JPS6161798A - Punching machining method of electric laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for punching a Yl, aluminum laminate used for electrical equipment, electronic equipment, computing equipment, communication equipment, etc.

[Background technology]

Conventionally, when punching through-hole holes, holes for mounting semiconductor elements and electronic components, etc. on electrical laminates such as metal-clad laminates and printed wiring boards, electrical laminates were used to prevent delamination, bulges, etc. It was common to heat it to make it moldable and then punch it. This has caused problems such as a reduction in the finished diameter of the punched hole due to heating, a moth-eaten finish on the inner surface of the hole, dimensional changes and warping of the electrical laminate, and an increase in the number of steps.

[Purpose of the invention]

An object of the present invention is to provide a method for punching a vL fatigue laminate without heating and without causing delamination or buffing.

[Disclosure of the invention]

Since the present invention is a punching method for electrical laminates, which is characterized by punching with a punch diameter/plate thickness ratio of 0.75 or more, it is necessary to know in advance the safety limit in which delamination and bulges do not occur. Since it is possible to use a corresponding punching method. The present invention will be explained in detail below.

In the punch for punching and the electrical laminate used in the method of the present invention, it is necessary that the punch diameter/plate thickness ratio be 0.75 or more. That is, if the punch diameter/plate thickness ratio is less than α75, bulges, delamination, etc. are likely to occur around the hole. ! For laminates, phenolic resin, cresol resin, epoxy resin, unsaturated polyester) V resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether are used as resins for laminates. It uses ketones, fluorinated resins, etc. alone, modified products, mixtures, etc., and if necessary, solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are added to adjust the precision.As a base material for laminates. , glass, asbestos, or other inorganic fibers, polyester, polyamide, polyvinyl alcohol, acrylic, or other organic synthetic fibers, cotton or other natural fibers, woven fabrics, Maputo or paper, or a combination of these base materials for the above laminates. Impregnate the above laminate base material with resin, stack the required number of dried resin-impregnated base materials, and if necessary, coat the upper and/or lower surfaces with metal foil such as copper foil, aluminum foil, stainless steel foil, nickel foil, brass foil, etc. Metal-clad laminates obtained by laminating and molding laminates on which laminates are placed, printed wiring boards processed from these laminates, etc. It can be used for all air layered laminates.

The method of the present invention will be explained below using Examples.

Example: A single-sided copper-clad paper-based phenolic resin laminate with a thickness of 1.6 mm was punched from the copper foil side at 25°C using a punch with a diameter of 1.25 fl (punch diameter/plate thickness ratio = 0.78). However, no bulges or delaminations occurred around the punched holes.

Comparative Example The same laminate as in the example was punched from the copper foil side at 25°C using a punch with a diameter of α94 mm (punch diameter/thickness ratio = 0.5).
9) L, but there were frequent bulges and delaminations around the punched holes.

〔Effect of the invention〕

Example and Comparative Example 1! Comparing the punched products of general purpose laminates, a lot of bulges and delaminations were observed around the holes in the punched products of the comparative example, but none were observed in the punched products of the example. The superiority of the punching method for electrical and electrical laminates was confirmed.

Claims (1)

[Claims] (1) A method for punching an electrical laminate, the method comprising punching an electrical laminate at a punch diameter/thickness ratio of 0.75 or more.