JP2012091322A - High thermal conductive laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate and print circuit board that can achieve high thermal conductivity while maintaining strength, and can secure insulation reliability.SOLUTION: The laminate is obtained by sticking metal foils on a topmost layer and heating and molding, in which configuration a prepreg is sandwiched with resin sheets, or the plurality of configurations are laminated. The prepreg is a prepreg obtained by impregnating a glass substrate with a thermal curing resin, and there is a portion that is not filled with a resin in a gap of a warp thread and weft thread of the glass substrate. The resin sheet is a high thermal conductive resin sheet where the resin sheet is formed by applying and drying a filler high-filling resin including an inorganic filler of 60-95 mass% in the thermal curing resin on the metal foil or an organic film.

Description

  The present invention relates to a highly heat-conductive laminate and a printed wiring board using the same.

  In recent years, in electronic devices, with higher performance, smaller size, lighter weight, etc., higher density mounting of semiconductor packages, higher integration of LSIs, higher speeds, etc., the amount of heat generated per unit area in electronic components has increased. ing. Therefore, it is an important issue to improve the thermal conductivity in order to effectively dissipate heat from the electronic component to the outside.

  For such a problem, in general, improvement of thermal conductivity is achieved by using a resin highly filled with an inorganic filler such as alumina having high thermal conductivity as a base material (for example, Patent Document 1).

JP 2009-274929 A

  However, when the glass substrate is impregnated with a resin with a high filler content, it is difficult to impregnate the glass substrate, and there is a problem in insulation reliability as a laminated plate. Therefore, there is a limit to the high filling of the filler.

  On the other hand, a resin sheet that does not use a glass substrate or a resin sheet with a copper foil has a problem in that it lacks rigidity when used as a laminated board, and the strength of the printed board is insufficient.

  This invention is made | formed in view of this situation, Comprising: It aims at providing the laminated board and printed wiring board which can implement | achieve high heat conductivity, maintaining insulation reliability, and ensuring insulation reliability.

  As a result of intensive studies to solve the above problems, the present inventor has found that the above problems can be solved by the following means.

  That is, the laminated board of the present invention is a laminated board obtained by laminating a prepreg with a resin sheet, or by laminating a plurality of the above-described structures, and by bonding metal foil to the outermost layer and heat molding, The prepreg is a prepreg formed by impregnating a glass base material with a thermosetting resin, wherein the gap between the warp and the weft of the glass base material is not filled with resin, and the resin sheet Is a highly thermally conductive resin sheet formed by applying a filler high-filling resin containing 60 to 95% by mass of an inorganic filler in a thermosetting resin on a metal foil or organic film and drying it. . Furthermore, this invention provides the printed wiring board obtained by processing the said laminated board.

  ADVANTAGE OF THE INVENTION According to this invention, the moldability and the laminated board and printed wiring board which can ensure insulation reliability while showing high heat conductivity, and its manufacturing method can be provided.

FIG. 1 is a view for explaining a void portion of a perforated prepreg. FIG. 2 is a schematic cross-sectional view of a laminate having a configuration in which two resin sheets are sandwiched between one prepreg, which is an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a laminated board in which a plurality of structures each having two resin sheets sandwiched between one prepreg, which is an embodiment of the present invention.

[Laminated board]
The laminated board of the present invention of the present invention is a laminated board obtained by laminating a metal foil on the outermost layer in a configuration in which a prepreg is sandwiched between resin sheets, or a configuration in which a plurality of the above-described configurations are stacked, and heat molding. The prepreg is a prepreg obtained by impregnating a glass base material with a thermosetting resin, wherein the gap between the warp and the weft of the glass base material is not filled with the resin, and the resin The sheet is a highly thermally conductive resin sheet formed by applying a filler high-filling resin containing 60 to 95% by mass of an inorganic filler in a thermosetting resin on a metal foil or an organic film and drying. To do.

  In this way, a highly heat conductive resin sheet highly filled with inorganic filler, a structure in which a perforated prepreg not filled with resin is sandwiched between the glass fiber warp and weft mesh gaps, or a multilayer structure in which this structure is stacked By making a laminated board that is heat-molded with a high-conductivity resin sheet that has high heat conduction in the thickness direction by filling the voids of the perforated prepreg with the resin of the high thermal conductive resin sheet, and having high insulation reliability A filled high thermal conductive laminate can be obtained.

