JPS59125698A - Method of producing multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the field of a method for manufacturing a multilayer printed wiring board used for industrial equipment, electronic equipment, electrical equipment, etc.

[Background technology]

Conventional multilayer printed wiring boards are made by laminating and molding resin-impregnated paper, resin-impregnated glass cloth, or resin-impregnated cloth between an inner layer laminate with an electric circuit formed on its surface and an outer layer circuit board. However, if the base material interposed between the inner layer laminate and the outer layer circuit board is paper, glass, cotton cloth, etc., the adhesive strength with the inner layer laminate will be too high, which is a problem. However, when aromatic polyamide fiber cloth, which has excellent heat resistance, dimensional stability, and lightness, was used as a base material, the adhesive strength decreased significantly, which caused problems. .

[Purpose of the invention]

The present invention provides a multilayer printed wiring board with excellent heat resistance, dimensional stability, and light weight by improving the adhesive strength of the resin-impregnated aromatic polyamide fiber cloth interposed between the inner M-layer board and the outer circuit board. The purpose is to

[Disclosure of the invention]

An example of the present invention will be described below with reference to the illustrated embodiment. As shown in Figure 1, phenolic resin,
Cresol resin, epoxy resin, unsaturated polynisder resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene prephleglate, polyetheretherketone,
Resin faces for laminates made of fluorinated resins alone, modified products, mixtures, etc. are made of inorganic fibers such as galanu, anubenuto, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, and natural fibers such as cotton. woven fabric,
Layer the required number of prepregs impregnated with a laminate base material such as non-woven fabric, matte or paper, and then laminate a laminate with metal foil such as copper foil, aluminum foil, brass foil, nickel foil placed on the bottom surface. An inner layer laminate 2 in which an electric circuit 1 is formed on the surface of an electrical laminate such as a molded metal-clad laminate or an additive laminate, and an outer layer circuit board 3 such as the metal-clad laminate or metal foil. A multilayer printed wiring board is obtained by laminating and molding a resin-impregnated, surface-plasma-treated aromatic polyamide fiber cloth (manufactured by DuPont, product name: Kepler Cloth with Plasma Treatment) 4 interposed therebetween. The resin used for the resin-impregnated surface plasma-treated aromatic polyamide fiber cloth is not particularly limited, but it is preferable to use the same type of resin as the resin used for the inner layer laminate in order to stabilize adhesiveness and dimensional stability. This is desirable. Only one piece of resin-impregnated surface plasma-treated aromatic polyamide fiber cloth may be used, but a plurality of pieces may be used if necessary. Furthermore, the present invention is applicable to both single-sided and double-sided circuit boards. In a test using polyimide-impregnated aromatic polyamide fiber cloth using a polyimide inner layer laminated board, the adhesive strength of the plasma-treated product was 1.1 kVCIn, while that of the non-treated product was 0.5 kVcm, indicating a large difference in adhesive strength.

〔Effect of the invention〕

As described above, according to the present invention, the aromatic polyamide woven fabric can be safely used between the inner/f'l laminate and the circuit board, resulting in excellent heat resistance, dimensional stability, and light weight. A multilayer printed wiring board can be provided.

[Brief explanation of the drawing]

FIG. 1 is a simplified F18 sectional view showing one embodiment of the present invention. 1t/'i electric circuit, 2 a laminate for inner layer, 8 an outer circuit board, 4 resin-impregnated surface plasma-treated aromatic polyamide fiber cloth.

Claims (1)

[Claims] A method for manufacturing a multilayer printed wiring board, which comprises laminating and molding a resin-impregnated surface plasma-treated aromatic polyamide fiber cloth interposed between an inner layer laminate on which an electric circuit is formed and an outer layer circuit board. .