JPS62295495A - Multilayer printed interconnection board - Google Patents
Multilayer printed interconnection boardInfo
- Publication number
- JPS62295495A JPS62295495A JP13898886A JP13898886A JPS62295495A JP S62295495 A JPS62295495 A JP S62295495A JP 13898886 A JP13898886 A JP 13898886A JP 13898886 A JP13898886 A JP 13898886A JP S62295495 A JPS62295495 A JP S62295495A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- laminate
- resin
- printed wiring
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 55
- 239000010410 layer Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 48
- 239000011888 foil Substances 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 7
- 239000012756 surface treatment agent Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- 238000002844 melting Methods 0.000 description 27
- 230000008018 melting Effects 0.000 description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 12
- 239000003921 oil Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 7
- 239000004745 nonwoven fabric Substances 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ３、発明の詳細な説明 ［技術分野１ 本発明は多層プリント配線板に関する。[Detailed description of the invention] 3. Detailed description of the invention [Technical field 1 The present invention relates to multilayer printed wiring boards.
［背景技術１
従来上り、〃ラス布基材にエポキシ樹脂あるいはポリイ
ミド樹脂を含浸させ乾燥させて形成した樹脂含浸基材を
積層成形してプリント配線板用の積層板が製造されてい
るが、この積層板の誘電率は〃ラス／エポキシ系の樹脂
含浸基材を採用した場合には４．５で、〃ラス／ポリイ
ミド系で４．０と比較的大きく、従って、高周波に対す
る特性が不充分で、高周波クロックを用いた高周波演算
回路の実装とか、通信機器回路の実装には制約を受けて
いた。 このため本発明者らは、既に、絶縁層をフッ素
樹脂又はフッ素樹脂含浸紙（不織布）基材で形成し誘電
率が小さく、高周波特性が良好な積層板を開発している
。[Background technology 1] Conventionally, laminates for printed wiring boards have been manufactured by laminating and molding resin-impregnated base materials formed by impregnating and drying a lath cloth base material with epoxy resin or polyimide resin. The dielectric constant of the laminated board is 4.5 when a lath/epoxy resin-impregnated base material is used, and 4.0 when a lath/polyimide base material is used, which is relatively high. Therefore, the characteristics against high frequencies are insufficient. However, there were restrictions on the implementation of high-frequency arithmetic circuits using high-frequency clocks and the implementation of communication equipment circuits. For this reason, the present inventors have already developed a laminate having an insulating layer formed of a fluororesin or a fluororesin-impregnated paper (nonwoven fabric) base material, which has a low dielectric constant and good high frequency characteristics.
しかしながら、高密度実装化にともなって、多層化、即
ち、第３図に示すようにフッ素樹脂含浸基材で形成した
内層材１に両面にフッ素樹脂層２を介して金属箔５を貼
着して絶縁基板６′を形成し、この絶縁基板６′１に導
体パターンを形成して多層プリント配線板Ａ′を形成し
た場合には、誘電率は小さい（２，７）いものの、寸法
変化率が１０〜１５％と、寸法安定性が悪くなるという
問題が新たに発生している。However, with the trend toward high-density packaging, metal foils 5 are attached to both sides of an inner layer material 1 formed of a fluororesin-impregnated base material through fluororesin layers 2, as shown in Fig. 3. If a multilayer printed wiring board A' is formed by forming an insulating substrate 6' on this insulating substrate 6'1 and forming a conductive pattern on this insulating substrate 6'1, the dielectric constant is small (2,7), but the dimensional change rate is low. is 10 to 15%, and a new problem has arisen that dimensional stability deteriorates.
［発明の目的１
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、誘電率が小さく、高周波特性が良好
となり、高周波演剪回路、通信機回路の実装が可能な絶
縁特性に優れ、しかも多層であり高密度実装が可能であ
って寸法安定性にも優れた多層プリント配線板を提供す
ることにある。[Objective of the Invention 1 The present invention was made in view of the above circumstances, and its purpose is to have a low dielectric constant, good high frequency characteristics, and enable implementation of high frequency shearing circuits and communication device circuits. An object of the present invention is to provide a multilayer printed wiring board that has excellent insulation properties, is multilayered, can be mounted at high density, and has excellent dimensional stability.
［発明の開示１
本発明の多層プリント配線板は、７ツ索樹脂で形成した
内層材１の片面又は両面に順次フッ素樹脂［２，７ツ索
樹脂含浸〃ラス基材の積層体３、接着剤層４及び金属箔
５を積層して絶縁基板６を形成し、この絶縁基板６の両
面に導体パターン７を形成して成るものであり、この構
成により上記目的を達成できたものである。[Disclosure of the Invention 1] The multilayer printed wiring board of the present invention has an inner layer material 1 formed of a 7-strand resin, which is sequentially impregnated with a fluororesin [2,7-strand resin], a laminated body 3 of a lath base material, and bonded. The insulating substrate 6 is formed by laminating the agent layer 4 and the metal foil 5, and the conductor pattern 7 is formed on both surfaces of the insulating substrate 6. With this structure, the above object can be achieved.