  Hereinafter, each of the prepreg and the resin sheet constituting the laminate of the present invention will be described in detail.

[Prepreg]
The prepreg used in the present invention is a perforated prepreg. A perforated prepreg is a prepreg formed by impregnating a glass substrate with a thermosetting resin, and the resin is not completely filled in the voids of the warp and weft meshes of glass fiber (there is an unfilled part) Although it is a prepreg and there is no restriction | limiting in particular in the shape of a hole, a magnitude | size, etc., the effect of this invention is so remarkable that a hole is large.

  In the present invention, the fact that the resin is not completely filled in the gap between the glass fiber warp and weft mesh means that the porosity X shown in the following formula 1 satisfies X> 0.

Formula 1: X = 1-Y / (s * t)
(In the formula, X: porosity (resin unfilled portion), Y: resin-filled area of a portion surrounded by warps and wefts, s and t: side length shown in FIG. 1).

  The porosity X is not particularly limited as long as it is larger than 0, but is preferably 0.3 or more, more preferably 0.5 or more. The upper limit is not particularly limited, and the upper limit is preferably as large as possible, and theoretically 100% is possible.

  Although there is no restriction | limiting in particular as a glass base material used for said prepreg, The glass base material with a large space | gap part 2 as shown to Fig.1 (a) is preferable, and the glass which has not performed the general fiber opening process A substrate is preferred.

  Specific examples of the glass substrate include glass cloth and organic fiber cloth. Among them, glass cloth having a glass fiber diameter of about 6 to 9 μm is preferable.

  Although there is no restriction | limiting in particular about the thermosetting resin used for the said prepreg, Preferably they are an epoxy resin, a urea resin, a melamine resin, a phenol resin, etc., It is especially preferable to use an epoxy resin especially. These can be used alone or in combination.

  Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, naphthalene diol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak. Type epoxy resins, cycloaliphatic epoxy resins, glycidyl ester resins, glycidyl amine resins, heterocyclic epoxy resins (triglycidyl isocyanurate, diglycidyl hydantoin, etc.) and modified epoxy resins modified with various materials can be used. . In addition, halides such as bromides and chlorides can also be used.

  Furthermore, two or more of these epoxy resins can be used in appropriate combination. In particular, use of phenol novolac type epoxy resin, foil resole novolak type epoxy resin, bisphenol A novolak type epoxy resin or their halides, because high heat resistance and reliability applicable to electrical and electronic materials can be imparted to the insulating layer. Is desirable.

  Moreover, you may add a hardening | curing agent to the said resin for the objective of workability improvement, hardening acceleration of the added resin, etc. As a hardening | curing agent, well-known hardening | curing agents, such as a phenol type, an amine type, a cyanate type compound, can be used individually or in combination.

  More specifically, phenolic curing agents having a phenolic hydroxyl group such as phenol novolak, cresol novolak, bisphenol A, bisphenol F, bisphenol S, melamine-modified novolak type phenol resin, or halogenated curing agents thereof. And amine-based curing agents such as dicyandiamide.

  In addition, when adding a hardening | curing agent to resin, it is preferable that the compounding quantity of the said hardening | curing agent shall be the range of 0.1-5 mass% with respect to the whole resin composition.

  Furthermore, a curing accelerator may be added to the resin of the present invention in order to accelerate the curing reaction. Any curing accelerator can be used without particular limitation as long as it can accelerate the curing reaction between the above-described resin component and the curing agent. Specific examples include 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole, and the like. These may be used alone or in combination of two or more.

  In the present invention, when a curing accelerator is contained, it is preferably about 0.001 to 0.01% by mass in the total amount of the resin composition.

  The resin composition of the present invention may further contain other additives, for example, a flame retardant, a flame retardant aid, a leveling agent, a colorant and the like, as necessary, within a range not impairing the effects of the present invention. .

  In the present invention, the resin is usually prepared and used in the form of a varnish as a resin composition containing other additives (such as the curing agent). Such a varnish is prepared as follows, for example.

  That is, other additives, organic solvents, and the like can be added to the above-described resin as necessary, and uniformly dispersed and mixed using a ball mill, bead mill, mixer, blender, or the like to prepare a varnish.

  And a prepreg can be obtained by impregnating the glass substrate as mentioned above with the varnish-like resin composition and drying by heating.

