μ、最大粒径１５０ｐ以下
のものを用いることが推奨されるが、これらに限定され
ることはない。なお、この発明では、接着剤中の上記３
〜５０％のケイ酸マグネシウムの一部が、その他の熱放
散性のよい物質で置き換わっていてもよい。すなわち、
その他の熱放散性のよい物質がケイ酸マグネシウムと併
用されていてもよく、その際、任意の併用物質とケイ酸
マグネシウムとの総量が、接着剤中の５０％を越えない
ように設定されることが好ましい。Further, it is recommended to use particles with an average particle diameter of 1 to 50 μm and a maximum particle diameter of 150 μm or less, but the present invention is not limited to these. In addition, in this invention, the above 3 in the adhesive
A portion of the ~50% magnesium silicate may be replaced by other materials with good heat dissipation properties. That is,
Other materials with good heat dissipation properties may be used in combination with magnesium silicate, provided that the total amount of any combination material and magnesium silicate does not exceed 50% of the adhesive. It is preferable.
構成される接着層については、その厚み（塗布量）等、
特に限定されることはない。なお、接着層は、予め金属
箔上に形成されていることが好ましい。この接着層付金
属箔を配設した後の積層−体化は、通常の積層プレス工
程に添って行われ、特に限定されることはない。Regarding the adhesive layer, its thickness (coating amount), etc.
There are no particular limitations. Note that the adhesive layer is preferably formed on the metal foil in advance. The formation of a laminate after disposing the metal foil with an adhesive layer is carried out in accordance with a normal laminate pressing process, and is not particularly limited.
以下に、この発明のさらに詳しい実施例について、比較
例と併せて説明するが、この発明にかかる電気用積層板
が、同実施例に限定されるものではないことは言うまで
もない。More detailed examples of the present invention will be described below in conjunction with comparative examples, but it goes without saying that the electrical laminate according to the present invention is not limited to the examples.
一実施例１〜６−
下記の各成分（「部」は重量部を表す）からなる樹脂フ
ェスを調製し、これを、乾燥後重量が５０％になるよう
に、厚さ０．２ ｍｓのガラス布に含浸させ、乾燥させ
た。Examples 1 to 6 - A resin face made of the following components ("parts" represents parts by weight) was prepared, and it was coated with a thickness of 0.2 ms so that the weight after drying was 50%. A glass cloth was impregnated and dried.
得られた樹脂含浸基材を７枚積層し、その上下に、第１
表に示した組成の、クリソタイル（Ｍｇ＊５ｔ４０＋−
（０１（）ｓ）または含水ケイ酸マグネシウム（上述の
昭和鉱業■製「ミルコン」粉末品）入り接着剤が塗布（
２５０Ｂ／ｎ＋”）された、厚さ０．０３５鶴の銅箔を
それぞれ配設し、得られた積層体を成形圧力４０ｋｇ／
ｃｊ、温度１６５℃で１２０分間積層成形して電気用積
層板を得た。なお、クリソタイル、含水ケイ酸マグネシ
ウムは、共に、平均粒径３０μ、最大粒径１００μのも
のを用いた。Seven sheets of the obtained resin-impregnated base materials were laminated, and the first
Chrysotile (Mg*5t40+-
(01()s) or an adhesive containing hydrated magnesium silicate ("Mirucon" powder product manufactured by Showa Mining ■ mentioned above) is applied (
Copper foils with a thickness of 0.035 mm and 250 B/n
cj, laminate molding was carried out at a temperature of 165° C. for 120 minutes to obtain an electrical laminate. Note that both chrysotile and hydrous magnesium silicate used had an average particle size of 30 μm and a maximum particle size of 100 μm.
−比較例−
接着剤として、クリソタイルおよび含水ケイ酸マグネシ
ウムを含まないものを用いるようにする他は、上記実施
例と同様にして電気用積層板を作製した。- Comparative Example - An electrical laminate was produced in the same manner as in the above example, except that an adhesive that did not contain chrysotile or hydrated magnesium silicate was used.
上記得られた実施例および比較例の電気用積層板につい
て、１６０℃×５００時間後の銅箔ピーリング強度、お
よび、接着層の熱伝導率を測定した。Regarding the electrical laminates of Examples and Comparative Examples obtained above, the copper foil peeling strength after 500 hours at 160° C. and the thermal conductivity of the adhesive layer were measured.
結果を、同じく第１表に示す。The results are also shown in Table 1.
