JPS5894458A - Both-surface metal lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The invention relates to a double-sided metal-clad laminate used for electrical equipment, industrial equipment, electronic equipment, etc., and its purpose is to eliminate residual steel on the upper and lower surfaces when processed into a flint wiring board. The aim is to eliminate the warping of printed wiring boards caused by differences in rate.

Conventional double-sided metal-clad laminates are used to create printed wiring board IIIM by leaving the electric circuits by etching, etc. However, because the electric circuits on the upper and lower sides are different, the residual copper ratio is different, causing warping in the printed wiring board and impairing precision. This has become a major problem for the printed wiring boards that are required.

The present invention is a book that solves the above-mentioned drawbacks, so the appearance state of the metal foil on one side is changed from the appearance state of the other metal foil, and a prepreg with a high shrinkage rate is sandwiched on the back side of the metal foil on one side. Since this is a double-sided metal-clad laminate with one layer of normal prepreg, the electric circuit side where the residual steel ratio is high is set on the metal foil side that sandwiched the prepreg with a high shrinkage ratio. The prepreg, which has a high shrinkage rate, cancels out the movement and is able to avoid the same warping as the printed board.At this time, it is necessary to make a difference in the appearance of the metal foil on the upper and lower surfaces to reduce the shrinkage rate. The existence of large prepregs is unknown.

The appearance state of the metal foil can be differentiated by any means such as the color of the metal foil, the polishing state of the metal foil, the gloss of the metal foil, and the surface treatment of the metal foil. Metal foils include copper, aluminum, stainless steel, brass, nickel,
Iron etc. are used. The base material for the laminate may be glass, inorganic fibers such as asbestos, organic synthetic fibers such as polyester, polyacrylate, polyvinyl alcohol, acrylic, woven fabrics, non-woven fabrics or mats, paper made of natural fibers from cotton fields, or paper. General base materials for laminates, such as combination base materials.

Resins for laminates include phenolic resin, epoxy resin,
Unsaturated polyester resins, melane resins, polyiod resins, polysulfones, polybutadiene, fluorinated resins, polybutylene terephthalates, polyether ether ketones, etc., used alone or in modified forms or mixtures thereof, can be used. Incidentally, a solvent such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. may be added as necessary to adjust the viscosity. The present invention will be explained below using Examples.

EXAMPLE A 0.2 ff thick kraft paper was impregnated with a 7-enol resin having a resin content of 50% by weight (hereinafter simply referred to as %) and dried to obtain a prepreg A having a resin content of over 50%. Separately, a linter paper with a N diameter of 0.2 ml was impregnated with the above phenol resin and dried to obtain a prepreg B having a resin amount of 50. Next, prepreg A
Layer 81 sheets of prepreg on top of 7 sheets! On top of that, a glossy copper foil with a thickness of 0.035 m was layered, and then a non-glossy steel foil with a thickness of 0.035 fin was placed on the opposite side, and the polar layer was sandwiched between metal plates to form a pressure-stretched laminate. Obtained.

Conventional Example A laminate in which Motosawa copper foil (0.0351 CIn), the same thickness as in the example, was placed on the earthwork surface on which 8 sheets of prepreg A were laid was treated in the same manner as in the example, and a double-sided copper-clad laminate was obtained. Got the board.

After processing the double-sided metal-clad laminates of the example and the conventional example into printed wiring boards (for example b, the electrical circuit side with a high residual copper ratio was set as the glossy copper foil side). The warpage was Vi196 for the example, but it was 5 for the conventional example, confirming the superiority of the present invention.

patent applicant Matsushita Electric Works Co., Ltd.

Claims (1)

[Claims] A double-sided metal-clad laminate, characterized in that the appearance of the metal foil on one side is different from that on the other metal side, and a B prepreg with a large shrinkage rate is sandwiched on the Jl side of the metal foil on one side.