JPS6390891A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPS6390891A JPS6390891A JP23659286A JP23659286A JPS6390891A JP S6390891 A JPS6390891 A JP S6390891A JP 23659286 A JP23659286 A JP 23659286A JP 23659286 A JP23659286 A JP 23659286A JP S6390891 A JPS6390891 A JP S6390891A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- circuits
- circuit
- present
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 description 1
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 235000001484 Trigonella foenum graecum Nutrition 0.000 description 1
- 244000250129 Trigonella foenum graecum Species 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電気機器、電子機器、計算機器、通信機器、Ｉ
Ｃカード等に用いられる配線板の製造方法に関するもの
である。Detailed Description of the Invention The present invention relates to electrical equipment, electronic equipment, computing equipment, communication equipment, I
The present invention relates to a method of manufacturing a wiring board used for C cards and the like.
従来、配線板上に設けられた鍍金リード等のように回路
形成工程では必要だが最終製品では不必要な回路を除去
する湯合、エツチングで除去したり、ルータ−等の切削
機で切削除去されているが、前者については全鍍金リー
ドには用いられず、後者については必要回路の剥離が多
発し回路Ｍ傾注を低下させる原因となっていた。Conventionally, circuits that are necessary in the circuit formation process but unnecessary in the final product, such as plating leads provided on wiring boards, have been removed by hot-tempering or etching, or by cutting with a cutting machine such as a router. However, the former was not used for fully plated leads, and the latter caused frequent peeling of the necessary circuits, causing a decrease in circuit M concentration.
本発明の目的とするところは、必要回路の剥離がなく、
且つあらゆる材質の回路に適用できる不要回路の除去方
法を提供することにある。The purpose of the present invention is to eliminate the peeling of necessary circuits,
Another object of the present invention is to provide a method for removing unnecessary circuits that can be applied to circuits made of any material.
本発明は配線板上に設けられた必要回路と不必要回路と
の境界部分に予じめ切れ目を設けてから、切削機で不要
回路を除去することを特徴とする配線板の製造方法のた
め、不要回路の除去に際して必要回路への影９をなくす
ることができるので必要回路の剥離が全くなくなったも
ので、しかもエツチング処理を必要としないため全ゆる
材質の回路に適用することができるもので、以下本発明
の詳細な説明する。The present invention relates to a method for manufacturing a wiring board, characterized in that a cut is made in advance at the boundary between a necessary circuit and an unnecessary circuit provided on the wiring board, and then the unnecessary circuit is removed by a cutting machine. When removing unnecessary circuits, it is possible to eliminate the shadow 9 on the necessary circuits, so there is no peeling of the necessary circuits, and since no etching treatment is required, it can be applied to circuits made of all kinds of materials. The present invention will now be described in detail.
本発明に用いる配線板としては、フェノ−／Ｌ／ｌｆｄ
脂、クレゾール樹脂、エボキＶ樹脂、不飽和ポリエステ
７１’樹脂、メラミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ポリスルフォン、
ボリフエニレンサμファイド、ポリフェニレンオキサイ
ド、ポリプチレンテレフタレート、ポリ二−デ〃エーテ
μケトン、弗化樹脂等の単独、変性物、混合物等に必要
に応じて粘度調整に水、メチ！アμコーｙ、アセトン、
シクロヘキサノン、スチレン等の溶媒を添加した樹脂フ
ェスをガフス、アスベスト等の無機繊維やポリエステμ
、ポリアミド、ポリビニルアルコ−μ、アクリμ等の有
機合成繊維や木ｆｌＩｌｉ１等の天然繊維からなる織布
、不繊布、マット或は紙又はこれらの組合せ基材等に含
浸した樹脂含浸基材を所要枚数重ねた上下面に銅、アμ
ミニクム、ニッケμ、亜鉛、鉄等の単独、合金からなる
金属箔を配設一体化してなる両面金属張ｇ！Ｉ層板の上
面及び又は下面をエツチング醇で処理して回路パターン
を形成したものや、アμミニウム、鉄、銅、ニッケル、
亜鉛等の単独、合金からなる金属板の上下に樹脂層を介
して金属箔を配設一体化してなる両面金属張金属ベース
板の上面及び又は下面をエツチング等で処理して回路パ
ターンを形成したものや樹脂積層板の両面に４電インク
等で回路形成したものや、樹脂階層板の両面に回路を鍍
金等で形成したものである。必要回路と不必要回路との
境界部分に予じめ設けられる切れ目は特に限定するもの
ではないが好ましくは回路部分を貫通して配線板に値か
に切れ目が入る程度が望ましい。切削材についてはルー
ダ一等のよりな切削材全般を用りることかでき、特に限
定しないが好ましくはルータ−によることが望まし一〇
以下本発明を実施例にもとづいて説明する。The wiring board used in the present invention includes pheno-/L/lfd
resin, cresol resin, ebony V resin, unsaturated polyester 71' resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Borifuenylene sulfide, polyphenylene oxide, polybutylene terephthalate, poly(di-deate μketone), fluorinated resins, etc. alone, modified products, mixtures, etc. can be used with water or methi! to adjust the viscosity as necessary! μcoy, acetone,
Gaffs are made of resin fabrics containing solvents such as cyclohexanone and styrene, and inorganic fibers such as asbestos and polyester fibers are used.
