JPS63290735A - Flexible laminated sheet - Google Patents
Flexible laminated sheetInfo
- Publication number
- JPS63290735A JPS63290735A JP12649787A JP12649787A JPS63290735A JP S63290735 A JPS63290735 A JP S63290735A JP 12649787 A JP12649787 A JP 12649787A JP 12649787 A JP12649787 A JP 12649787A JP S63290735 A JPS63290735 A JP S63290735A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- resin
- treatment
- fiber cloth
- metallic foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 12
- 239000011888 foil Substances 0.000 claims abstract description 9
- 239000004760 aramid Substances 0.000 claims abstract description 8
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 2
- 238000009832 plasma treatment Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電子機器、電９ＩＣ機器、計算機、コンピュタ
−等に用いられる印刷配線板用積層板の特にフレキシブ
ル積層板の分野に属するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the field of laminates for printed wiring boards, particularly flexible laminates, used in electronic devices, electric IC devices, calculators, computers, etc.
従来のフレキシブル積層板は耐熱性に優れたポリイミド
樹脂フィルムに金属箔を貼シつけたものから形成されて
いるため、誘電率が４９後もあシ高周波回路用には用い
難い欠点があった。更に加えて吸水率、耐屈曲性も低１
．−ｆｌｉＩｆｆｇがあった。Conventional flexible laminates are made of a polyimide resin film with excellent heat resistance and metal foil pasted on them, so even after a dielectric constant of 49, they have the disadvantage of being difficult to use for high-frequency circuits. In addition, water absorption rate and bending resistance are also low.
．． - There was fliIffg.
本発明は低誘電率、低吸水率、高強度のフレキシブル積
層板を提供することにある。An object of the present invention is to provide a flexible laminate having a low dielectric constant, low water absorption, and high strength.
本発明は表面活性化処理した芳香族ポリアミド繊維布に
フッ素樹脂を含浸した樹脂含浸基材の上下面にフッ素樹
脂フィルムを介して金属箔を配設した積層体をＷＲ層一
体化してなることを特徴とするフレキシブｆｉ／積層板
のため上記目的を達成することができたもので、以下本
発明を詳細に説明する。The present invention is made by integrating a WR layer with a laminate in which metal foil is arranged on the upper and lower surfaces of a resin-impregnated base material made of a surface-activated aromatic polyamide fiber cloth impregnated with a fluororesin via a fluororesin film. The above object has been achieved because of the flexible FI/laminated board, and the present invention will be described in detail below.
本発明（用いる芳香族ポリアミドｍＲ布としては例えば
デュポン社製のケグツー繊維布等をあげることができる
が、更く芳香族ポリアミド繊維と他の繊維例えばがラス
繊維、ポリエステル繊維、ポリアクリル繊維等との金権
、合糸、混合等の繊維布をも包含するものであるが、Ｖ
＆維布はプヲズマ処理、化学処理等によって表面活性化
処理したものであることが必要である。表面活性化処理
としてはデフＸマ処理を用いるととが処理時間が短かく
且つ効果が大なるため望ましいことである。The aromatic polyamide mR fabric used in the present invention includes, for example, Keg-Two fiber cloth manufactured by DuPont, but aromatic polyamide fibers and other fibers such as lath fibers, polyester fibers, polyacrylic fibers, etc. It also includes textile fabrics such as gold rights, doublings, and blends, but V
& The textile fabric must be surface-activated by PUZMA treatment, chemical treatment, etc. As the surface activation treatment, it is preferable to use a differential x-ray machining process because the treatment time is short and the effect is large.
更に表面活性化処理した芳香族ポリアミド繊維布に必要
に応じてシランカップリング剤処理等を施すことによっ
て繊維布と樹脂との浸透、結合を向上させることができ
るので望ましいことである。Furthermore, it is desirable to subject the surface-activated aromatic polyamide fiber cloth to a silane coupling agent treatment, etc., if necessary, since it is possible to improve the penetration and bonding between the fiber cloth and the resin.
フッ素樹脂としては四フッ化エチレン樹脂、四フッ化エ
チレンパーフルオロビニルエーテル共重合体、四フフ化
エチレン六フッ化プロピレン共重合体、四フッ化エチレ
ンエチレン共重合体、三フフ化塩化エチレン樹脂等のよ
うにフッ素樹脂全般を用いることができる。金属箔とし
ては銅、アルミニウム、鉄、ニッケル、亜鉛等の単独、
合金、複合からなる金属箔を用りることができ、更に必
要に応じてその片面に接着剤層を設けておき、接着力を
向上させることもできる。Examples of fluororesins include tetrafluoroethylene resin, tetrafluoroethylene perfluorovinyl ether copolymer, tetrafluoroethylene hexafluoropropylene copolymer, tetrafluoroethylene ethylene copolymer, trifluorochloride ethylene resin, etc. All fluororesins can be used. Metal foils include copper, aluminum, iron, nickel, zinc, etc.
A metal foil made of an alloy or a composite can be used, and if necessary, an adhesive layer can be provided on one side of the foil to improve adhesive strength.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み０．１ｆｉの芳香族ポリアミド繊維布Ｃ商品名ケプ
ヲークロスンの表面をプフズマ処理してからがンマアミ
ノプロビルトリエトキシフンを付着量が０．０５重！９
６ｃ以下単に％と記す）になるように付着処理させた。Example: After the surface of aromatic polyamide fiber cloth C with a thickness of 0.1fi (trade name: Kepuwo Clothon) was treated with Pfuzuma, the amount of aminopropyltriethoxyphen deposited was 0.05 weight! 9
6c or less (simply expressed as %).
