JPS6413766U - - Google Patents

Info

Publication number
JPS6413766U
JPS6413766U JP10960287U JP10960287U JPS6413766U JP S6413766 U JPS6413766 U JP S6413766U JP 10960287 U JP10960287 U JP 10960287U JP 10960287 U JP10960287 U JP 10960287U JP S6413766 U JPS6413766 U JP S6413766U
Authority
JP
Japan
Prior art keywords
circuit board
utility
model registration
porous fluororesin
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10960287U
Other languages
Japanese (ja)
Other versions
JPH0316299Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987109602U priority Critical patent/JPH0316299Y2/ja
Priority to US07/172,256 priority patent/US5136123A/en
Priority to EP88303715A priority patent/EP0299595B1/en
Priority to DE88303715T priority patent/DE3881973T2/en
Priority to AT88303715T priority patent/ATE91058T1/en
Priority to GB8809737A priority patent/GB2207287B/en
Publication of JPS6413766U publication Critical patent/JPS6413766U/ja
Application granted granted Critical
Publication of JPH0316299Y2 publication Critical patent/JPH0316299Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図はこの考案による一実施例を示す多層回路板
の断面図である。 １４Ａ，１４Ｂ：補強誘電体層、２１Ａ，２１
Ｂ：電気回路、２２：多孔質弗素樹脂層。 The figure is a sectional view of a multilayer circuit board showing an embodiment of this invention. 14A, 14B: Reinforced dielectric layer, 21A, 21
B: Electric circuit, 22: Porous fluororesin layer.

Claims (1)

【実用新案登録請求の範囲】 (1) 少なくとも一層の、電気回路を施した多孔
質弗素樹脂層と、この多孔質弗素樹脂層の最外層
に設けた補強誘電体層とを備える多層回路板。 (2) 実用新案登録請求の範囲第１項に記載の多
層回路板において、補強誘電体層は、熱硬化性樹
脂からなることを特徴とする多層回路板。[Claims for Utility Model Registration] (1) A multilayer circuit board comprising at least one porous fluororesin layer provided with an electric circuit and a reinforcing dielectric layer provided as the outermost layer of the porous fluororesin layer. (2) Utility Model Registration The multilayer circuit board according to claim 1, wherein the reinforcing dielectric layer is made of a thermosetting resin.
JP1987109602U 1987-07-17 1987-07-17 Expired JPH0316299Y2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1987109602U JPH0316299Y2 (en) 1987-07-17 1987-07-17
US07/172,256 US5136123A (en) 1987-07-17 1988-03-23 Multilayer circuit board
EP88303715A EP0299595B1 (en) 1987-07-17 1988-04-25 A multilayer circuit board
DE88303715T DE3881973T2 (en) 1987-07-17 1988-04-25 Multi-layer circuit board.
AT88303715T ATE91058T1 (en) 1987-07-17 1988-04-25 MULTILAYER CIRCUIT BOARD.
GB8809737A GB2207287B (en) 1987-07-17 1988-04-25 A multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987109602U JPH0316299Y2 (en) 1987-07-17 1987-07-17

Publications (2)

Publication Number Publication Date
JPS6413766U true JPS6413766U (en) 1989-01-24
JPH0316299Y2 JPH0316299Y2 (en) 1991-04-08

Family

ID=31345992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987109602U Expired JPH0316299Y2 (en) 1987-07-17 1987-07-17

Country Status (1)

Country Link
JP (1) JPH0316299Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013249A (en) * 2004-06-28 2006-01-12 Tdk Corp Electronic component and multilayered substrate
JP2008244325A (en) * 2007-03-28 2008-10-09 Japan Gore Tex Inc Printed wiring board and ball grid array package

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5653240A (en) * 1979-09-28 1981-05-12 Mitsubishi Rayon Co Pile like structure and method
JPS59161674U (en) * 1983-04-15 1984-10-29 株式会社日立製作所 multilayer wiring board
JPS6182496A (en) * 1984-09-28 1986-04-26 日立化成工業株式会社 Multilayer wiring board
JPS61176196A (en) * 1985-01-31 1986-08-07 株式会社日立製作所 Wiring board for module
JPS62295495A (en) * 1986-06-14 1987-12-22 松下電工株式会社 Multilayer printed interconnection board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5653240A (en) * 1979-09-28 1981-05-12 Mitsubishi Rayon Co Pile like structure and method
JPS59161674U (en) * 1983-04-15 1984-10-29 株式会社日立製作所 multilayer wiring board
JPS6182496A (en) * 1984-09-28 1986-04-26 日立化成工業株式会社 Multilayer wiring board
JPS61176196A (en) * 1985-01-31 1986-08-07 株式会社日立製作所 Wiring board for module
JPS62295495A (en) * 1986-06-14 1987-12-22 松下電工株式会社 Multilayer printed interconnection board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013249A (en) * 2004-06-28 2006-01-12 Tdk Corp Electronic component and multilayered substrate
JP4496858B2 (en) * 2004-06-28 2010-07-07 Ｔｄｋ株式会社 Electronic components and multilayer boards
JP2008244325A (en) * 2007-03-28 2008-10-09 Japan Gore Tex Inc Printed wiring board and ball grid array package

Also Published As

Publication number Publication date
JPH0316299Y2 (en) 1991-04-08

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