Requires resin-impregnated base materials such as woven fabrics, nonwoven fabrics, mats, paper, or combinations of these materials made of organic synthetic fibers such as polyamide, polyvinyl alcohol-μ, and acrylic fibers, and natural fibers such as wood flIli1. Copper and aluminum are applied to the upper and lower surfaces of the stacked sheets.
Double-sided metal cladding made by integrating metal foils made of minicum, nickel μ, zinc, iron, etc. alone or made of alloys g! The top and/or bottom surfaces of I-layer boards are treated with etching solution to form circuit patterns, aluminum, iron, copper, nickel,
A circuit pattern is formed by etching the upper and/or lower surfaces of a double-sided metal-clad metal base plate, which is made by disposing metal foil on the top and bottom of a metal plate made of zinc or other metal alone or an alloy through a resin layer. Circuits are formed on both sides of a plastic laminate using 4-electron ink, or circuits are formed on both sides of a resin layered board using plating or the like. The cut previously provided at the boundary between the necessary circuit and the unnecessary circuit is not particularly limited, but it is preferable that the cut be such that it penetrates the circuit portion and makes a cut in the wiring board. As for the cutting material, any cutting material such as Ruder etc. can be used, and although it is not particularly limited, it is preferable to use a router.The present invention will be described below based on Examples.
実施例
第１図は本発明の一実施例を示す簡略断面図、第２図は
同じく本発明の一実施例を示す簡略平面図である。８１
図及び第２図に示すように、片面のみに回路パターンが
形成された厚さ１．０口の片面銅張紙基材フエ、／−／
Ｌ／樹脂配線板１の必要回路２と不必要回５３３との境
界部分に配線板に０．０５１くい込む切れ口４を設けて
から、ル−ターで不必要回路３を除去して配線板を得た
。Embodiment FIG. 1 is a simplified sectional view showing an embodiment of the present invention, and FIG. 2 is a simplified plan view showing an embodiment of the present invention. 81
As shown in the figure and FIG.
L/ After making a cut 4 that cuts into the wiring board by 0.051 at the boundary between the necessary circuit 2 and unnecessary circuit 533 of the resin wiring board 1, remove the unnecessary circuit 3 with a router to complete the wiring board. I got it.
従来例
実施例と同じ片面鋼張紙基材フェノール樹脂配線板の不
必要回路を、必要回路との境界部分からｙ−ターで除去
して配線板を得た。A wiring board was obtained by removing unnecessary circuits from the boundary with necessary circuits using a Y-tar from a single-sided steel-clad paper-based phenolic resin wiring board as in the conventional example.
実施例及び従来例の配線板の性能は、第１表で明白な工
うに本発明のものの性能はよく、本発明の配線板の製造
方法の優れていることを確認した。As shown in Table 1, the performance of the wiring boards of the example and the conventional example was good, and it was confirmed that the wiring board manufacturing method of the present invention was superior.
第１表Table 1
第１図は本発明の一実施例を示す簡略断面図、第２図は
同じく本発明の一実施例を示す簡略平面図である。
ｌは配線板、２は必要回路、３は不必要回路、４は切れ
目である。FIG. 1 is a simplified sectional view showing an embodiment of the present invention, and FIG. 2 is a simplified plan view showing an embodiment of the present invention. 1 is a wiring board, 2 is a necessary circuit, 3 is an unnecessary circuit, and 4 is a cut.
Claims (1)
境界部分に予じめ切れ目を設けてから、切削機で不必要
回路を除去することを特徴とする配線板の製造方法。(1) A method for manufacturing a wiring board, which comprises making cuts in advance at the boundary between necessary circuits and unnecessary circuits provided on the wiring board, and then removing the unnecessary circuits using a cutting machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23659286A JPS6390891A (en) | 1986-10-03 | 1986-10-03 | Manufacture of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23659286A JPS6390891A (en) | 1986-10-03 | 1986-10-03 | Manufacture of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390891A true JPS6390891A (en) | 1988-04-21 |
Family
ID=17002927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23659286A Pending JPS6390891A (en) | 1986-10-03 | 1986-10-03 | Manufacture of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390891A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272647A (en) * | 2009-08-12 | 2009-11-19 | Dowa Holdings Co Ltd | Method for manufacturing of circuit board |
| JP2014010184A (en) * | 2012-06-27 | 2014-01-20 | Uproad Plans Co Ltd | Two-dimensionally-arrayed led lamp |
-
1986
- 1986-10-03 JP JP23659286A patent/JPS6390891A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272647A (en) * | 2009-08-12 | 2009-11-19 | Dowa Holdings Co Ltd | Method for manufacturing of circuit board |
| JP2014010184A (en) * | 2012-06-27 | 2014-01-20 | Uproad Plans Co Ltd | Two-dimensionally-arrayed led lamp |
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