JPH05318638A - Laminated sheet - Google Patents
Laminated sheetInfo
- Publication number
- JPH05318638A JPH05318638A JP13292492A JP13292492A JPH05318638A JP H05318638 A JPH05318638 A JP H05318638A JP 13292492 A JP13292492 A JP 13292492A JP 13292492 A JP13292492 A JP 13292492A JP H05318638 A JPH05318638 A JP H05318638A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- aramid fiber
- resin
- glass fiber
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、熱膨張が小さく、加工
性に優れた表面実装用プリント配線板用の積層板に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate for a surface mounting printed wiring board which has a small thermal expansion and is excellent in workability.
【0002】[0002]
【従来の技術】電子部品が小型化し、高集積化するにと
もなって、印刷配線板上への部品実装も高密度化してい
る。基板材料にも、低熱膨張係数、寸法安定性などの特
性が強く要求されるようになってきた。基材に紙のよう
なセルロース系繊維、ガラス繊維を用いた積層板は、熱
膨張係数が大きく、寸法安定性が悪いために、この要求
に応えられない。そこで、熱膨張の小さいアラミド繊維
基材が用いられるようになってきている。2. Description of the Related Art As electronic parts have become smaller and highly integrated, the density of parts mounted on a printed wiring board has increased. Substrate materials are also strongly required to have characteristics such as low thermal expansion coefficient and dimensional stability. A laminated board using a cellulosic fiber such as paper or a glass fiber as a base material cannot meet this requirement because it has a large coefficient of thermal expansion and poor dimensional stability. Therefore, an aramid fiber base material having a small thermal expansion has been used.
【0003】[0003]
【発明が解決しようとする課題】ところが、、基材にア
ラミド繊維を用いた積層板は、ドリル切削性がよくない
ため、スルーホール用穴の内壁が平滑にならずスルーホ
ールめっきの被着がよくないという欠点があった。本発
明は、アラミド繊維の長所を活かしてそのドリル切削性
を改良することを目的とするものである。However, since the laminate using the aramid fiber as the base material has poor drill machinability, the inner wall of the through hole hole is not smooth and the through hole plating is not adhered. It had the drawback of not being good. The present invention aims to improve the drill machinability by utilizing the advantages of aramid fiber.
【0004】[0004]
【課題を解決するための手段】本発明は、表面層がガラ
ス繊維基材からなり、中心層がアラミド繊維を含む基材
からなる積層板である。The present invention is a laminated plate in which the surface layer is made of a glass fiber base material and the center layer is made of a base material containing aramid fibers.
【0005】アラミド繊維基材の厚みは特に制限がない
が、低熱膨張、加工性を満足させるため、0.05〜
1.5mm程度とする。織布、不織布(紙を含む)いず
れでもよい。アラミド繊維基材に不織布を用いるとき
は、他の基材に織布を用いるというように織布と不織布
を組み合わせるのが望ましい。The thickness of the aramid fiber base material is not particularly limited, but in order to satisfy the low thermal expansion and workability, it is 0.05 to
It is about 1.5 mm. Either woven cloth or non-woven cloth (including paper) may be used. When a non-woven fabric is used for the aramid fiber substrate, it is desirable to combine the woven fabric and the non-woven fabric such that a woven fabric is used for another substrate.
【0006】また、ガラス繊維中のSiO2成分を60
%以上にすると、より低熱膨張の基材となり、積層板全
体のの熱膨張係数をより低くすることができる。Further, the SiO 2 component in the glass fiber is adjusted to 60
When it is at least%, the base material has a lower thermal expansion, and the thermal expansion coefficient of the entire laminated plate can be further lowered.
【0007】基材に含浸する樹脂としてはフェノ−ル樹
脂、エポキシ樹脂、ポリイミド樹脂、メラミン樹脂、不
飽和ポリエステル樹脂、ビニルエステル樹脂などがあ
る。層の接着性を確保するため、有機質層の樹脂は、全
層にわたり同じ樹脂とするのが望ましい。As the resin with which the base material is impregnated, there are phenol resin, epoxy resin, polyimide resin, melamine resin, unsaturated polyester resin, vinyl ester resin and the like. In order to secure the adhesiveness of the layers, it is desirable that the resin of the organic layer be the same resin for all layers.
