JPS6032654A - Metal lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a metal-clad laminate used in electronic equipment, electrical equipment, computing equipment, communication equipment, and the like.

[Background technology]

Conventionally, printed wiring boards have been printed on paper phenol laminates, paper epoxy laminates, glass epoxy laminates, glass polyimide laminates, or other laminates with metal foils such as copper foil attached, or ceramic substrates. A metal foil such as copper foil is used. However, by using the above-mentioned laminated board, it is difficult to increase the density of the printed wiring board, increase the number of layers of wiring, or increase the calculation speed. On the other hand, when a ceramic substrate is used, the size of the printed wiring board is limited because it is difficult to manufacture a large-sized one and the ceramic substrate is easily broken.

[Purpose of the invention]

The purpose of the present invention is to increase the density and multilayering of printed wiring boards and increase the calculation speed by lowering the coefficient of thermal expansion and dielectric constant of the laminate, and to improve the wear resistance of drills during processing. [Disclosure of the Invention] The present invention is a metal-clad laminate formed by laminating and molding a laminate in which a required number of resin-impregnated substrates are stacked and metal foil is placed on the upper and/or lower surfaces, and the resin-impregnated Detailed description of the present invention will be described below regarding a metal-clad laminate characterized in that at least one of the base materials is a quartz fiber cloth with a silicon dioxide content of 60 to 90% by weight (hereinafter simply referred to as %). do. The resins for laminates used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate 1 polyether ether ketone, and fluorinated resin. Resins, etc. alone, modified products, mixtures, etc. are used, and water, methyl alcohol, a7ton, cyclohexanone, etc. are used to adjust the viscosity as necessary.
A solvent such as styrene is added, and the base material for the laminate is a woven fabric made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. non-woven fabric,
Matte or paper or these 4118-type substrates, etc., but at least one substrate has a silicon dioxide content of 60 to 90.
% of quartz fiber cloth is required. That is, by including a quartz fiber cloth with a silicon dioxide content of 60 to 90% in the base material, the laminated (3) board's coefficient of thermal expansion is reduced, especially by improving the dimensional stability under heat. This is because it is possible to increase the density and increase the number of layers, and by lowering the dielectric constant of the laminate, it is possible to increase the calculation speed. In other words, if it is less than 60%, the thermal expansion coefficient and dielectric constant cannot be lowered (and if it exceeds 90%, the drill abrasion during drilling of the laminate will be large and the workability will be reduced.As a metal foil, It is also possible to use a metal foil made of copper, aluminum, brass, stainless steel, iron, nickel, etc., and apply an adhesive to the metal foil if necessary.The present invention will be described below based on examples. I will explain.

Example Silicon dioxide, as the base material quartz fiber cloth.

Plain woven quartz fiber yarn with a content of 70% and a thickness of 0.18
■, The warp yarn arrangement was 42/25 ■, and the weft yarn arrangement was 32/25 cod. A resin-impregnated base material was prepared by impregnating the quartz fiber cloth as described above with polyimide so that the amount of resin was 50% by weight (4). Six sheets of this resin-impregnated base material were stacked, and copper foil with a thickness of 35 μm was placed on the top and bottom surfaces, and then heated at 165℃ and 70℃.
A copper-clad laminate was obtained by heating and pressurizing for 90 minutes under the same conditions as above for lamination molding.

Conventional Example A copper-clad laminate was obtained by the poisonous treatment in the same manner as in the example except that glass cloth was used as the base material.

Comparative Example A copper-clad laminate was obtained in the same manner as in the example except that a quartz fiber cloth containing 98% silicon dioxide was used as the base material.

[Effects of the Invention] As is clear from Table 1, the thermal expansion coefficient, dielectric constant, and drill abrasion resistance of the copper-clad laminates of Examples, Conventional Examples, and Comparative Examples show that the performance of the metal-clad laminates of the present invention is better than that of the standard. 111 points about the excellence of inventions
1m1L.

Note to Table 1. Number of holes that can be drilled into a 1.6-thick laminate board without any problems Patent applicant: Matsushita Electric Works Co., Ltd. Representative patent attorney Toshimaru Takemoto (2 people)

Claims (1)

[Claims] (1) A metal-clad laminate formed by laminating and molding a laminate in which a required number of resin-impregnated base materials are stacked and metal foil is placed on the upper and/or lower surfaces, in which at least one of the resin-impregnated base materials is laminated. A metal-clad laminate, characterized in that the material is a quartz fiber cloth having a silicon dioxide content of 60 to 90% by weight.