JPS60257592A - Multilayer printed circuit board - Google Patents
Multilayer printed circuit boardInfo
- Publication number
- JPS60257592A JPS60257592A JP11526384A JP11526384A JPS60257592A JP S60257592 A JPS60257592 A JP S60257592A JP 11526384 A JP11526384 A JP 11526384A JP 11526384 A JP11526384 A JP 11526384A JP S60257592 A JPS60257592 A JP S60257592A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- multilayer printed
- layer material
- inner layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機等に用いられる多
層プリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a multilayer printed wiring board used in electrical equipment, electronic equipment, computers, etc.
従来、多層プリント配線板は回路を形成した内層材の上
面及び又は下面にエポキシ樹脂、フェノ−Ｍ樹脂、不飽
和ポリエステル樹脂等の熱硬化性樹脂をガラス布、ガラ
ス不織布、紙、ガラスベーパー等の基材に含浸させた樹
脂含浸基材を所要枚数配設してから片面金属張積層板や
金属箔等の外層材を配役、一体化して得られるものであ
るが、高周波特性１寸法安定性、ドリル開孔時の耐スミ
アー性、熱時ピーＶ性が悪いという問題があった。Conventionally, in multilayer printed wiring boards, thermosetting resins such as epoxy resins, pheno-M resins, and unsaturated polyester resins are coated on the upper and/or lower surfaces of inner layer materials on which circuits are formed. It is obtained by disposing the required number of resin-impregnated base materials and then casting and integrating an outer layer material such as a single-sided metal-clad laminate or metal foil, but it has high frequency characteristics, dimensional stability, There were problems with poor smear resistance during drilling and poor P-V properties when heated.
本発明の目的とするところは高周波特性、寸法安定性、
ドＩＪ ｉｖ開孔時の耐スミアー性、熱時ピーＶ性に優
れた多層プリント配線板を提供することにある。The objectives of the present invention are high frequency characteristics, dimensional stability,
An object of the present invention is to provide a multilayer printed wiring board that has excellent smear resistance during hole opening and high peak-to-voltage properties when heated.
本発明は回路を有する内層材の上面及び又は下面に、所
要枚数の接着用フッ素樹脂層を介して外層材を配役又は
、更に内層材を配設稜、所要枚数の接着用フッ素系樹脂
層を介することを所要回数反復して外層材を配設、一体
化してなる多層プリント配線板に於て、フッ素糸樹脂フ
ィＶムが外側になるようフプ素系樹脂フィルムとフッ素
系樹脂含浸基材とを交互に組合せた接着用フッ素系樹脂
層を用いたことを特徴とする多層プリント配線板のため
、フッ素系樹脂の優れた高周波特性を活用でき、又熱可
塑性であるため寸法安定性が向上し且つフッ素系樹脂の
優れた耐熱性を活用し耐スミアー性、熱時ビール性を改
良することができたもので、以下本発明の詳細な説明す
る。In the present invention, an outer layer material is placed on the upper and/or lower surface of an inner layer material having a circuit via a required number of adhesive fluororesin layers, or an inner layer material is further placed on the upper and/or lower surface of the inner layer material having a circuit. In a multilayer printed wiring board that is formed by repeating this process a required number of times to arrange and integrate the outer layer material, the fluorocarbon resin film and the fluorocarbon resin-impregnated base material are placed so that the fluorocarbon fiber resin film is on the outside. This multilayer printed wiring board is characterized by using adhesive fluororesin layers that are alternately combined with fluororesin, so it can take advantage of the excellent high frequency properties of fluororesin, and because it is thermoplastic, it has improved dimensional stability. Moreover, by utilizing the excellent heat resistance of fluororesin, smear resistance and hot beer properties can be improved.The present invention will be described in detail below.
本発明に用いる回路を有する内層材としては、片面回路
内層材２両面回路内層材の各れをも用いることかでき、
更に内層材の回路形成側に所要枚数の接着用フッ素系樹
脂層を介して回路形成した内層材を配設することにより
更に多層のプリント配線板とすることもできるものであ
る。接着用フッ素系樹脂層のフッ素系樹脂としては、四
フッ化エチレン樹脂、四フッ化エチレンバーフＶオロビ
ニルエーテ〜共重合体、四フ、フ化エチレン六フッ化プ
ロピレン共重合体、四フッ化エチレンエチレン共重合体
等のフッ素系樹脂全般を用いることが１１’ Ｆあ、ヤ
ッ２１．１□９，７．７ Ｘ −”ＣＸ ） ＠。−□
繊維やポリエステ／Ｌ／、ポリアミド、ポリビニＭ丁ル
コール、ポリアク＋）１ｖ廊の有機合成繊維や木綿等の
天然繊維からなる織布、不織布、マット、寒冷紗或は紙
又はこれらの組合せ基材等であるが好ましくは寸法安定
性に優れたガラス布を用１／−１石ことが望ましい。接
着用フッ素系樹脂層としてはフッ素糸樹脂フィＶムが外
側になるようフッ素系樹脂フィルムとフッ素系樹脂含浸
基材とを交互に組合せたものであることが必要である。As the inner layer material having a circuit used in the present invention, each of the single-sided circuit inner layer material and the double-sided circuit inner layer material can be used.
