JPS6369637A - Printed wiring substrate - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a printed wiring board used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.

[Background technology]

Conventional printed wiring boards use paper, guff cloth, phenol resin, or epoxy resin between inner layer materials and between inner layer materials and outer layer materials.
It is obtained by laminating and molding a laminate with a resin-impregnated base material impregnated with resin or polyimide resin and dried, and the dielectric constant of this printed wiring board #1 is as follows.
5.0 when EBOKI V resin-impregnated Gaos cloth is used as the resin-impregnated base material. The polyimide resin-impregnated guff cloth has a relatively large size of 4.0, so when used as a printed wiring board, the high frequency characteristics are insufficient, and restrictions have been placed on use in high frequency arithmetic circuits and communication equipment circuits.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to have a small dielectric constant t, good high frequency characteristics, and a high frequency performance circuit and communication circuit when used as a printed wiring board. The object of the present invention is to provide a printed wiring board on which a mechanical circuit can be mounted and which has excellent insulation properties.

[Disclosure of the invention]

The present invention is characterized in that it is formed by integrating a laminate in which an outer layer material is arranged with a resin layer containing at least one resin-impregnated fluororesin fiber nonwoven fabric interposed on the upper and/or lower surface of a required number of inner layer materials. The present invention will be described in detail below as a printed wiring board that can improve the high frequency characteristics of a fluorine resin layer having excellent high frequency characteristics.

Among the materials used in the present invention, inorganic fibers such as glass and asbestos, polyester, polyamide, polyvinyl
Woven fabrics, non-woven fabrics, and i-ft fabrics made of organic synthetic fibers such as Ayco1μ and Acryμ and natural fibers made of cotton are used as base materials such as paper with phenol/1/resin, cresol resin, and EBOKI V! M fat,
Unsaturated polyester/L' resin, melamine resin, polyimide, polygetadiene, polyamide, polyamideimide,
Impregnate with polysulfone, polyphenylene oxide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluororesin, etc. alone, modified products, mixtures, etc., and dry. An electric circuit is formed on the gold 8 foil of an electrical laminated board made by integrating metal foil into the gold foil. As the resin layer, the above-mentioned resin-impregnated base material used for manufacturing electrical laminates can be used as it is, and furthermore, a coated layer of the above-mentioned resin may be %'-)% film. However, it is necessary to use at least one resin-impregnated fluororesin fiber nonwoven fabric in the resin layer.

This is because the high frequency characteristics of the printed wiring board can be greatly improved. As the resin to be impregnated into the fluororesin fiber nonwoven fabric, the resin of the resin-impregnated base material can be used as long as it is. The fluororesin forming the fluororesin fiber nonwoven fabric is trifluorochloroethylene resin (melting point 210-212°C, tetrafluoroethylene C).
a point 3z7℃), tetrafluoroethylene-propylene hexafluoride copolymer IHI (/!!7II point 270℃), tetrafluoroethylene-perfluorovinyl ether copolymer resin (r4 point 302-310℃), etc. The melting point is 20
Preferably, the temperature is 0°C or higher. The fluororesin fiber nonwoven fabric is not particularly limited, but preferably has a thickness of 0.5 to 2M% and an aeration rate of 75 to 300C (: /cd
, seconds. The resin-impregnated fluororesin fiber nonwoven fabric may be used for the entire resin layer, or it may be used only in the center of the resin layer, or only in the outermost layer of the resin layer, or alternatively, it may be used in layers alternately with a regular resin-impregnated base material. It may be used optionally. As the outer layer material, a single or alloy foil of copper, aluminum, aluminum, nickel, zinc, etc., or a horizontal laminate plate clad with metal foil on one side can be used, and there are no particular limitations.

The present invention will be explained below based on examples.

$! 1 Example 1 Upper and lower surfaces K of inner layer material made by forming electric IW circuits on both sides of a gaff cloth base material epoxy V resin double-sided steel clad laminate with a thickness of 0.5 stories, tetrafluoroethylene barf OLOBINI Made of ether copolymer, 1 m thick, 9 IC degree 150 Cc/
d, hardening agent-containing epoxy V@ in fluororesin fiber nonwoven fabric
Impregnated with fat varnish, dried and expressed as % by weight of resin mass (hereinafter simply %)
], curing time 200 seconds (160°C) Ebony Vt
# Two sheets of fat-impregnated fluororesin fiber nonwoven fabric C (hereinafter referred to as prepreg A) were interposed with copper foil having a thickness of 0.01810F, and a nine bond layer was molded at a pressure of 40Q/d, 170
C. for 90 minutes to obtain a printed ts board.

Example 2 Prepreg layers were placed on the upper and lower surfaces of the same inner layer material as in Example 1, and on the outside, a glass woven fabric with a thickness of 0.1511 was impregnated with the above curing agent-containing Evoki V8M fat varnish and dried. Epoxy resin-impregnated glass woven fabric (hereinafter referred to as prepreg B) with a resin content of 50% and a curing time of 200 seconds (160"C)
Thickness o, om company's t7i4?3i
A printed wiring board was obtained by laminating and molding the compensating layer body provided with the following in the same manner as in Example 1.

Example 3 The same inner layer material as in Example 1 was impregnated with polyimide long resin (Rhone-Poulenc J, trade name: Kelimide 601) on the upper and lower surfaces of the same fluororesin heavy fiber nonwoven fabric as in Example 1, and dried to form a resin. A polyimide resin-impregnated fluororesin fiber irregular fabric (hereinafter referred to as Gripreg C) with a curing time of 500 seconds (160°C) and a curing time of 500 seconds (160°C) was placed on the outside thereof, and a 0.15% thick
XX glass woven fabric was impregnated with the above polyimide resin and dried to reduce the amount of resin to 50% and harden time (polyimide a at 160°C).
The laminated body in which a 0.01860-thick copper foil was interposed with T fat-impregnated guff woven fabric (hereinafter referred to as prepreg D) was soaked for 200 minutes at a molding pressure of #/-4, :oo''C. Two printed circuit boards were obtained by molding.

Comparative example 1 5! Prepreg 83 on the top and bottom of the inner 71 material as in Example 1
A piece of copper foil with a thickness of 0.0:[8M] was molded in the same manner as in Example 1, and a pudding 1 was prepared.
One substrate was obtained.

Comparative Example 2 A printed Amamaki board was obtained in the same manner as Comparative Example 1, except that 83 prepregs were used instead of 83 sheets of Hishichi 011 prepreg.

Table 11 shows the 55 voltage heights of the printed wiring board & 1 board of Examples 1 to 3 and Comparative Example 11'F.

Table 1 [Effects of the Invention] In the present invention, between the inner layer material and the outer layer material, a resin-impregnated base material formed by impregnating a nonwoven fabric with a resin varnish and dry-exploding the fluorocarbon resin is used. Therefore, it has a small dielectric constant and good high frequency characteristics, and when bent sideways as a printed wiring board, it becomes possible to mount high frequency arithmetic circuits and communication device circuits using a high frequency clock.

Claims (1)

[Claims] (1) It is characterized by being formed by integrating a laminate in which an outer layer material is arranged with a resin layer containing at least one resin-impregnated fluororesin nonwoven fabric interposed on the upper and/or lower surface of the required number of inner layer materials. Printed wiring board.