次に該繊維布に四フッ化エチレン樹脂Ｃダイキン工業株
式会社製、品名ポリフロンＴＦＥ）を樹脂量が８０％に
なるようく含浸、焼成して得た樹脂含浸基材の上下面に
厚さりμの四フフ化エチレン樹脂フィルムを夫々１枚づ
つ介して厚さ０．０１８００銅箔を夫々配設した積層体
を成形圧力３） ｋｔｊ／ｄ 、 ３８０℃で７０分
間積層成形 してフレキシブｆｉ／積層板を得た。Next, the fiber cloth is impregnated with tetrafluoroethylene resin C (manufactured by Daikin Industries, Ltd., product name: Polyflon TFE) so that the resin amount becomes 80%, and the resulting resin-impregnated base material is coated with a thickness of μ on the upper and lower surfaces. A laminate in which a copper foil with a thickness of 0.01800 was interposed between each polytetrafluoroethylene resin film was laminated at a molding pressure of 3) ktj/d at 380°C for 70 minutes to form a flexible fi/laminate. Got the board.
比較例
ポリイミド樹脂フィルム罠銅箔を接着してなる市販のフ
レキシブル積層板を比較例とした。Comparative Example A commercially available flexible laminate formed by adhering a polyimide resin film trapping copper foil was used as a comparative example.
実施例及び比較例のフレキシブル積層板の性能は第１表
で明白なように本発明のものの性能はよく、本発明のフ
レキシブル積層板の優れていることを確認した。As clearly shown in Table 1, the performance of the flexible laminates of the Examples and Comparative Examples was good, confirming that the flexible laminates of the present invention were superior.
第 １ 表Table 1
Claims (2)
ッ素樹脂を含浸した樹脂含浸基材の上下面にフッ素樹脂
フィルムを介して金属箔を配設した積層体を積層一体化
してなることを特徴とするフレキシブル積層板。(1) It is characterized by an integrated laminate consisting of a resin-impregnated base material made of a surface-activated aromatic polyamide fiber cloth impregnated with a fluororesin, and metal foils arranged on the upper and lower surfaces of the surface through a fluororesin film. Flexible laminate board.
とする特許請求の範囲第１項記載のフレキシブル積層板
。(2) The flexible laminate according to claim 1, wherein the surface activation treatment is plasma treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12649787A JPS63290735A (en) | 1987-05-22 | 1987-05-22 | Flexible laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12649787A JPS63290735A (en) | 1987-05-22 | 1987-05-22 | Flexible laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63290735A true JPS63290735A (en) | 1988-11-28 |
Family
ID=14936668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12649787A Pending JPS63290735A (en) | 1987-05-22 | 1987-05-22 | Flexible laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63290735A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540866B1 (en) | 1999-06-29 | 2003-04-01 | Institute Of Microelectronics | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| WO2006067970A1 (en) * | 2004-12-20 | 2006-06-29 | Asahi Glass Company, Limited | Laminate for flexible printed wiring boards |
| EP1820637A1 (en) * | 2004-12-09 | 2007-08-22 | Asahi Glass Company, Limited | Laminate for printed wiring board |
| CN103917042A (en) * | 2012-12-28 | 2014-07-09 | 新日铁住金化学株式会社 | Flexible copper-coated laminated plate |
| JP2015056558A (en) * | 2013-09-12 | 2015-03-23 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board, multilayer printed wiring board, and method for manufacturing flexible printed wiring board |
-
1987
- 1987-05-22 JP JP12649787A patent/JPS63290735A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540866B1 (en) | 1999-06-29 | 2003-04-01 | Institute Of Microelectronics | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| EP1820637A1 (en) * | 2004-12-09 | 2007-08-22 | Asahi Glass Company, Limited | Laminate for printed wiring board |
| EP1820637A4 (en) * | 2004-12-09 | 2009-06-24 | Asahi Glass Co Ltd | Laminate for printed wiring board |
| US7687142B2 (en) | 2004-12-09 | 2010-03-30 | Asahi Glass Company, Limited | Laminate for printed wiring board |
| WO2006067970A1 (en) * | 2004-12-20 | 2006-06-29 | Asahi Glass Company, Limited | Laminate for flexible printed wiring boards |
| EP1830613A1 (en) * | 2004-12-20 | 2007-09-05 | Asahi Glass Company, Limited | Laminate for flexible printed wiring boards |
| US7476434B2 (en) | 2004-12-20 | 2009-01-13 | Asahi Glass Company, Limited | Laminate for flexible printed wiring board |
| EP1830613A4 (en) * | 2004-12-20 | 2009-07-01 | Asahi Glass Co Ltd | Laminate for flexible printed wiring boards |
| JP4816459B2 (en) * | 2004-12-20 | 2011-11-16 | 旭硝子株式会社 | Laminate for flexible printed wiring boards |
| CN103917042A (en) * | 2012-12-28 | 2014-07-09 | 新日铁住金化学株式会社 | Flexible copper-coated laminated plate |
| JP2015056558A (en) * | 2013-09-12 | 2015-03-23 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board, multilayer printed wiring board, and method for manufacturing flexible printed wiring board |
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