JPH02286238A - Laminated board for printed circuit - Google Patents
Laminated board for printed circuitInfo
- Publication number
- JPH02286238A JPH02286238A JP10604689A JP10604689A JPH02286238A JP H02286238 A JPH02286238 A JP H02286238A JP 10604689 A JP10604689 A JP 10604689A JP 10604689 A JP10604689 A JP 10604689A JP H02286238 A JPH02286238 A JP H02286238A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic filler
- hydrate
- parts
- water
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011256 inorganic filler Substances 0.000 claims abstract description 32
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000004744 fabric Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims abstract description 5
- 239000002344 surface layer Substances 0.000 claims abstract description 5
- 239000004745 nonwoven fabric Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 3
- 229940024545 aluminum hydroxide Drugs 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 10
- 239000002966 varnish Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910001679 gibbsite Inorganic materials 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002759 woven fabric Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910001593 boehmite Inorganic materials 0.000 description 3
- 150000004677 hydrates Chemical class 0.000 description 3
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 208000002352 blister Diseases 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 wallasnite Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- ZHZFKLKREFECML-UHFFFAOYSA-L calcium;sulfate;hydrate Chemical compound O.[Ca+2].[O-]S([O-])(=O)=O ZHZFKLKREFECML-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は耐熱性、耐溶剤性が優れ、加工性の良い印刷回
路用積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed circuit laminate that has excellent heat resistance, solvent resistance, and good workability.
成で、エポキシ樹脂を含浸させ結合剤とした積層板（以
下コンポジット積層板と略称する）が多量に使用される
ようになった。As a result, laminates impregnated with epoxy resin and used as a binder (hereinafter referred to as composite laminates) have come to be used in large quantities.
ところで、一般のコンポジット積層板は機械的性能に寄
与する無機基材、即ち、ガラス織布とガラス不織布の合
計量がガラス織布積層板より少ない、有機物と無機物の
比率が約６０：４０であり、ガラス織布積層板とは比率
が逆転しているため、寸法安定性やスルーホールメツキ
の偉績性が低いと評価されていた。By the way, in general composite laminates, the total amount of inorganic base materials that contribute to mechanical performance, that is, glass woven fabric and glass nonwoven fabric, is smaller than that of glass woven fabric laminates, and the ratio of organic matter to inorganic matter is about 60:40. Because the ratio is reversed from that of glass woven fabric laminates, it was evaluated as having low dimensional stability and through-hole plating performance.
そのため、コンポジット積層板の優れた特徴を活かしな
がら、これらの欠点を改良すべく検討され、一般のコン
ポジット積層板の構成にさらに無機充填剤を大量に配合
することにより、単一組成では得られない特徴あるコン
ポジット積層板が得られている（特開昭６０−７７９６
号）、さらにコンポジット積層板に無機充填剤として用
いる水酸化アルミニウムについてその結晶構造の特徴を
検討して、結晶構造がベーマイト型である水酸化アルミ
ニウムをコンポジット積層板に配合することにより、ギ
ブサイト型水酸化アルミニウムを配合したコンポジット
積層板よりもはんだ耐熱性が著しく向上することも知ら
れている（特開昭６０５９７９５号）。Therefore, studies were conducted to improve these shortcomings while taking advantage of the excellent characteristics of composite laminates, and by adding a large amount of inorganic filler to the composition of general composite laminates, it is possible to create products that cannot be obtained with a single composition. Characteristic composite laminates have been obtained (Japanese Patent Application Laid-Open No. 60-7796
Furthermore, we investigated the characteristics of the crystal structure of aluminum hydroxide, which is used as an inorganic filler in composite laminates, and found that by incorporating aluminum hydroxide, which has a boehmite-type crystal structure, into composite laminates, we could create gibbsite-type water. It is also known that the solder heat resistance is significantly improved compared to a composite laminate containing aluminum oxide (Japanese Patent Application Laid-Open No. 6059795).
ギブサイト型水酸化アルミニウム（以下、ギブサイトと
いう）は、２００ ’Ｃから５００°Ｃの範囲で水を放
出する。この時の吸熱量が大きいので、これを利用して
一般の合成樹脂では難燃性を保たせるための充填剤とし
て用いられている。しかし積層板は印刷回路及び組立て
工程において高熱状態にさらされる頻度が高く、例えば
はんだ工程では通常２６０°Ｃのはんだ浴に浸るので、
ギブサイトを充填材として用いたコンポジット積層板は
、浸漬時間が長くなるとふくれによる不良が発生する。Gibbsite-type aluminum hydroxide (hereinafter referred to as gibbsite) releases water in the range of 200'C to 500°C. Since the amount of heat absorbed at this time is large, this is used as a filler in general synthetic resins to maintain flame retardancy. However, laminates are frequently exposed to high temperatures during printed circuit and assembly processes, such as during soldering processes where they are typically immersed in a 260°C solder bath.
Composite laminates using gibbsite as a filler suffer from blistering defects when immersed for a long time.
この原因は熱によるギブサイトからの水の放出であるこ
とが判っている。It is known that the cause of this is the release of water from the gibbsite due to heat.
一方、結晶性の良いベーマイト型水酸化アルミニウム（
以下、ベーマイトという）は５００°Ｃから脱水が始る
ことが知られており、これをコンポジット積層板用樹脂
に充填することにより、はんだ耐熱性は著しく向上する
が、ギブサイトを充填した積層板よりも透明性及び孔あ
け加工におけるドリル刃の寿命、更にコスト的な面で劣
る。またベーマイトは、ギブサイトの３永和型と比べ、
ｌ水和型であるため熱分解時の水放出量による吸熱量が
小さく難燃効果が弱いことも知られている。On the other hand, boehmite-type aluminum hydroxide with good crystallinity (
It is known that boehmite (hereinafter referred to as boehmite) starts to dehydrate at 500°C, and by filling it into the resin for composite laminates, the soldering heat resistance is significantly improved. However, it is inferior in terms of transparency, drill bit life in drilling, and cost. Also, boehmite is compared to Gibbsite's 3-Eiwa type.
It is also known that because it is a hydrated type, the amount of heat absorbed by the amount of water released during thermal decomposition is small, and its flame retardant effect is weak.
本発明は、従来のコンポジット積層板では得られなかっ
た更に高い耐熱性、耐溶剤性、高信頼性を有し、更に加
工性の良い印刷回路用積層板を従供することを目的とす
る。An object of the present invention is to provide a printed circuit laminate that has higher heat resistance, solvent resistance, and higher reliability than conventional composite laminates, and is also easy to process.
本発明は、表面層はエポキシ樹脂含浸ガラス織布からな
り、中間層は無機フィラー含有エポキシ樹脂含浸不織布
からなり、かつ無機フィラーとして、２００°Ｃ〜６０
０°Ｃで水を放出する水和物又は含水物がエポキシ樹脂
１００重量部に対して、１０〜１００重量部、上記水和
物又は含水物以外のものが１０部以上で前記フィラーと
の合計で５０〜２００重量部になる様含有されているこ
とを特徴とする印刷回路用積層板である。本発明に用い
られる水和物あるいは含水物の無機フィラーは、２００
”Ｃ〜６００°Ｃの範囲で水を放出するものであり、
例ば水酸化アルミニウム、水酸化マグネシウム、水酸化
カルシウム、硫酸カルシウム水和物、などがあるが、好
ましくは、２００°Ｃから水を放出する、ギブサイト型
水酸化アルミニウムがよい。In the present invention, the surface layer is made of an epoxy resin-impregnated glass woven fabric, and the intermediate layer is made of an epoxy resin-impregnated nonwoven fabric containing an inorganic filler.
Hydrates or water-containing substances that release water at 0°C are 10 to 100 parts by weight based on 100 parts by weight of the epoxy resin, and substances other than the above-mentioned hydrates or water-containing substances are 10 parts or more in total with the filler. This is a laminate for printed circuits, characterized in that the amount of 50 to 200 parts by weight is 50 to 200 parts by weight. The hydrate or water-containing inorganic filler used in the present invention has a
"It emits water in the range of 600°C to 600°C,
Examples include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, calcium sulfate hydrate, etc., but gibbsite type aluminum hydroxide, which releases water from 200°C, is preferable.
また、水和物あるいは含水物以外の無機フィラーとして
は、酸化マグネシウム、シリカ、タルク、ワラスナイト
、ガラス粉末などがあるが、好ましくは、ドリル加工性
から、硬度の低い タルク−がよい。Examples of inorganic fillers other than hydrates or water-containing fillers include magnesium oxide, silica, talc, wallasnite, and glass powder, but talc, which has a low hardness, is preferred from the viewpoint of drillability.
さらに両者の配合は、エポキシ樹脂１００重量部に対し
、水和物又は含水物が１０〜１００重量部、好ましくは
３０〜７０重量部、水和物又は含２００重量部、好まし
くは８０〜２００重量部になる様に含有されている。こ
れは、−船釣な臭素含有率１５〜２５％のエポキシ樹脂
を使用した場合、水和物又は含水物が１０重量部以下で
は積層板の難燃性が保てず、また、１００重量部以上で
は印刷回路及び組み立て時にソルダーコートやリフロー
ソルダーなどの工程で、積層板が高温状態になった時、
フィラーが分解し水分子が放出され、ふくれの原因とな
る。Furthermore, the combination of both is such that the hydrate or water-containing material is 10 to 100 parts by weight, preferably 30 to 70 parts by weight, and the hydrate or water-containing material is 200 parts by weight, preferably 80 to 200 parts by weight, per 100 parts by weight of the epoxy resin. It is contained in such a way that it becomes a part. This is because - when using an epoxy resin with a bromine content of 15 to 25%, the flame retardancy of the laminate cannot be maintained if the hydrate or water content is less than 10 parts by weight; In the above, when the laminate becomes high temperature during processes such as solder coating and reflow soldering during printed circuit and assembly,
The filler breaks down and releases water molecules, causing blisters.
さらに水和物又は含水物以外のフィラーが１０重量部以
下ではその配合効果が小さく、水和物又は含水物フィラ
ーとの合計が５０重量部以下では、レジン量が多いため
、積層板の熱膨張率が大きく、スルーホールメツキの信
顧性が低下して好ましくなく、２００重量部以上では無
機フィラーを樹脂に混合したとき粘度が高くなり過ぎて
、ガラス不織布への含浸が困難になる。Furthermore, if the amount of filler other than hydrate or water-containing filler is less than 10 parts by weight, the blending effect will be small, and if the total amount with hydrate or water-containing filler is less than 50 parts by weight, the amount of resin will be large, resulting in thermal expansion of the laminate. If the ratio is too large, the reliability of through-hole plating is undesirable, and if it exceeds 200 parts by weight, the viscosity becomes too high when the inorganic filler is mixed with the resin, making it difficult to impregnate the glass nonwoven fabric.
本発明は、従来の２００℃〜６００°Ｃで水を放出する
水和物又は含水物の無機フィラーの特長である難燃性を
維持、向上させるとともに、欠点であるリフローソルダ
ーなどの高温処理時のフィラーの水分子の放出によるふ
くれの問題を上記水和物又は含水物以外のフィラーを所
定量混合することにより解決したことに特徴がある。The present invention maintains and improves flame retardancy, which is a feature of conventional hydrate or water-containing inorganic fillers that release water at 200°C to 600°C, and also maintains and improves flame retardancy, which is a drawback during high-temperature processing such as reflow soldering. The present invention is characterized in that the problem of blistering caused by the release of water molecules from the filler is solved by mixing a predetermined amount of a filler other than the above hydrated or water-containing filler.
これらの充填剤はエポキシ樹脂中でいわゆるままこにな
らないで均一に分散し、ガラス不織布に含浸させたとき
も均一に分布するために、充填剤の平均粒径が５〜１０
μｍであり、最大粒径が４０μｍ以下であることが好ま
しい０粒径が４０μｍより大きい場合には、無機充填剤
含有エポキシ樹脂をガラス不織布に含浸させた時に、不
織布による濾過作用のため積層板のガラス不織布中で無
機充填剤の分布が不均一になりやすい、一方無機充填剤
の粒子の多くが粒径５μｍより小さい場合には、無機充
填剤の微粉末が固まり、ままこの状態になりやすく、や
はり無機充填剤の分布が不均一になる傾向がある。These fillers are uniformly dispersed in the epoxy resin without clumping, and are evenly distributed when impregnated into glass nonwoven fabric, so the average particle size of the fillers is 5 to 10.
μm, and the maximum particle size is preferably 40 μm or less. If the zero particle size is larger than 40 μm, when a glass nonwoven fabric is impregnated with an inorganic filler-containing epoxy resin, the filtration effect of the nonwoven fabric causes the laminated plate to The distribution of the inorganic filler in the glass nonwoven fabric tends to be uneven.On the other hand, if most of the particles of the inorganic filler have a particle size of less than 5 μm, the fine powder of the inorganic filler tends to solidify and remain in this state. After all, the distribution of the inorganic filler tends to be uneven.
さらに超微粒子シリカを無機充填剤の中に全体量の２〜
１０％配合することにより、エポキシ樹脂ワニス中の無
機充填剤の沈降を防止し、さらにガラス不織布に含浸さ
せた時に無機充填剤の分布を均一にするのに大きな効果
がある。In addition, ultrafine particle silica is added to the inorganic filler by 2 to 30% of the total amount.
By adding 10%, it is highly effective in preventing sedimentation of the inorganic filler in the epoxy resin varnish and also in making the distribution of the inorganic filler uniform when it is impregnated into a glass nonwoven fabric.
以下に本発明の実施例及び比較例（従来例）を示す。 Examples of the present invention and comparative examples (conventional examples) are shown below.
実施例１〜５ エポキシ樹脂配合ワニスの組成は次の通りである。Examples 1-5 The composition of the epoxy resin-containing varnish is as follows.
（１） 臭素化エポキシ樹脂
（油化シェル製ＥＰ−，１０４６）１００部（２）
ジシアンジアミド ４部（３）２エチ
ル４メチルイミグゾール ０．１５部（４）メチルセル
ソルブ ３６部（５）アセトン
６０部上記材料を混合して均一なワニ
スを作成した。(1) Brominated epoxy resin (Yuka Shell EP-1046) 100 parts (2)
Dicyandiamide 4 parts (3) 2-ethyl 4-methyl imiguzole 0.15 parts (4) Methyl cellosolve 36 parts (5) Acetone
A uniform varnish was prepared by mixing 60 parts of the above materials.
次に該ワニスをガラス織布（日東紡製ＷＥ−１８Ｋ
ＲＢ−８４）に樹脂含有量が４２〜４５％になるように
含浸乾燥しガラス織布プリプレグを得たｌｌＶｔいて前
記エポキシ樹脂配合ワニスに樹脂分１００部に対し無機
充填剤を第１表に示す配合で添加し、攪拌混合し無機充
填剤含有ワニスを作成した。Next, the varnish was applied to a glass woven cloth (Nittobo WE-18K manufactured by Nittobo Co., Ltd.).
RB-84) was impregnated with a resin content of 42 to 45% and dried to obtain a glass woven prepreg.Table 1 shows the amount of inorganic filler per 100 parts of resin in the epoxy resin-containing varnish. A varnish containing an inorganic filler was prepared by adding the mixture and stirring and mixing.
この無機充填剤含有ワニスをガラス不織布（日本バイリ
ーン製ＥＰ−４０７５）に樹脂及び無機充填剤の含有量
が９０％になるように含浸乾燥して、ガラス不織布プリ
プレグを得た。This inorganic filler-containing varnish was impregnated into a glass nonwoven fabric (EP-4075, manufactured by Nippon Vilene Co., Ltd.) so that the resin and inorganic filler content was 90% and dried to obtain a glass nonwoven fabric prepreg.
次に前記ガラス不織布プリプレグを中間層とし、上下表
面層に前記のガラス織布プリプレグを配置し、さらにそ
の上にｆＩ箔を重ね、成形温度１６５°Ｃ１圧力６０ｋ
ｇ／ｃ−で９０分間積層成形して、厚さ１．６−の銅張
り積層板を得た。Next, the glass non-woven fabric prepreg was used as an intermediate layer, the glass woven fabric prepreg was placed on the upper and lower surface layers, and fI foil was layered on top of that, and the molding temperature was 165°C and the pressure was 60k.
Laminate molding was carried out for 90 minutes at g/c- to obtain a copper-clad laminate having a thickness of 1.6-.
比較例１ （従来例）
エポキシ樹脂ワニス中に添加する無機充填剤の配合割合
を、前記ワニス中の樹脂分１００部に対して
（１）ギブサイト型水酸化アルミニウム（昭和軽金属製
ハイシライトＨ−４２） ８５部（２）超微粉末シリ
カ（ジオツギ製薬製カープレックス）
５部とした。これ以外は、実施例と同様にし
て銅張積層板を得た。Comparative Example 1 (Conventional example) The blending ratio of the inorganic filler added to the epoxy resin varnish was (1) Gibbsite type aluminum hydroxide (Hisilite H-42 manufactured by Showa Light Metal) based on 100 parts of the resin content in the varnish. 85 parts (2) Ultrafine powder silica (Carplex manufactured by Geotsugi Pharmaceutical)
There were 5 parts. Other than this, a copper-clad laminate was obtained in the same manner as in the example.
比較例２
比較例１において、添加する無機充填剤のギブサイト型
水酸化アルミニウムの量を５０部にかえた以外は、実施
例と同様にして銅張積層板を得た。Comparative Example 2 A copper-clad laminate was obtained in the same manner as in Comparative Example 1, except that the amount of gibbsite-type aluminum hydroxide added as an inorganic filler was changed to 50 parts.
比較例３
比較例１において、添加する無機充填剤をギブサイト型
水酸化アルミニウムをタルク８５部にかえた以外は、実
施例と同様にして銅張積層板を得た。Comparative Example 3 A copper-clad laminate was obtained in the same manner as in Comparative Example 1, except that the inorganic filler added was changed from gibbsite type aluminum hydroxide to 85 parts of talc.
以上の実施例及び比較例において、リフロー半田耐熱性
、半田耐熱性、ドリル摩耗性、厚さ方向の熱膨張率及び
難燃性の測定結果を第２表に示す。Table 2 shows the measurement results of reflow soldering heat resistance, soldering heat resistance, drill abrasion resistance, coefficient of thermal expansion in the thickness direction, and flame retardance in the above Examples and Comparative Examples.
なお、寸法安定性、電気絶縁特性等も測定したが、実施
例と比較例との間に差はみられなかった。In addition, dimensional stability, electrical insulation properties, etc. were also measured, and no difference was found between the example and the comparative example.
以上のように、本発明の印刷回路用積層板は、リフロー
半田耐熱性、半田耐熱性、厚さ方向の熱膨張率及び難燃
性が共にすぐれているので工業用として極めて好適であ
る。As described above, the printed circuit laminate of the present invention has excellent reflow soldering heat resistance, soldering heat resistance, coefficient of thermal expansion in the thickness direction, and flame retardance, and is therefore extremely suitable for industrial use.
本発明に従うと、含水物又は水和物の無機充填剤を単独
に使用したものに比較して、リフロー半田耐熱性、半田
耐熱性が著しく優れたコンポジット積層板が得られ、ま
た、含水物、水和物以外の無機充填剤を単独で使用した
場合に比較して、難燃性に優れたスルーホールメツキ信
較性のあるコンポジット積層板が得られるので、工業的
な高耐熱難燃性コンポジット積層板として好適である。According to the present invention, a composite laminate can be obtained which has significantly superior reflow soldering heat resistance and soldering heat resistance compared to a composite laminate using only a hydrated or hydrated inorganic filler. Compared to the case where an inorganic filler other than hydrate is used alone, a composite laminate with excellent flame retardancy and through-hole plating reliability can be obtained, making it possible to create a highly heat-resistant, flame-retardant composite for industrial use. Suitable as a laminate.
Claims (1)
中間層は無機フィラー含有エポキシ樹脂含浸不織布から
なり、かつ無機フィラーとして２００℃〜６００℃で水
を放出する水和物又は含水物がエポキシ樹脂１００重量
部に対して１０〜１００重量部、上記水和物又は含水物
以外のものが１０重量部以上で前記フィラーとの合計で
５０〜２００重量部になる様含有されていることを特徴
とする印刷回路用積層板。(1) The surface layer is made of epoxy resin-impregnated glass fabric,
The intermediate layer is made of an epoxy resin-impregnated nonwoven fabric containing an inorganic filler, and the inorganic filler contains 10 to 100 parts by weight of a hydrate or water-containing material that releases water at 200°C to 600°C, based on 100 parts by weight of the epoxy resin, and the above-mentioned water. 1. A laminate for a printed circuit, comprising 10 parts by weight or more of a substance other than a hydrate or a hydrate, and a total of 50 to 200 parts by weight including the filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1106046A JP2924966B2 (en) | 1989-04-27 | 1989-04-27 | Printed circuit laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1106046A JP2924966B2 (en) | 1989-04-27 | 1989-04-27 | Printed circuit laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02286238A true JPH02286238A (en) | 1990-11-26 |
| JP2924966B2 JP2924966B2 (en) | 1999-07-26 |
Family
ID=14423692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1106046A Expired - Lifetime JP2924966B2 (en) | 1989-04-27 | 1989-04-27 | Printed circuit laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2924966B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011061894A1 (en) * | 2009-11-20 | 2011-05-26 | パナソニック電工株式会社 | Prepreg, laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59222338A (en) * | 1983-06-01 | 1984-12-14 | 松下電工株式会社 | Metallic foil lined laminated board |
| JPS607796A (en) * | 1983-06-28 | 1985-01-16 | 住友ベークライト株式会社 | Copper-lined laminated board for printed circuit and method of producing same |
| JPS6259021A (en) * | 1985-09-10 | 1987-03-14 | Sumitomo Bakelite Co Ltd | Manufacture of laminated sheet for printed circuit |
| JPS6271643A (en) * | 1985-09-26 | 1987-04-02 | 住友ベークライト株式会社 | Manufacture of laminated board for printed circuit |
| JPH0197633A (en) * | 1987-10-09 | 1989-04-17 | Sumitomo Bakelite Co Ltd | Manufacture of laminated plate for printed circuit |
-
1989
- 1989-04-27 JP JP1106046A patent/JP2924966B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59222338A (en) * | 1983-06-01 | 1984-12-14 | 松下電工株式会社 | Metallic foil lined laminated board |
| JPS607796A (en) * | 1983-06-28 | 1985-01-16 | 住友ベークライト株式会社 | Copper-lined laminated board for printed circuit and method of producing same |
| JPS6259021A (en) * | 1985-09-10 | 1987-03-14 | Sumitomo Bakelite Co Ltd | Manufacture of laminated sheet for printed circuit |
| JPS6271643A (en) * | 1985-09-26 | 1987-04-02 | 住友ベークライト株式会社 | Manufacture of laminated board for printed circuit |
| JPH0197633A (en) * | 1987-10-09 | 1989-04-17 | Sumitomo Bakelite Co Ltd | Manufacture of laminated plate for printed circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011061894A1 (en) * | 2009-11-20 | 2011-05-26 | パナソニック電工株式会社 | Prepreg, laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting |
| KR20120095938A (en) * | 2009-11-20 | 2012-08-29 | 파나소닉 주식회사 | Prepreg, laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting |
| US8603624B2 (en) | 2009-11-20 | 2013-12-10 | Panasonic Corporation | Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting |
| JP5776019B2 (en) * | 2009-11-20 | 2015-09-09 | パナソニックＩｐマネジメント株式会社 | Prepreg, laminate, metal foil clad laminate, circuit board, and circuit board for LED mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2924966B2 (en) | 1999-07-26 |
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