【0008】[0008]
【作用】アラミド繊維を含む層が少なくなるので、ドリ
ル加工性が、全体としてよくなる。アラミド繊維の層が
中心にあるので、アラミド繊維の持つ特性も活かされ
る。また、アラミド繊維基材の両側にガラス基材を介在
させることで、銅はく、ガラス、アラミドという熱膨張
係数の大きさの順に基材が並ぶので、加熱時において、
各層間での伸縮差が少なくなり、耐熱性が向上する。Since the layer containing the aramid fiber is reduced, the drill workability is improved as a whole. Since the layer of aramid fiber is at the center, the characteristics of aramid fiber are also utilized. Further, by interposing a glass base material on both sides of the aramid fiber base material, copper foil, glass, since the base materials are arranged in the order of the coefficient of thermal expansion of aramid, during heating,
The difference in expansion and contraction between the layers is reduced, and the heat resistance is improved.
【0009】[0009]
実施例1 坪量140g/m2のアラミド繊維不織布に積層板用エ
ポキシ樹脂ワニスを含浸し、樹脂をBステージ化して樹
脂分50%のアラミド繊維基材プリプレグを製造した。
電気絶縁板用ガラスクロス(SiO2成分52〜56
%)に同じエポキシ樹脂ワニスを含浸し、樹脂をBステ
ージ化して樹脂分45%のガラス繊維基材プリプレグを
製造した。厚さ35μmの銅はくを2枚、その内側にガ
ラス繊維基材プリプレグを各1枚、中心層にアラミド繊
維基材プリプレグを1枚配置し、175℃、60分、3
MPaで減圧プレス(1333〜8000Pa)で加熱
加圧し、厚さ0.6mmの両面銅張積層板を製造した。Example 1 An aramid fiber non-woven fabric having a basis weight of 140 g / m 2 was impregnated with an epoxy resin varnish for a laminate, and the resin was B-staged to produce an aramid fiber base material prepreg having a resin content of 50%.
Glass cloth for electrical insulation board (SiO 2 components 52-56
%) Was impregnated with the same epoxy resin varnish and the resin was B-staged to produce a glass fiber base material prepreg having a resin content of 45%. Two copper foils with a thickness of 35 μm, one glass fiber base material prepreg for each inside, and one aramid fiber base material prepreg for the center layer were placed at 175 ° C. for 60 minutes, 3 minutes.
A double-sided copper clad laminate having a thickness of 0.6 mm was manufactured by heating and pressurizing with a vacuum press (1333 to 8000 Pa) at MPa.
【0010】実施例2 電気絶縁板用ガラスクロス(SiO2成分60%)に、
実施例1で用いたものと同じエポキシ樹脂ワニスを含浸
し、樹脂をBステージ化して樹脂分45%のガラス繊維
基材プリプレグを製造した。厚さ35μmの銅はくを2
枚、その内側にこのプリプレグを各1枚、中心層に実施
例1で製造したアラミド繊維基材プリプレグを1枚配置
し、以下実施例1と同様にして両面銅張積層板を製造し
た。Example 2 A glass cloth (SiO 2 component 60%) for an electric insulating plate was prepared.
The same epoxy resin varnish as used in Example 1 was impregnated and the resin was B-staged to produce a glass fiber base material prepreg having a resin content of 45%. 2 copper foils with a thickness of 35 μm
A double-sided copper-clad laminate was manufactured in the same manner as in Example 1 below by arranging one prepreg each on the inside and one aramid fiber base prepreg manufactured in Example 1 on the center layer.
【0011】比較例1 厚さ35μmの銅はくを2枚、その内側に実施例1で得
たアラミド繊維基材プリプレグを各1枚、実施例1と同
様にして製造したガラス繊維基材プリプレグを1枚中心
に配置し、実施例1と同様にして両面銅張積層板を製造
した。Comparative Example 1 Two 35 .mu.m thick copper foils, one inside each of which was the aramid fiber base material prepreg obtained in Example 1, and a glass fiber base material prepreg manufactured in the same manner as in Example 1 Was placed in the center, and a double-sided copper-clad laminate was manufactured in the same manner as in Example 1.