第１表にみるように、銅箔を接着する接着剤としてケイ
酸マグネシウム（クリソタイルまたはｒミルコン」）を
含む接着剤が用いられている実施例の電気用積層板は、
比較例に比べ、同接着剤により構成される接着層の熱伝
導率に優れ、銅箔ピーリング強度の大きい、すなわち銅
箔の剥がれにくいものになっている。As shown in Table 1, the electrical laminates of the examples in which an adhesive containing magnesium silicate (chrysotile or R-milcon) is used as the adhesive for bonding the copper foil are as follows:
Compared to the comparative example, the adhesive layer made of the same adhesive has excellent thermal conductivity and high copper foil peeling strength, that is, the copper foil is difficult to peel off.
以上のように、この発明にかかる電気用積層板では、熱
放散性に優れたケイ酸マグネシウムを含有する接着剤が
用いられているため、金属箔を接着している接着層の熱
伝導率が向上してその熱劣化が防止され、金属箔の剥離
が抑えられる。したがって、この発明の電気用積層板を
用いて、たとえば、回路の脱落等のない、信頼性の高い
プリント配線板や多層プリント配線板を実現することが
可能となる。As described above, in the electrical laminate according to the present invention, since an adhesive containing magnesium silicate with excellent heat dissipation properties is used, the thermal conductivity of the adhesive layer bonding the metal foil is low. thermal deterioration is prevented, and peeling of the metal foil is suppressed. Therefore, by using the electrical laminate of the present invention, it is possible to realize, for example, a highly reliable printed wiring board or multilayer printed wiring board in which circuits do not come off.
代理人 弁理士 松 本 武 彦Agent: Patent Attorney Takehiko Matsumoto
Claims (1)
接着層を介して金属箔が積層されてなる電気用積層板で
あって、前記接着層が、ケイ酸マグネシウムを３〜５０
重量％含有する接着剤により構成されていることを特徴
とする電気用積層板。1. An electrical laminate comprising a metal foil laminated on at least one side of an insulating substrate made of a resin-impregnated base material via an adhesive layer, the adhesive layer containing 3 to 50% of magnesium silicate.
An electrical laminate comprising an adhesive containing % by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28630388A JPH02130144A (en) | 1988-11-11 | 1988-11-11 | Electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28630388A JPH02130144A (en) | 1988-11-11 | 1988-11-11 | Electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02130144A true JPH02130144A (en) | 1990-05-18 |
Family
ID=17702635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28630388A Pending JPH02130144A (en) | 1988-11-11 | 1988-11-11 | Electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02130144A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011040415A1 (en) * | 2009-09-29 | 2011-04-07 | 日立化成工業株式会社 | Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
-
1988
- 1988-11-11 JP JP28630388A patent/JPH02130144A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011040415A1 (en) * | 2009-09-29 | 2011-04-07 | 日立化成工業株式会社 | Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3119577B2 (en) | Laminated board | |
| JPS607796A (en) | Copper-lined laminated board for printed circuit and method of producing same | |
| JPH02130144A (en) | Electrical laminate | |
| JP2708821B2 (en) | Electric laminate | |
| JPH1017684A (en) | Production of prepreg and laminate | |
| JPH02130145A (en) | Electrical laminate | |
| JPH02130146A (en) | Electrical laminate | |
| JP2659490B2 (en) | Printed circuit laminate | |
| JP2740600B2 (en) | Printed circuit laminate | |
| JP3327366B2 (en) | Manufacturing method of laminated board | |
| JP3343722B2 (en) | Method for producing composite prepreg and laminate | |
| JPH1034806A (en) | Laminate material and laminate | |
| JPH06302926A (en) | Multilayered boad for printed circuit | |
| JPH09254331A (en) | Laminated sheet | |
| JP2557325B2 (en) | Multilayer copper clad laminate | |
| JPH02252294A (en) | Manufacture of multilayer board | |
| JPS605598A (en) | Method of producing high thermal conductive metal base printed board | |
| JP3354346B2 (en) | Manufacturing method of laminated board | |
| JP3173082B2 (en) | Manufacturing method of laminated board | |
| JPH01225545A (en) | Laminated sheet for electrical application | |
| JP2923342B2 (en) | Electric laminate | |
| JPH05327150A (en) | Laminated plate for printed circuit | |
| JPH09153665A (en) | Heat-radiation printed circuit board and its manufacturing method | |
| JPH02252292A (en) | Manufacture of multilayer board | |
| JPH0423384A (en) | Printed wiring board |