以下本発明を添付の図面を参照して詳細に説明する。本
発明で用いるフッ素樹脂としては、三７ツ化塩化エチレ
ン樹脂（融点２１０〜２１２℃）、四７ツ化エチレン樹
ｆｆＩ？（融点３２７℃）、四７ツ化エチレンー六７ツ
化プロピレン共重合体樹脂（融点２７０℃）、四７ツ化
エチレンーパーフルオロビニルエーテル共重合体樹脂（
融点３０２〜３１０’Ｃ）などのような融点が２００℃
以上のものが好ましい。内層材１はフッ素樹脂フィルム
又は複数枚のフッ素ａｔ脂含浸基材の積層体の片面又は
両面に常法により導体パターン８を形成したものである
。この内層材１の両面にフッ素樹脂Ｎ２を介してフッ素
樹脂含浸ガラス基材の積層体３が積層されている。この
積層体３に接着剤層４を介して金属箔５が貼着されて絶
縁基板６が形成されている。フッ素樹脂Ｎ２はフッ素樹
脂フィルム又はフッ素樹脂含浸基材（紙、不織布、ガラ
ス布）により形成され、接着剤層２はフッ素樹脂フィル
ム、フッ素樹脂含浸紙（又は不織布）基材、他の樹脂フ
ィルム又は他の樹脂含浸基材（紙、不織布、ガラス布）
により形成されでいる。成形」二、積層体３のフッ素樹
脂はその融点が内層材１のフッ素樹脂の融点と略等しい
ものを使用するのが好ましく、又、フッ素樹脂層２のフ
ッ素樹脂及び接着剤Ｎ４のフッ素樹脂又は他の樹脂はそ
の融点が積層体３のフッ素樹脂の融点より低いものを採
用するのが好ましい。又、フッ素樹脂含浸ガラス基材の
積層体３の表面を表面処理剤で粗化させてフッ素樹脂層
２との接着性を向上させておけばよい。表面処理剤とし
ては金属ナトリウム・アンモニアとか金属ナトリウム混
合・テトラヒドロフランとか、あるいはテトラエッチ（
商品名、潤工社株式会社製）などを挙げることがで終る
。テトラエッチによる処理を説明すると、まず積層体３
の表面の汚れをアセトンなどでおとし、乾燥させる。こ
の後積層体３をテトラエッチに浸すか、金属又はポリエ
チレンのへらで塗布する。The present invention will now be described in detail with reference to the accompanying drawings. Examples of the fluororesin used in the present invention include tri7tethylene chloride resin (melting point 210 to 212°C), tetra7tethylene chloride resin ffI? (melting point 327°C), tetra7tethylene-perfluorovinyl ether copolymer resin (melting point 270°C), tetra7tethylene-perfluorovinyl ether copolymer resin (
The melting point is 200℃, such as 302~310'C)
The above are preferred. The inner layer material 1 is made by forming a conductor pattern 8 on one or both sides of a fluororesin film or a laminate of a plurality of fluorine and atom fat-impregnated base materials by a conventional method. A laminate 3 of fluororesin-impregnated glass substrates is laminated on both surfaces of this inner layer material 1 via a fluororesin N2. A metal foil 5 is adhered to this laminate 3 via an adhesive layer 4 to form an insulating substrate 6. The fluororesin N2 is formed of a fluororesin film or a fluororesin-impregnated base material (paper, non-woven fabric, glass cloth), and the adhesive layer 2 is formed of a fluororesin film, a fluororesin-impregnated paper (or non-woven fabric) base material, another resin film or Other resin-impregnated substrates (paper, non-woven fabric, glass cloth)
It is formed by 2. It is preferable to use a fluororesin for the laminate 3 whose melting point is approximately equal to that of the fluororesin for the inner layer material 1. It is preferable to use a resin whose melting point is lower than the melting point of the fluororesin of the laminate 3 as the other resin. Further, the surface of the laminate 3 of the fluororesin-impregnated glass substrate may be roughened with a surface treatment agent to improve adhesion to the fluororesin layer 2. Surface treatment agents include metallic sodium/ammonia, metallic sodium mixture/tetrahydrofuran, or tetra-etch (
I will end by listing the product name (manufactured by Junkosha Co., Ltd.), etc. To explain the treatment by Tetra Etch, first, the laminate 3
Remove dirt from the surface with acetone etc. and dry. The laminate 3 is then dipped in Tetraetch or applied with a metal or polyethylene spatula.
処理時間はフッ素樹脂の種類により異なるが５〜１０秒
程度程度る。又、金属箔を貼着した積層体３の金属箔エ
ツチングにより表面を粗化してもよい。The processing time varies depending on the type of fluororesin, but is approximately 5 to 10 seconds. Alternatively, the surface of the laminate 3 to which the metal foil is attached may be roughened by etching the metal foil.
金属ｆｉ５としては銅箔、アルミニウム箔、真ちゅう箔
、鉄箔、ステンレス鋼箔、ニッケル箔、ケイ素鋼箔など
いずれをも採用できる。本発明の絶縁基板６は内層材１
の両面に７７素樹脂フイルム又は７ツ素樹脂含浸基材、
複数枚のフッ素樹脂含浸ガラス基材３及び金属箔５を順
次積み重ね、このものを−組みとして成形プレートを介
して複数組み熱盤間に配置し、２００℃以上、２０−１
５０ｋｇ／ｃ＋＋＋２．４０〜１００分で加熱加圧して
積層一体化させて製造される。この絶縁基板６を順次、
孔明け、無電解めっき、パターン形成、パターンめっき
、レジストめっミ、レジスト除去、エツチング、外形仕
上げ、シンボルマーク印刷といった工程でスルーホール
めっき多層プリント配線板Ａが製造される。Any of copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used as the metal fi5. The insulating substrate 6 of the present invention is an inner layer material 1
77 base resin film or 7 base resin impregnated base material on both sides of
A plurality of fluororesin-impregnated glass substrates 3 and metal foils 5 are stacked one after another, and this set is placed between heating plates via a molding plate, and heated at 200° C. or higher at 20-1.
50kg/c+++2. Manufactured by heating and pressurizing for 40 to 100 minutes to integrate the layers. This insulating substrate 6 is sequentially
A through-hole plated multilayer printed wiring board A is manufactured through the steps of hole drilling, electroless plating, pattern formation, pattern plating, resist plating, resist removal, etching, external finishing, and symbol mark printing.
