JPS6413766U - - Google Patents
Info
- Publication number
- JPS6413766U JPS6413766U JP10960287U JP10960287U JPS6413766U JP S6413766 U JPS6413766 U JP S6413766U JP 10960287 U JP10960287 U JP 10960287U JP 10960287 U JP10960287 U JP 10960287U JP S6413766 U JPS6413766 U JP S6413766U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- utility
- model registration
- porous fluororesin
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Description
図はこの考案による一実施例を示す多層回路板
の断面図である。
14A,14B:補強誘電体層、21A,21
B:電気回路、22:多孔質弗素樹脂層。
The figure is a sectional view of a multilayer circuit board showing an embodiment of this invention. 14A, 14B: Reinforced dielectric layer, 21A, 21
B: Electric circuit, 22: Porous fluororesin layer.
Claims (1)
質弗素樹脂層と、この多孔質弗素樹脂層の最外層
に設けた補強誘電体層とを備える多層回路板。 (2) 実用新案登録請求の範囲第1項に記載の多
層回路板において、補強誘電体層は、熱硬化性樹
脂からなることを特徴とする多層回路板。[Claims for Utility Model Registration] (1) A multilayer circuit board comprising at least one porous fluororesin layer provided with an electric circuit and a reinforcing dielectric layer provided as the outermost layer of the porous fluororesin layer. (2) Utility Model Registration The multilayer circuit board according to claim 1, wherein the reinforcing dielectric layer is made of a thermosetting resin.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987109602U JPH0316299Y2 (en) | 1987-07-17 | 1987-07-17 | |
US07/172,256 US5136123A (en) | 1987-07-17 | 1988-03-23 | Multilayer circuit board |
AT88303715T ATE91058T1 (en) | 1987-07-17 | 1988-04-25 | MULTILAYER CIRCUIT BOARD. |
GB8809737A GB2207287B (en) | 1987-07-17 | 1988-04-25 | A multilayer circuit board |
DE88303715T DE3881973T2 (en) | 1987-07-17 | 1988-04-25 | Multi-layer circuit board. |
EP88303715A EP0299595B1 (en) | 1987-07-17 | 1988-04-25 | A multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987109602U JPH0316299Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6413766U true JPS6413766U (en) | 1989-01-24 |
JPH0316299Y2 JPH0316299Y2 (en) | 1991-04-08 |
Family
ID=31345992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987109602U Expired JPH0316299Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0316299Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006013249A (en) * | 2004-06-28 | 2006-01-12 | Tdk Corp | Electronic component and multilayered substrate |
JP2008244325A (en) * | 2007-03-28 | 2008-10-09 | Japan Gore Tex Inc | Printed wiring board and ball grid array package |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5653240A (en) * | 1979-09-28 | 1981-05-12 | Mitsubishi Rayon Co | Pile like structure and method |
JPS59161674U (en) * | 1983-04-15 | 1984-10-29 | 株式会社日立製作所 | multilayer wiring board |
JPS6182496A (en) * | 1984-09-28 | 1986-04-26 | 日立化成工業株式会社 | Multilayer wiring board |
JPS61176196A (en) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | Wiring board for module |
JPS62295495A (en) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | Multilayer printed interconnection board |
-
1987
- 1987-07-17 JP JP1987109602U patent/JPH0316299Y2/ja not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5653240A (en) * | 1979-09-28 | 1981-05-12 | Mitsubishi Rayon Co | Pile like structure and method |
JPS59161674U (en) * | 1983-04-15 | 1984-10-29 | 株式会社日立製作所 | multilayer wiring board |
JPS6182496A (en) * | 1984-09-28 | 1986-04-26 | 日立化成工業株式会社 | Multilayer wiring board |
JPS61176196A (en) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | Wiring board for module |
JPS62295495A (en) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | Multilayer printed interconnection board |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006013249A (en) * | 2004-06-28 | 2006-01-12 | Tdk Corp | Electronic component and multilayered substrate |
JP4496858B2 (en) * | 2004-06-28 | 2010-07-07 | Tdk株式会社 | Electronic components and multilayer boards |
JP2008244325A (en) * | 2007-03-28 | 2008-10-09 | Japan Gore Tex Inc | Printed wiring board and ball grid array package |
Also Published As
Publication number | Publication date |
---|---|
JPH0316299Y2 (en) | 1991-04-08 |
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