  As described above, the specific method for producing the prepreg of the present invention is not particularly limited as long as it is a method in which a portion not filled with resin remains in the gap between the warp and weft meshes of glass fiber, Various means may be used in the same manner as in the past or as an improvement thereof.

  More specifically, for example, the substrate is first impregnated with the varnish resin by immersing the substrate in the varnish resin. Impregnation is performed by dipping or coating. The impregnation can be repeated a plurality of times as necessary. In this case, it is also possible to repeat the impregnation using a plurality of solutions having different compositions and concentrations, and finally adjust the desired composition and resin amount. Further, at this time, for example, the perforated prepreg of the present invention can be obtained by extremely reducing the amount of resin applied to the glass substrate.

  Next, the base material impregnated with the varnish-like resin composition is then heat-dried under desired heating conditions (for example, at 120 to 170 ° C. for 2 to 15 minutes), and the resin component is semi-cured (B-stage). To obtain a prepreg. At this time, it is preferable that the resin amount in a prepreg is 30-99.9 mass% with respect to the prepreg whole quantity.

  In addition, the thickness of the prepreg obtained is not particularly limited, but a thickness in the range of 0.04 to 0.3 mm is usually preferable.

[Resin sheet]
The resin sheet of the present invention is a high thermal conductivity resin sheet, and is obtained using a resin highly filled with an inorganic filler having high thermal conductivity.

  There is no restriction | limiting in particular as a thermosetting resin used for the resin sheet of this invention, Resin similar to the thermosetting resin used for the above prepregs can be used.

  Furthermore, additives such as curing agents and curing accelerators that can be used in the prepreg as described above can also be blended in the thermosetting resin for resin sheets.

The type of inorganic filler used in the resin sheet is not particularly limited. For example, aluminum oxide (Al ₂ O ₃ ) powder, aluminum nitride (AlN) powder, silicon oxide (SiO ₂ ) powder is used. It is preferable to use a silicon nitride (SiN) powder, boron nitride (BN) powder, or the like having high thermal conductivity and high electrical insulation. Of these, aluminum oxide powder is particularly preferable. In the case of aluminum nitride powder, it is useful to improve the moisture resistance by oxidizing the surface to form an oxide layer of aluminum oxide. The inorganic powder may be subjected to a surface treatment such as a coupling treatment in order to improve the compatibility with the resin. Further, a plurality of the above compounds may be used in combination.

  The compounding quantity of the inorganic filler with which the said resin sheet is filled is 60-95 mass% with respect to the whole resin composition, More preferably, it is 75-95%. By appropriately combining the average particle size and blending ratio of the inorganic filler, the inorganic filler can be blended with the resin in a content of 60 to 95% by mass. If content of an inorganic filler is less than 60 mass%, the effect by mix | blending an inorganic filler cannot be expected. Moreover, when content of an inorganic filler exceeds 95 mass%, there exists a possibility that the viscosity of resin at the time of shaping | molding may become high too much.

  In addition, in order to improve the compatibility with the resin, the inorganic filler is subjected to a surface treatment such as a coupling treatment, or a dispersant is added to improve the dispersibility in the resin composition. Also good. A plurality of inorganic fillers may be used in combination.

  In this way, a resin sheet having extremely high thermal conductivity can be obtained by using a high thermal conductive resin in which an inorganic filler is highly filled in the resin.

  Furthermore, other additives such as a flame retardant, a flame retardant aid, a leveling agent, a colorant and the like are also added to the heat conductive resin for the resin sheet of the present invention as long as the effects of the present invention are not impaired. May be included.

  In the present invention, the heat conductive resin is usually prepared and used in a varnish form as a resin composition containing the inorganic filler as described above and other additives (such as the curing agent) as necessary. Such a varnish is prepared as follows, for example.

  In other words, an inorganic filler and, if necessary, other additives and an organic solvent are added to the above-mentioned resin, and the mixture is uniformly dispersed and mixed using a ball mill, a bead mill, a mixer, a blender, etc. to prepare a varnish. Can do.

  And the resin sheet of this invention can be obtained as a resin sheet of a B stage state by forming the above-mentioned varnish-like highly heat conductive resin composition on a metal foil or an organic film and drying it by heating. .

  There is no restriction | limiting in particular also about the manufacturing method of the said resin sheet, For example, it can manufacture by the method similar to the manufacturing method of the above-mentioned prepreg. However, it is not necessary to reduce the amount of the resin composition applied on the metal foil or the organic film as in the case of the above-described perforated prepreg.