尚、本発明は第１図に示すような４層だけでなく、３層
あるいは第２図に示すような６層以上のものも含むもの
である。Note that the present invention includes not only four layers as shown in FIG. 1, but also three layers or six or more layers as shown in FIG.
次に本発明の実施例を具体的に説明する。Next, embodiments of the present invention will be specifically described.
（実施例１）
融点が３３０℃のフッ素樹脂含浸ガラス基材から形成し
た内層材の両面に、順次融点が３３０℃のフッ素樹脂フ
ィルム、融点が３３０℃の７ツ素樹脂含浸〃ラス基材の
積層体、融点が３３０℃の７ツ索樹脂フイルム、銅箔を
積み重ねて、このものを−組として熱盤間に複数組み配
置して加熱加圧成形して銅箔張り絶縁基板を形成した（
１１図参照）。加熱加圧条件は、２８０’Ｃ、１０ｋｇ
／ｃ＋ｏ２．１２０分であった。(Example 1) Both sides of an inner layer material formed from a glass substrate impregnated with a fluororesin having a melting point of 330°C are sequentially coated with a fluororesin film having a melting point of 330°C and a glass base material impregnated with a 7-carbon resin having a melting point of 330°C. A laminate, a 7-wire resin film with a melting point of 330°C, and a copper foil were stacked together, and multiple sets of these were placed between heating plates and molded under heat and pressure to form a copper foil-clad insulating substrate (
(See Figure 11). Heating and pressurizing conditions are 280'C, 10kg
/c+o2.120 minutes.
この絶縁基板から常法により４Ｎプリント配線板を製造
した。誘電率を測定した（ＪＩＳ Ｃ８４８１による）
。誘電率は２．６であった。又、寸法変化率は９％であ
った。A 4N printed wiring board was manufactured from this insulating substrate by a conventional method. Dielectric constant was measured (according to JIS C8481)
. The dielectric constant was 2.6. Further, the dimensional change rate was 9%.
（実施例２）
接着剤層としてフッ素樹脂フィルム以外の他の１［ｔフ
ィルム（ボンディングフィルム、Ｎｏ−６７００住友３
Ｍ（株）製）を使用し、２０４℃、７ｋｇ／ｃｒｅ２．
１２０分かけて加熱加圧した以外は実施例１と同様にし
て４層プリント配線板を製造した（第２図参照）。(Example 2) A 1[t film (bonding film, No. 6700 Sumitomo 3] other than the fluororesin film) was used as the adhesive layer.
M Co., Ltd.) at 204°C, 7kg/cre2.
A four-layer printed wiring board was manufactured in the same manner as in Example 1, except that heating and pressing was performed for 120 minutes (see FIG. 2).
誘電率は２．７であった。寸法変化率は５％であった。The dielectric constant was 2.7. The dimensional change rate was 5%.
（実施例３）
一方の積層体としてその両面に銅箔を貼着し、エツチン
グに上り銅箔を除去したアンクラツド板を使用した以外
は実施例１と同様にして４層プリント配線板を製造した
。誘電率は２．５であった。(Example 3) A 4-layer printed wiring board was manufactured in the same manner as in Example 1, except that one of the laminates was an unclad board with copper foil pasted on both sides and the copper foil removed by etching. . The dielectric constant was 2.5.
寸法変化率は２％であった。又シこの実施例ではスルホ
ール信頼性はオイルディップ２７回であった。The dimensional change rate was 2%. Also, in this example, the through-hole reliability was 27 oil dips.
（実施例４）
実施例１と同様の内層材の片面に、順次実施例１と同様
のフッ素樹脂フィルム、積層体として実施例３と同様な
アンクラツド板、接着剤層として実施例１と同様のフッ
素樹脂フィルム、銅箔を積み重ね、この内層材の他面に
実施例１と同様のフッ素樹脂フィルム、積層体、他の内
層材、接着剤層として実施例２と同様な樹脂フィルム、
銅箔を積み重ねてこのものを一組として熱盤間に複数組
み配置して加熱加圧成形して銅箔張り絶縁基板を形成し
た（第２図参照）。加熱加圧条件は、２０４℃、７ｋｇ
／Ｃ１１１２，６０分であった。この絶縁基板から常法
により６層プリント配線板を製造した。誘電率は２゜６
であった。又、寸法変化率は２％であった。スルホール
信頼性はオイルディップ２５回であった。(Example 4) On one side of the same inner layer material as in Example 1, the same fluororesin film as in Example 1, the same unclad plate as in Example 3 as a laminate, and the same as in Example 1 as an adhesive layer were applied. A fluororesin film and a copper foil are stacked, and on the other side of this inner layer material, a fluororesin film similar to that of Example 1, a laminate, another inner layer material, a resin film similar to that of Example 2 as an adhesive layer,
Copper foils were stacked and a plurality of sets were arranged between hot platens and molded under heat and pressure to form a copper foil-clad insulating substrate (see Fig. 2). The heating and pressurizing conditions are 204℃, 7kg
/C1112, 60 minutes. A six-layer printed wiring board was manufactured from this insulating substrate by a conventional method. The dielectric constant is 2°6
Met. Further, the dimensional change rate was 2%. Through hole reliability was 25 oil dips.
（実施例５）
積層体として実施例３と同様なアンクラツド板に更にテ
トラエッチにより表面処理を施した以外は実施例４と同
様にして６層プリント配線板を製造した。誘電率は２．
５であった。寸法変化率は２＝７−
％であった。スルホール信頼性はオイルディップ２８回
であった。(Example 5) A 6-layer printed wiring board was manufactured in the same manner as in Example 4, except that the same unclad board as in Example 3 was used as a laminate and was further subjected to surface treatment by tetra-etch. The dielectric constant is 2.