【0012】比較例2 厚さ35μmの銅はくを2枚、その内側に実施例1で得
たアラミド繊維基材プリプレグを3枚、配置し、実施例
1と同様にして両面銅張積層板を製造した。Comparative Example 2 Two double-sided copper foils having a thickness of 35 μm and three aramid fiber base material prepregs obtained in Example 1 were placed inside the copper foil, and double-sided copper clad laminate was prepared in the same manner as in Example 1. Was manufactured.
【0013】比較例3 厚さ35μmの銅はくを2枚、その内側に実施例1と同
様にして製造したガラス繊維基材プリプレグを3枚配置
し、実施例1と同様にして両面銅張積層板を製造した。Comparative Example 3 Two copper foils each having a thickness of 35 μm and three glass fiber base prepregs produced in the same manner as in Example 1 were arranged inside the copper foil, and double-sided copper-clad in the same manner as in Example 1. Laminates were manufactured.
【0014】これらの両面銅張積層板について、その特
性を表1に示す。The characteristics of these double-sided copper-clad laminates are shown in Table 1.
【0015】[0015]
【表1】 [Table 1]
【0016】ドリル加工条件 回転数:60,000r/min、ドリル:直径0.5
mmスペ−ドタイプ 送り速度:30μm/r/min 3枚重ね、4000
ヒット 穴壁あらさ:3枚目の3,900〜4,000穴の最大
穴壁あらさ 穴もり上がり:1枚目の3,900〜4,000穴の最
大穴もり上がりDrilling conditions Rotation speed: 60,000 r / min, Drill: Diameter 0.5
mm Spade type Feed rate: 30 μm / r / min 3 sheets stacked, 4000
Hit Hole Wall Roughness: Maximum hole wall roughness of the third 3,900 to 4,000 holes Climbing hole: Maximum hole climbing of the third 3,900 to 4,000 holes
【0017】[0017]
【発明の効果】本発明によれば、表面層にガラス繊維基
材、中心層にアラミド繊維基材ををもちいたので、アラ
ミド繊維基材の特徴をいかして、アラミド繊維のドリル
加工性の悪さを少なくすることができる。According to the present invention, since the glass fiber base material is used for the surface layer and the aramid fiber base material is used for the central layer, the aramid fiber has poor drilling workability due to the characteristics of the aramid fiber base material. Can be reduced.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 成沢 浩 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Naruzawa 1500 Ogawa, Shimodate-shi, Ibaraki Hitachi Chemical Co., Ltd. Shimodate factory
Claims (1)
層がアラミド繊維を含む基材からなる積層板。1. A laminate comprising a surface layer made of a glass fiber base material and a central layer made of a base material containing aramid fibers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13292492A JPH05318638A (en) | 1992-05-26 | 1992-05-26 | Laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13292492A JPH05318638A (en) | 1992-05-26 | 1992-05-26 | Laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05318638A true JPH05318638A (en) | 1993-12-03 |
Family
ID=15092695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13292492A Pending JPH05318638A (en) | 1992-05-26 | 1992-05-26 | Laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05318638A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4882372A (en) * | 1988-08-08 | 1989-11-21 | The Glidden Company | Water-dispersed epoxy/acrylic coatings for plastic substrates |
US4902566A (en) * | 1988-08-08 | 1990-02-20 | The Glidden Company | Water-dispersed epoxy/acrylic coatings for plastic substrates |
-
1992
- 1992-05-26 JP JP13292492A patent/JPH05318638A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4882372A (en) * | 1988-08-08 | 1989-11-21 | The Glidden Company | Water-dispersed epoxy/acrylic coatings for plastic substrates |
US4902566A (en) * | 1988-08-08 | 1990-02-20 | The Glidden Company | Water-dispersed epoxy/acrylic coatings for plastic substrates |
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