  In addition, the thickness of the resin sheet to be obtained is not particularly limited, but usually a thickness in the range of 0.04 to 0.3 mm is preferable.

[Laminated board]
As a method of creating a metal-clad laminate using the resin sheet and perforated prepreg obtained as described above, as a configuration in which the prepreg and the resin sheet are laminated and formed, one prepreg as shown in FIG. Thus, it is possible to perform lamination molding with a structure in which two resin sheets are sandwiched or a structure as shown in FIG.

  The method and apparatus for laminating and laminating and bonding, and the conditions thereof may be the same as those in the past or various means for improving the same.

  Specifically, for example, one or a plurality of the structures in which a resin sheet is sandwiched between two prepregs as described above are stacked, and a metal foil is stacked on the outermost surface, and this is heated and pressed. A method of producing a laminated body of metal foil by forming and laminating and integrating is mentioned. In addition, the said metal foil can be piled up on the upper and lower surfaces or single side | surface of the said structure, and according to it, the laminated body of double-sided metal foil tension or single-sided metal foil tension can be produced. The heating and pressing conditions can be appropriately set depending on the thickness of the laminate to be produced, the type of the resin composition of the prepreg, etc. For example, the temperature is 160 to 180 ° C., the pressure is 2 to 4 MPa, and the time is 60 to 120. Can be minutes.

  As the metal foil, a foil made of copper, aluminum, nickel, iron, or the like, a foil of these alloys, or a composite foil can be used. It is preferable to use a metal foil having a thickness in the range of 5 to 400 μm.

  The laminate of the present invention thus obtained is extremely excellent in thermal conductivity, and the thermal conductivity obtained by the formula 2 in the examples described later is 3 W / m · K or more. One.

[Multilayer printed wiring board]
A printed wiring board provided with a conductor pattern as a circuit on the surface of the laminate can be obtained by forming a circuit by etching the metal foil on the surface of the laminate produced as described above.

  The printed wiring board thus obtained is extremely excellent in thermal conductivity while maintaining strength.

  Hereinafter, the present invention will be described more specifically with reference to examples. In addition, this invention is not limited at all by the following examples.

  First, the raw materials used in this example are shown together.

<Epoxy resin>
・ "Epiclon 840S" (DIC Corporation, bisphenol A type liquid epoxy resin)
・ "VG3101" (Mitsui Petrochemical Co., Ltd., trifunctional epoxy resin)
<Curing agent component>
・ Dicyandiamide (reagent)
<Curing accelerator>
・ "2E4MZ" (manufactured by Shikoku Chemicals Co., Ltd., imidazole)
<Inorganic filler>
・ “CB-A20S” (average particle size 20 μm alumina, Showa Denko)
"CB-A05S" (average particle size 5 μm alumina, Showa Denko)

Example 1
Epoxy varnish was mixed at the blending ratio shown in Table 1 below, and impregnated into a 1080-type E glass fiber woven fabric having a thickness of 60 μm (glass fiber diameter: 5 μm, number of weaves: vertical 60/25 mm, horizontal 46/25 mm), 120 A perforated prepreg having a porosity X of 75% was prepared by heating and drying at ˜160 ° C. for 5 to 10 minutes.

  On the other hand, an alumina powder is mixed at a blending ratio shown in Table 2 below, and an epoxy resin varnish containing 90% by weight of an arnami powder is adjusted to the epoxy varnish mixed at the blending ratio shown in Table 2. This varnish was applied to a 75 μm-thick PET film and dried by heating at 120 to 140 ° C. for 5 to 10 minutes to obtain a B-stage resin sheet having a resin thickness of 100 μm.

Combining one prepreg and two resin sheets with the configuration shown in FIG. 2 above, a 35 μm copper foil is placed on both sides of the surface layer, and heating and pressure molding is performed for 90 minutes at a temperature of 180 ° C. and a pressure of 40 kg / cm ² To obtain a laminate.

(Example 2)
Implemented except that the epoxy varnish was mixed at the compounding ratio shown in Table 1 and a 7628 type E glass fiber woven fabric with a thickness of 200 μm (glass fiber diameter: 9 μm, number of weaves: length 60/25 mm, width 47/25 mm) In the same manner as in Example 1, a perforated prepreg having a porosity of 75% was produced.