It was 5. The dimensional change rate was 2=7-%. Through-hole reliability was 28 oil dips.
（比較例）
積層体及び接着剤層を介装させなかった以外は実施例１
と同様にして４層プリント配線板を製造した。誘電率は
２．７であり、寸法変化率は１３％で、スルホール信頼
性はオイルディップ２０回と本発明の実施例と比較して
低いものであった。(Comparative example) Example 1 except that the laminate and adhesive layer were not interposed.
A four-layer printed wiring board was manufactured in the same manner as above. The dielectric constant was 2.7, the dimensional change rate was 13%, and the through-hole reliability was 20 oil dips, which was low compared to the examples of the present invention.
［発明の効果１
本発明にあっては、フッ素樹脂で形成した内層材の片面
又は両面に順次７−）素樹脂層、フッ素樹脂含浸ガラス
基材の積層体、接着剤層及び金属箔を積層して絶縁基板
を形成し、この絶縁基板の両面に導体パターンを形成し
ているので、誘電率が小さく、高周波特性が良好となり
、高周波クロックを使用する高周波演算回路、通信機回
路の実装が可能な絶縁特性に優れ、しがも多層であり高
密度実装が可能で、更に、フッ素樹脂含浸ガラス基材の
積層体を介装さセているので、寸法安定性にも優れるも
のである。[Effect of the invention 1] In the present invention, 7-) a base resin layer, a laminate of a fluororesin-impregnated glass substrate, an adhesive layer, and a metal foil are sequentially laminated on one or both sides of an inner layer material formed of a fluororesin. Since an insulating substrate is formed using the insulating substrate, and conductive patterns are formed on both sides of this insulating substrate, the dielectric constant is small and the high frequency characteristics are good, making it possible to implement high frequency arithmetic circuits and communication circuits that use high frequency clocks. It has excellent insulation properties, is multi-layered, allows high-density packaging, and has excellent dimensional stability because it is interposed with a laminate of fluororesin-impregnated glass substrates.
第１図は本発明の一実施例を示す概略分解断面図、第２
図は同上の他の実施例を示す概略分解断面図、第３図は
本発明者らが開発した多層プリント配線板の他側を示す
概略分解断面図であって、Ａはプリント配線板、１は内
層材、２はフッ素樹脂層、３は積層体、４は接着剤層、
５は金属箔、６は絶縁基板、７は導体パターンである。
代理人 弁理士 石 １）艮 七
第１図
第２図 第３′Ａ
手続補正書（自発）
昭和６１年１１月２９日
特許庁長官殿 −１１、
事件の表示
昭和６１年特許順第１３８９８８号
２、発明の名称
多層プリント配線板
３、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真１０４８番地名称（５８
３）松下電工株式会社
代表者 藤 井 Ｉ 夫
４、代理人
郵便番号 ５３０
住 所 大阪市北区梅田１丁目１２番１７号５、補正命
令の日付
自 発
６、補正により増加する発明の数 なしく１）明細書を
別紙全文補正明細書の通り補正致します。
（２）添付図面を全図削除して、別紙第１図、第２図及
び第３図を挿入致します。
代理人 弁理士 石 １）長 七
全文補正明細書
１、発明の名称
多層プリント配線板
２、特許請求の範囲
（１）フッ素樹脂で形成した内層材の片面又は両面に順
次１１１．７ツ素樹脂含浸〃ラス基材友び は７ツ
フィルムの積層体、接着層及び金属箔を積層して絶
縁基板を形成し、この絶縁基板に導体パターンを形成し
て成ることを特徴とする多層プリント配線板。
＜２）７９案樹脂含浸ガラス基材の積層体の表面を表面
処理剤で粗化して成ることを特徴とする特許請求の範囲
第１項記載の多層プリント配線板。
３、発明の詳細な説明
［技術分野１
本発明は多層プリント配線板に関する。
１背景技術１
従来より、ガラス布基材にエポキシ樹脂あるいはポリイ
ミド樹脂を含浸させ乾燥させて形成した樹脂含浸基材を
積層成形してプリント配線板用の積層板が製造されでい
るが、この積層板の誘電率はガラス／エポキシ系の樹脂
含浸基材を採用した場合には４．５で、〃ラス／ポリイ
ミド系で４．０と比較的大外く、従って、高周波に対す
る特性が不充分で、高周波クロックを用いた高周波演算
回路の実装とか、通信機器回路の実装には制約を受けて
いた。
このため本発明者らは、既に、絶縁層をフッ素樹脂又は
フッ素樹脂含浸布（不織布）基材で形成し誘電率が小さ
く、高周波特性が良好な積層板を開発している。
しかしながら、高密度実装化にともなって、多層化、即
ち、第３図に示すようにフッ素樹脂含浸基材で形成した
内層材１に両面に接着Ｎ２を介して金属箔４を貼着して
絶縁基板５′を形成し、この絶縁基板５′に導体パター
ン６を形成して多層プリント配線板Ａ′を形成した場合
には、誘電率は小さい（２，７）いものの、寸法変化率
が１０〜１５％と、寸法安定性が悪くなるという問題が
新たに発生している。
［発明の目的１
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、誘電率が小さく、高周波特性が良好
となり、高周波演算回路、通信機回路の実装が可能で絶
縁特性に優れ、しかも多層であり高密度実装が可能であ
って寸法安定性にも優れた多層プリント配線板を提供す
ることにある。
［発明の開示１
本発明の多層プリント配線板は、７７索樹脂で形成した
内層材１の片面又は両面に順次接着層２、フッ素樹脂含
浸ガラス基材及び／又は７ツ素樹脂フイルムの積層体３
、接着剤層２及び金属箔４を積層して絶縁基板５を形成
し、この絶縁基板５の両面に導体パターン６を形成して
成るものであり、この構成により上記目的を達成できた
ものである。
以下本発明を添付の図面を参照して詳細に説明する。本
発明で用いるフッ素樹脂としては、三７）化塩化エチレ
ン樹脂（融点２１０〜２１２℃）、Ｉ！！１１７フ化エ
チレン樹脂（融点３２７℃）、四７ツ化エチレン−六７
フ化プロピレン共重合体樹脂（融点２７０℃）、四７ツ
化エチレンーパーフルオロビニルエーテル共重合体樹脂
（融点３０２〜３１０℃）などのような融点が２００℃
以上のものが好ましい。内層材１は複数枚のフッ素樹脂
フィルム及び／又は７ツ素樹脂含浸基材の積層体の片面
又は両面に常法により内層導体パターン７を形成したも
のである。この内層材１の両面に接着Ｎ２を介して積層
体３が積層されている。積層体３は７ツ索樹脂フイルム
又は／及びフッ素樹脂含浸ガラス基材からなるものであ
る。この積層体３に接着層２を介して金属箔４が貼着さ
れて絶縁基板５が形成されている。接着層２は７ツ素樹
脂フイルム又はフッ素樹脂含浸基材（紙、不織布、ガラ
ス布）、あるいは他の樹脂フィルム又は他の樹脂含浸基
材（紙、不織布、ガラス布）により形成されている。成
形上、積層体３のフッ素樹脂はその融点が内層材１のフ
ッ素樹脂の融点と略等しいものを使用するのが好ましく
