JP2557325B2 - Multilayer copper clad laminate - Google Patents
Multilayer copper clad laminateInfo
- Publication number
- JP2557325B2 JP2557325B2 JP63019123A JP1912388A JP2557325B2 JP 2557325 B2 JP2557325 B2 JP 2557325B2 JP 63019123 A JP63019123 A JP 63019123A JP 1912388 A JP1912388 A JP 1912388A JP 2557325 B2 JP2557325 B2 JP 2557325B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- clad laminate
- glass
- inorganic filler
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、ドリル加工性、耐ミーズリング性、成形性
に優れた多層銅張積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a multilayer copper clad laminate having excellent drilling workability, measling resistance, and formability.
(従来の技術) 最近、産業用電子機器の高速化、高密度化に伴って、
これら電子機器に使用される配線板として多層プリント
配線板の需要が年毎に増加している。従来、ガラス織布
を使用する一般の多層プリント配線板は、ガラス織布
(以下ガラスクロスともいう)にエポキシ樹脂を塗布含
浸させ、加熱乾燥してガラス織布基材プリプレグを得、
これを銅箔とともに加熱加圧したのち回路形成した内層
プリント板に前記と銅構成のガラス織布基材プリプレグ
を介して銅箔を積層し、加熱加圧一体に成形して多層プ
リント配線板を製造するものであった。(Prior Art) With the recent increase in speed and density of industrial electronic devices,
The demand for multilayer printed wiring boards as wiring boards used in these electronic devices is increasing year by year. Conventionally, a general multilayer printed wiring board using a glass woven cloth is obtained by coating and impregnating a glass woven cloth (hereinafter also referred to as glass cloth) with an epoxy resin, followed by heating and drying to obtain a glass woven cloth base material prepreg.
After heating and pressing this together with the copper foil, the copper foil is laminated on the inner layer printed board on which the circuit is formed via the glass woven base material prepreg of the above and copper, and the heat and pressure are integrally molded to form a multilayer printed wiring board. It was manufactured.
しかし、そこで使用される従来のプリプレグは、基材
としてガラス織布を使用しているため、スルーホール加
工の際のドリル加工性が悪く、そのため内壁粗れやスミ
ヤが発生しやすく、またドリル刃の寿命も短いという欠
点があった。これを改良するものとして特開昭61−4009
4号の開示技術のように、基材としてガラス不織布を使
用し、一方含浸樹脂のエポキシ樹脂に無機質充填剤を含
有させる方法が知られている。しかしこの方法でも、ガ
ラス不織布を用いたプリプレグを製造する場合に、樹脂
ワニス中で無機質充填剤が沈降しやすく、またガラス不
織布自身の坪量にバラツキがあるため含浸不良や塗布む
らが発生しやすいという欠点がある。更にプリプレグ含
浸不良や塗布むらがあると多層成形時に流動性が悪く、
このプリプレグを使用した多層プリント板は内層回路付
近にボイドが残りやすく、その結果耐ミーズリングが低
下するという欠点があった。However, the conventional prepreg used there uses a glass woven fabric as the base material, so the drilling workability during through-hole processing is poor, and as a result, inner wall roughness and smearing easily occur, and the drill blade It had the drawback of having a short life. To improve this, Japanese Patent Laid-Open No. 640009/1986
A method is known in which a glass nonwoven fabric is used as a base material and an epoxy resin as an impregnating resin contains an inorganic filler as in the disclosed technique of No. 4. However, even in this method, when a prepreg using a glass nonwoven fabric is manufactured, the inorganic filler is likely to settle in the resin varnish, and the glass nonwoven fabric itself has variations in the basis weight, which may cause impregnation failure and uneven coating. There is a drawback that. Furthermore, if there is poor prepreg impregnation or uneven coating, the fluidity will be poor during multilayer molding,
The multilayer printed circuit board using this prepreg has a drawback that voids are likely to remain in the vicinity of the inner layer circuit, and as a result, the measling resistance is lowered.
(発明が解決しようとする課題) 本発明は、上記の問題点を解決するためになされたも
のでドリル加工性、耐ミーズリング性、成形性に優れた
ボイド発生のない多層銅張積層板を提供しようとするも
のである。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above problems and provides a multilayer copper clad laminate having no void formation, which is excellent in drilling processability, measling resistance, and formability. It is the one we are trying to provide.