  On the other hand, a resin sheet was obtained in the same manner as in Example 1 except that the alumina powder was mixed at the particle size and the mixing ratio shown in Table 2 and the epoxy varnish mixed at the mixing ratio shown in Table 2 was used.

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

(Example 3)
Implemented except that the epoxy varnish was mixed in the blending ratio shown in Table 1 and a 60-μm-thick 1080 type E glass fiber woven fabric (glass fiber diameter: 5 μm, number of weaves: length 60/25 mm, width 46/25 mm) In the same manner as in Example 1, a perforated prepreg having a porosity of 75% was produced.

  On the other hand, the alumina powder was mixed at the particle size and mixing ratio shown in Table 2, and the epoxy resin varnish containing 94% by weight of the arnami powder was adjusted to the epoxy varnish mixed at the mixing ratio shown in Table 2. Thus, a resin sheet was obtained.

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

Example 4
Implemented except that the epoxy varnish was mixed in the blending ratio shown in Table 1 and a 60-μm-thick 1080 type E glass fiber woven fabric (glass fiber diameter: 5 μm, number of weaves: length 60/25 mm, width 46/25 mm) In the same manner as in Example 1, a perforated prepreg having a porosity of 75% was produced.

  On the other hand, a resin sheet was obtained in the same manner as in Example 1 except that the alumina powder was mixed at the particle size and the mixing ratio shown in Table 2 and the epoxy varnish mixed at the mixing ratio shown in Table 2 was used.

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

(Comparative Example 1)
Implemented except that the epoxy varnish was mixed in the blending ratio shown in Table 1 and a 60-μm-thick 1080 type E glass fiber woven fabric (glass fiber diameter: 5 μm, number of weaves: length 60/25 mm, width 46/25 mm) In the same manner as in Example 1, a perforated prepreg having a porosity of 0% was produced.

  On the other hand, a resin sheet was obtained in the same manner as in Example 1 except that the epoxy resin varnish containing 0% by weight of the arnami powder was adjusted to the epoxy varnish mixed at the mixing ratio shown in Table 2 without blending the alumina powder. .

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

(Comparative Example 2)
Epoxy varnish was mixed at a blending ratio shown in Table 1, and a perforated prepreg having a porosity of 0% was produced in the same manner as in Comparative Example 1.

  On the other hand, the alumina powder was mixed at the particle size and mixing ratio shown in Table 2, and the epoxy resin varnish containing 90% by weight of the arami powder was adjusted to the epoxy varnish mixed at the mixing ratio shown in Table 2. Thus, a resin sheet was obtained.

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

(Comparative Example 3)
Implemented except that the epoxy varnish was mixed in the blending ratio shown in Table 1 and a 60-μm-thick 1080 type E glass fiber woven fabric (glass fiber diameter: 5 μm, number of weaves: length 60/25 mm, width 46/25 mm) In the same manner as in Example 1, a perforated prepreg having a porosity of 75% was produced.

  On the other hand, the alumina powder was mixed at the particle size and mixing ratio shown in Table 2, and the epoxy resin varnish containing 90% by weight of the arami powder was adjusted to the epoxy varnish mixed at the mixing ratio shown in Table 2. Thus, a resin sheet was obtained.

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

(Comparative Example 4)
Implemented except that the epoxy varnish was mixed in the blending ratio shown in Table 1 and a 60-μm-thick 1080 type E glass fiber woven fabric (glass fiber diameter: 5 μm, number of weaves: length 60/25 mm, width 46/25 mm) In the same manner as in Example 1, a perforated prepreg having a porosity of 75% was produced.

  On the other hand, the alumina powder was mixed at the particle size and mixing ratio shown in Table 2, and the epoxy resin varnish containing 96% by weight of the arnami powder was adjusted to the epoxy varnish mixed at the mixing ratio shown in Table 2. Thus, a resin sheet was obtained.

  Next, a laminate was obtained in the same manner as in Example 1 using one prepreg and two resin sheets.

<Evaluation>
About the laminated board obtained in said Examples 1-4 and Comparative Examples 1-4, presence of the void (space | gap) in hardened | cured material, thermal conductivity, and insulation reliability were evaluated.

(Voids in the cured product)
The edge and center part of the substrate were arbitrarily sampled at 5 points each, and the cross section was observed to confirm the presence or absence of voids. The length of the cross section was 20 mm.