、又、接着層２のフッ素樹脂又は他の樹脂はその融点が
内層材１及び積層体３のフッ素樹脂の融点より低いもの
を採用するのが好ましい。又、７ツ索樹脂含浸〃ラス基
材の積層体３の表面を表面処理剤で粗化させて接着層２
との接着性を向」ニさせておけばよい。表面処理剤とし
ては金属ナトリウム・アンモニアとか金属ナトリウム混
合・テトラヒドロ７ランとか、あるいはテトラエッチ（
商品名、潤工社株式会社製）などを挙げることができる
。テトラエッチによる処理を説明すると、まず積層体３
の表面の汚れをアセトンなどで落とし、乾燥させる。こ
の後積層体３をテトラエッチに浸すか、金属又はポリエ
チレンのへらで塗布する。処理時間はフッ素樹脂の種類
により異なるが５〜１０秒程度程度る。又、金属箔を貼
着した積層体３の釡属箔エツチングにより表面を粗化し
てもよい。金属箔５としては銅箔、アルミニウム箔、真
ちゅう箔、鉄箔、ステンレス鋼箔、ニッケル箔、ケイ素
鋼箔などいずれをも採用できる。本発明の絶縁基板６は
内層材１の両面にフッ素樹脂フィルム又はフッ素樹脂含
浸基材、複数枚のフッ素樹脂含浸ガラス基材３及び金属
箔５を順次積み重ね、このものを−組みとして成形プレ
ートを介して複数組み熱盤間に配置し、２００℃以上、
２０〜１５０ｋｇ／Ｃｌｌ１２．４０〜１００分で加熱
加圧して積層一体化させて製造される。
加熱温度は接着層２の融点よりも高く、また望ましくは
内層材１の融点よりも低い方が寸法安定性を向上させる
ためにも好ましい。この絶縁基板５を順次、孔明け、無
電解めっき、パターン形成、パターンめっト、レジスト
めっき、レジスト除去、エツチング、外形仕上げ、シン
ボルマーク印刷といった工程でスルーホールめっき多層
プリント配線板Ａが製造される。尚、本発明は第１図に
示すような４層だけでなく、３層あるいは第２図に示す
ような６層以上のものも含むものである。
次に本発明の実施例を具体的に説明する。
（実施例１）
融点が３３０℃の７ツ索樹脂含浸ガラス基材及び四７ツ
化エチレン樹脂フィルムから形成した内層材の両面に、
順次融点が２７０℃の７７索樹脂フイルム、融点が３３
０℃のフッ素樹脂含浸ガラス基材及び四７ツ化エチレン
フィルムの積層体、融点が２７０℃のフッ素樹脂フィル
ム、銅箔を積み重ねて、このものを−組として熱盤間に
複数組み配置〔て加熱加圧成形して銅箔張り絶縁基板を
形成した（第１図参照）。加熱加圧条件は、３００’Ｃ
ｓ １０ｋｇ／ｃａ＋２．１２０分であった。この絶縁
基板から常法によＩ）４層プリント配線板を製造した。
誘電率（ＪＩＳ Ｃ６４８１による）を測定したところ
２．６であった。又、寸法変化率は９％であった。
（実施例２）
接着層として実施例１よりも融点の低い７ツ索１１１］
Ｗフイルム（ボンディングフィルム、Ｎｏ−６７００住
友３Ｍ（株）製）を使用し、２０４℃、７ｋｇ／ｃ１１
１２．１２０分かけて加熱加圧した以外は実施例１と同
様にして４層プリント配線板を製造した（第１図参照）
。
誘電率は２．７であった。寸法変化率は５％であった。
（実施例３）
一方の積層体としてその両面に銅箔を貼着し、エツチン
グにより銅箔を除去したアンクラツド板を使用した以外
は実施例１と同様にして４層プリ、 −６−
ント配線板を製造した（第１図参照）。誘電率は２゜５
であった。寸法変化率は２％であった。又、この実施例
ではスルホール信頼性はオイルディップ２７回であった
。
（実施例４）
実施例１と同様な二枚の内層材、積層体として実施例３
と同様な三枚のアンクラツド板、実施例１と同様な接着
層、そして銅箔を積み重ねてこのものを一組として熱盤
間に複数組み配置して加熱加圧成形して銅箔張り絶縁基
板を形成した（第２図参照）。加熱加圧条件は、２０４
℃、７ｋｇ／ｃａ＋２．６０分であった。この絶縁基板
から常法により６層プリント配線板を製造した。誘電率
は２．６であった。
又、寸法変化率は２％であった。スルホール信頼性はオ
イルディップ２５回であった。
（実施例５）
積層体として実施例３と同様なアンクラツド板に更にテ
トラエッチにより表面処理を施した以外は実施例４と同
様にして６層プリント配線板を製造した。誘電率は２．
５であった。寸法変化率は２％であった。スルホール信
頼性はオイルディップ２８回であった。
（比較例）
実施例１と同様な内層材の両面に融点が３３０℃のフッ
素樹脂フィルム及びフッ素樹脂含浸ガラス基材、次いで
銅箔を積み重ね、加熱温度が３７０℃とした以外は実施
例１と同様にして４７９プリント配線板を製造した（第
２図参照）。誘電率は２．７であり、寸法変化率は１３
％で、スルホール信頼性はオイルディップ２０回と本発
明の実施例と比較して低いものであった。
［発明の効果１
本発明にあっては、フッ素樹脂で形成した内層材の片面
又は両面に順次接着層、フッ素樹脂含浸ガラス基材及び
／又はフッ素樹脂フィルムの積層体、接着剤層及び金Ｊ
Ｋ箔を積層して絶縁基板を形成し、この絶縁基板の両面
に導体パターンを形成しているので、誘電率が小さく、
高周波特性が良好となり、高周波り、四ツクを使用する
高周波演算回路、通信機回路の実装が可能で絶縁特性に
優れ、しかも多層であり高密度実装が可能であり、又、
内層材のフッ素樹脂の融点よりも低い温度で成形すると
いった成形条件の設定により、内層材の再溶融を少なく
することにより、フッ素樹脂含浸ガラス基材及び又は７
ツ素樹脂フイルムの積層体を介装させていることと相ま
って、寸法安定性にも優れるものである。
４、図面の簡単な説明
＃Ｓ１図は本発明の一実施例を示す概略分解断面図、第
２図は同上の他の実施例を示す概略分解断面図、第３図
は本発明者らが開発した多層プリント配線板の他側を示
す概略分解断面図であって、Ａはプリント配線板、１は
内層材、２は接着層、３は積層体、４は金属箔、５は絶
縁基板、６は導体パターンである。
代理人 弁理士 石 １）長 七
？Ａ２図FIG. 1 is a schematic exploded cross-sectional view showing one embodiment of the present invention, and FIG.
The figure is a schematic exploded cross-sectional view showing another embodiment of the same as above, and FIG. is an inner layer material, 2 is a fluororesin layer, 3 is a laminate, 4 is an adhesive layer,
5 is a metal foil, 6 is an insulating substrate, and 7 is a conductor pattern. Agent Patent Attorney Ishi 1) Ai Figure 7 Figure 1 Figure 2 Figure 3'A Procedural Amendment (Voluntary) November 29, 1985 To the Commissioner of the Japan Patent Office -11.
Indication of the case 1986 Patent Order No. 138988 2, Name of the invention Multilayer printed wiring board 3, Person making the amendment Relationship to the case Patent applicant address 1048 Kadoma, Kadoma City, Osaka Prefecture Name (58
3) Matsushita Electric Works Co., Ltd. Representative Io Fujii 4, Agent postal code 530 Address 1-12-17-5 Umeda, Kita-ku, Osaka City Date of amendment order 6 Number of inventions increased by amendment None 1) The specification will be amended as per the attached full text amended specification. (2) All attached drawings will be deleted and attached sheets Figures 1, 2 and 3 will be inserted. Agent Patent Attorney Ishi 1) Long Seventh Full Text Amended Specification 1, Name of Invention Multilayer Printed Wiring Board 2, Claims (1) 111.7 tungsten resin sequentially on one or both sides of the inner layer material formed of fluororesin Impregnation: 7 lath base material friends