[発明の構成] (課題を解決するための手段) 本発明者らは、上記の目的を達成しようと鋭意研究を
重ねた結果、無機質充填剤を抄造において含有させたガ
ラス不織布を基材とするプリプレグを回路形成をした内
層板に接するように配置すれば、ドリル加工性、耐ミー
ズリング性、成形性に優れた多層銅張積層板が得られる
ことを見いだし、本発明を完成したものである。すなわ
ち、本発明は、回路形成をした内層板の表裏に、複数枚
のプリプレグと外層銅箔とを重ね合わせ、加熱加圧一体
に成形してなる多層銅張積層板において、前記複数枚の
プリプレグのうちの内層板に接するプリプレグとして、
抄造の際に配合したことによって無機質充填剤を含有す
る不織布に熱硬化性樹脂を含浸乾燥させたプリプレグを
使用してなることを特徴とする多層銅張積層板である。
また、その無機質充填剤として平均粒径が1〜10μmの
ものを用い、ガラス不織布に対して20〜70重量%含有さ
せる多層銅張積層板である。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive studies conducted by the present inventors to achieve the above-mentioned object, a glass nonwoven fabric containing an inorganic filler in papermaking is used as a base material. It was found that a multilayer copper clad laminate excellent in drilling processability, measling resistance and formability can be obtained by arranging the prepreg so as to be in contact with the circuit-formed inner layer plate, and has completed the present invention. . That is, the present invention is a multilayer copper clad laminate formed by superposing a plurality of prepregs and an outer layer copper foil on the front and back surfaces of an inner layer board on which a circuit is formed, and integrally molding by heating and pressing, and the plurality of prepregs. As a prepreg that contacts the inner layer plate of
A multilayer copper-clad laminate characterized by using a prepreg obtained by impregnating and drying a thermosetting resin in a non-woven fabric containing an inorganic filler, which has been compounded during papermaking.
Further, it is a multi-layered copper-clad laminate which uses an inorganic filler having an average particle diameter of 1 to 10 μm and is contained in an amount of 20 to 70% by weight based on the glass nonwoven fabric.
本発明に用いる無機質充填剤としては、電気絶縁性が
良好なものはすべて使用することができる。例えばEガ
ラス粉末、水酸化アルミニウム、水酸化マグネシウム、
アルミナ、酸化マグネシウム、二酸化チタン、チタン酸
カルシウム、ケイ酸カルシウム、ケイ酸アルミニウム等
が挙げられ、これらは単独もしくは2種以上混合して使
用する。この無機質充填剤の平均粒径は1〜10μmのも
のが好ましい。平均粒径が1μm未満の場合な抄造時に
ガラス不織布に付着しにくく、また10μmを超えると抄
造時の沈降が著しくガラス不織布の抄造むらの原因とな
り好ましくない。無機質充填剤の配合割合は、ガラス不
織布に対して20〜70重量%含有することが望ましい。そ
の割合が20重量%未満では耐ミーズリング性に効果な
く、また70重量%を超えるとガラス繊維間の接点が減少
し、ガラス不織布の引張り強度が低下し好ましくない。As the inorganic filler used in the present invention, any one having a good electric insulating property can be used. For example, E glass powder, aluminum hydroxide, magnesium hydroxide,
Alumina, magnesium oxide, titanium dioxide, calcium titanate, calcium silicate, aluminum silicate and the like can be mentioned, and these can be used alone or in admixture of two or more. The average particle size of this inorganic filler is preferably 1 to 10 μm. When the average particle diameter is less than 1 μm, it is difficult to adhere to the glass nonwoven fabric during papermaking, and when it exceeds 10 μm, sedimentation during papermaking is remarkable, which causes unevenness of papermaking of the glass nonwoven fabric, which is not preferable. The blending ratio of the inorganic filler is preferably 20 to 70% by weight based on the glass nonwoven fabric. If the proportion is less than 20% by weight, the measling resistance is not effective, and if it exceeds 70% by weight, the contact points between the glass fibers are decreased and the tensile strength of the glass nonwoven fabric is lowered, which is not preferable.
本発明に用いるガラス不織布としては、電気特性の優
れた無アルカリガラスのEガラス繊維からなるものが挙
げられる。Eガラス繊維をシランカップリング剤で表面
処理したものであればより好ましい。Examples of the glass nonwoven fabric used in the present invention include those made of non-alkali glass E glass fiber having excellent electrical characteristics. More preferably, the E glass fiber is surface-treated with a silane coupling agent.
本発明に用いる熱硬化性樹脂としては、エポキシ樹
脂、ポリイミド樹脂、不飽和ポリエステル樹脂およびこ
れらの変性樹脂等か挙げられ、これらは単独又は2種以
上混合して使用する。Examples of the thermosetting resin used in the present invention include epoxy resins, polyimide resins, unsaturated polyester resins and modified resins thereof, and these may be used alone or in admixture of two or more.
