JPS5996949A - Laminated board for electricity - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, computing equipment, computer equipment, etc., and its purpose is to eliminate warping and twisting during processing of the laminate. There is a particular thing.

Conventional electrical laminates have a synthetic resin-impregnated base material layer and a metal 95
Due to the large difference in linear expansion coefficient between the two and It was thick (warped and twisted).

The present invention solves the above four points, and by using a resin with a slow curing speed only for the resin-impregnated base material in contact with the metal foil, the strain generated in the gold foil is alleviated by the uncured resin layer, so that the residual stress is reduced. No δl strain occurs, and warpage and twisting can be prevented even during heating when processing an electrical laminate into a printed wiring board or the like.

The present invention will be explained in detail below. Synthetic resins used for Oge and light include phenol 1 fat, cresol resin, unsaturated polyester resin, 4 boxy resin, melamine resin, polyimide, polybutadiene, polyamide, polyamide,
F-mide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and water, water, etc. are used to adjust the viscosity as necessary.
(Nail grease should be one with a slow curing speed. It is not necessary to use resins of the same type, but from the viewpoint of stability, it is preferable to use resins of the same type and to have a difference of 1% in the thickness of the resin.For laminate board I: Materials include inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural materials such as cotton (woven fabric, nonwoven fabric, mat, paper, etc.) It is a combination base material, etc., and the metal foil is a gold (gold) A foil made of copper, aluminum, nickel, etc., and a t&' adhesive layer is provided on one side as necessary.

Example epoxy resin (Shell Chemical Co., Ltd., product t Yaebi Coat 82B
) A resin solution (hereinafter referred to as resin liquid) consisting of 4 parts of dicyandiamide, 0.2 parts of benzyldimethylamine, and 0 parts of methyloxytol per 100 parts (hereinafter simply referred to as parts) was added to a thickness of 0.0 parts. Impregnated with L8 am crow cloth,
Place 4 dried prepregs on top of one another and add 5 drops of a resin liquid (hereinafter referred to as resin liquid) consisting of 100 parts of the above epoxy resin, 4 parts of dicyandiamide, and 50 parts of methyl oxytol to a 0,618 cup glass. Cloth: Soaked, dried 1
One prepreg was placed on each sheet, and a laminate with a copper foil of lVt and 0.035 mm on the bottom was placed between the molding plates, and the molding pressure was 60 mm and the molding temperature was 1.
A conventional example of obtaining an epoxy resin copper-clad laminate by simple molding at 70°C for 120 minutes (6 sheets of prepreg impregnated with the same resin solution A as in the example into a glass cloth with a thickness of 0.18, and dried. A laminate on which a copper foil having a thickness of 0.035 parts m was placed on the lower surface was treated in the same manner as in the example to obtain an electrical laminate.

As is clear from Table 1, the warping rate and twisting rate of the electrical laminates of the Examples and Conventional Examples show that the electrical laminates of the present invention had less warpage and twisting, confirming the superiority of the present invention. .

Note: The rates for each US are J to 1000m.

Claims (1)

[Claims] 1. An electrical laminate comprising a resin-impregnated base material and metal foil, wherein resins 1 and 7 having a slow curing rate are used only in the resin-impregnated base material in contact with the metal foil.