(Thermal conductivity)
The thermal diffusivity was measured by the laser flash method, and the thermal conductivity was calculated from the following formula 2.
(Equation 2) Thermal conductivity (W / m · K) = density (kg / m ³ ) × specific heat (J / kg · K) × thermal diffusivity (m ² / s)
In addition, the density in a formula is based on the substitution method in water, and specific heat is based on DSC method.

(Insulation reliability)
A part of the copper foil at the center of each laminate obtained as described above is left, the remaining copper foil is removed by etching, and the remaining copper foil is used as an electrode connection portion, under a humidified heat condition of 85 ° C. and 85%. A voltage of 50 V was applied, the resistance value in the thickness direction was measured, and the insulation reliability was evaluated. In addition, the evaluation criteria set that the resistance value after 1000 hours passed was 1 × 10 ⁸ (Ω) or more.

  The results of the above evaluation are shown in Table 3.

  As is clear from these results, it was revealed that the laminated board of the present invention has good moldability and can ensure insulation reliability while exhibiting high thermal conductivity. Furthermore, the manufacturing method of the laminated board of this invention has shown that it was useful as a method of obtaining the highly thermally conductive laminated board.

  As described above, the laminated board according to one aspect of the present invention has a configuration in which a prepreg is sandwiched between resin sheets, or a configuration in which a plurality of the above-described configurations are stacked, and a metal foil is bonded to the outermost layer and heat-molded. A prepreg obtained by impregnating a glass base material with a thermosetting resin, wherein the gap between the warp and the weft of the glass base material is not filled with the resin. In addition, the resin sheet is formed by applying a highly filled resin containing 60 to 95% by mass of an inorganic filler to a thermosetting resin on a metal foil or an organic film and drying it. It is a resin sheet.

  With such a configuration, it is possible to obtain a laminated plate that achieves high thermal conductivity and excellent insulation reliability while maintaining strength.

  In addition, the glass substrate is preferably a glass substrate that has not been subjected to fiber opening treatment, and with such a configuration, a laminate that achieves high thermal conductivity and excellent insulation reliability while maintaining strength Can be obtained more reliably.

  Furthermore, the inorganic filler is preferably at least one selected from aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, or boron nitride. Thereby, remarkable excellent thermal conductivity and insulation reliability can be achieved more reliably.

  The laminated plate preferably has a thermal conductivity of 3 W / m · K or more.

  Furthermore, a printed wiring board according to another aspect of the present invention is obtained by forming a circuit by partially removing the metal foil on the surface of the laminated board.

  Further, in the present invention, as a further aspect, a step of impregnating a glass substrate with a thermosetting resin and obtaining a prepreg so that a portion not filled with resin remains in the gap between the warp and the weft of the glass substrate; and A step of forming a highly heat conductive resin sheet by applying a highly filled resin containing 60 to 95% by mass of an inorganic filler to a thermosetting resin on a metal foil or an organic film, and drying the prepreg. Including a step of obtaining a laminated sheet by laminating a metal foil on the outermost layer and heat-molding the laminated structure with a plurality of layers of the above-described structure, which is sandwiched between conductive resin sheets. . With such a configuration, according to the method for manufacturing a laminated board of the present invention, it is possible to obtain a laminated board having high thermal conductivity and excellent insulation reliability while maintaining strength.

Claims (5)

In a configuration in which a prepreg is sandwiched between resin sheets, or a configuration in which a plurality of the above-described configurations are stacked, a metal foil is bonded to the outermost layer, and the laminate is obtained by heat molding,
The prepreg is a prepreg obtained by impregnating a glass base material with a thermosetting resin, and there is a part of the glass base material where the resin is not filled in the space between the warp and the weft, and
The resin sheet is a highly thermally conductive resin sheet formed by applying a filler high-filling resin containing 60 to 95% by mass of an inorganic filler in a thermosetting resin on a metal foil or an organic film and drying. A laminated board characterized.   The laminated board of Claim 1 which is a glass base material in which the said glass base material has not performed the fiber-opening process.   The laminate according to claim 1 or 2, wherein the inorganic filler is at least one selected from aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, or boron nitride.   The laminated board in any one of Claims 1-3 whose heat conductivity is 3 W / m * K or more.   The printed wiring board formed by processing the laminated board in any one of Claims 1-4.

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