本発明に用いるプリプレグは、無機質充填剤を含有す
る不織布基材に熱硬化樹脂を常法によって含浸乾燥させ
てつくり、またプリプレグと銅箔からなる内層板も常法
によってつくることができる。また本発明に用いる銅箔
も、圧延銅箔、電解銅箔いずれでもよく、通常プリント
板用として使用されるものも用いる。The prepreg used in the present invention can be prepared by impregnating and drying a thermosetting resin in a non-woven fabric base material containing an inorganic filler by a conventional method, and an inner layer plate made of a prepreg and a copper foil can also be prepared by a conventional method. The copper foil used in the present invention may be either a rolled copper foil or an electrolytic copper foil, and those usually used for printed boards are also used.
次に、本発明の多層銅張積層板の層構成について図面
を用いて説明する。両面に形成回路を有する内層板1の
表裏に、すなわち内層板に接して無機質充填剤を含有す
るガラス不織布に熱硬化性樹脂を含浸乾燥させてなるプ
リプレグ(A)2を1枚又は複数枚を重ね合わせ、次に
その上下面に通常のガラスクロス(織布)に熱硬化性樹
脂を含浸乾燥してなるプリプレグ(B)3を重ね、更に
その両面に外層銅箔4を重ね合わせ、加熱加圧一体に成
形して多層銅張積層板をつくることができる。第1図で
は4層板について図示したが、4層板に限定されるもの
ではなく5層以上の板にも応用される。要するに回路形
成した内層板の両側に複数枚のプリプレグ[(A)+
(B)]を配置する場合であっても、プリプレグ(A)
を内層板に接するように配置することが重要である。6
層板以上の場合には、外層銅箔側にのみプリプレグ
(B)を配置し各内層板間のプリプレグはプリプレグ
(A)のみであってもよいし、また配置するプリプレグ
(A)の枚数は1枚であってもよい。Next, the layer structure of the multilayer copper clad laminate of the present invention will be described with reference to the drawings. One or a plurality of prepregs (A) 2 formed by impregnating a glass nonwoven fabric containing an inorganic filler with a thermosetting resin and drying the prepreg (A) 2 on the front and back sides of the inner layer board 1 having forming circuits on both sides Then, the prepreg (B) 3 formed by impregnating and drying a normal glass cloth (woven cloth) with a thermosetting resin is overlaid on the upper and lower surfaces thereof, and the outer copper foil 4 is overlaid on both surfaces thereof and heated. It is possible to form a multi-layer copper clad laminate by pressure molding. Although FIG. 1 shows a four-layer plate, the present invention is not limited to the four-layer plate, but may be applied to a plate having five or more layers. In short, multiple prepregs [(A) + on both sides of the circuit-formed inner layer board
(B)], the prepreg (A)
It is important to arrange the so as to contact the inner layer plate. 6
In the case of more than a layer board, the prepreg (B) may be arranged only on the outer layer copper foil side and the prepreg between the inner layer boards may be only the prepreg (A), or the number of prepregs (A) to be arranged is It may be one.
(作用) 本発明は、無機質充填剤を含有したガラス不織布に熱
硬化性樹脂を含浸乾燥したので、ガラス織布基材プリプ
レグにおける含浸不良や塗布むらを防止することができ
る。また回路形成をした内層板に接するように、無機質
充填剤を含有したガラス不織布に熱硬化性樹脂を含浸乾
燥してなるプリプレグを配置したので、加工時のプリプ
レグの流動性を良くすることができ、またボイドの発生
を防止することができる。(Operation) In the present invention, since the glass nonwoven fabric containing the inorganic filler is impregnated with the thermosetting resin and dried, impregnation failure or coating unevenness in the glass woven fabric base material prepreg can be prevented. Further, since the prepreg made by impregnating and drying the thermosetting resin in the glass non-woven fabric containing the inorganic filler is arranged so as to be in contact with the circuit-formed inner layer plate, it is possible to improve the fluidity of the prepreg during processing. Moreover, it is possible to prevent the occurrence of voids.
(実施例) 次に本発明を実施例によって具体的に説明するが、本
発明は、これらの実施例によって限定されるものではな
い。(Examples) Next, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples.