1. A multilayer printed wiring board characterized in that an insulating substrate is formed by laminating a film laminate, an adhesive layer, and a metal foil, and a conductor pattern is formed on this insulating substrate. <2) The multilayer printed wiring board according to claim 1, characterized in that the surface of a laminate of 79 resin-impregnated glass substrates is roughened with a surface treatment agent. 3. Detailed Description of the Invention [Technical Field 1 The present invention relates to a multilayer printed wiring board. 1 Background Art 1 Conventionally, laminates for printed wiring boards have been manufactured by laminating and molding resin-impregnated base materials formed by impregnating and drying a glass cloth base material with epoxy resin or polyimide resin. The dielectric constant of the plate is 4.5 when a glass/epoxy resin-impregnated base material is used, and 4.0 when a lath/polyimide base material is used, which is a relatively large difference.Therefore, the properties against high frequencies are insufficient. However, there were restrictions on the implementation of high-frequency arithmetic circuits using high-frequency clocks and the implementation of communication equipment circuits. For this reason, the present inventors have already developed a laminate having an insulating layer formed of a fluororesin or a fluororesin-impregnated cloth (nonwoven fabric) base material, which has a low dielectric constant and good high frequency characteristics. However, with the trend toward high-density packaging, multi-layering is required. In other words, as shown in FIG. When a multilayer printed wiring board A' is formed by forming a substrate 5' and forming a conductive pattern 6 on this insulating substrate 5', the dielectric constant is small (2,7), but the dimensional change rate is 10. ~15%, which is a new problem of poor dimensional stability. [Objective of the Invention 1 The present invention has been made in view of the above circumstances, and its purpose is to have a low dielectric constant, good high frequency characteristics, and to enable the implementation of high frequency arithmetic circuits and communication device circuits. It is an object of the present invention to provide a multilayer printed wiring board that has excellent insulation properties, is multilayered, can be mounted at high density, and has excellent dimensional stability. [Disclosure 1 of the Invention] The multilayer printed wiring board of the present invention includes an inner layer material 1 made of a 77 resin, an adhesive layer 2 on one or both sides of the inner layer 1, a laminate of a fluororesin-impregnated glass substrate and/or a 7 resin film. 3
, an insulating substrate 5 is formed by laminating an adhesive layer 2 and a metal foil 4, and a conductive pattern 6 is formed on both sides of this insulating substrate 5. With this structure, the above object can be achieved. be. The present invention will now be described in detail with reference to the accompanying drawings. Examples of the fluororesin used in the present invention include 37) chlorinated ethylene resin (melting point 210 to 212°C), I! ! 117-fluorinated ethylene resin (melting point 327°C), 47-fluorinated ethylene-67
Polypropylene fluoride copolymer resin (melting point 270°C), ethylene tetrafluoride-perfluorovinyl ether copolymer resin (melting point 302-310°C), etc. have a melting point of 200°C.
The above are preferred. The inner layer material 1 has an inner layer conductor pattern 7 formed on one or both sides of a laminate of a plurality of fluororesin films and/or a base material impregnated with a seven-layer resin by a conventional method. A laminate 3 is laminated on both surfaces of this inner layer material 1 via adhesive N2. The laminate 3 is made of a 7-strand resin film and/or a fluororesin-impregnated glass substrate. A metal foil 4 is adhered to this laminate 3 via an adhesive layer 2 to form an insulating substrate 5. The adhesive layer 2 is formed of a 7-carbon resin film or a fluororesin-impregnated base material (paper, non-woven fabric, glass cloth), or another resin film or other resin-impregnated base material (paper, non-woven fabric, glass cloth). For molding, it is preferable to use a fluororesin for the laminate 3 whose melting point is approximately equal to that of the fluororesin for the inner layer material 1, and for the fluororesin or other resin for the adhesive layer 2 to have a melting point equal to that of the inner layer material. It is preferable to use a material having a melting point lower than that of the fluororesins of 1 and 3. In addition, the surface of the laminated body 3 of the lath base material impregnated with 7-strand resin is roughened with a surface treatment agent to form the adhesive layer 2.
It is only necessary to improve the adhesion with the material. Surface treatment agents include metallic sodium/ammonia, metallic sodium mixture/tetrahydro7ran, or tetra-etch (
Examples include the product name (manufactured by Junkosha Co., Ltd.). To explain the treatment by Tetra Etch, first, the laminate 3
Remove dirt from the surface with acetone etc. and dry. The laminate 3 is then dipped in Tetraetch or applied with a metal or polyethylene spatula. The processing time varies depending on the type of fluororesin, but is approximately 5 to 10 seconds. Alternatively, the surface of the laminate 3 to which the metal foil is attached may be roughened by etching the metal foil. As the metal foil 5, copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used. The insulating substrate 6 of the present invention consists of sequentially stacking a fluororesin film or a fluororesin-impregnated base material, a plurality of fluororesin-impregnated glass base materials 3, and a metal foil 5 on both sides of an inner layer material 1, and then assembling this material into a molded plate. Placed between multiple sets of heating plates through the
20 to 150 kg/Cll12. Manufactured by heating and pressing for 40 to 100 minutes and laminating and integrating. The heating temperature is preferably higher than the melting point of the adhesive layer 2 and preferably lower than the melting point of the inner layer material 1 in order to improve dimensional stability. A through-hole plated multilayer printed wiring board A is manufactured from this insulating substrate 5 through the following steps: hole-drilling, electroless plating, pattern formation, pattern plating, resist plating, resist removal, etching, external finishing, and symbol mark printing. Ru. Note that the present invention includes not only four layers as shown in FIG. 1, but also three layers or six or more layers as shown in FIG. Next, embodiments of the present invention will be specifically described. (Example 1) On both sides of an inner layer material formed from a glass base material impregnated with a 7-stranded resin having a melting point of 330°C and a 47-stranded ethylene resin film,
77 resin film with sequential melting point of 270℃, melting point of 33
A laminate of a fluororesin-impregnated glass substrate at 0°C and a tetroxyethylene film, a fluororesin film with a melting point of 270°C, and copper foil were stacked together, and multiple sets were placed between heating plates. A copper foil-clad insulating substrate was formed by heating and pressure molding (see FIG. 1). The heating and pressurizing conditions are 300'C.
s 10 kg/ca+2.120 minutes. I) A four-layer printed wiring board was manufactured from this insulating substrate by a conventional method. The dielectric constant (according to JIS C6481) was measured and found to be 2.6. Further, the dimensional change rate was 9%. (Example 2) 7-wire 111 with a lower melting point than Example 1 as an adhesive layer]
Using W film (bonding film, No. 6700 manufactured by Sumitomo 3M Co., Ltd.), 204°C, 7kg/c11
12. A 4-layer printed wiring board was manufactured in the same manner as in Example 1, except that heating and pressing was performed for 120 minutes (see Figure 1).
. The dielectric constant was 2.7. The dimensional change rate was 5%. (Example 3) A four-layer pre-printed, -6-int wiring was made in the same manner as in Example 1, except that an unclad board with copper foil pasted on both sides and the copper foil removed by etching was used as one of the laminates. A plate was manufactured (see Figure 1). The dielectric constant is 2°5
Met. The dimensional change rate was 2%. Further, in this example, the through-hole reliability was 27 oil dips. (Example 4) Two inner layer materials similar to Example 1, Example 3 as a laminate
A set of three unclad plates similar to , an adhesive layer similar to Example 1, and copper foil are stacked together, and multiple sets are placed between hot platens and molded under heat and pressure to form a copper foil-covered insulating board. was formed (see Figure 2). The heating and pressurizing conditions are 204
℃, 7 kg/ca + 2.60 minutes. A six-layer printed wiring board was manufactured from this insulating substrate by a conventional method. The dielectric constant was 2.6. Further, the dimensional change rate was 2%. Through-hole reliability was 25 oil dips. (Example 5) A 6-layer printed wiring board was manufactured in the same manner as in Example 4, except that the same unclad board as in Example 3 was used as a laminate and was further subjected to surface treatment by tetra-etch. The dielectric constant is 2.
It was 5. The dimensional change rate was 2%. Through-hole reliability was 28 oil dips. (Comparative example) Example 1 except that a fluororesin film with a melting point of 330°C and a fluororesin-impregnated glass substrate were stacked on both sides of the same inner layer material as in Example 1, and then copper foil was stacked at a heating temperature of 370°C. A 479 printed wiring board was manufactured in the same manner (see FIG. 2). The dielectric constant is 2.7 and the dimensional change rate is 13
%, the through-hole reliability was 20 oil dips, which was lower than that of the example of the present invention. [Effect of the invention 1] In the present invention, an adhesive layer, a laminate of a fluororesin-impregnated glass substrate and/or a fluororesin film, an adhesive layer, and gold J are sequentially formed on one or both sides of an inner layer material formed of a fluororesin.
K foil is laminated to form an insulating substrate, and conductive patterns are formed on both sides of this insulating substrate, so the dielectric constant is small.
It has good high frequency characteristics, enables the mounting of high frequency arithmetic circuits and communication circuits using high frequency circuits, has excellent insulation characteristics, and is multi-layered, allowing high density mounting.
The fluororesin-impregnated glass base material and/or 7
Coupled with the fact that it is interposed with a laminate of resin film, it also has excellent dimensional stability. 4. Brief description of the drawings #S1 is a schematic exploded sectional view showing one embodiment of the present invention, FIG. 2 is a schematic exploded sectional view showing another embodiment of the same, and FIG. It is a schematic exploded sectional view showing the other side of the developed multilayer printed wiring board, where A is the printed wiring board, 1 is the inner layer material, 2 is the adhesive layer, 3 is the laminate, 4 is the metal foil, 5 is the insulating substrate, 6 is a conductor pattern. Agent Patent Attorney Ishi 1) Cho Shichi? A2 diagram
Claims (2)
次フッ素樹脂層、フッ素樹脂含浸ガラス基材の積層体、
接着剤層及び金属箔を積層して絶縁基板を形成し、この
絶縁基板に導体パターンを形成して成ることを特徴とす
る多層プリント配線板。(1) A laminate of a fluororesin layer on one or both sides of an inner layer material formed of a fluororesin, and a fluororesin-impregnated glass substrate;
A multilayer printed wiring board characterized in that an adhesive layer and a metal foil are laminated to form an insulating substrate, and a conductor pattern is formed on the insulating substrate.
処理剤で粗化して成ることを特徴とする特許請求の範囲
第１項記載の多層プリント配線板。(2) The multilayer printed wiring board according to claim 1, characterized in that the surface of a laminate of fluororesin-impregnated glass substrates is roughened with a surface treatment agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61138988A JPH0815235B2 (en) | 1986-06-14 | 1986-06-14 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61138988A JPH0815235B2 (en) | 1986-06-14 | 1986-06-14 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62295495A true JPS62295495A (en) | 1987-12-22 |
| JPH0815235B2 JPH0815235B2 (en) | 1996-02-14 |
Family
ID=15234858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61138988A Expired - Fee Related JPH0815235B2 (en) | 1986-06-14 | 1986-06-14 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0815235B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6413766U (en) * | 1987-07-17 | 1989-01-24 | ||
| JPH03283492A (en) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | Multilayered printed circuit board and manufacture thereof |
| CN111492723A (en) * | 2017-12-19 | 2020-08-04 | Ａｇｃ株式会社 | Processed circuit board, multilayer circuit board, method for producing circuit board with cover film, and film with adhesive layer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60257592A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
-
1986
- 1986-06-14 JP JP61138988A patent/JPH0815235B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60257592A (en) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | Multilayer printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6413766U (en) * | 1987-07-17 | 1989-01-24 | ||
| JPH0316299Y2 (en) * | 1987-07-17 | 1991-04-08 | ||
| JPH03283492A (en) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | Multilayered printed circuit board and manufacture thereof |
| CN111492723A (en) * | 2017-12-19 | 2020-08-04 | Ａｇｃ株式会社 | Processed circuit board, multilayer circuit board, method for producing circuit board with cover film, and film with adhesive layer |
| KR20200100592A (en) * | 2017-12-19 | 2020-08-26 | 에이지씨 가부시키가이샤 | Processed circuit board, multi-layer circuit board and circuit board manufacturing method with coverlay film, and film with adhesive layer |
| CN111492723B (en) * | 2017-12-19 | 2023-04-14 | Ａｇｃ株式会社 | Processed circuit board, multilayer circuit board, method for manufacturing circuit board with cover film, and film with adhesive layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0815235B2 (en) | 1996-02-14 |
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