JPS607796A - Copper-lined laminated board for printed circuit and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper-clad laminate for printed circuits using an epoxy resin-impregnated prepreg containing a large amount of an inorganic filler, and a method for manufacturing the same.

In recent years, laminates (hereinafter referred to as composite laminates) have been developed as copper-clad laminates for printed circuits, which have a structure in which glass nonwoven fabric is used as an intermediate layer base material and glass woven fabric is used as a surface layer base material, and epoxy resin is impregnated and used as a binder. (abbreviation)) is used for binary purposes (2-valued) - Laminated sheets made by impregnating only the woven glass fabric base material with epoxy resin have excellent mechanical strength, dimensional stability, moisture resistance,
Because of its heat resistance (= excellent) and high reliability of through-hole plating, it is widely used in industrial electronic equipment such as electronic computers, communications equipment, and electronic exchanges. Therefore, punching is not possible in the drilling process, which is one of the processing steps for printed circuit boards, and the actual situation is that drilling is performed.

On the other hand, composite laminates are superior to laminates based on woven glass fabric because they are more economical (lower cost) and can be punched and punched, and are attracting attention as laminates based on H-rata substrates with good processability. However, the reliability of through-hole plating was evaluated to be lower than that of glass woven fabric base laminates.The reason for this is that the composition of glass fiber base epoxy laminates is a combination of an organic epoxy resin and an inorganic glass fabric. The weight ratio of the cloth is approximately 40:60.In this case, epoxy resin is the main material (C2, which has excellent electrical performance), and glass woven cloth has good mechanical performance such as bending strength and dimensional stability. It is thought that the

By the way, general composite laminates have poor mechanical performance (=
The total amount of contributing inorganic substrates, ie glass woven fabric and glass non-woven fabric, is less than that of the glass woven laminate.

The ratio of organic matter to inorganic matter is about 60:40, which is the opposite of that of the glass woven fabric laminate, so it was evaluated that the dimensional stability and reliability of through-pole plating were low.

The inventors of the present invention have studied to improve these drawbacks while taking advantage of the excellent features of composite laminates, and have added a large amount of inorganic fillers to the structure of general composite laminates. We obtained a new composite laminate with characteristics that cannot be obtained with a single composition.

In the composite laminate of the present invention, the epoxy resin (=inorganic filler is blended with large iC2 to increase the ratio of inorganic matter in the composite laminate (2), the reliability of through-hole plating, etc. We were able to improve the performance to the same level or even higher than that of cloth laminates.

The present invention is a composite laminate (:, in the middle layer (
= 100 parts (parts by weight, the same applies hereinafter) of the epoxy resin of the intermediate layer in the inorganic filler (100 to 200 parts per two furnaces).

The present invention (=Inorganic fillers used include clay talc, mica, silica powder, alumina, aluminum hydroxide, glass powder, titanium white, wallanutonite, antimony trioxide, etc.).

As a preferable inorganic filler, a mixed powder of silica and/or alumina and aluminum hydroxide is used.

Silica and alumina are effective in improving the heat resistance of laminates, and aluminum hydroxide is effective in improving flame resistance.

In order for the inorganic filler to be uniformly dispersed in the epoxy resin without forming a so-called lump, it is preferable that the filler has an average particle size of 5 to 10 μm and a maximum particle size of 40 μm or less. When the particle size is larger than 40μ (2) When the glass nonwoven fabric is impregnated with the inorganic filler-containing epoxy resin, the inorganic filler is unevenly distributed in the glass nonwoven fabric of the laminate due to the filtration effect of the nonwoven fabric. Uniform: Two. On the other hand, if most of the particles of the inorganic filler are smaller than 5μ in particle size (= is this state where the fine powder of the inorganic filler remains solidified): This is likely to occur, and the distribution of the inorganic filler is also uneven. Two.

Next, add two ultrafine silica particles to the inorganic filler (2 of the total amount).
-10% (2) Prevents the sedimentation of the inorganic filler in the epoxy resin varnish, and (= When impregnated into glass nonwoven fabric (= Great effect on making the distribution of the inorganic filler uniform) .

Example 1 The composition of the epoxy resin-containing varnish is as follows.

(1) Brominated epoxy resin (manufactured by Yuka NEL, EP-(3)
)2ethyl4methylimidazole 0.15 (4) Methyl cellosolve 36 (5) Acetone 60 The above materials were mixed to prepare a uniform face.

Next (=The varnish is applied to glass woven fabric (manufactured by Nittobo, Iku-18KB)
Z-2)! 2. The resin content was 42 to 45% (2) Impregnated and dried to obtain a glass woven prepreg.

Subsequently, the following inorganic filler was added to 100 parts of the epoxy resin-containing varnish (two resins) and mixed with stirring to prepare an inorganic filler-containing varnish.

(1) Silica (Tatsumori, Crystallite VX-3)
30 parts (2) Aluminum hydroxide (manufactured by Showa Light Metal).

Hisilite H-42) 7Q (3) Ultrafine powdered silica (manufactured by Geotsugi Pharmaceutical).

Carplex) 5 Next, this varnish containing an inorganic filler was applied to a glass nonwoven fabric (manufactured by Nippon Vilene, BP-4075') - two resins and a non-woven fabric with a filler content of 10% C (two impregnated and dried). A nonwoven fabric prepreg was obtained.

Next, the glass nonwoven fabric prepreg was used as an intermediate layer, the glass nonwoven fabric prepreg was placed on the surface layer, and copper foil was further layered on top of the glass nonwoven fabric prepreg at a molding temperature of 165°C and a pressure of 60K9/cr.
A copper-clad laminate having a thickness of 1.6 mm was obtained by lamination molding at I for 90 minutes.

Example 2 Example 1 (= epoxy resin varnish (2 additions (1
) 5 parts of silica (2) 95 parts of aluminum hydroxide (3) 5 parts of ultrafine powdered silica (2) A copper-clad laminate was obtained in the same manner as in Example 1, except that 5 parts of ultrafine powdered silica were used.

Comparative Example Glass woven prepreg was obtained in the same manner as in the example. Subsequently, a glass nonwoven fabric was impregnated with the epoxy resin varnish used in the example so that the resin content was 70 to 75% and dried to obtain a glass nonwoven fabric prepreg.

Thereafter, a copper-clad laminate having a thickness of 1.6 x m was obtained in the same manner as in the example.

The properties of the copper-clad laminates obtained are shown in Tables 1 and 2. The measurement method was based on JIS C6481i2 except for flame resistance, shrinkage rate, and punchability.

Table 1 - General Special Outsourcing (1) Initial dimensions. After removing the copper foil etching from C2 and heat-treating it at 150°C for 30 minutes, the dimensions are Ll and calculated using the following formula. The method is as follows (see Figure 1). Copper-clad laminate (
1) (Nitrile processing (: Through-hole of a specified diameter (
2) is provided, and after performing through-hole plating (3), the copper foil on the surface is removed. Next, Q, nickel silver wire of 5 mnφ (4
) in the through hole with solder (5). This nickel silver wire (4) is pulled out in the input direction (=pulled out) and its pulling strength is measured.

As mentioned above (=, since the present invention has a structure containing a large amount of inorganic filler, the adhesion of through-hole plating is excellent compared to the conventional product (comparative example) (=), and the reliability of through-hole plating is improved. can improve

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a method for measuring adhesion of through-hole plating. Patent Application - Person Sumitomo Bakelite Co., Ltd. Figure 1

Claims (5)

[Claims] (1) The surface layer is made of epoxy resin glass woven fabric, the middle layer is made of epoxy resin glass nonwoven fabric, copper foil is laminated on one or both of the surfaces of the surface layer, and these are heated and pressed (two pieces are integrated into one). Copper-clad laminate (-, intermediate layer (
= is a copper-clad laminate for printed circuits, characterized in that 100 to 200 parts by weight of an inorganic filler is contained in 100 parts by weight of epoxy resin of the intermediate layer. (2) The copper-clad laminate for printed circuits according to claim 1, wherein the inorganic filler is composed of a mixed powder of silica and/or alumina and aluminum hydroxide. (3) The copper-clad laminate for printed circuits according to item 1, wherein the inorganic filler has an average particle size of 5 to 10 μm and a maximum particle size of 40 μm or less. (4) As silica in the inorganic filler, the average particle size is 10~
40ff! 2. The copper-clad laminate for printed circuits according to item 1, characterized in that ultrafine silica particles of μ are blended. (5) 100 parts by weight of epoxy resin (2 parts by weight of inorganic filler
A varnish containing 00 to 200 parts by weight of glass non-woven fabric [2] One or more sheets of prepreg obtained by impregnation and drying is used as an intermediate layer, A method for producing a copper-clad laminate for printed circuits, which comprises disposing a copper foil on one or both surfaces and forming the copper-clad laminate under heat and pressure.