実施例 1 臭素化エポキシ樹脂(エポキシ当量470g/eq、臭素含
有量20.5%)100重量部に、ジンシアジアミド3重量
部、ベンジルジメチルアミン0.2重量%部およびジメチ
ルホルムアミドもしくはアセトンの適量を加えて撹拌し
てエポキシ樹脂ワニスを調製した。次に平均長さ13μ
m、平均径9μmのガラス繊維に無機質充填剤として平
均粒径2μmの水酸化アルミニウム粉末を20重量%配合
して抄造された単重60g/m2のガラス不織布に、前記エポ
キシ樹脂ワニスを含浸塗布し、160℃で乾燥して単重300
g/m2のプリプレグ(A)を得た。次に前記エポキシ樹脂
ワニス、常法により厚さ100μmのガラス織布に含浸乾
燥してプリプレグ(B)を得た。次に、両面に厚さ70μ
mの内層銅箔回路を有する厚さ0.5mmの内層板の表裏
に、プリプレグ(A)を2枚ずつ重ね、その両面にプリ
プレグ(B)を1枚ずつ重ね合わせ、更に厚さ18μmの
外層銅箔を積層し、175℃で90分間、加熱加圧一体に成
形して4層銅張積層板を製造した。Example 1 To 100 parts by weight of a brominated epoxy resin (epoxy equivalent: 470 g / eq, bromine content: 20.5%), 3 parts by weight of ginciadiamide, 0.2% by weight of benzyldimethylamine, and an appropriate amount of dimethylformamide or acetone were added and stirred. Then, an epoxy resin varnish was prepared. Next average length 13μ
m, glass fiber with an average diameter of 9 μm was mixed with 20% by weight of aluminum hydroxide powder with an average particle diameter of 2 μm as an inorganic filler, and a glass nonwoven fabric with a single weight of 60 g / m 2 was impregnated with the epoxy resin varnish. Then, dry it at 160 ℃ and unit weight 300
A prepreg (A) of g / m 2 was obtained. Then, the epoxy resin varnish was impregnated into a glass woven cloth having a thickness of 100 μm by a conventional method and dried to obtain a prepreg (B). Next, thickness 70μ on both sides
2 layers of prepreg (A) on the front and back of a 0.5 mm thick inner layer board having an inner copper foil circuit of m, and 1 layer of prepreg (B) on both sides, and an outer layer copper layer of 18 μm thickness The foils were laminated and integrally molded by heating and pressing at 175 ° C. for 90 minutes to produce a 4-layer copper clad laminate.
実施例 2 実施例1において用いたガラス不織布の化わりに、平
均長さ13mm、平均径9μmのガラス繊維に無機質充填剤
として平均粒径5μmのEガラス粉末を30重量%配合し
て抄造された単重60g/m2のガラス不織布を用いた以外
は、すべて実施例1と同様にしてプリプレグ(C)を
得、そして4層銅張積層板を製造した。Example 2 A sheet made by mixing 30% by weight of E glass powder having an average particle size of 5 μm as an inorganic filler into glass fiber having an average length of 13 mm and an average diameter of 9 μm in place of the glass nonwoven fabric used in Example 1 A prepreg (C) was obtained in the same manner as in Example 1 except that a glass nonwoven fabric having a weight of 60 g / m 2 was used, and a 4-layer copper-clad laminate was produced.
比較例 1 平均長さ13mm、平均径9μmのガラス繊維を無機質充
填剤なしに抄造した従来タイプの単重60g/m2のガラス不
織布に、実施例1で用いたエポキシ樹脂ワニスに上記ガ
ラス不織布に対して10重量%になる量の平均粒径2μm
の水酸化アルミニウム粉末を配合して得られたワニス
を、含浸塗布乾燥して単重300g/m2のプリプレグ(D)
を得た。実施例1においてプリプレグ(A)の代わりに
プリプレグ(D)を用いた以外は同一構成として4層銅
張積層板を製造した。Comparative Example 1 A glass non-woven fabric of a conventional type having a single weight of 60 g / m 2 produced by making glass fibers having an average length of 13 mm and an average diameter of 9 μm without an inorganic filler, and the epoxy resin varnish used in Example 1 as the above glass non-woven fabric. On the other hand, the average particle size is 2 μm, which is 10% by weight.
The varnish obtained by blending the aluminum hydroxide powder of 1. was impregnated, coated and dried to obtain a prepreg (D) having a unit weight of 300 g / m 2.
I got A four-layer copper-clad laminate was produced with the same configuration as in Example 1 except that the prepreg (D) was used instead of the prepreg (A).