Further, by disposing an inner layer material on which a circuit is formed via a required number of adhesive fluororesin layers on the circuit forming side of the inner layer material, a printed wiring board with even more layers can be obtained. Examples of the fluororesin for the adhesive fluororesin layer include tetrafluoroethylene resin, tetrafluoroethylene barf V orovinylethe copolymer, tetrafluoroethylene hexafluoropropylene copolymer, and tetrafluoroethylene ethylene. It is recommended to use fluororesins in general such as copolymers. , polyac +) 1V woven fabrics, non-woven fabrics, mats, cheesecloth, paper, or combinations of these materials made of organic synthetic fibers or natural fibers such as cotton, but preferably glass fabrics with excellent dimensional stability. The adhesive fluororesin layer should be a combination of alternating fluororesin films and fluororesin-impregnated substrates with the fluororesin thread V film on the outside. is necessary.
かくすることにより内層回路の信頼性を維持した上で気
泡残留のない層間接着性のよい多層プリント配線板を得
ることができるものである。By doing so, it is possible to obtain a multilayer printed wiring board with good interlayer adhesion without residual bubbles while maintaining the reliability of the inner layer circuit.
外層材としては片面金属張積層板や銅、ア！レミニウム
、ステンレス鋼、 眞鍮、 鉄、ニッケル等の単独又は
合金からなる金属箔を用いるものである。External layer materials include single-sided metal-clad laminates, copper, and a! Metal foil made of reminium, stainless steel, brass, iron, nickel, etc. alone or in an alloy is used.
一体化手段についても特に限定するものではないが好ま
しくは積層加熱加圧方法によることが望ましいことであ
る。Although there are no particular limitations on the integration means, it is preferable to use a lamination heating and pressing method.
以下本発明を実施例にもとず−て説明する。The present invention will be explained below based on examples.
実施例
両面に回路を形成した厚さＱ、ｆ３ ＦＩＮのフッ素樹
脂ガラス積層板からなる内層材の上、下面に、厚さ０．
０３５１ｆｆ＊の四フッ化エチレン樹脂（ダイキン工業
株式会社製、商品名ポリフロン）フィルム３枚の各フイ
ルム量に１ｖさｇ、 １ ｍｍの四フッ化エチレン樹脂
（ダイキン工業株式会社製、商品名ポリフロン）含浸ガ
ラス布１枚を夫々挿入した接着用フッ素系樹脂層を介し
て厚さ０．０１８Ｂの銅箔を夫々配設した積層体を３８
０℃、３０ Ｋｑ／ｃ１！で５ｏ分間積層加熱成形して
多層プリント配線板ル得た。EXAMPLE An inner layer material made of a fluororesin glass laminate with a thickness of Q and f3 FIN, with circuits formed on both sides, is coated on the top and bottom surfaces with a thickness of 0.
0351ff* tetrafluoroethylene resin (manufactured by Daikin Industries, Ltd., trade name Polyflon) 1vsg for each film of 3 films, 1 mm of tetrafluoroethylene resin (manufactured by Daikin Industries, Ltd., trade name Polyflon) 38 laminates each having a copper foil with a thickness of 0.018B interposed between an adhesive fluororesin layer and one impregnated glass cloth inserted therein.
0℃, 30Kq/c1! A multilayer printed wiring board was obtained by laminating and heating molding for 50 minutes.
従来例
実施例と同じ内層材の上、下面に厚さ０．１ｌｌｌｌｊ
ｌのエポキシ樹脂含浸ガラス布３枚を夫々介して厚さ０
．０３ ｓｕｍの銅箔を配設した積層体を１７０′ｃ。Thickness 0.1llllj on the top and bottom surfaces of the same inner layer material as in the conventional example
Thickness 0 through 3 sheets of epoxy resin-impregnated glass cloth
．． A laminate with copper foil of 03 sum is 170'c.
５０ Ｋｖｃａで９０分間積層加熱成形して多層プリン
ト配線板を得た。A multilayer printed wiring board was obtained by laminating and heating molding at 50 Kvca for 90 minutes.
実施例及び従来例の多層プリント配線板の高周波特性１
寸法安定性、耐スミア−性、熱時ピーＭ性は筑１表で明
白なように本発明の多層プリント配線板の性能はよく、
本発明の優れていることを確認した。High frequency characteristics 1 of multilayer printed wiring boards of embodiments and conventional examples
The performance of the multilayer printed wiring board of the present invention is good in terms of dimensional stability, smear resistance, and thermal resistance as shown in the Chiku1 table.
The superiority of the present invention was confirmed.
Claims (1)
数の接着用フッ素系樹脂層を介して外層材を配設又は、
更に内層材を配設後、所要枚数の接着用フッ素樹脂層を
介することを所要回路反復して外層材を配設、一体化し
てなる多層プリント配線板に於て、フッ素光樹脂フイＭ
ムが外側になるようフッ素光樹脂フイＭムとフッ素樹脂
含浸基材とを交互に組合せた接着用フッ素系樹脂層を用
いたことを特徴とする多層プリント配線板。(1) Arranging the outer layer material on the upper and/or lower surface of the inner layer material having the circuit via the required number of adhesive fluororesin layers, or
Furthermore, after disposing the inner layer material, the outer layer material is disposed and integrated by repeating the required number of adhesive fluororesin layers for the required circuit.
1. A multilayer printed wiring board characterized in that a fluororesin layer for adhesion is used in which a fluororesin film and a fluororesin-impregnated base material are alternately combined so that the film is on the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526384A JPS60257592A (en) | 1984-06-04 | 1984-06-04 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526384A JPS60257592A (en) | 1984-06-04 | 1984-06-04 | Multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60257592A true JPS60257592A (en) | 1985-12-19 |
| JPH0354875B2 JPH0354875B2 (en) | 1991-08-21 |
Family
ID=14658338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11526384A Granted JPS60257592A (en) | 1984-06-04 | 1984-06-04 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60257592A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62285498A (en) * | 1986-06-03 | 1987-12-11 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPS62295495A (en) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH03283492A (en) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | Multilayered printed circuit board and manufacture thereof |
| JPH06344503A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and composite film for laminated sheet |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
| US9648720B2 (en) | 2007-02-19 | 2017-05-09 | Semblant Global Limited | Method for manufacturing printed circuit boards |
| US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745997A (en) * | 1980-09-02 | 1982-03-16 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
| JPS57150567A (en) * | 1981-03-13 | 1982-09-17 | Hitachi Cable | Copper lined laminated board |
| JPS5846691A (en) * | 1981-09-14 | 1983-03-18 | 東レ株式会社 | High frequency electric circuit board and method of producing same |
-
1984
- 1984-06-04 JP JP11526384A patent/JPS60257592A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745997A (en) * | 1980-09-02 | 1982-03-16 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
| JPS57150567A (en) * | 1981-03-13 | 1982-09-17 | Hitachi Cable | Copper lined laminated board |
| JPS5846691A (en) * | 1981-09-14 | 1983-03-18 | 東レ株式会社 | High frequency electric circuit board and method of producing same |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62285498A (en) * | 1986-06-03 | 1987-12-11 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPS62295495A (en) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH03283492A (en) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | Multilayered printed circuit board and manufacture thereof |
| JPH06344503A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and composite film for laminated sheet |
| US9648720B2 (en) | 2007-02-19 | 2017-05-09 | Semblant Global Limited | Method for manufacturing printed circuit boards |
| US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354875B2 (en) | 1991-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2007066788A1 (en) | Fluororesin laminate substrate | |
| JPS60257592A (en) | Multilayer printed circuit board | |
| JPS60258232A (en) | Laminated board of fluorine-containing resin | |
| JPS60257596A (en) | Multilayer printed circuit board | |
| JPS60257594A (en) | Multilayer printed circuit board | |
| JPS60257593A (en) | Multilayer printed circuit board | |
| JPS6338298A (en) | Multilayer printed interconnection board | |
| JPS63145341A (en) | Fluorocarbon resin prepreg and multilayer interconnection board prepared by using same | |
| JPS60257597A (en) | Multilayer printed circuit board | |
| JPS60257598A (en) | Multilayer printed circuit board | |
| JPS60257595A (en) | Multilayer printed circuit board | |
| JPS62162539A (en) | Multilayer printed wiring board | |
| JPS59125698A (en) | Method of producing multilayer printed circuit board | |
| JPS63290735A (en) | Flexible laminated sheet | |
| JPS59232846A (en) | Laminated board for electric wiring board and manufacture thereof | |
| JPS63145021A (en) | Multilayer wiring substrate | |
| JPS60258233A (en) | Laminated board of polyimide based resin | |
| JPS6256134A (en) | Metallic foil lined laminated board | |
| JPS63173638A (en) | Laminated board | |
| JPH07120854B2 (en) | Multilayer wiring board | |
| JPS62106697A (en) | Processing of metal base substrate | |
| JP2503630B2 (en) | Method for manufacturing multilayer printed circuit board | |
| JPH03166930A (en) | Electric laminated sheet | |
| JPS62295495A (en) | Multilayer printed interconnection board | |
| JPS63224936A (en) | Laminated board |