比較例 2 厚さ180μmのガラスクロスに、実施例1で用いたエ
ポキシ樹脂ワニスを含浸塗布乾燥してプリプレグ(E)
を得た。実施例1においてプリプレグ(A)の代わりに
プリプレグ(E)を用いた以外は同一構成として4層銅
張積層板を製造した。Comparative Example 2 A glass cloth having a thickness of 180 μm was impregnated with the epoxy resin varnish used in Example 1 and dried to prepare a prepreg (E).
I got A four-layer copper-clad laminate was manufactured with the same configuration as in Example 1 except that the prepreg (E) was used instead of the prepreg (A).
実施例1〜2および比較例1〜2で製造した4層銅張
積層板について、ボイドの発生数、耐ミーズリング性、
ドリル加工性について試験を行ったので、その結果を第
1表に示した。本発明の多層銅張積層板は従来のものよ
り優れており、本発明の効果が確認された。Regarding the four-layer copper-clad laminates produced in Examples 1-2 and Comparative Examples 1-2, the number of voids generated, measling resistance,
Tests were conducted for drill workability, and the results are shown in Table 1. The multilayer copper clad laminate of the present invention is superior to the conventional one, and the effect of the present invention was confirmed.
[発明の効果] 以上の説明および第1表から明らかなように、本発明
の多層銅張積層板は、無機質充填剤を含有したガラス不
織布に熱硬化性樹脂を含浸乾燥させてなるプリプレグの
内層板に接するように配置したことによって、ドリル加
工性が良好で内壁粗れやスミアの発生がなく、耐ミーズ
リング性に優れ、成形性が良好でボイドの発生のない、
優れた多層銅張積層板を得ることができた。 [Effects of the Invention] As is clear from the above description and Table 1, the multilayer copper-clad laminate of the present invention is an inner layer of a prepreg obtained by impregnating and drying a thermosetting resin in a glass nonwoven fabric containing an inorganic filler. By placing it in contact with the plate, it has good drilling workability, no inner wall roughness or smear, excellent measling resistance, good formability, and no voids.
An excellent multilayer copper clad laminate could be obtained.
第1図は本発明による多層銅張積層板の層構成を示す説
明図である。 1……内層板、2……プリプレグ(A)(無機質充填剤
入りガラス不織布基材)、3……プリプレグ(B)、4
……外層銅箔。FIG. 1 is an explanatory view showing the layer structure of a multilayer copper clad laminate according to the present invention. 1 ... Inner layer plate, 2 ... Prepreg (A) (glass non-woven fabric substrate with inorganic filler), 3 ... Prepreg (B), 4
…… Outer layer copper foil.
Claims (2)
プリプレグと外層銅箔とを重ね合わせ、加熱加圧一体に
成形してなる多層銅張積層板において、前記複数枚のプ
リプレグのうちの内層板に接するプリプレグとして、抄
造の際に配合したことによって無機質充填剤を含有する
不織布に熱硬化性樹脂を含浸乾燥させたプリプレグを使
用してなることを特徴とする多層銅張積層板。1. A multilayer copper clad laminate obtained by stacking a plurality of prepregs and an outer layer copper foil on the front and back of an inner layer board on which a circuit is formed, and integrally molding the layers by heating and pressing. As the prepreg in contact with the inner layer board, a multi-layer copper-clad laminate characterized by using a prepreg obtained by impregnating a non-woven fabric containing an inorganic filler with a thermosetting resin and drying the prepreg by blending at the time of papermaking .
ガラス不織布に対して20〜70重量%含有される特許請求
の範囲第1項記載の多層銅張積層板。2. The inorganic filler has an average particle size of 1 to 10 μm,
The multilayer copper clad laminate according to claim 1, which is contained in an amount of 20 to 70% by weight based on the glass nonwoven fabric.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63019123A JP2557325B2 (en) | 1988-01-29 | 1988-01-29 | Multilayer copper clad laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63019123A JP2557325B2 (en) | 1988-01-29 | 1988-01-29 | Multilayer copper clad laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01194499A JPH01194499A (en) | 1989-08-04 |
JP2557325B2 true JP2557325B2 (en) | 1996-11-27 |
Family
ID=11990690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63019123A Expired - Fee Related JP2557325B2 (en) | 1988-01-29 | 1988-01-29 | Multilayer copper clad laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2557325B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086833A1 (en) * | 2003-03-27 | 2004-10-07 | Zeon Corporation | Printed wiring board, its manufacturing method, and curing resin molded article with support |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140094A (en) * | 1984-07-31 | 1986-02-26 | 新神戸電機株式会社 | Method of producing multilayer circuit board |
-
1988
- 1988-01-29 JP JP63019123A patent/JP2557325B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01194499A (en) | 1989-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |